User Guide for SILICON LABS models including: MGM260P Module Explorer Kit, MGM260P, Module Explorer Kit, Explorer Kit
2025-02-26 — The kit features a USB interface, an on-board SEGGER J-Link debugger, two user-LEDs and two buttons, and support for hardware add-on boards via a mikroBus ...
File Info : application/pdf, 19 Pages, 3.59MB
DocumentDocumentUG613: MGM260P Module Explorer Kit User's Guide The MGM260P Module Explorer Kit is an ultra-low cost, small form factor development and evaluation platform for the MGM260P Wireless Gecko Module. The MGM260P Module Explorer Kit is focused on rapid prototyping and concept creation of IoT applications. It is designed around the MGM260P Module, which is an ideal device family for developing energy-friendly connected IoT applications. The kit features a USB interface, an on-board SEGGER J-Link debugger, two user-LEDs and two buttons, and support for hardware add-on boards via a mikroBus socket and a Qwiic connector. The hardware add-on support allows developers to create and prototype applications using a virtually endless combination of off-the-shelf boards from MIKROE, SparkFun, Adafruit, and Seeed Studio. TARGET DEVICE · MGM260P Wireless Gecko Module (MGM260PD32VNA2R) · Built-in Antenna · 32-bit ARM® Cortex®-M33 with 80 MHz maximum operating frequency · 3200 kB flash and 512 kB RAM KIT FEATURES · 2x User LEDs and push buttons · 26-pin 2.54 mm breakout pads · mikroBUSTM socket · Qwiic® connector · SEGGER J-Link on-board debugger · Virtual COM port · Packet Trace Interface (PTI) · USB-powered SOFTWARE SUPPORT · Simplicity StudioTM ORDERING INFORMATION · MGM260P-EK2713A silabs.com | Building a more connected world. Copyright © 2025 by Silicon Laboratories Rev. 1.0 Table of Contents 1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 Kit Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 Getting Started . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.3 Hardware Content . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.4 Kit Hardware Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.1 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . 5 2.2 Current Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3. Hardware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3.1 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3.2 Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.3 MGM260P Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.4 Push Button and LED. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.5 On-board Debugger . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.6 Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3.6.1 Breakout Pads . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 3.6.2 Mini Simplicity Connector . . . . . . . . . . . . . . . . . . . . . . . . .11 3.6.3 MikroBUS Socket . . . . . . . . . . . . . . . . . . . . . . . . . . .12 3.6.4 Qwiic Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 3.6.5 Debug USB Type-C Connector . . . . . . . . . . . . . . . . . . . . . . .13 4. Debugging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 4.1 On-board Debugger . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 4.2 Virtual COM Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 5. Schematics, Assembly Drawings, and BOM . . . . . . . . . . . . . . . . . . . 15 6. Kit Revision History and Errata . . . . . . . . . . . . . . . . . . . . . . .16 6.1 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 6.2 Errata . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 7. Board Revision History and Errata . . . . . . . . . . . . . . . . . . . . . . 17 7.1 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 7.2 Errata . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 8. Document Revision History . . . . . . . . . . . . . . . . . . . . . . . . . 18 silabs.com | Building a more connected world. Rev. 1.0 | 2 UG613: MGM260P Module Explorer Kit User's Guide Introduction 1. Introduction The MGM260P Module Explorer Kit has been designed to inspire customers to make IoT devices with the Silicon Labs MGM260P Wireless Gecko Module. The kit includes a mikroBUSTM socket and Qwiic® connector, allowing users to add features to the kit with a large selection of off-the-shelf boards. Programming the MGM260P Module Explorer Kit is easily done using a USB Type-C cable and the on-board J-Link debugger. A USB virtual COM port provides a serial connection to the target application, and the Packet Trace Interface (PTI) offers invaluable debug information about transmitted and received packets in wireless links. The MGM260P Module Explorer Kit is supported in Simplicity StudioTM and a Board Support Package (BSP) is provided to give application developers a flying start. External hardware is connected to the MGM260P Module Explorer Kit by using the 26 breakout pads which present peripherals from the MGM260P Wireless Gecko Module such as I2C, SPI, UART, and GPIOs. The mikroBUS socket allows inserting mikroBUS add-on boards which interface with the MGM260P through SPI, UART, or I2C. The Qwiic connector can be used to connect hardware from the Qwiic Connect System through I2C. 1.1 Kit Contents The following items are included in the box: · 1x MGM260P Module Explorer Kit board (BRD2713A) 1.2 Getting Started Refer to the Silicon Labs webpage, https://www.silabs.com/dev-tools, for detailed instructions on how to get started with your new MGM260P Module Explorer Kit. 1.3 Hardware Content The following key hardware elements are included on the MGM260P Module Explorer Kit: · MGM260P Wireless Gecko Module with 80 MHz operating frequency, 3200 kB kB flash, and 512 kB RAM · Two LEDs and two push buttons · On-board SEGGER J-Link debugger for easy programming and debugging, which includes a USB virtual COM port and Packet Trace Interface (PTI) · MikroBUS socket for connecting click boards and other mikroBUS add-on boards · Qwiic connector for connecting Qwiic Connect System hardware · Breakout pads for GPIO access and connection to external hardware · Reset button silabs.com | Building a more connected world. Rev. 1.0 | 3 1.4 Kit Hardware Layout MGM260P Module Explorer Kit layout is shown below. 35.56 mm Top View MGM260P Wireless Module UG613: MGM260P Module Explorer Kit User's Guide Introduction Push Button0 Push Button1 LED0 Breakout Pads mikroBUS Socket Qwiic Connector LED1 57.38 mm On-board USB J-Link Debugger USB Type-C Connector - Virtual COM port - Debug access Reset Button Figure 1.1. MGM260P Module Explorer Kit Hardware Layout silabs.com | Building a more connected world. Rev. 1.0 | 4 2. Specifications 2.1 Recommended Operating Conditions UG613: MGM260P Module Explorer Kit User's Guide Specifications Table 2.1. Recommended Operating Conditions Parameter USB Supply Input Voltage Supply Input Voltage (VMCU supplied externally) Symbol Min VUSB -- VVMCU -- Typ +5.0 +3.3 Max -- -- Unit V V 2.2 Current Consumption The operating current of the board greatly depends on the application and the amount of external hardware connected. The table below attempts to give some indication of typical current consumptions for the MGM260P and the on-board debugger. Note that the numbers are taken from the datasheets for the devices. For a full overview of the conditions that apply for a specific number from a datasheet, the reader is encouraged to read the specific datasheet. Table 2.2. Current Consumption Parameter Symbol Condition Typ MGM260P Current Con- IMGM260P MCU current consumption in EM0 mode with all peripher- 59.4 sumption1 als disabled (module supply voltage = 3.0 V, VSCALE2, 40 MHz crystal, CPU running Prime from flash at 25 °C) Radio system current consumption in receive mode, active 5.7 packet reception (VDD = 3.0 V, MCU in EM1 and all MCU peripherals disabled, HCLK = 40 MHz, 1Mbit/s, 2GFSK, f = 2.4 GHz at 25 °C) Radio system current consumption in transmit mode (VDD 162 = 3.0 V, MCU in EM1 and all MCU peripherals disabled, HCLK = 40 MHz, f = 2.4 GHz, CW, 20 dBm output power at 25 °C) On-board Debugger Sleep Current Consumption 2 IDBG On-board debugger current consumption when USB cable 80 is not inserted (EFM32GG12 EM4S mode current con- sumption) 1 From MGM260P datasheet 2 From EFM32GG12 datasheet Unit µA/MHz mA mA nA silabs.com | Building a more connected world. Rev. 1.0 | 5 UG613: MGM260P Module Explorer Kit User's Guide Hardware 3. Hardware The core of the MGM260P Module Explorer Kit is the MGM260P Wireless Gecko Module. Refer to section 1.4 Kit Hardware Layout for placement and layout of the hardware components. 3.1 Block Diagram An overview of the MGM260P Module Explorer Kit is illustrated in the figure below. Device Connectivity & Debugging USB Type-C Connector J-Link Debugger Mini-Simplicity Breakout Pads Connector (EXP-Header pinout) Buttons and LEDs User Buttons & LEDs MGM260P Wireless Module Expandability Qwiic Connector mikroBUS Socket Figure 3.1. Kit Block Diagram silabs.com | Building a more connected world. Rev. 1.0 | 6 3.2 Power Supply The kit is powered by the debug USB cable as illustrated in the figure below. UG613: MGM260P Module Explorer Kit User's Guide Hardware 5V0 3V3 USB Type-C IN OUT LDO Automatic Isolation VMCU Peripherals Peripherals Peripherals MGM260P Wireless Module Peripherals Figure 3.2. MGM260P Module Explorer Kit Power Topology The 5 V power net on the USB bus is regulated down to 3.3 V using a low-dropout regulator (LDO). An automatic isolation circuit isolates the LDO when the USB cable is not plugged in. Power can be injected externally on the VMCU net if the USB cable is removed and no other power sources are present on the kit. Failure to follow this guideline can cause power conflicts and damage the LDO. 3.3 MGM260P Reset The MGM260P can be reset by a few different sources: · A user pressing the RESET button. · The on-board debugger pulling the #RESET pin low. 3.4 Push Button and LED The kit has two user push buttons, marked BTN0 and BTN1, that are connected to GPIOs on the MGM260P. The buttons are connected to pin PB01 and PB00, respectively, and they are debounced by an RC filter with a time constant of 1 ms. The logic state of a button is high while that button is not being pressed, and low when it is pressed. The kit also features two yellow LEDs, marked LED0 and LED1, that are controlled by GPIO pins on the MGM260P. The LEDs are connected to pin PA09 and PC09, respectively, in an active-high configuration. MGM260P PB01 (GPIO) PB00 (GPIO) BUTTON0 BUTTON1 PA09 (GPIO) PC09 (GPIO) LED0 LED1 User Buttons & LEDs Figure 3.3. Buttons and LEDs silabs.com | Building a more connected world. Rev. 1.0 | 7 UG613: MGM260P Module Explorer Kit User's Guide Hardware 3.5 On-board Debugger The MGM260P Module Explorer Kit contains a microcontroller separate from the MGM260P Wireless Gecko Module that provides the user with an on-board J-Link debugger through the USB Type-C port. This microcontroller is referred to as the "on-board debugger", and is not programmable by the user. When the USB cable is removed, the on-board debugger goes into a very low power shutoff mode (EM4S), consuming around 80 nA typically (from EFM32GG12 datasheet). In addition to providing code download and debug features, the on-board debugger also presents a virtual COM port for general purpose application serial data transfer. The figure below shows the connections between the target MGM260P device and the on-board debugger. Refer to section 4. Debugging for more details on debugging. Host PC VCOM_TX VCOM_RX USB On-Board VCOM_CTS J-Link VCOM_RTS Debugger SWCLK_C2CK SWDIO_C2D DBG_SWO DATA FRAME DBG_RESET MGEMFR23620MP G PB02 (USART1.TX) PB03 (USART1.RX) PA06 (USART1.CTS) PA00 (USART1.RTS) PA01 (GPIO.SWCLK) PA02 (GPIO.SWDIO) PA03 (GPIO.SWO) PD04 (FRC.DOUT) PD05 (FRC.DFRAME) RESETn Figure 3.4. On-Board Debugger Connections silabs.com | Building a more connected world. Rev. 1.0 | 8 UG613: MGM260P Module Explorer Kit User's Guide Hardware 3.6 Connectors The MGM260P Module Explorer Kit features a USB Type-C connector, 26 breakout pads, a Mini Simplicity connector (not mounted), a mikroBUS connector for connecting mikroBUS add-on boards, and a Qwiic connector for connecting Qwiic Connect System hardware. The Qwiic connector, mikroBUS socket, and USB Type-C connector are located on the top side of the board. The breakout header can be placed on either side of the board based on user preference. The Mini Simplicity connector can be placed on the bottom side of the board. Their placement and pinout are shown in the figure below. For additional information on the connectors, see the following sub chapters. Breakout Pads P101 PA08 PB04 GND 5V PC07 - MIKROE_QWIIC_I2C_SDA PC05 - MIKROE_QWIIC_I2C_SCL PA04 - MIKROE_UART_TX PA05 - MIKROE_UART_RX PC00 - MIKROE_INT PD05 - PTI_FRAME PA07 - MIKROE_PWM GND 3V3 Qwiic Connector P102 PC08 PB05 PD03 VMCU PC02 - MIKROE_SPI_MOSI PC01 - MIKROE_SPI_MISO PC03 - MIKROE_SPI_SCK PC04 - MIKROE_SPI_CS PC06 - MIKROE_RST PD02 - MIKROE_ANALOG PD04 - PTI_DATA BOARD_ID_SCL BOARD_ID_SDA USB Type-C Connector mikroBUS Connector Qwiic Connector GND VMCU SDA - PC07 SCL - PC05 Mini Simplicity Connector (not mounted) PTI_DATA - PD04 SWCLK_C2CK - PA01 SWO - PA03 VCOM_RX - PB03 GND PD05 - PTI_FRAME PA02 - SWDIO_C2D PB02 - VCOM_TX DBG_RST VMCU Pin 1 Figure 3.5. MGM260P Module Explorer Kit Connectors silabs.com | Building a more connected world. Rev. 1.0 | 9 UG613: MGM260P Module Explorer Kit User's Guide Hardware 3.6.1 Breakout Pads Twenty-six breakout pads are provided and allow connection of external peripherals. There are 13 pads on the left side of the board, and 13 pads on the right. The breakout pads contain a number of I/O pins that can be used with most of the MGM260P Wireless Gecko Module's features. Additionally, the VMCU (main board power rail), 3V3 (LDO regulator output), and 5V power rails are also exposed on the pads. The pin-routing on the Wireless Gecko Module is very flexible, so most peripherals can be routed to any pin. However, pins may be shared between the breakout pads and other functions on the MGM260P Module Explorer Kit. The table below includes an overview of the breakout pads and functionality that is shared with the kit. Table 3.1. Breakout Pads Pinout Pin Connection Shared Feature Peripheral Mapping Left-side Breakout Pins 1 PA08 -- GPIO 3 PB04 -- GPIO 5 GND Ground 7 5V Board USB voltage 9 PC07 QWIIC_I2C_SDA, MIKROE_I2C_SDA I2C_SDA 11 PC05 QWIIC_I2C_SCL, MIKROE_I2C_SCL I2C_SCL 13 PA04 MIKROE_TX UART_TX 15 PA05 MIKROE_RX UART_RX 17 PC00 MIKROE_INT EXT_INT 19 PD05 PTI_FRAME PTI_FRAME 21 PA07 MIKROE_PWM PWM 23 GND Ground 25 3V3 Board controller supply Right-side Breakout Pins 2 PC08 -- GPIO 4 PB05 -- GPIO 6 PD03 -- GPIO 8 VMCU MGM260P voltage domain 10 PC02 MIKROE_MOSI SPI_MOSI 12 PC01 MIKROE_MISO SPI_MISO 14 PC03 MIKROE_SCK SPI_SCLK 16 PC04 MIKROE_CS SPI_CS 18 PC06 MIKROE_RST GPIO 20 PD02 MIKROE_AN AIN 22 PD04 PTI_DATA PTI_DATA 24 BOARD_ID_SCL Connected to Board Controller for identification of add-on boards. 26 BOARD_ID_SDA Connected to Board Controller for identification of add-on boards. silabs.com | Building a more connected world. Rev. 1.0 | 10 UG613: MGM260P Module Explorer Kit User's Guide Hardware 3.6.2 Mini Simplicity Connector The Mini Simplicity Connector (not mounted) is a 10-pin, 1.27 mm pitch connector that allows the use of an external debugger such as the one found on a Silicon Labs Wireless Starter Kit mainboard. The pinout of the connector on the board is described in the table below with the names being referenced from the MGM260P. Table 3.2. Mini Simplicity Connector Pin Descriptions Pin number 1 2 3 4 5 6 7 8 9 10 Function AEM GND RST VCOM_RX VCOM_TX SWO SWDIO SWCLK PTI_FRAME PTI_DATA Connection VMCU GND RESET PB03 PB02 PA03 PA02 PA01 PD05 PD04 Description Target voltage on the debugged application. May be supplied and monitored by the AEM on an external debugger. Ground MGM260P reset Virtual COM Rx Virtual COM Tx Serial Wire Output Serial Wire Data Serial Wire Clock Packet Trace Frame Packet Trace Data silabs.com | Building a more connected world. Rev. 1.0 | 11 UG613: MGM260P Module Explorer Kit User's Guide Hardware 3.6.3 MikroBUS Socket The MGM260P Module Explorer Kit features a mikroBUS socket compatible with mikroBUS add-on boards. MikroBUS add-on boards can expand the functionality of the kit with peripherals such as sensors and LCDs. Add-on boards follow the mikroBUS socket pin mapping and communicate with the on-kit MGM260P through UART, SPI, or I2C. Several GPIOs are exposed on the mikroBUS socket. MikroBUS add-on boards can be powered by the 5V or VMCU power rails, which are available on the mikroBUS socket. The pinout of the MGM260P on the kit is made such that all required peripherals are available on the mikroBUS socket. The I2C signals are, however, shared with the Qwiic connector. When inserting a mikroBUS add-on board, refer to the orientation notch on the MGM260P Module Explorer Kit, shown in the figure below, to ensure correct orientation. Add-on boards have a similar notch that needs to be lined up with the one shown below. Orientation notch mikroBUS socket Figure 3.6. mikroBUS Add-on Board Orientation The table below gives an overview of the mikroBUS socket pin connections to the MGM260P. Table 3.3. mikroBUS Socket Pinout mikroBUS Pin Name mikroBUS Pin Function AN Analog RST Reset CS SPI Chip Select SCK SPI Clock MISO SPI Main Input Secondary Output MOSI SPI Main Output Secondary Input PWM PWM Output INT Hardware Interrupt RX UART Receive TX UART Transmit SCL I2C Clock SDA I2C Data Connection PD02 PC06 PC04 PC03 PC01 PC02 PA07 PC00 PA05 PA04 PC05 PC07 Shared Feature -- -- -- -- -- -- -- -- -- -- QWIIC_I2C_SCL QWIIC_I2C_SDA Suggested Peripheral Mapping IADC0 -- USARTx.CS USARTx.CLK USARTx.RX USARTx.TX TIMER0.CCx -- USARTx.RX USARTx.TX I2Cx.SCL I2Cx.SDA silabs.com | Building a more connected world. Rev. 1.0 | 12 mikroBUS Pin Name mikroBUS Pin Function 3V3 VCC 3.3V power 5V VCC 5V power GND Reference Ground Connection VMCU 5V GND UG613: MGM260P Module Explorer Kit User's Guide Hardware Shared Feature Suggested Peripheral Mapping MGM260P voltage domain Board USB voltage Ground 3.6.4 Qwiic Connector The MGM260P Module Explorer Kit features a Qwiic connector compatible with Qwiic Connect System hardware. The Qwiic connector provides an easy way to expand the functionality of the MGM260P Module Explorer Kit with sensors, LCDs, and other peripherals over the I2C interface. The Qwiic connector is a 4-pin polarized JST connector, which ensures the cable is inserted the right way. Qwiic Connect System hardware is daisy chain-able as long as each I2C device in the chain has a unique I2C address. Note: The Qwiic I2C lines are shared with the on-board I2C sensors. The Qwiic connector and its connections to Qwiic cables and the MGM260P are illustrated in the figure below. Qwiic cable GND VMCU SDA - PC07 SCL - PC05 Figure 3.7. Qwiic Connector The table below gives an overview of the Qwiic connections to the MGM260P. Table 3.4. Qwiic Connector Pinout Qwiic Pin Ground 3.3V SDA SCL Connection GND VMCU PC07 PC05 Shared Feature Suggested Peripherial Mapping Ground MGM260P voltage domain MIKROE_I2C_SDA I2Cx.SDA MIKROE_I2C_SCL I2Cx.SCL 3.6.5 Debug USB Type-C Connector The debug USB port can be used for uploading code, debugging, and as a Virtual COM port. More information is available in section 4. Debugging. silabs.com | Building a more connected world. Rev. 1.0 | 13 UG613: MGM260P Module Explorer Kit User's Guide Debugging 4. Debugging The MGM260P Module Explorer Kit contains an on-board SEGGER J-Link Debugger that interfaces to the target MGM260P using the Serial Wire Debug (SWD) interface. The debugger allows the user to download code and debug applications running in the target MGM260P. Additionally, it provides a virtual COM port (VCOM) to the host computer that is connected to the target device's serial port for general purpose communication between the running application and the host computer. The on-board debugger is accessible through the USB Type-C connector. 4.1 On-board Debugger The on-board debugger is a SEGGER J-Link debugger running on an EFM32 Giant Gecko. The debugger is directly connected to the debug and VCOM pins of the target MGM260P. When the debug USB cable is inserted, the on-board debugger is automatically activated and takes control of the debug and VCOM interfaces. This means that debug and communication will not work with an external debugger connected at the same time. The onboard LDO is also activated, providing power to the board. 4.2 Virtual COM Port The virtual COM port is a connection to a UART of the target MGM260P and allows serial data to be sent and received from the device. The on-board debugger presents this as a virtual COM port on the host computer that shows up when the USB cable is inserted. Data is transferred between the host computer and the debugger through the USB connection, which emulates a serial port using the USB Communication Device Class (CDC). From the debugger, the data is passed on to the target device through a physical UART connection. The serial format is 115200 bps, 8 bits, no parity, and 1 stop bit by default. Note: Changing the baud rate for the COM port on the PC side does not influence the UART baud rate between the debugger and the target device. silabs.com | Building a more connected world. Rev. 1.0 | 14 UG613: MGM260P Module Explorer Kit User's Guide Schematics, Assembly Drawings, and BOM 5. Schematics, Assembly Drawings, and BOM Schematics, assembly drawings, and Bill of Materials (BOM) are available through Simplicity Studio when the kit documentation package has been installed. They are also available from the kit page on the Silicon Labs website: silabs.com. silabs.com | Building a more connected world. Rev. 1.0 | 15 6. Kit Revision History and Errata UG613: MGM260P Module Explorer Kit User's Guide Kit Revision History and Errata 6.1 Revision History The kit revision can be found printed on the box label of the kit, as outlined in the figure below. The kit revision history is summarized in the table below. MGM260P Module Explorer Kit MGM260P-EK2713A 08-01-25 2416000960 A01 Kit Revision A00 Released 7 January 2025 6.2 Errata There are no known errata at present. Figure 6.1. Revision Info Table 6.1. Kit Revision History Description New kit introduction of MGM260P-EK2713A. silabs.com | Building a more connected world. Rev. 1.0 | 16 7. Board Revision History and Errata UG613: MGM260P Module Explorer Kit User's Guide Board Revision History and Errata 7.1 Revision History The board revision can be found laser printed on the board, and the board revision history is summarized in the following table. Table 7.1. Board Revision History Revision A04 Released 20 December 2024 Description Initial production release. 7.2 Errata There are no known errata at present. silabs.com | Building a more connected world. Rev. 1.0 | 17 8. Document Revision History Revision 1.0 February 2025 · Initial document release. UG613: MGM260P Module Explorer Kit User's Guide Document Revision History silabs.com | Building a more connected world. Rev. 1.0 | 18 Simplicity Studio One-click access to MCU and wireless tools, documentation, software, source code libraries & more. Available for Windows, Mac and Linux! IoT Portfolio www.silabs.com/IoT SW/HW www.silabs.com/simplicity Quality www.silabs.com/quality Support & Community www.silabs.com/community Disclaimer Silicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes without further notice to the product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Without prior notification, Silicon Labs may update product firmware during the manufacturing process for security or reliability reasons. Such changes will not alter the specifications or the performance of the product. Silicon Labs shall have no liability for the consequences of use of the information supplied in this document. This document does not imply or expressly grant any license to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any FDA Class III devices, applications for which FDA premarket approval is required or Life Support Systems without the specific written consent of Silicon Labs. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons. Silicon Labs disclaims all express and implied warranties and shall not be responsible or liable for any injuries or damages related to use of a Silicon Labs product in such unauthorized applications. Trademark Information Silicon Laboratories Inc.®, Silicon Laboratories®, Silicon Labs®, SiLabs® and the Silicon Labs logo®, Bluegiga®, Bluegiga Logo®, EFM®, EFM32®, EFR, Ember®, Energy Micro, Energy Micro logo and combinations thereof, "the world's most energy friendly microcontrollers", Redpine Signals®, WiSeConnect , n-Link, EZLink®, EZRadio®, EZRadioPRO®, Gecko®, Gecko OS, Gecko OS Studio, Precision32®, Simplicity Studio®, Telegesis, the Telegesis Logo®, USBXpress® , Zentri, the Zentri logo and Zentri DMS, Z-Wave®, and others are trademarks or registered trademarks of Silicon Labs. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered trademark of ARM Limited. Wi-Fi is a registered trademark of the Wi-Fi Alliance. All other products or brand names mentioned herein are trademarks of their respective holders. Silicon Laboratories Inc. 400 West Cesar Chavez Austin, TX 78701 USA www.silabs.com