SILICON LABS MGM260P Module Explorer Kit User Guide

Use the breakout pads for peripherals like I2C, SPI, UART, and
GPIOs.
Insert mikroBUS add-on boards into the mikroBUS socket for SPI,
UART, or I2C interfacing.

Connect hardware from the Qwiic Connect System through the
Qwiic connector using I2C.

3. Debugging

Debugging on the kit can be done through the following
methods:

Utilize the on-board debugger for debugging purposes.
Access debug information through the Packet Trace Interface
(PTI) for wireless links.

Frequently Asked Questions (FAQ)

Q: What type of applications is the MGM260P Module Explorer Kit
suitable for?

A: The kit is ideal for rapid prototyping and concept creation
of IoT applications due to its focus on energy-friendly connected
IoT applications.

Q: Can I use off-the-shelf boards with the MGM260P Module
Explorer Kit?

A: Yes, developers can create and prototype applications using
various off-the-shelf boards from brands like MIKROE, SparkFun,
Adafruit, and Seeed Studio through the hardware add-on support.

“`

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UG613: MGM260P Module Explorer Kit User’s Guide

The MGM260P Module Explorer Kit is an ultra-low cost, small form factor development and evaluation platform for the MGM260P Wireless Gecko Module.
The MGM260P Module Explorer Kit is focused on rapid prototyping and concept creation of IoT applications. It is designed around the MGM260P Module, which is an ideal device family for developing energy-friendly connected IoT applications.
The kit features a USB interface, an on-board SEGGER J-Link debugger, two user-LEDs and two buttons, and support for hardware add-on boards via a mikroBus socket and a Qwiic connector. The hardware add-on support allows developers to create and prototype applications using a virtually endless combination of off-the-shelf boards from MIKROE, SparkFun, Adafruit, and Seeed Studio.

TARGET DEVICE
· MGM260P Wireless Gecko Module (MGM260PD32VNA2R)
· Built-in Antenna · 32-bit ARM® Cortex®-M33 with 80 MHz
maximum operating frequency · 3200 kB flash and 512 kB RAM
KIT FEATURES
· 2x User LEDs and push buttons · 26-pin 2.54 mm breakout pads · mikroBUSTM socket · Qwiic® connector · SEGGER J-Link on-board debugger · Virtual COM port · Packet Trace Interface (PTI) · USB-powered

SOFTWARE SUPPORT

· Simplicity StudioTM

ORDERING INFORMATION

· MGM260P-EK2713A

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Rev. 1.0

Table of Contents
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 Kit Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 Getting Started . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.3 Hardware Content . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.4 Kit Hardware Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.1 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . 5 2.2 Current Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3. Hardware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3.1 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3.2 Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.3 MGM260P Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.4 Push Button and LED. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.5 On-board Debugger . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.6 Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3.6.1 Breakout Pads . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 3.6.2 Mini Simplicity Connector . . . . . . . . . . . . . . . . . . . . . . . . .11 3.6.3 MikroBUS Socket . . . . . . . . . . . . . . . . . . . . . . . . . . .12 3.6.4 Qwiic Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 3.6.5 Debug USB Type-C Connector . . . . . . . . . . . . . . . . . . . . . . .13
4. Debugging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 4.1 On-board Debugger . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 4.2 Virtual COM Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
5. Schematics, Assembly Drawings, and BOM . . . . . . . . . . . . . . . . . . . 15
6. Kit Revision History and Errata . . . . . . . . . . . . . . . . . . . . . . .16 6.1 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 6.2 Errata . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
7. Board Revision History and Errata . . . . . . . . . . . . . . . . . . . . . . 17 7.1 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 7.2 Errata . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
8. Document Revision History . . . . . . . . . . . . . . . . . . . . . . . . . 18

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UG613: MGM260P Module Explorer Kit User’s Guide
Introduction
1. Introduction
The MGM260P Module Explorer Kit has been designed to inspire customers to make IoT devices with the Silicon Labs MGM260P Wireless Gecko Module. The kit includes a mikroBUSTM socket and Qwiic® connector, allowing users to add features to the kit with a large selection of off-the-shelf boards.
Programming the MGM260P Module Explorer Kit is easily done using a USB Type-C cable and the on-board J-Link debugger. A USB virtual COM port provides a serial connection to the target application, and the Packet Trace Interface (PTI) offers invaluable debug information about transmitted and received packets in wireless links. The MGM260P Module Explorer Kit is supported in Simplicity StudioTM and a Board Support Package (BSP) is provided to give application developers a flying start.
External hardware is connected to the MGM260P Module Explorer Kit by using the 26 breakout pads which present peripherals from the MGM260P Wireless Gecko Module such as I2C, SPI, UART, and GPIOs. The mikroBUS socket allows inserting mikroBUS add-on boards which interface with the MGM260P through SPI, UART, or I2C. The Qwiic connector can be used to connect hardware from the Qwiic Connect System through I2C.
1.1 Kit Contents
The following items are included in the box: · 1x MGM260P Module Explorer Kit board (BRD2713A)
1.2 Getting Started
Refer to the Silicon Labs webpage, https://www.silabs.com/dev-tools, for detailed instructions on how to get started with your new MGM260P Module Explorer Kit.
1.3 Hardware Content
The following key hardware elements are included on the MGM260P Module Explorer Kit: · MGM260P Wireless Gecko Module with 80 MHz operating frequency, 3200 kB kB flash, and 512 kB RAM · Two LEDs and two push buttons · On-board SEGGER J-Link debugger for easy programming and debugging, which includes a USB virtual COM port and Packet
Trace Interface (PTI) · MikroBUS socket for connecting click boards and other mikroBUS add-on boards · Qwiic connector for connecting Qwiic Connect System hardware · Breakout pads for GPIO access and connection to external hardware · Reset button

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1.4 Kit Hardware Layout MGM260P Module Explorer Kit layout is shown below.

35.56 mm

Top View

MGM260P Wireless Module

UG613: MGM260P Module Explorer Kit User’s Guide
Introduction

Push Button0 Push Button1
LED0
Breakout Pads
mikroBUS Socket

Qwiic Connector
LED1

57.38 mm

On-board USB J-Link Debugger

USB Type-C Connector – Virtual COM port – Debug access

Reset Button

Figure 1.1. MGM260P Module Explorer Kit Hardware Layout

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2. Specifications
2.1 Recommended Operating Conditions

UG613: MGM260P Module Explorer Kit User’s Guide
Specifications

Table 2.1. Recommended Operating Conditions

Parameter USB Supply Input Voltage Supply Input Voltage (VMCU supplied externally)

Symbol

Min

VUSB

—

VVMCU

—

Typ +5.0 +3.3

Max — —

Unit V V

2.2 Current Consumption
The operating current of the board greatly depends on the application and the amount of external hardware connected. The table below attempts to give some indication of typical current consumptions for the MGM260P and the on-board debugger. Note that the numbers are taken from the datasheets for the devices. For a full overview of the conditions that apply for a specific number from a datasheet, the reader is encouraged to read the specific datasheet.
Table 2.2. Current Consumption

Parameter

Symbol

Condition

Typ

MGM260P Current Con-

IMGM260P MCU current consumption in EM0 mode with all peripher-

59.4

sumption1

als disabled (module supply voltage = 3.0 V, VSCALE2,

40 MHz crystal, CPU running Prime from flash at 25 °C)

Radio system current consumption in receive mode, active

5.7

packet reception (VDD = 3.0 V, MCU in EM1 and all MCU

peripherals disabled, HCLK = 40 MHz, 1Mbit/s, 2GFSK, f

= 2.4 GHz at 25 °C)

Radio system current consumption in transmit mode (VDD

162

= 3.0 V, MCU in EM1 and all MCU peripherals disabled,

HCLK = 40 MHz, f = 2.4 GHz, CW, 20 dBm output power

at 25 °C)

On-board Debugger Sleep Current Consumption 2

IDBG

On-board debugger current consumption when USB cable

is not inserted (EFM32GG12 EM4S mode current con-

sumption)

1 From MGM260P datasheet 2 From EFM32GG12 datasheet

Unit µA/MHz
mA
mA
nA

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UG613: MGM260P Module Explorer Kit User’s Guide
Hardware
3. Hardware
The core of the MGM260P Module Explorer Kit is the MGM260P Wireless Gecko Module. Refer to section 1.4 Kit Hardware Layout for placement and layout of the hardware components.

3.1 Block Diagram An overview of the MGM260P Module Explorer Kit is illustrated in the figure below.
Device Connectivity & Debugging

USB Type-C Connector

J-Link Debugger

Mini-Simplicity Breakout Pads

Connector

(EXP-Header pinout)

Buttons and LEDs
User Buttons & LEDs

MGM260P Wireless Module

Expandability

Qwiic Connector

mikroBUS Socket

Figure 3.1. Kit Block Diagram

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3.2 Power Supply The kit is powered by the debug USB cable as illustrated in the figure below.

UG613: MGM260P Module Explorer Kit User’s Guide
Hardware

5V0

3V3

USB Type-C

OUT

LDO

Automatic Isolation

VMCU

Peripherals

MGM260P Wireless Module
Peripherals
Figure 3.2. MGM260P Module Explorer Kit Power Topology
The 5 V power net on the USB bus is regulated down to 3.3 V using a low-dropout regulator (LDO). An automatic isolation circuit isolates the LDO when the USB cable is not plugged in. Power can be injected externally on the VMCU net if the USB cable is removed and no other power sources are present on the kit. Failure to follow this guideline can cause power conflicts and damage the LDO.

3.3 MGM260P Reset
The MGM260P can be reset by a few different sources: · A user pressing the RESET button. · The on-board debugger pulling the #RESET pin low.

3.4 Push Button and LED
The kit has two user push buttons, marked BTN0 and BTN1, that are connected to GPIOs on the MGM260P. The buttons are connected to pin PB01 and PB00, respectively, and they are debounced by an RC filter with a time constant of 1 ms. The logic state of a button is high while that button is not being pressed, and low when it is pressed.
The kit also features two yellow LEDs, marked LED0 and LED1, that are controlled by GPIO pins on the MGM260P. The LEDs are connected to pin PA09 and PC09, respectively, in an active-high configuration.

MGM260P PB01 (GPIO) PB00 (GPIO)

BUTTON0 BUTTON1

PA09 (GPIO) PC09 (GPIO)

LED0 LED1

User Buttons & LEDs

Figure 3.3. Buttons and LEDs

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UG613: MGM260P Module Explorer Kit User’s Guide
Hardware
3.5 On-board Debugger
The MGM260P Module Explorer Kit contains a microcontroller separate from the MGM260P Wireless Gecko Module that provides the user with an on-board J-Link debugger through the USB Type-C port. This microcontroller is referred to as the “on-board debugger”, and is not programmable by the user. When the USB cable is removed, the on-board debugger goes into a very low power shutoff mode (EM4S), consuming around 80 nA typically (from EFM32GG12 datasheet).
In addition to providing code download and debug features, the on-board debugger also presents a virtual COM port for general purpose application serial data transfer.
The figure below shows the connections between the target MGM260P device and the on-board debugger.
Refer to section 4. Debugging for more details on debugging.

Host PC

VCOM_TX

VCOM_RX

USB

On-Board

VCOM_CTS

J-Link

VCOM_RTS

Debugger

SWCLK_C2CK

SWDIO_C2D

DBG_SWO

DATA FRAME

DBG_RESET

MGEMFR23620MP G
PB02 (USART1.TX) PB03 (USART1.RX) PA06 (USART1.CTS) PA00 (USART1.RTS) PA01 (GPIO.SWCLK) PA02 (GPIO.SWDIO) PA03 (GPIO.SWO) PD04 (FRC.DOUT) PD05 (FRC.DFRAME) RESETn

Figure 3.4. On-Board Debugger Connections

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UG613: MGM260P Module Explorer Kit User’s Guide
Hardware
3.6 Connectors
The MGM260P Module Explorer Kit features a USB Type-C connector, 26 breakout pads, a Mini Simplicity connector (not mounted), a mikroBUS connector for connecting mikroBUS add-on boards, and a Qwiic connector for connecting Qwiic Connect System hardware. The Qwiic connector, mikroBUS socket, and USB Type-C connector are located on the top side of the board. The breakout header can be placed on either side of the board based on user preference. The Mini Simplicity connector can be placed on the bottom side of the board. Their placement and pinout are shown in the figure below. For additional information on the connectors, see the following sub chapters.
Breakout Pads

P101
PA08 PB04 GND
5V PC07 – MIKROE_QWIIC_I2C_SDA PC05 – MIKROE_QWIIC_I2C_SCL
PA04 – MIKROE_UART_TX PA05 – MIKROE_UART_RX
PC00 – MIKROE_INT PD05 – PTI_FRAME PA07 – MIKROE_PWM
GND 3V3

Qwiic Connector
P102
PC08 PB05 PD03 VMCU PC02 – MIKROE_SPI_MOSI PC01 – MIKROE_SPI_MISO PC03 – MIKROE_SPI_SCK PC04 – MIKROE_SPI_CS PC06 – MIKROE_RST PD02 – MIKROE_ANALOG PD04 – PTI_DATA BOARD_ID_SCL BOARD_ID_SDA

USB Type-C Connector

mikroBUS Connector

Qwiic Connector
GND VMCU SDA – PC07 SCL – PC05

Mini Simplicity Connector (not mounted)

PTI_DATA – PD04 SWCLK_C2CK – PA01
SWO – PA03 VCOM_RX – PB03
GND

PD05 – PTI_FRAME PA02 – SWDIO_C2D PB02 – VCOM_TX DBG_RST VMCU
Pin 1

Figure 3.5. MGM260P Module Explorer Kit Connectors

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UG613: MGM260P Module Explorer Kit User’s Guide
Hardware
3.6.1 Breakout Pads
Twenty-six breakout pads are provided and allow connection of external peripherals. There are 13 pads on the left side of the board, and 13 pads on the right. The breakout pads contain a number of I/O pins that can be used with most of the MGM260P Wireless Gecko Module’s features. Additionally, the VMCU (main board power rail), 3V3 (LDO regulator output), and 5V power rails are also exposed on the pads.
The pin-routing on the Wireless Gecko Module is very flexible, so most peripherals can be routed to any pin. However, pins may be shared between the breakout pads and other functions on the MGM260P Module Explorer Kit. The table below includes an overview of the breakout pads and functionality that is shared with the kit.
Table 3.1. Breakout Pads Pinout

Connection

Shared Feature

Peripheral Mapping

Left-side Breakout Pins

PA08

—

GPIO

PB04

—

GPIO

GND

Ground

Board USB voltage

PC07

QWIIC_I2C_SDA, MIKROE_I2C_SDA

I2C_SDA

PC05

QWIIC_I2C_SCL, MIKROE_I2C_SCL

I2C_SCL

PA04

MIKROE_TX

UART_TX

PA05

MIKROE_RX

UART_RX

PC00

MIKROE_INT

EXT_INT

PD05

PTI_FRAME

PA07

MIKROE_PWM

PWM

GND

Ground

3V3

Board controller supply

Right-side Breakout Pins

PC08

—

GPIO

PB05

—

GPIO

PD03

—

GPIO

VMCU

MGM260P voltage domain

PC02

MIKROE_MOSI

SPI_MOSI

PC01

MIKROE_MISO

SPI_MISO

PC03

MIKROE_SCK

SPI_SCLK

PC04

MIKROE_CS

SPI_CS

PC06

MIKROE_RST

GPIO

PD02

MIKROE_AN

AIN

PD04

PTI_DATA

BOARD_ID_SCL

Connected to Board Controller for identification of add-on boards.

BOARD_ID_SDA

Connected to Board Controller for identification of add-on boards.

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UG613: MGM260P Module Explorer Kit User’s Guide
Hardware
3.6.2 Mini Simplicity Connector
The Mini Simplicity Connector (not mounted) is a 10-pin, 1.27 mm pitch connector that allows the use of an external debugger such as the one found on a Silicon Labs Wireless Starter Kit mainboard. The pinout of the connector on the board is described in the table below with the names being referenced from the MGM260P.
Table 3.2. Mini Simplicity Connector Pin Descriptions

Pin number 1
2 3 4 5 6 7 8 9 10

Function AEM
GND RST VCOM_RX VCOM_TX SWO SWDIO SWCLK PTI_FRAME PTI_DATA

Connection VMCU
GND RESET PB03 PB02 PA03 PA02 PA01 PD05 PD04

Description Target voltage on the debugged application. May be supplied and monitored by the AEM on an external debugger. Ground MGM260P reset Virtual COM Rx Virtual COM Tx Serial Wire Output Serial Wire Data Serial Wire Clock Packet Trace Frame Packet Trace Data

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UG613: MGM260P Module Explorer Kit User’s Guide
Hardware
3.6.3 MikroBUS Socket
The MGM260P Module Explorer Kit features a mikroBUS socket compatible with mikroBUS add-on boards. MikroBUS add-on boards can expand the functionality of the kit with peripherals such as sensors and LCDs. Add-on boards follow the mikroBUS socket pin mapping and communicate with the on-kit MGM260P through UART, SPI, or I2C. Several GPIOs are exposed on the mikroBUS socket. MikroBUS add-on boards can be powered by the 5V or VMCU power rails, which are available on the mikroBUS socket.
The pinout of the MGM260P on the kit is made such that all required peripherals are available on the mikroBUS socket. The I2C signals are, however, shared with the Qwiic connector.
When inserting a mikroBUS add-on board, refer to the orientation notch on the MGM260P Module Explorer Kit, shown in the figure below, to ensure correct orientation. Add-on boards have a similar notch that needs to be lined up with the one shown below.

Orientation notch

mikroBUS socket

Figure 3.6. mikroBUS Add-on Board Orientation The table below gives an overview of the mikroBUS socket pin connections to the MGM260P.
Table 3.3. mikroBUS Socket Pinout

mikroBUS Pin
Name

mikroBUS Pin Function

Analog

RST

Reset

SPI Chip Select

SCK

SPI Clock

MISO SPI Main Input Secondary Output

MOSI

SPI Main Output Secondary Input

PWM

PWM Output

INT Hardware Interrupt

UART Receive

UART Transmit

SCL

I2C Clock

SDA

I2C Data

Connection
PD02 PC06 PC04 PC03 PC01
PC02
PA07 PC00 PA05 PA04 PC05 PC07

Shared Feature
— — — — —
—
— — — — QWIIC_I2C_SCL QWIIC_I2C_SDA

Suggested Peripheral Mapping
IADC0 —
USARTx.CS USARTx.CLK USARTx.RX
USARTx.TX
TIMER0.CCx —
USARTx.RX USARTx.TX
I2Cx.SCL I2Cx.SDA

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mikroBUS Pin
Name

mikroBUS Pin Function

3V3 VCC 3.3V power

VCC 5V power

GND Reference Ground

Connection
VMCU 5V GND

UG613: MGM260P Module Explorer Kit User’s Guide
Hardware

Shared Feature

Suggested Peripheral Mapping

MGM260P voltage domain Board USB voltage Ground

3.6.4 Qwiic Connector The MGM260P Module Explorer Kit features a Qwiic connector compatible with Qwiic Connect System hardware. The Qwiic connector provides an easy way to expand the functionality of the MGM260P Module Explorer Kit with sensors, LCDs, and other peripherals over the I2C interface. The Qwiic connector is a 4-pin polarized JST connector, which ensures the cable is inserted the right way. Qwiic Connect System hardware is daisy chain-able as long as each I2C device in the chain has a unique I2C address. Note: The Qwiic I2C lines are shared with the on-board I2C sensors.
The Qwiic connector and its connections to Qwiic cables and the MGM260P are illustrated in the figure below.
Qwiic cable
GND VMCU SDA – PC07 SCL – PC05

Figure 3.7. Qwiic Connector The table below gives an overview of the Qwiic connections to the MGM260P.
Table 3.4. Qwiic Connector Pinout

Qwiic Pin Ground 3.3V SDA SCL

Connection GND VMCU PC07 PC05

Shared Feature

Suggested Peripherial Mapping

Ground

MGM260P voltage domain

MIKROE_I2C_SDA

I2Cx.SDA

MIKROE_I2C_SCL

I2Cx.SCL

3.6.5 Debug USB Type-C Connector
The debug USB port can be used for uploading code, debugging, and as a Virtual COM port. More information is available in section 4. Debugging.

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UG613: MGM260P Module Explorer Kit User’s Guide
Debugging
4. Debugging
The MGM260P Module Explorer Kit contains an on-board SEGGER J-Link Debugger that interfaces to the target MGM260P using the Serial Wire Debug (SWD) interface. The debugger allows the user to download code and debug applications running in the target MGM260P. Additionally, it provides a virtual COM port (VCOM) to the host computer that is connected to the target device’s serial port for general purpose communication between the running application and the host computer. The on-board debugger is accessible through the USB Type-C connector.
4.1 On-board Debugger
The on-board debugger is a SEGGER J-Link debugger running on an EFM32 Giant Gecko. The debugger is directly connected to the debug and VCOM pins of the target MGM260P.
When the debug USB cable is inserted, the on-board debugger is automatically activated and takes control of the debug and VCOM interfaces. This means that debug and communication will not work with an external debugger connected at the same time. The onboard LDO is also activated, providing power to the board.
4.2 Virtual COM Port
The virtual COM port is a connection to a UART of the target MGM260P and allows serial data to be sent and received from the device. The on-board debugger presents this as a virtual COM port on the host computer that shows up when the USB cable is inserted.
Data is transferred between the host computer and the debugger through the USB connection, which emulates a serial port using the USB Communication Device Class (CDC). From the debugger, the data is passed on to the target device through a physical UART connection.
The serial format is 115200 bps, 8 bits, no parity, and 1 stop bit by default.
Note: Changing the baud rate for the COM port on the PC side does not influence the UART baud rate between the debugger and the target device.

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UG613: MGM260P Module Explorer Kit User’s Guide
Schematics, Assembly Drawings, and BOM
5. Schematics, Assembly Drawings, and BOM
Schematics, assembly drawings, and Bill of Materials (BOM) are available through Simplicity Studio when the kit documentation package has been installed. They are also available from the kit page on the Silicon Labs website: silabs.com.

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6. Kit Revision History and Errata

UG613: MGM260P Module Explorer Kit User’s Guide
Kit Revision History and Errata

6.1 Revision History
The kit revision can be found printed on the box label of the kit, as outlined in the figure below. The kit revision history is summarized in the table below.

MGM260P Module Explorer Kit

MGM260P-EK2713A

08-01-25

2416000960 A01

Kit Revision A00

Released 7 January 2025

6.2 Errata There are no known errata at present.

Figure 6.1. Revision Info Table 6.1. Kit Revision History
Description New kit introduction of MGM260P-EK2713A.

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7. Board Revision History and Errata

UG613: MGM260P Module Explorer Kit User’s Guide
Board Revision History and Errata

7.1 Revision History The board revision can be found laser printed on the board, and the board revision history is summarized in the following table.
Table 7.1. Board Revision History

Revision A04

Released 20 December 2024

Description Initial production release.

7.2 Errata There are no known errata at present.

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8. Document Revision History
Revision 1.0 February 2025 · Initial document release.

UG613: MGM260P Module Explorer Kit User’s Guide
Document Revision History

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Disclaimer Silicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and “Typical” parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes without further notice to the product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Without prior notification, Silicon Labs may update product firmware during the manufacturing process for security or reliability reasons. Such changes will not alter the specifications or the performance of the product. Silicon Labs shall have no liability for the consequences of use of the information supplied in this document. This document does not imply or expressly grant any license to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any FDA Class III devices, applications for which FDA premarket approval is required or Life Support Systems without the specific written consent of Silicon Labs. A “Life Support System” is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons. Silicon Labs disclaims all express and implied warranties and shall not be responsible or liable for any injuries or damages related to use of a Silicon Labs product in such unauthorized applications.
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Documents / Resources

SILICON LABS MGM260P Module Explorer Kit [pdf] User Guide
MGM260P Module Explorer Kit, MGM260P, Module Explorer Kit, Explorer Kit

References

User Manual

MGM260P Module Explorer Kit

Specifications

Product Usage Instructions

1. Getting Started

2. Hardware Connectivity

3. Debugging

Frequently Asked Questions (FAQ)

Q: What type of applications is the MGM260P Module Explorer Kit
suitable for?

Q: Can I use off-the-shelf boards with the MGM260P Module
Explorer Kit?

Documents / Resources

References

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