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Qualcomm QCC730M-OP Wi-Fi Module FCC Compliance Report

This comprehensive report details the electromagnetic emissions compliance testing for the Qualcomm QCC730M-OP, a Micro-Power Wi-Fi LGA Module designed for advanced Internet of Things (IoT) applications.

Developed by Qualcomm Technologies, Inc., this module facilitates reliable wireless connectivity. The testing, conducted by SGS Taiwan Ltd., rigorously evaluates the device's adherence to FCC regulations, with a specific focus on Transmit Power Control (TPC) and Dynamic Frequency Selection (DFS) functionalities.

Key information presented includes:

Product: Micro-Power Wi-Fi LGA Module for IoT applications
Brand: Qualcomm
Model Number: QCC730M-OP
Manufacturer: Qualcomm Technologies, Inc.
Testing Agency: SGS Taiwan Ltd.
Report Identifier: TERF2501000160ER
Compliance Focus: FCC Part 15, Subpart E (TPC & DFS)

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