DFI RPS183-Q670E & RPS183-H610E Mini-ITX Motherboards

For 14th/13th/12th Gen Intel® Core Processors

Overview

The DFI RPS183-Q670E and RPS183-H610E are Mini-ITX form factor motherboards designed for desktop and industrial applications, supporting 14th, 13th, and 12th Generation Intel® Core processors with LGA 1700 socket. They offer robust features including DDR5 memory support, wide voltage input, multiple display outputs, and extensive expansion capabilities.

Key Features

  • DDR5 Memory: Supports 2 DDR5 SODIMM slots, up to 64GB.
  • Wide Voltage Input: Power input range of 19-24V DC.
  • Multiple Display: Supports up to 4 displays via DP++ (CPU), DP++ (MXM), USB Type-C (DP Alt-mode), eDP (MXM), and internal HDMI (MXM).
  • Multiple Expansion: Features 1 PCIe x4 slot (side), M.2 slots (2280 M Key, 2230 E Key, 2242/3042/3052 B Key), and MXM support.
  • Rich I/O: Includes dual Intel® 2.5GbE LAN, up to 4 USB 3.2 Type-A ports, and up to 1 USB Type-C port.

Block Diagram Overview

The block diagram illustrates the core architecture. It features an Intel® LGA 1700 socket for 14th/13th/12th Gen Intel® Core processors. Memory is supported via dual-channel DDR5 4800MHz SODIMM slots (Channel A and Channel B). Connectivity includes multiple PCIe lanes (PCIe x4, PCIe x16, PCIe x1) for expansion and peripherals, MXM 3.1 slots for graphics modules, and various I/O interfaces such as USB 3.2 Gen2, USB 3.2 Gen1, USB 2.0, SATA 3.0, 2.5GbE LAN, and audio jacks. The diagram also highlights M.2 slots (2280 M Key, 2230 E Key, 2242/3042/3052 B Key) and SIM card slot.

Mechanical Specifications

The motherboards conform to the Mini-ITX standard with dimensions of 195mm (7.7 inches) x 170mm (6.7 inches). The PCB thickness is 1.6mm. Key port locations are indicated by measurements: Top side features include audio and RJ45 connectors, with a bottom side height of 13.53mm.

Processor Support

Model NameProcessor Options
RPS183-Q670E14th Generation Intel® LGA 1700 Socket Processors (TDP up to 65W): Core™ i9-14900 (24 Cores, 36M Cache, up to 5.8 GHz); Core™ i9-14900T (24 Cores, 36M Cache, up to 5.5 GHz); Core™ i7-14700 (20 Cores, 33M Cache, up to 5.4 GHz); Core™ i7-14700T (20 Cores, 33M Cache, up to 5.2 GHz); Core™ i5-14500 (14 Cores, 24M Cache, up to 5.0 GHz); Core™ i5-14500T (14 Cores, 24M Cache, up to 4.8 GHz); Core™ i5-14400 (10 Cores, 20M Cache, up to 4.7 GHz); Core™ i5-14400T (10 Cores, 20M Cache, up to 4.5 GHz); Core™ i3-14100 (4 Cores, 12M Cache, up to 4.7 GHz); Core™ i3-14100T (4 Cores, 12M Cache, up to 4.4 GHz); Intel® 300 (2 Cores, 6M Cache, 3.9 GHz); Intel® 300T (2 Cores, 4M Cache, 3.4 GHz).
13th Generation Intel® LGA 1700 Socket Processors (TDP up to 65W): Core™ i9-13900E (24 Cores, 36M Cache, up to 5.2 GHz); Core™ i9-13900TE (24 Cores, 36M Cache, up to 5.0 GHz); Core™ i7-13700E (16 Cores, 30M Cache, up to 5.1 GHz); Core™ i7-13700TE (16 Cores, 30M Cache, up to 4.8 GHz); Core™ i7-13700T (16 Cores, 30M Cache, up to 4.9 GHz); Core™ i5-13500E (14 Cores, 24M Cache, up to 4.6 GHz); Core™ i5-13500TE (14 Cores, 24M Cache, up to 4.5 GHz); Core™ i5-13500T (14 Cores, 24M Cache, up to 4.6 GHz); Core™ i5-13400E (10 Cores, 20M Cache, up to 4.6 GHz); Core™ i3-13100E (4 Cores, 12M Cache, up to 3.3 GHz); Core™ i3-13100TE (4 Cores, 12M Cache, up to 4.1 GHz); Core™ i3-13100T (4 Cores, 12M Cache, up to 4.2 GHz).
12th Generation Intel® LGA 1700 Socket Processors (TDP up to 65W): Core™ i9-12900E (16 Cores, 30M Cache, up to 5.0 GHz); Core™ i9-12900TE (16 Cores, 30M Cache, up to 4.8 GHz); Core™ i7-12700E (12 Cores, 25M Cache, up to 4.8 GHz); Core™ i7-12700TE (12 Cores, 25M Cache, up to 4.6 GHz); Core™ i5-12500E (6 Cores, 18M Cache, up to 4.5 GHz); Core™ i5-12500TE (6 Cores, 18M Cache, up to 4.3 GHz); Core™ i3-12100E (4 Cores, 12M Cache, up to 4.2 GHz); Core™ i3-12100TE (4 Cores, 12M Cache, up to 4.0 GHz); Pentium® G7400E (2 Cores, 6M Cache, 3.6 GHz); Pentium® G7400TE (2 Cores, 6M Cache, 3.0 GHz); Celeron® G6900E (2 Cores, 4M Cache, 3.0 GHz); Celeron® G6900TE (2 Cores, 4M Cache, 2.4 GHz).
RPS183-H610E14th Generation Intel® LGA 1700 Socket Processors (TDP up to 65W): Core™ i5-14500 (14 Cores, 24M Cache, up to 5.0 GHz); Core™ i5-14500T (14 Cores, 24M Cache, up to 4.8 GHz); Core™ i5-14400 (10 Cores, 20M Cache, up to 4.7 GHz); Core™ i5-14400T (10 Cores, 20M Cache, up to 4.5 GHz); Core™ i3-14100 (4 Cores, 12M Cache, up to 4.7 GHz); Core™ i3-14100T (4 Cores, 12M Cache, up to 4.4 GHz); Intel® 300 (2 Cores, 6M Cache, 3.9 GHz); Intel® 300T (2 Cores, 4M Cache, 3.4 GHz).
13th Generation Intel® LGA 1700 Socket Processors (TDP up to 65W): Core™ i5-13500E (14 Cores, 24M Cache, up to 4.6 GHz); Core™ i5-13500TE (14 Cores, 24M Cache, up to 4.5 GHz); Core™ i5-13500T (14 Cores, 24M Cache, up to 4.6 GHz); Core™ i5-13400E (10 Cores, 20M Cache, up to 4.6 GHz); Core™ i3-13100E (4 Cores, 12M Cache, up to 3.3 GHz); Core™ i3-13100TE (4 Cores, 12M Cache, up to 4.1 GHz); Core™ i3-13100T (4 Cores, 12M Cache, up to 4.2 GHz).
12th Generation Intel® LGA 1700 Socket Processors (TDP up to 65W): Core™ i5-12500E (6 Cores, 18M Cache, up to 4.5 GHz); Core™ i5-12500TE (6 Cores, 18M Cache, up to 4.3 GHz); Core™ i3-12100E (4 Cores, 12M Cache, up to 4.2 GHz); Core™ i3-12100TE (4 Cores, 12M Cache, up to 4.0 GHz); Pentium® G7400E (2 Cores, 6M Cache, 3.6 GHz); Pentium® G7400TE (2 Cores, 6M Cache, 3.0 GHz); Celeron® G6900E (2 Cores, 4M Cache, 3.0 GHz); Celeron® G6900TE (2 Cores, 4M Cache, 2.4 GHz).

Chipset, Memory & BIOS

CategoryRPS183-Q670ERPS183-H610E
ChipsetIntel® Q670E ChipsetIntel® H610E Chipset
Memory2x 262-pin SODIMM up to 64GB, Dual Channel DDR5 4800MHz2x 262-pin SODIMM up to 64GB, Dual Channel DDR5 4800MHz
BIOSAMI SPI 256MbitAMI SPI 256Mbit

Graphics

CategoryControllerFeatureDisplay OutputsMultiple Display
GraphicsIntel® UHD Graphics 700 seriesOpenGL 4.5, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9
HW Encode: MPEG2, AVC/H264, JPEG, HEVC/H265, VP8, VP9
1 x DP++(CPU): Resolution up to 4096x2304 @ 60Hz
1 x DP++(MXM): Resolution by MXM
1 x USB Type C: DP Alt-mode, Resolution up to 4096x2304 @60Hz
1 x eDP(MXM): Resolution by MXM
1 x Internal HDMI: Resolution by MXM
1 DP++(CPU) + 1 DP++(MXM) + 1 USB Type C(DP Alt-mode) + 1 eDP(MXM) + 1 internal HDMI(MXM)

Expansion Interface

CategoryRPS183-Q670ERPS183-H610E
Expansion Slots1 x PCIe Gen4 x4 (side)
1 x M.2 2280 M Key (PCIE Gen3x4, SATA3)
1 x M.2 2230 E Key (PCIE Gen3x1, USB 2.0, support Intel® CNVi)
1 x MXM Type-A/B/B+
1 x M.2 2242/3042/3052 B Key (PCIE Gen3x1, USB 3.2 Gen2, USB 2.0)
1 x M.2 2280 M Key (PCIE Gen3x4, SATA3)
1 x M.2 2230 E Key (PCIE Gen3x1, USB 2.0, support Intel® CNVi)
1 x MXM Type-A/B/B+
1 x M.2 2242/3042/3052 B Key (PCIE Gen3x1, USB 3.2 Gen1, USB 2.0)

Audio & Ethernet

CategoryRPS183-Q670ERPS183-H610E
Audio CodecRealtek ALC888SRealtek ALC888S
Ethernet Controller1 x Intel® I226LM(vPro)(10/100/1000/2500Mbps)
1 x Intel® I226V (10/100/1000/2500Mbps)
1 x Intel® I219V (10/100/1000/2500Mbps)
1 x Intel® I226V (10/100/1000/2500Mbps)

Rear I/O

CategoryRPS183-Q670ERPS183-H610E
Audio1 Audio Jack (Line-out/Mic-in) (Audio header by opt.)1 Audio Jack (Line-out/Mic-in) (Audio header by opt.)
USB2 x USB 3.2 Gen2, 1 x USB Type C2 x USB 3.2 Gen2, 2 x USB 2.0 Type A
Display1 x DP++, 1 DP++(MXM), 1 x USB Type C1 x DP++, 1 DP++(MXM), 1 x USB Type C
Serial2 x RS-232/422/4852 x RS-232/422/485
SATA1 x SATA 3.01 x SATA 3.0
LAN2 x 2.5GbE RJ452 x 2.5GbE RJ45

Internal I/O

CategoryRPS183-Q670ERPS183-H610E
USB2 x USB 3.2 Gen1 Header, 1 x USB 2.0 Type A2 x USB 3.2 Gen1 Header, 1 x USB 2.0 Type A
Display1 x eDP(MXM), 1 x HDMI(MXM)1 x eDP(MXM), 1 x HDMI(MXM)
DIO1 x 8-bit DIO (BOX HEADER 1*10P/1.00mm)1 x 8-bit DIO (BOX HEADER 1*10P/1.00mm)
SPI1 x SPI (BOX HEADER 1*7P/1.25mm)(For OOB)1 x SPI (BOX HEADER 1*7P/1.25mm)(For OOB)
I2C2 x I2C (BOX HEADER, 1*5P/1.0m)2 x I2C (BOX HEADER, 1*5P/1.0m)
FAN1 x CPU, 2 x System (WAFER, 1*4P/1.25mm)1 x CPU, 2 x System (WAFER, 1*4P/1.25mm)

Watchdog Timer, Security & Power

CategoryDetails
Watchdog TimerSystem Reset, Programmable via Software from 1 to 255 Seconds
SecuritydTPM (default), fTPM (option)
Power TypeDC IN
Power Connector4-pin Terminal 19~24V DC-In
Power Consumption (Idle/Max Example: i9-13900E 65W with MXM A4500)Idle: 24V @ 2.03A (48.72W), 19V @ 2.50A (47.50W) / Max: 24V @ 11.66A (279.84W), 19V @ 14.73A (279.87W)
Power Consumption (Idle/Max Example: i9-13900E 65W)Idle: 24V @ 2.60A (62.40W), 19V @ 3.13A (59.47W) / Max: 24V @ 6.40A (153.60W), 19V @ 8.08A (153.52W)

OS Support, Environment & Certification

CategoryRPS183-Q670ERPS183-H610E
RTC BatteryCR2032 Coin CellCR2032 Coin Cell
OS Support (Microsoft)Windows 10 IoT Enterprise 64-bit
Windows 11 LTSC
Windows 10 IoT Enterprise 64-bit
Windows 11 LTSC
OS Support (Linux)Linux Ubuntu 22.04Linux Ubuntu 22.04
Temperature (Operating w/o MXM)-5°C ~ 65°C-5°C ~ 65°C
Temperature (Operating w/ MXM)By MXM specBy MXM spec
Temperature (Storage)-40°C ~ 85°C-40°C ~ 85°C
Humidity (Operating)5% ~ 90% RH5% ~ 90% RH
Humidity (Storage)5% ~ 90% RH5% ~ 90% RH
MTBF (Calculated)480,169 hrs @ 25°C; 281,641 hrs @ 45°C; 182,084 hrs @ 60°C (Telcordia Issue 4)480,169 hrs @ 25°C; 281,641 hrs @ 45°C; 182,084 hrs @ 60°C (Telcordia Issue 4)
Dimensions195mm (7.7") x 170mm (6.7")195mm (7.7") x 170mm (6.7")
HeightPCB: 1.6mm
Top Side: 26.0mm (Audio); 25.79mm(RJ45)
Bottom Side: 13.53mm
PCB: 1.6mm
Top Side: 26.0mm (Audio); 25.79mm(RJ45)
Bottom Side: 13.53mm
CertificationCE, FCC, RoHS, UKCACE, FCC, RoHS, UKCA

Ordering Information

Model NameP/NMemoryDisplay2.5 GbEUSBInternal I/O (PCIE, M.2, Display, USB)TPMPowerOperating Temp.
RPS183-H610EDB770-RPS1831-000G2 DDR52 DP*++N/A2 USB 3.2 Gen2, 1 USB Type C1 PCIEx4 (side), 1 M.2 M/B/E Key, 1 eDP*, 1 HDMI*w/TPM19~24V DC-5 to 65°C
RPS183-Q670EDB770-RPS1831-100G2 DDR52 DP*++2.5 GbE3 USB 3.2 Gen2, 1 USB Type C1 PCIEx4 (side), 1 M.2 M/B/E Key, 1 eDP*, 1 HDMI*w/TPM19~24V DC-5 to 65°C
RPS183-H610EDB770-RPS1831-200G2 DDR52 DP*++N/A2 USB 3.2 Gen2, 2 USB 2.0 Type A1 PCIEx4 (side), 1 M.2 M/B/E Key, 1 eDP*, 1 HDMI*N/A19~24V DC-5 to 65°C
RPS183-Q670EDB770-RPS1831-300G2 DDR52 DP*++2.5 GbE4 USB 3.2 Gen21 PCIEx4 (side), 1 M.2 M/B/E Key, 1 eDP*, 1 HDMI*N/A19~24V DC-5 to 65°C

(NOTE: * Full functionality requires MXM implementation)

Optional Items

  • Active Thermal Solution (65W): P/N A71-101137-000G (Thermal solution for 65W, Height: 46mm)
  • Active Thermal Solution (35W): P/N A71-101136-000G (Thermal solution for 35W, Height: 39mm)
  • PSU (450W, 24V): P/N 671-745001-000G (Meanwell HRP-450-24)
  • Power adapter (360W, 24V): P/N 671-136001-000G (Meanwell GST360B24-C6P)
  • Power adapter (160W, 24V): P/N 671-116005-000G (Meanwell GST160A24-DFIA)
  • Power terminal converting cable (Spade-to-Phoenix 4P): P/N A81-004398-018G (20cm, for Meanwell HRP-450-24)
  • Power terminal converting cable (ATX 6P-to-Phoenix 4P): P/N A81-004397-018G (20cm, for Meanwell GST360B24-C6P)
  • Power terminal converting cable (DC5.5-to-ATX 2x2P): P/N A81-004110-009G (20cm, for Meanwell GST160A24-DFIA)

Packing List

  • 1 RPS183 motherboard
  • 1 Serial ATA data cable (Length: 500mm)
  • 2 M.2 screws
  • 3 WIRE FAN CABLE 4P/1.25mm to 2.54mm, L=150mm
  • 1 COM PORT CABLE, L=250mm

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