MIPOT Wireless Protocol Modules MiP Series - Data Sheet

32001551xUS Family

Host Based LoRa™ Modem with MCU

Overview

The 32001551xUS is a family of transceivers operating in the 915 MHz SRD Band optimized for very long range, low power applications, suitable for LPWA networks. Based on LoRa® RF Technology, it provides ultra-long range spread spectrum communication and high interference immunity.

Thanks to its small LGA form factor (11.3 x 8.9 mm only) and its low current consumption, this module allows the implementation of highly integrated low power (battery operated) solutions for Internet of Things (IoT) applications, security systems, sensor networks, metering, smart buildings, agriculture, supply chain.

The 32001551xUS family features a dual core microcontroller in which one is dedicated to the radio stack and the ARM Cortex M4 is free for the customer application firmware.

It also includes a Secure Element chip to store root of trust, sensitive data, keys, certificates. The available radio stacks support a wide range of applications as the wM-Bus standard (32001551AUS), or accelerating the development of a LoRaWAN application (32001551BUS) using the LoRa modulation, or performing a local star network using the LoRa Mipot stack (32001551CUS). Using the LoRa Modem stack (32001551DUS), it is easy to create point-to-point applications or build a more complex custom stack. The 32001551FUS contains all the aforementioned stack allowing to switch between them at runtime.

1. Product Features

Mechanical highlights

Low power characteristics

Memories

RF performances

Additional features

Multiple Stacks available

Emission designator

Regulatory compliance

2. Mechanical Dimensions

Top View: The module has dimensions of 11.30 mm in length and 8.90 mm in width, with a height of 1.00 mm. A side view shows a height of 1.50 mm.

Footprint Top View: The LGA footprint is 11.30 mm x 8.90 mm, with pads arranged in a grid. Pad spacing is 0.70 mm and 1.27 mm.

Note: Dimension in mm. General tolerance ±0.1mm. The tolerance is not cumulative.

3. Pin Definition

Top View: The module features a pin grid labeled A1 through G9.

Bottom View: The pinout is mirrored from the top view, also labeled A1 through G9.

32001552DUS LGA PAD STM32WL BGA BALL 32001552DUS LGA PAD STM32WL BGA BALL
A1PA6D1GND
A2PA5D2PB10
A3PA4D3PB11
A4PC0D4GND
A5PC1D5PB14
A6PB5D6PA10
A7PB8D7VBAT
A8PB9D8PB13
A9VDDD9PC2
B1PA7E1GND
B2PC6E2GND
B3PA2E4PB1
B4PA3E6PB2
B5PB6E7PA12
B6PB7E9PC3
B7PA15F1ANT
B8VDDAF2GND
B9VDDF9PB12
C1PH3-BOOT0G1GND
C2PA8G2GND
C3PA1G3GND
C4GNDG5NRST
C5PA0G6SWDIO
C6PB4G7SWCLK
C7VREF+G8SWO
C9GNDG9PA9

4. Hardware Integration

4.1. Decoupling capacitors

Each power supply pin (VDD, Vdda, Vref+) must be decoupled with capacitors. The diagram shows recommended values: 4.7µF and 100nF for VDD, 1µF and 10nF for Vdda, and 1µF and 100nF for Vref+.

4.2. Layout guidelines

For better noise rejection, place the decoupling capacitors as close as possible to the power pins of the module, giving precedence to the low-value capacitors. The trace connecting to the RF pin (pad F1, ANT) must have an impedance of 50 Ω. For better performance, connect the GND pads around the RF pin without thermals.

5. Electrical Characteristics

5.1. Absolute Maximum Ratings

Parameter Max. Unit
Supply Voltage (VDD)3.9V
Radio Frequency Input Level, pin F10dBm
Voltage Standing Wave Radio (VSWR) at RF Input, ANT, pad F110:1
I/O Pin voltageVDD + 0.3V
Storage Temperature-40 ÷ 100°C
Operating Temperature-40 ÷ 85°C

5.2. Operating Condition

Note: All RF parameters measured with input (pad F1, ANT) connected to a 50 Ω impedance signal source or load.

5.2.1. GENERAL ELECTRICAL CHARACTERISTICS @ 25 °C

Parameter Min. Typ. Max. Unit Notes
Supply Voltage (VDD)1.93.03.6V
VDDA0-3.6V
VBAT1.55-3.6V
VIN-0.3-VDD+0.3V
Sleep DC Current-2.23.0µA
Data Rate 2-FSK--48kbit/s
Data Rate LoRa®0.98-21.9kbit/s

5.2.2. RECEIVER ELECTRICAL CHARACTERISTICS @ 25 °C

Parameter Min. Typ. Max. Unit Notes
DC Current Drain--11mA6
Operating Frequency902.0-928.0MHz
Channel Frequency Precision-±15-kHz
Sensitivity, 2-FSK--115-dBm2,3,5
Sensitivity, LoRa®--135-dBm2,4,5
Spurious radiated level---57dBm
Output Logic LowGND-0.05V
Output Logic HighVDD - 0.2-VDDV

5.2.3. TRANSMITTER ELECTRICAL CHARACTERISTICS @ 25 °C

Parameter Min. Typ. Max. Unit Notes
Current Drain (CW @20 dBm)-138-mA1,2
Operating frequency902.0-928.0MHz
Occupied Bandwidth LoRa® DTS500--kHz
Occupied Bandwidth LoRa® FHSS-125-kHz8
Operating Channel Width LoRa®-600-kHz
Operating Channel Width LoRa® FHSS-200-kHz8
Maximum Output power (50 Ω load)-20-dBm1,2,7
RF Output Impedance-50-Ω
Input Logic LowGND-0.05V
Input Logic HighVDD - 0.2-VDDV

Notes:

6. Temperature Range Curves

Note: All RF parameters measured with input (pad F1) connected to a 50 Ω impedance signal source or load.

TX Current Drain vs. Temperature (CW mode): This graph shows the current consumption in mA versus temperature in °C for VDD values of 2.1V, 3.0V, and 3.6V.

Output TX Power vs. Temperature (CW mode): This graph shows the output power in dBm versus temperature in °C for VDD values of 2.1V, 3.0V, and 3.6V.

7. Exposure Assessment

A conservative evaluation distance of 20 cm has been used to perform the assessment. The Maximum Gain to meet FCC Radiofrequency radiation exposure limits is:

Technology/Mode Band Frequency (MHz) Distance (cm) FCC General Population Limit (mW/cm²) Maximum Gain to comply with RF Exposure Limits (dBi)
LoRaISM (USA)902 - 928200.6016.10

8. Antenna Details

To perform the assessments, the following antenna was used as reference: Antenna model: 2J0B15-C885G, 868/915 MHz ISM Antenna. It supports ZigBee, ISM, SIGFOX, LoRa.

Parameters 868 915
Standards868/915 MHz ISM Antenna
Band (MHz)863 - 870902 - 928
Frequency (MHz)-7.8-8.0
Return Loss (dB)2.4:12.4:1
VSWR66.175.2
Efficiency (%)2.73.3
Peak Gain (dBi)-1.8-1.2
Average Gain (dB)50
Impedance (Ω)Linear
PolarizationOmni-Directional
Radiation Pattern25
Max. Input Power (W)

9. Application Notes

Title Description Doc
Command Reference ManualDescription of commands for the wM-Bus stack32001551AUS_Com_Ref
Command Reference ManualDescription of commands for the LoRaWAN stack32001551BUS_Com_Ref
Command Reference ManualDescription of commands for the LoRa Mipot stack32001551CUS_Com_Ref
Command Reference ManualDescription of commands for the LoRa Modem stack32001551DUS_Com_Ref
Command Reference ManualDescription of commands for the multi-stack module32001551FUS_Com_Ref
Manufacturing Process Information for LGA MiP Series ModulesPackaging information, Tape& Reel Specification, Reflow soldering informationAN_MNF002
STM32WLE5J data sheetOverview of the MCU and its peripheralsDS13293 (from ST)
STM32WLE5J reference manualDetailed description of the MCU and its peripheralsRM0453 (from ST)

10. Ordering Information

Title Description DoC
32001551AUSMiP-Wm-1C128S-USUnited States
32001551BUSMiP-Lw-1C128S-USUnited States
32001551CUSMiP-LoMi-1C128S-USUnited States
32001551DUSMiP-LoMo-1C128S-USUnited States
32001551FUSMiP-LwMo-1C128S-USUnited States

11. Regulatory Approvals

Models: 32001551AUS, 32001551BUS, 32001551CUS, 32001551DUS, 32001551FUS

U.S.

FCC ID: 2AQJP-MIP

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

CANADA

IC: 28566-MIP

HVIN: 32M01514A

PMN: 32001551AUS, 32001551BUS, 32001551CUS, 32001551DUS, 32001551FUS HVIN: 32M01514A
HMN: - FVIN: -
Doc Title Description
DoI 32001505BUS_DoI Declaration of Identity

12. Revision History

Revision Date Description
0.007.06.2023First emission
1.003.11.2023Added regulatory approvals labels, exposure assessment and antenna details
Models: 32001551AUS, 32001551BUS, 32001551CUS, 32001551DUS, 32001551FUS, MiP Series Wireless Protocol Modules, MiP Series, Wireless Protocol Modules, Protocol Modules, Modules

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References

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