Overview
The 32001551xUS is a family of transceivers operating in the 915 MHz SRD Band optimized for very long range, low power applications, suitable for LPWA networks. Based on LoRa® RF Technology, it provides ultra-long range spread spectrum communication and high interference immunity.
Thanks to its small LGA form factor (11.3 x 8.9 mm only) and its low current consumption, this module allows the implementation of highly integrated low power (battery operated) solutions for Internet of Things (IoT) applications, security systems, sensor networks, metering, smart buildings, agriculture, supply chain.
The 32001551xUS family features a dual core microcontroller in which one is dedicated to the radio stack and the ARM Cortex M4 is free for the customer application firmware.
It also includes a Secure Element chip to store root of trust, sensitive data, keys, certificates. The available radio stacks support a wide range of applications as the wM-Bus standard (32001551AUS), or accelerating the development of a LoRaWAN application (32001551BUS) using the LoRa modulation, or performing a local star network using the LoRa Mipot stack (32001551CUS). Using the LoRa Modem stack (32001551DUS), it is easy to create point-to-point applications or build a more complex custom stack. The 32001551FUS contains all the aforementioned stack allowing to switch between them at runtime.
1. Product Features
Mechanical highlights
- Extremely compact dimensions
- LGA pattern
Low power characteristics
- Sleep current consumption 2.2 µA
- 11 mA in RX mode
Memories
- 196 kB Flash memory
- 32 kB RAM
- 512 B OTP (One Time Programmable) memory
RF performances
- -135 dBm Sensitivity @LoRa®
- +20 dBm Output power
Additional features
- ARM Cortex-M4 CPU
- Preloaded radio library
- Internal communication channel with the radio peripheral
- Based on STM32WLE5J
Multiple Stacks available
- wM-Bus (32001551AUS)
- LoRaWAN (32001551BUS)
- LoRa Mipot (32001551CUS)
- LoRa Modem (32001551DUS)
- LoRa Multistack (32001551FUS)
Emission designator
- LoRa® DTS: 500KF1D
- LoRa® FHSS: 125KFXD
Regulatory compliance
- USA FCC Rules and Regulations CFR 47, Part 15, Subpart B (10-1-20 Edition)
- USA FCC Part 15.247 (10-1-20 Edition): Operation within the bands 902 - 928 MHz, 2400 - 2483.5 MHz, and 5725 - 5850 MHz.
- USA FCC Part 15.209 (10-1-20 Edition): Radiated emission limits; general requirements.
- USA FCC 47 CFR Part 2.1091 Radiofrequency radiation exposure evaluation: mobile devices.
- ANSI C63.10-2013: American National Standard for Testing Unlicensed Wireless Devices.
- CANADA ICES-003 Issue 7 (October 2020)
- CANADA RSS-247 Issue 2 (February 2017).
- CANADA RSS-Gen Issue 5 amendment 1 (March 2019).
- CANADA ISED RSS-102 Issue 5 (2015-03) – Radio Frequency Exposure Compliance of Radiocommunication Apparatus (All Frequency Bands)
2. Mechanical Dimensions
Top View: The module has dimensions of 11.30 mm in length and 8.90 mm in width, with a height of 1.00 mm. A side view shows a height of 1.50 mm.
Footprint Top View: The LGA footprint is 11.30 mm x 8.90 mm, with pads arranged in a grid. Pad spacing is 0.70 mm and 1.27 mm.
Note: Dimension in mm. General tolerance ±0.1mm. The tolerance is not cumulative.
3. Pin Definition
Top View: The module features a pin grid labeled A1 through G9.
Bottom View: The pinout is mirrored from the top view, also labeled A1 through G9.
32001552DUS LGA PAD | STM32WL BGA BALL | 32001552DUS LGA PAD | STM32WL BGA BALL |
---|---|---|---|
A1 | PA6 | D1 | GND |
A2 | PA5 | D2 | PB10 |
A3 | PA4 | D3 | PB11 |
A4 | PC0 | D4 | GND |
A5 | PC1 | D5 | PB14 |
A6 | PB5 | D6 | PA10 |
A7 | PB8 | D7 | VBAT |
A8 | PB9 | D8 | PB13 |
A9 | VDD | D9 | PC2 |
B1 | PA7 | E1 | GND |
B2 | PC6 | E2 | GND |
B3 | PA2 | E4 | PB1 |
B4 | PA3 | E6 | PB2 |
B5 | PB6 | E7 | PA12 |
B6 | PB7 | E9 | PC3 |
B7 | PA15 | F1 | ANT |
B8 | VDDA | F2 | GND |
B9 | VDD | F9 | PB12 |
C1 | PH3-BOOT0 | G1 | GND |
C2 | PA8 | G2 | GND |
C3 | PA1 | G3 | GND |
C4 | GND | G5 | NRST |
C5 | PA0 | G6 | SWDIO |
C6 | PB4 | G7 | SWCLK |
C7 | VREF+ | G8 | SWO |
C9 | GND | G9 | PA9 |
4. Hardware Integration
4.1. Decoupling capacitors
Each power supply pin (VDD, Vdda, Vref+) must be decoupled with capacitors. The diagram shows recommended values: 4.7µF and 100nF for VDD, 1µF and 10nF for Vdda, and 1µF and 100nF for Vref+.
4.2. Layout guidelines
For better noise rejection, place the decoupling capacitors as close as possible to the power pins of the module, giving precedence to the low-value capacitors. The trace connecting to the RF pin (pad F1, ANT) must have an impedance of 50 Ω. For better performance, connect the GND pads around the RF pin without thermals.
5. Electrical Characteristics
5.1. Absolute Maximum Ratings
Parameter | Max. | Unit |
---|---|---|
Supply Voltage (VDD) | 3.9 | V |
Radio Frequency Input Level, pin F1 | 0 | dBm |
Voltage Standing Wave Radio (VSWR) at RF Input, ANT, pad F1 | 10:1 | |
I/O Pin voltage | VDD + 0.3 | V |
Storage Temperature | -40 ÷ 100 | °C |
Operating Temperature | -40 ÷ 85 | °C |
5.2. Operating Condition
Note: All RF parameters measured with input (pad F1, ANT) connected to a 50 Ω impedance signal source or load.
5.2.1. GENERAL ELECTRICAL CHARACTERISTICS @ 25 °C
Parameter | Min. | Typ. | Max. | Unit | Notes |
---|---|---|---|---|---|
Supply Voltage (VDD) | 1.9 | 3.0 | 3.6 | V | |
VDDA | 0 | - | 3.6 | V | |
VBAT | 1.55 | - | 3.6 | V | |
VIN | -0.3 | - | VDD+0.3 | V | |
Sleep DC Current | - | 2.2 | 3.0 | µA | |
Data Rate 2-FSK | - | - | 48 | kbit/s | |
Data Rate LoRa® | 0.98 | - | 21.9 | kbit/s |
5.2.2. RECEIVER ELECTRICAL CHARACTERISTICS @ 25 °C
Parameter | Min. | Typ. | Max. | Unit | Notes |
---|---|---|---|---|---|
DC Current Drain | - | - | 11 | mA | 6 |
Operating Frequency | 902.0 | - | 928.0 | MHz | |
Channel Frequency Precision | - | ±15 | - | kHz | |
Sensitivity, 2-FSK | - | -115 | - | dBm | 2,3,5 |
Sensitivity, LoRa® | - | -135 | - | dBm | 2,4,5 |
Spurious radiated level | - | - | -57 | dBm | |
Output Logic Low | GND | - | 0.05 | V | |
Output Logic High | VDD - 0.2 | - | VDD | V |
5.2.3. TRANSMITTER ELECTRICAL CHARACTERISTICS @ 25 °C
Parameter | Min. | Typ. | Max. | Unit | Notes |
---|---|---|---|---|---|
Current Drain (CW @20 dBm) | - | 138 | - | mA | 1,2 |
Operating frequency | 902.0 | - | 928.0 | MHz | |
Occupied Bandwidth LoRa® DTS | 500 | - | - | kHz | |
Occupied Bandwidth LoRa® FHSS | - | 125 | - | kHz | 8 |
Operating Channel Width LoRa® | - | 600 | - | kHz | |
Operating Channel Width LoRa® FHSS | - | 200 | - | kHz | 8 |
Maximum Output power (50 Ω load) | - | 20 | - | dBm | 1,2,7 |
RF Output Impedance | - | 50 | - | Ω | |
Input Logic Low | GND | - | 0.05 | V | |
Input Logic High | VDD - 0.2 | - | VDD | V |
Notes:
- 1) VDD = 3.6 V.
- 2) All RF parameters measured with input (pin F1, ANT) connected to 50 Ω impedance signal source or load.
- 3) Pseudo random code NRZ, 2-FSK BER (bit error rate) = 0.1 % or better, 2-level FSK modulation without pre-filtering, Bit Rate = 4.8 kbit/s, frequency deviation = 5 kHz, filter bandwidth = 20 kHz.
- 4) LoRa® PER (packet error rate) = 1 %, packet of 64 bytes, preamble of 8 bytes, error correction code CR = 4/5, CRC on payload enabled, no reduced encoding, no implicit header.
- 5) Sensitivities given using highest LNA gain step.
- 6) Power consumption measured with -140 dBm signal and AGC ON.
- 7) In order not to exceed the maximum power permitted by the FCC PART 15 regulation, choose an appropriate antenna system and power supply.
- 8) Single hop OBW and OCW.
6. Temperature Range Curves
Note: All RF parameters measured with input (pad F1) connected to a 50 Ω impedance signal source or load.
TX Current Drain vs. Temperature (CW mode): This graph shows the current consumption in mA versus temperature in °C for VDD values of 2.1V, 3.0V, and 3.6V.
Output TX Power vs. Temperature (CW mode): This graph shows the output power in dBm versus temperature in °C for VDD values of 2.1V, 3.0V, and 3.6V.
7. Exposure Assessment
A conservative evaluation distance of 20 cm has been used to perform the assessment. The Maximum Gain to meet FCC Radiofrequency radiation exposure limits is:
Technology/Mode | Band | Frequency (MHz) | Distance (cm) | FCC General Population Limit (mW/cm²) | Maximum Gain to comply with RF Exposure Limits (dBi) |
---|---|---|---|---|---|
LoRa | ISM (USA) | 902 - 928 | 20 | 0.60 | 16.10 |
8. Antenna Details
To perform the assessments, the following antenna was used as reference: Antenna model: 2J0B15-C885G, 868/915 MHz ISM Antenna. It supports ZigBee, ISM, SIGFOX, LoRa.
Parameters | 868 | 915 |
---|---|---|
Standards | 868/915 MHz ISM Antenna | |
Band (MHz) | 863 - 870 | 902 - 928 |
Frequency (MHz) | -7.8 | -8.0 |
Return Loss (dB) | 2.4:1 | 2.4:1 |
VSWR | 66.1 | 75.2 |
Efficiency (%) | 2.7 | 3.3 |
Peak Gain (dBi) | -1.8 | -1.2 |
Average Gain (dB) | 50 | |
Impedance (Ω) | Linear | |
Polarization | Omni-Directional | |
Radiation Pattern | 25 | |
Max. Input Power (W) |
9. Application Notes
Title | Description | Doc |
---|---|---|
Command Reference Manual | Description of commands for the wM-Bus stack | 32001551AUS_Com_Ref |
Command Reference Manual | Description of commands for the LoRaWAN stack | 32001551BUS_Com_Ref |
Command Reference Manual | Description of commands for the LoRa Mipot stack | 32001551CUS_Com_Ref |
Command Reference Manual | Description of commands for the LoRa Modem stack | 32001551DUS_Com_Ref |
Command Reference Manual | Description of commands for the multi-stack module | 32001551FUS_Com_Ref |
Manufacturing Process Information for LGA MiP Series Modules | Packaging information, Tape& Reel Specification, Reflow soldering information | AN_MNF002 |
STM32WLE5J data sheet | Overview of the MCU and its peripherals | DS13293 (from ST) |
STM32WLE5J reference manual | Detailed description of the MCU and its peripherals | RM0453 (from ST) |
10. Ordering Information
Title | Description | DoC |
---|---|---|
32001551AUS | MiP-Wm-1C128S-US | United States |
32001551BUS | MiP-Lw-1C128S-US | United States |
32001551CUS | MiP-LoMi-1C128S-US | United States |
32001551DUS | MiP-LoMo-1C128S-US | United States |
32001551FUS | MiP-LwMo-1C128S-US | United States |
11. Regulatory Approvals
Models: 32001551AUS, 32001551BUS, 32001551CUS, 32001551DUS, 32001551FUS
U.S.
FCC ID: 2AQJP-MIP
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
CANADA
IC: 28566-MIP
HVIN: 32M01514A
PMN: | 32001551AUS, 32001551BUS, 32001551CUS, 32001551DUS, 32001551FUS | HVIN: | 32M01514A |
HMN: | - | FVIN: | - |
Doc | Title | Description |
DoI | 32001505BUS_DoI | Declaration of Identity |
12. Revision History
Revision | Date | Description |
---|---|---|
0.0 | 07.06.2023 | First emission |
1.0 | 03.11.2023 | Added regulatory approvals labels, exposure assessment and antenna details |