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MIPOT MiP Series Wireless Protocol Modules

MIPOT-MiP-Series-Wireless-Protocol-Modules-FIG- (7)

Overview

The 32001551xUS is a family of transceivers operating in the 915 MHz SRD Band optimized for very long-range, low-power applications, suitable for LPWA networks. Based on LoRa® RF Technology provides ultra-long range spread spectrum communication and high interference immunity.

Thanks to its small LGA form factor (11.3 x 8.9 mm only) and its low current consumption, this module allows the implementation of highly integrated low-power (battery-operated) solutions for Internet of Things (IoT) applications, security systems, sensor networks, metering, smart buildings, agriculture, and supply chain. The 32001551xUS family features a dual-core microcontroller in which one is dedicated to the radio stack and the ARM Cortex M4 is free for the customer application firmware. It also includes a Secure Element chip to store the root of trust, sensitive data, keys, and certificates.

The available radio stacks support a wide range of applications as the wM-Bus standard (32001551AUS), accelerating the development of a LoRaWAN application (32001551BUS) using the LoRa modulation, or performing a local star network using the LoRa Mipot stack (32001551CUS). Using the LoRa Modem stack (32001551DUS), it is easy to create point-to-point applications or build a more complex custom stack. The 32001551FUS contains all the aforementioned stack allowing to switch between them at runtime.

Product Features

Mechanical highlights

  • Extremely compact dimensions
  • LGA pattern

Low power characteristics

  • Sleep current consumption 2.2 µA
  • 11 mA in RX mode

Memories

  • 196 kB Flash memory
  • 32 kB RAM
  • 512 B OTP
  • (One Time Programmable) memory

RF performances

  • -135 dBm Sensitivity LoRa
  • +20 dBm Output power

Additional features

  • ARM Cortex-M4 CPU
  • Preloaded radio library
  • Internal communication channel with the radio peripheral
  • Based on STM32WLE5J

Multiple Stacks available

  • wM-Bus (32001551AUS)
  • LoRaWAN (32001551BUS)
  • LoRa Mipot (32001551CUS)
  • LoRa Modem (32001551DUS)
  • LoRa Multistack (32001551FUS)

Emission designator

  • LoRa® DTS: 500KF1D
  • LoRa® FHSS: 125KFXD

Regulatory compliance

  • USA FCC Rules and Regulations CFR 47, Part 15, Subpart B (10-1-20 Edition)
  • USA FCC Part 15.247 (10-1-20 Edition): Operation within the bands 902 – 928 MHz, 2400 -2483.5 MHz, and 5725 – 5850 MHz.
  • USA FCC Part 15.209 (10-1-20 Edition): Radiated emission limits; general requirements.
  • USA FCC 47 CFR Part 2.1091 Radiofrequency radiation exposure evaluation: mobile devices.
  • ANSI C63.10-2013: American National Standard for Testing Unlicensed Wireless Devices.
  • CANADA ICES-003 Issue 7 (October 2020)
  • CANADA RSS-247 Issue 2 (February 2017).
  • CANADA RSS-Gen Issue 5 amendment 1 (March 2019).
  • CANADA ISED RSS-102 Issue 5 (2015-03) – Radio Frequency Exposure Compliance of Radiocommunication Apparatus (All Frequency Bands)

Mechanical Dimensions

MIPOT-MiP-Series-Wireless-Protocol-Modules-FIG- (1)MIPOT-MiP-Series-Wireless-Protocol-Modules-FIG- (2)

Note: Dimension in mm. General tolerance ±0.1mm. The tolerance is not cumulative.

Pin Definition

MIPOT-MiP-Series-Wireless-Protocol-Modules-FIG- (3)MIPOT-MiP-Series-Wireless-Protocol-Modules-FIG- (4)

32001552DUS LGA PAD STM32WL BGA BALL   32001552DUS LGA PAD STM32WL BGA BALL
A1 PA6 D1 GND
A2 PA5 D2 PB10
A3 PA4 D3 PB11
A4 PC0 D4 GND
A5 PC1 D5 PB14
A6 PB5 D6 PA10
A7 PB8 D7 VBAT
A8 PB9 D8 PB13
A9 VDD D9 PC2
B1 PA7 E1 GND
B2 PC6 E2 GND
B3 PA2 E4 PB1
B4 PA3 E6 PB2
B5 PB6 E7 PA12
B6 PB7 E9 PC3
B7 PA15 F1 ANT
B8 VDDA F2 GND
B9 VDD F9 PB12
C1 PH3-BOOT0 G1 GND
C2 PA8 G2 GND
C3 PA1 G3 GND
C4 GND G5 NRST
C5 PA0 G6 SWDIO
C6 PB4 G7 SWCLK
C7 VREF+ G8 SWO
C9 GND G9 PA9

Hardware integration

Decoupling capacitors
Each power supply pin must be decoupled with capacitors with the values suggested in the figure.

MIPOT-MiP-Series-Wireless-Protocol-Modules-FIG- (6)

Layout guidelines
For better noise rejection, put the decoupling capacitors as close as possible to the power pins of the module, giving precedence to the low-value ones. The trace connecting to the RF pin must have an impedance of 50 Ω. For better performance, connect the GND pads around the RF pin without thermals.

Electrical Characteristics
Absolute Maximum Ratings

Parameter Max. Unit
Supply Voltage (VDD) 3.9 V
Radio Frequency Input Level, pin F1 0 dBm
Voltage Standing Wave Radio (VSWR) at RF Input, ANT, pad F1 10:1  
I/O Pin voltage VDD + 0.3 V
Storage Temperature -40 ÷ 100 °C
Operating Temperature -40 ÷ 85 °C

Operating Condition
Note: All RF parameters are measured with input (pad F1, ANT) connected to a 50 Ω impedance signal source or load.

GENERAL ELECTRICAL CHARACTERISTICS 25 °C

Parameter Min. Typ. Max. Unit Notes
Supply Voltage (VDD) 1.9 3.0 3.6 V  
VDDA 0 3.6 V  
VBAT 1.55 3.6 V  
VIN -0.3 VDD+0.3 V  
Sleep DC Current 2.2 3.0 µA  
Data Rate 2-FSK 48 kbit/s  
Data Rate LoRa® 0.98 21.9 kbit/s  

RECEIVER ELECTRICAL CHARACTERISTICS 25 °C

Parameter Min. Typ. Max. Unit Notes
DC Current Drain 11 mA 6
Operating Frequency 902.0 928.0 MHz  
Channel Frequency Precision ±15 kHz  
Sensitivity, 2-FSK -115 dBm 2,3,5
Sensitivity, LoRa® -135 dBm 2,4,5
Spurious radiated level -57 dBm  
Output Logic Low GND 0.05 V  
Output Logic High VDD – 0.2 VDD V  

TRANSMITTER ELECTRICAL CHARACTERISTICS 25 °C

Parameter Min. Typ. Max. Unit Notes
Current Drain (CW @20 dBm) 138 mA 1,2
Operating frequency 902.0 928.0 MHz  
Occupied Bandwidth LoRa® DTS 500 kHz  
Occupied Bandwidth LoRa® FHSS 125 kHz 8
Operating Channel Width LoRa® 600 kHz  
Operating Channel Width LoRa® FHSS 200 kHz 8
Maximum Output power (50 Ω load) 20 dBm 1,2,7
RF Output Impedance 50  
Input Logic Low GND 0.05 V  
Input Logic High VDD – 0.2 VDD V  

Notes

  1. VDD = 3.6 V.
  2. All RF parameters are measured with input (pin F1, ANT) connected to a 50 Ω impedance signal source or load.
  3. Pseudo-random code NRZ, 2-FSK BER (bit error rate) = 0.1 % or better, 2-level FSK modulation without pre-filtering, Bit Rate = 4.8 kbit/s, frequency deviation = 5 kHz, filter bandwidth = 20 kHz.
  4. LoRa® PER (packet error rate) = 1 %, a packet of 64 bytes, preamble of 8 bytes, error correction code CR = 4/5, CRC on payload enabled, no reduced encoding, no implicit header.
  5. Sensitivities are given using the highest LNA gain step.
  6. Power consumption was measured with a -140 dBm signal and AGC ON.
  7. In order not to exceed the maximum power permitted by the FCC PART 15 regulation, choose an appropriate antenna system and power supply.
  8. Single hop OBW and OCW.

Temperature Range Curves
Note: All RF parameters measured d with input (pad F1) connected to a 50 Ω impedance signal source or load.

MIPOT-MiP-Series-Wireless-Protocol-Modules-FIG- (7)

Exposure assessment
A conservative evaluation distance of 20 cm has been used to perform the assessment. The Maximum Gain to meet FCC Radiofrequency radiation exposure limits is:

 

Technology/Mode

 

Band

 

Frequency (MHz)

 

Distance (cm)

FCC General Population Limit (mW/cm2) Maximum Gain to comply with RF Exposure Limits

(dBi)

LoRa ISM

(USA)

902 – 928 20 0.60 16.10

Antenna details
To perform the assessments the following antenna has been used as a reference:

Antenna model 2J0B15 – C885G
Parameters 868/915 MHz ISM Antenna
Standards ZigBee, ISM, SIGFOX, LoRa
Band (MHz) 868   915
Frequency (MHz) 863 – 870   902 – 928
Return Loss (dB) ̴ -7.8   -8.0
VSWR 2.4:1   2.4:1
Efficiency (%) 66.1   75.2
Peak Gain (dBi) 2.7   3.3
Average Gain (dB) -1.8   -1.2
Impedance (Ω)   50  
Polarization   Linear  
Radiation Pattern   Omni-Directional  
Max. Input Power (W)   25  

Application Notes

Title Description Doc
Command Reference Manual Description of commands for the wM-Bus stack 32001551AUS_Com_Ref
Command Reference Manual Description of commands for the LoRaWAN stack 32001551BUS_Com_Ref
Command Reference Manual Description of commands for the LoRa Mipot stack 32001551CUS_Com_Ref
Command Reference Manual Description of commands for the LoRa Modem stack 32001551DUS_Com_Ref
Command Reference Manual Description of commands for the multi-stack module 32001551FUS_Com_Ref
Manufacturing Process Information for LGA MiP Series Modules Packaging information, Tape& Reel Specification, Reflow soldering information  

AN_MNF002

STM32WLE5J data sheet Overview of the MCU and its peripherals DS13293 (from ST)
STM32WLE5J reference manual Detailed description of the MCU and its peripherals RM0453 (from ST)

Ordering Information

Title Description DoC
32001551AUS MiP-Wm-1C128S-US United States
32001551BUS MiP-Lw-1C128S-US United States
32001551CUS MiP-LoMi-1C128S-US United States
32001551DUS MiP-LoMo-1C128S-US United States
32001551FUS MiP-LwMo-1C128S-US United States

Regulatory Approvals
Models: 32001551AUS, 32001551BUS, 32001551CUS, 32001551DUS, 32001551FUS
The U.S. FCC ID: 2AQJP-MIP

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

CANADA
IC: 28566-MIP
HVIN: 32M01514A

 

 

PMN:

32001551AUS,

32001551BUS,

32001551CUS,

32001551DUS,

32001551FUS

 

 

HVIN:

32M01514A
HMN: FVIN:
Doc Title Description
DoI 32001505BUS_DoI Declaration of Identity

Revision History

Revision Date Description
0.0 07.06.2023 First emission
1.0 03.11.2023 Added regulatory approvals labels, exposure assessment and antenna details

Documents / Resources

MIPOT MiP Series Wireless Protocol Modules [pdf] Owner's Manual
32001551AUS, 32001551BUS, 32001551CUS, 32001551DUS, 32001551FUS, MiP Series Wireless Protocol Modules, MiP Series, Wireless Protocol Modules, Protocol Modules, Modules
MIPOT MiP Series Wireless Protocol Modules [pdf] Owner's Manual
32001506AUS, 32001506BUS, 32001506CUS, 32001506DUS, 32001506FUS, MiP Series Wireless Protocol Modules, MiP Series, Wireless Protocol Modules, Protocol Modules, Modules

References

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