DFI RPS183-Q670E and RPS183-H610E Motherboards
Supporting 14th/13th/12th Gen Intel® Core™ Processors
Overview
The DFI RPS183-Q670E and RPS183-H610E are Mini-ITX motherboards designed for industrial applications, featuring support for a wide range of Intel® Core™ processors from the 14th, 13th, and 12th generations. These boards offer robust connectivity and expansion options suitable for demanding environments.
Key Features
- Processors: Support for 14th/13th/12th Gen Intel® LGA 1700 Socket Processors with TDP up to 65W.
- Memory: 2x DDR5 SODIMM slots supporting up to 64GB of dual-channel DDR5 4800MHz memory.
- Expansion: 1x PCIe Gen4 x4 slot, 1x M.2 2280 M Key slot, 1x M.2 2230 E Key slot, and 1x M.2 2242/3042/3052 B Key slot.
- Storage: Multiple SATA 3.0 interfaces.
- Networking: Dual 2.5GbE LAN ports (Intel® I226-V or I226-LM for Q670E).
- Display: Multiple display outputs including DP++, USB Type-C (DP Alt-mode), and eDP, supporting resolutions up to 4096x2304 @ 60Hz.
- I/O: Rich rear I/O including USB 3.2 Gen2, USB 2.0, and COM ports.
- Power: Wide voltage input range (19-24V DC-In).
- Form Factor: Mini-ITX.
Block Diagram
The block diagram illustrates the connectivity and component layout, including CPU, Chipset, Memory, PCIe, M.2 slots, SATA, USB controllers, LAN, Audio, and various internal headers.
Key Connections:
- CPU Interface: LGA 1700 Socket for Intel® Raptor Lake-S processors.
- Memory Channels: Dual Channel DDR5 support.
- Expansion Slots: PCIe x4, M.2 slots (M Key, E Key, B Key).
- Connectivity: Multiple USB 3.2 Gen2, USB 2.0 ports, 2.5GbE LAN, SATA 3.0.
- Display Outputs: DP++, HDMI, eDP.
- Internal Headers: COM ports, DIO, SPI, I2C, FAN headers, USB headers.
Mechanical Drawing
The mechanical drawing provides detailed dimensions of the motherboard, including length, width, and the placement of key connectors and components. The dimensions are approximately 195mm x 170mm.
Specifications Table
| Specification | RPS183-Q670E | RPS183-H610E |
|---|---|---|
| Processor | 14th/13th/12th Gen Intel® LGA 1700 Socket Processors, TDP up to 65W | 14th/13th/12th Gen Intel® LGA 1700 Socket Processors, TDP up to 65W |
| Chipset | Intel® Q670E Chipset | Intel® H610E Chipset |
| Memory | 2x 262-pin SODIMM up to 64GB, Dual Channel DDR5 4800MHz | 2x 262-pin SODIMM up to 64GB, Dual Channel DDR5 4800MHz |
| BIOS | AMI SPI 256Mbit | AMI SPI 256Mbit |
| Graphics Controller | Intel® UHD Graphics 700 series | Intel® UHD Graphics 700 series |
| Graphics Feature | OpenGL 4.5, DirectX 12, OpenCL 2.1. Supports HW Decode/Encode for various codecs. | OpenGL 4.5, DirectX 12, OpenCL 2.1. Supports HW Decode/Encode for various codecs. |
| Display Outputs | 1x DP++(CPU), 1x DP++(MXM), 1x USB Type C (DP Alt-mode), 1x eDP(MXM), 1x Internal HDMI(MXM) | 1x DP++(CPU), 1x DP++(MXM), 1x USB Type C (DP Alt-mode), 1x eDP(MXM), 1x Internal HDMI(MXM) |
| Multiple Display | 1 DP++(CPU) + 1 DP++(MXM) + 1 USB Type C(DP Alt-mode) + 1 eDP(MXM) + 1 internal HDMI(MXM) | 1 DP++(CPU) + 1 DP++(MXM) + 1 USB Type C(DP Alt-mode) + 1 eDP(MXM) + 1 internal HDMI(MXM) |
| Expansion Interface | 1x PCIe Gen4 x4, 1x M.2 2280 M Key, 1x M.2 2230 E Key, 1x M.2 2242/3042/3052 B Key, 1x MXM Type-A/B/B+ | 1x M.2 2280 M Key, 1x M.2 2230 E Key, 1x M.2 2242/3042/3052 B Key, 1x MXM Type-A/B/B+ |
| Audio Controller | Realtek ALC888S | Realtek ALC888S |
| Ethernet Controller | 2x Intel® 2.5GbE (I226-V/LM) | 1x Intel® I219V (Gigabit Ethernet) |
| Rear I/O USB | 4x USB 3.2 Gen2 or 3x USB 3.2 Gen2 + 1x USB Type C | 2x USB 3.2 Gen2 + 2x USB 2.0 or 2x USB 3.2 Gen2 + 1x USB Type C |
| Rear I/O Display | 1x DP++, 1x DP++(MXM), 1x USB Type C | 1x DP++, 1x DP++(MXM), 1x USB Type C |
| Internal I/O USB | 2 x USB 3.2 Gen1 Header, 1 x USB 2.0 Type A | 2 x USB 3.2 Gen1 Header, 1 x USB 2.0 Type A |
| Internal I/O Display | 1 x eDP(MXM), 1 x HDMI(MXM) | 1 x eDP(MXM), 1 x HDMI(MXM) |
| Serial | 2 x RS-232/422/485 | 2 x RS-232/422/485 |
| SATA | 1 x SATA 3.0 | 1 x SATA 3.0 |
| DIO | 1 x 8-bit DIO | 1 x 8-bit DIO |
| SPI | 1 x SPI (For OOB) | 1 x SPI (For OOB) |
| I2C | 2 x I2C | 2 x I2C |
| FAN | 1 x CPU, 2 x System | 1 x CPU, 2 x System |
| Watchdog Timer | System Reset, Programmable via Software from 1 to 255 Seconds | System Reset, Programmable via Software from 1 to 255 Seconds |
| Security | dTPM (default), fTPM (option) | dTPM (default), fTPM (option) |
| Power Type | DC IN | DC IN |
| Power Consumption | Idle/Max values provided for various CPU/GPU configurations. Example: Idle i9-13900E 65W with MXM A4500: 24V @ 2.03A (48.72W) | Idle/Max values provided for various CPU/GPU configurations. Example: Idle i9-13900E 65W with MXM A4500: 24V @ 2.03A (48.72W) |
| OS Support | Microsoft Windows, Linux Ubuntu | Microsoft Windows, Linux Ubuntu |
| Environment Temperature | Operating w/o MXM: -5°C ~ 65°C. Operating w/i MXM: By MXM spec. Storage: -40°C ~ 85°C. | Operating w/o MXM: -5°C ~ 65°C. Operating w/i MXM: By MXM spec. Storage: -40°C ~ 85°C. |
| Humidity | Operating: 5% ~ 90% RH. Storage: 5% ~ 90% RH. | Operating: 5% ~ 90% RH. Storage: 5% ~ 90% RH. |
| MTBF | RPS183-Q670E: 480,169 hrs @ 25°C; 281,641 hrs @ 45°C; 182,084 hrs @ 60°C. Calculation model: Telcordia Issue 4. | RPS183-H610E: 480,169 hrs @ 25°C; 281,641 hrs @ 45°C; 182,084 hrs @ 60°C. Calculation model: Telcordia Issue 4. |
| Dimensions | 195mm (7.7") x 170mm (6.7") | 195mm (7.7") x 170mm (6.7") |
| Height | PCB: 1.6mm. Top Side: 26.0mm (Audio); 25.79mm(RJ45). Bottom Side: 13.53mm. | PCB: 1.6mm. Top Side: 26.0mm (Audio); 25.79mm(RJ45). Bottom Side: 13.53mm. |
| Certification | CE, FCC, RoHS, UKCA | CE, FCC, RoHS, UKCA |
Ordering Information
| Model Name | P/N | Memory | Rear I/O Display | Rear I/O USB | Internal I/O M.2 | Internal I/O Display | TPM | Power | Operating Temp. |
|---|---|---|---|---|---|---|---|---|---|
| RPS183-H610EDB | 770-RPS1831-000G | 2 DDR5 | 2 DP++ | 2 USB 3.2 Gen2, 1 USB Type C | 1 M/B/E Key | 2 USB 3.2 Gen1, 1 USB 2.0 Type A | w/TPM | 19~24VDC | -5 to 65°C |
| RPS183-Q670EDB | 770-RPS1831-100G | 2 DDR5 | 2 DP++ | 3 USB 3.2 Gen2, 1 USB Type C | 1 M/B/E Key | 2 USB 3.2 Gen1, 1 USB 2.0 Type A | w/TPM | 19~24VDC | -5 to 65°C |
| RPS183-H610EDB | 770-RPS1831-200G | 2 DDR5 | 1 HDMI*, 2 DP++ | 2 USB 3.2 Gen2, 2 USB 2.0 Type A | 1 M/B/E Key | 2 USB 3.2 Gen1, 1 USB 2.0 Type A | w/TPM | 19~24VDC | -5 to 65°C |
| RPS183-Q670EDB | 770-RPS1831-300G | 2 DDR5 | 1 HDMI*, 2 DP++ | 4 USB 3.2 Gen2 | 1 M/B/E Key | 2 USB 3.2 Gen1, 1 USB 2.0 Type A | w/TPM | 19~24VDC | -5 to 65°C |
NOTE: * Full functionality requires MXM implementation.
Optional Items
- Active Thermal Solution (65W): P/N: A71-101137-000G. Thermal solution for 65W CPUs, Height: 46mm.
- Active Thermal Solution (35W): P/N: A71-101136-000G. Thermal solution for 35W CPUs, Height: 39mm.
- PSU (450W, 24V): P/N: 671-745001-000G. Manufacturer: Meanwell HRP-450-24.
- Power adapter (360W, 24V): P/N: 671-136001-000G. Manufacturer: Meanwell GST360B24-C6P.
- Power adapter (160W, 24V): P/N: 671-116005-000G. Manufacturer: Meanwell GST160A24-DFIA.
- Power terminal converting cable (Spade-to-Phoenix 4P): P/N: A81-004398-018G. 20cm, for Meanwell HRP-450-24.
- Power terminal converting cable (ATX 6P-to-Phoenix 4P): P/N: A81-004397-018G. 20cm, for Meanwell GST360B24-C6P.
- Power terminal converting cable (DC5.5-to-ATX 2x2P): P/N: A81-004110-009G. 20cm, for Meanwell GST160A24-DFIA.
Packing List
- 1 RPS183 motherboard
- 1 Serial ATA data cable (Length: 500mm)
- 2 M.2 screws
- 3 WIRE FAN CABLE 4P/1.25mm to 2.54mm, L=150mm
- 1 COM PORT CABLE, L=250mm
