Qualcomm® QCC730M Micro-Power Dual-Band Wi-Fi Module
Overview
The Qualcomm® QCC730M is an industry-leading 1x1 dual-band Wi-Fi 4 module designed to deliver micro-power Wi-Fi, flexibility to scale, and versatility for ease of design. It is intended to unleash new battery-powered Wi-Fi capabilities or replace traditional Bluetooth® Low Energy-enabled IoT applications. The module's selectable power modes and innovative power management allow for exponential battery life in battery-powered or energy-harvested IoT devices. The QCC730M includes an open-source SDK and a VS Code-based IDE for streamlined development, featuring a software stack that supports cloud connectivity offloading for a comprehensive solution. It offers direct cloud connectivity with full stack offloading, freeing up the host processor for dedicated IoT applications. The QCC730M is driven by an open-source SDK available on CodeLinaro and is equipped with the Qualcomm® Connectivity Integrated Development Environment based on Microsoft Visual Studio Code (VS Code). A QCC730M-specific VS Code extension plugin is available as open-source software for customized VS Code environments. Pre-certified, size, and cost-optimized modules and development kits are also available to accelerate product development and minimize time to market.
Highlights
- Unbelievable micro-power Wi-Fi for extremely long battery life: Selectable power modes and innovative power management maximize savings for extended battery life, making it Qualcomm's lowest-power Wi-Fi module for IoT connectivity.
- Flexibility to scale: Offers extreme flexibility for developers by operating in either hostless or hosted mode, supporting an internal or external power amplifier, and having integrated, non-volatile memory.
- Versatile system for ease of design: Features full integration of the on-chip microcontroller, NVM, and SRAM for versatility and ease of design, empowering developers to replace or integrate with traditionally Bluetooth-only applications.
- Full cloud connectivity stack: Provides a complete solution with all cloud connectivity stack offloading, an open-source SDK available on CodeLinaro, and a VS Code-based IDE along with an associated development kit.
Ordering Information
| Module | Product Code | Order Number | FEM | Embedded Memory | USB | Antenna Config | Ext Memory |
|---|---|---|---|---|---|---|---|
| QCC730M | QCC730M-1-AA | QCC-730M-1-LGM42-MT-00-0-AA | IPA | No | N | PCB Antenna | 4 MB Flash |
| QCC730M-1-AB | QCC-730M-1-LGM42A-MT-00-0-AB | IPA | RF Connector | ||||
| QCC730M-1-AD | QCC-730M-1-LGM42B-MT-00-0-AD | XPA | PCB Antenna | ||||
| QCC730M-1-AE | QCC-730M-1-LGM42C-MT-00-0-AE | XPA | RF Connector | ||||
| EVK | 65-79685-1 | EVK-QCC730M-1-00-0-AA | IPA | PCB Antenna | |||
| 65-79685-2 | EVK-QCC730M-1-00-0-AB | IPA | RF Connector | ||||
| 65-79685-3 | EVK-QCC730M-1-00-0-AD | XPA | PCB Antenna | ||||
| 65-79685-4 | EVK-QCC730M-1-00-0-AE | XPA | RF Connector |
Materials are subject to change without notice. Document revision: 87-84453-1 Rev. D
Target Applications
- Smart Door Locks
- Battery-Powered IP Cameras
- Video Doorbells
- Smart Sensors
- Wearables and Portable Medical Devices
- Smart Tags
Features
- Dedicated 60 MHz applications processor to cover full cloud connectivity stack and applications
- Dual-band 1x1 802.11a/b/g/n, HT20, up to MCS3
- On-chip 1.5 MB RRAM (NVM) and 640 KB SRAM provide sufficient memory resource without the need for an external NOR flash
- Integrated hardware crypto accelerator
- Advanced power management scheme to minimize power dissipation for each use case
Specifications
| Category | Specifications |
|---|---|
| CPU | Processor with FPU @ 60 MHz 1.5 MB RRAM (600 KB for applications) 640 KB SRAM (260 KB for applications) |
| Wi-Fi | XIP over QSPI Flash Dual-band 1x1 802.11a/b/g/n, HT20, up to MCS3 |
| Security Support | Integrated hardware crypto accelerations Security services (boot, debug, provisioning, com/OTA, etc.) |
| Interfaces & Peripherals | 36 Pins SPI (slave), QSPI (master), I2C (master), UART (2-wire) Wakeup, VBAT, GND, FEM Signaling |
| Package Type | 36-pin LGA module package, all module variants are pin-compatible • iPA: 12.28 x 19.8 x 2.6 mm (PCB Antenna) and 12.28 x 14.8 x 2.2 mm (RF Connector) • xPA: 12.28 x 23.0 x 2.6 mm (PCB Antenna) and 12.28 x 18.0 x 2.6 mm (RF Connector) |
Related Products
This product is based on the Qualcomm QCC730, an industry-leading 1x1 Wi-Fi 4 transceiver built to deliver ultralow micro-power Wi-Fi, flexibility to scale, and versatility for ease of design.
Block Diagrams
QCC730M IPA Module Block Diagram
This diagram illustrates the Qualcomm QCC730M IPA module. It shows the Wi-Fi Antenna connecting to a Diplexer, which then splits the signal into 2.4G and 5G paths, each with a Band Pass Filter (BPF). The core processing is handled by the QCC730 chip (WLCSP-90 package, 3.30 x 3.58 x 0.55 mm), operating at 38.4MHz, with an optional 32.768kHz oscillator. The chip includes FreeRTOS, JTAG, 15x GPIO pins, EXT_WAKEUP_INTR_N signal, and 4 MB of QSPI NOR Flash memory. GPIO8 is also indicated as optional.
QCC730M XPA Module Block Diagram
This diagram outlines the Qualcomm QCC730M XPA module. Similar to the IPA version, it features a Wi-Fi Antenna connected to a Diplexer, splitting signals for 2.4G and 5G. However, this version includes dedicated 2.4G XPA and 5G XPA components for power amplification. The central QCC730 chip (WLCSP-90 package, 3.30 x 3.58 x 0.55 mm) runs at 38.4MHz, with an optional 32.768kHz oscillator. It supports FreeRTOS, JTAG, GPIO, EXT_WAKEUP_INTR_N, and has 4 MB of QSPI NOR Flash memory. GPIO8 is marked as optional.
