DFI RPS183-Q670E & RPS183-H610E Mini-ITX Motherboards
For 14th/13th/12th Gen Intel® Core™ Processors
Overview
The DFI RPS183-Q670E and RPS183-H610E are Mini-ITX form factor motherboards designed for desktop and industrial applications, supporting 14th, 13th, and 12th Generation Intel® Core™ processors with LGA 1700 socket. They offer robust features including DDR5 memory support, wide voltage input, multiple display outputs, and extensive expansion capabilities.
Key Features
- DDR5 Memory: Supports 2 DDR5 SODIMM slots, up to 64GB.
- Wide Voltage Input: Power input range of 19-24V DC.
- Multiple Display: Supports up to 4 displays via DP++ (CPU), DP++ (MXM), USB Type-C (DP Alt-mode), eDP (MXM), and internal HDMI (MXM).
- Multiple Expansion: Features 1 PCIe x4 slot (side), M.2 slots (2280 M Key, 2230 E Key, 2242/3042/3052 B Key), and MXM support.
- Rich I/O: Includes dual Intel® 2.5GbE LAN, up to 4 USB 3.2 Type-A ports, and up to 1 USB Type-C port.
Block Diagram Overview
The block diagram illustrates the core architecture. It features an Intel® LGA 1700 socket for 14th/13th/12th Gen Intel® Core™ processors. Memory is supported via dual-channel DDR5 4800MHz SODIMM slots (Channel A and Channel B). Connectivity includes multiple PCIe lanes (PCIe x4, PCIe x16, PCIe x1) for expansion and peripherals, MXM 3.1 slots for graphics modules, and various I/O interfaces such as USB 3.2 Gen2, USB 3.2 Gen1, USB 2.0, SATA 3.0, 2.5GbE LAN, and audio jacks. The diagram also highlights M.2 slots (2280 M Key, 2230 E Key, 2242/3042/3052 B Key) and SIM card slot.
Mechanical Specifications
The motherboards conform to the Mini-ITX standard with dimensions of 195mm (7.7 inches) x 170mm (6.7 inches). The PCB thickness is 1.6mm. Key port locations are indicated by measurements: Top side features include audio and RJ45 connectors, with a bottom side height of 13.53mm.
Processor Support
Model Name | Processor Options |
---|---|
RPS183-Q670E | 14th Generation Intel® LGA 1700 Socket Processors (TDP up to 65W): Core™ i9-14900 (24 Cores, 36M Cache, up to 5.8 GHz); Core™ i9-14900T (24 Cores, 36M Cache, up to 5.5 GHz); Core™ i7-14700 (20 Cores, 33M Cache, up to 5.4 GHz); Core™ i7-14700T (20 Cores, 33M Cache, up to 5.2 GHz); Core™ i5-14500 (14 Cores, 24M Cache, up to 5.0 GHz); Core™ i5-14500T (14 Cores, 24M Cache, up to 4.8 GHz); Core™ i5-14400 (10 Cores, 20M Cache, up to 4.7 GHz); Core™ i5-14400T (10 Cores, 20M Cache, up to 4.5 GHz); Core™ i3-14100 (4 Cores, 12M Cache, up to 4.7 GHz); Core™ i3-14100T (4 Cores, 12M Cache, up to 4.4 GHz); Intel® 300 (2 Cores, 6M Cache, 3.9 GHz); Intel® 300T (2 Cores, 4M Cache, 3.4 GHz). 13th Generation Intel® LGA 1700 Socket Processors (TDP up to 65W): Core™ i9-13900E (24 Cores, 36M Cache, up to 5.2 GHz); Core™ i9-13900TE (24 Cores, 36M Cache, up to 5.0 GHz); Core™ i7-13700E (16 Cores, 30M Cache, up to 5.1 GHz); Core™ i7-13700TE (16 Cores, 30M Cache, up to 4.8 GHz); Core™ i7-13700T (16 Cores, 30M Cache, up to 4.9 GHz); Core™ i5-13500E (14 Cores, 24M Cache, up to 4.6 GHz); Core™ i5-13500TE (14 Cores, 24M Cache, up to 4.5 GHz); Core™ i5-13500T (14 Cores, 24M Cache, up to 4.6 GHz); Core™ i5-13400E (10 Cores, 20M Cache, up to 4.6 GHz); Core™ i3-13100E (4 Cores, 12M Cache, up to 3.3 GHz); Core™ i3-13100TE (4 Cores, 12M Cache, up to 4.1 GHz); Core™ i3-13100T (4 Cores, 12M Cache, up to 4.2 GHz). 12th Generation Intel® LGA 1700 Socket Processors (TDP up to 65W): Core™ i9-12900E (16 Cores, 30M Cache, up to 5.0 GHz); Core™ i9-12900TE (16 Cores, 30M Cache, up to 4.8 GHz); Core™ i7-12700E (12 Cores, 25M Cache, up to 4.8 GHz); Core™ i7-12700TE (12 Cores, 25M Cache, up to 4.6 GHz); Core™ i5-12500E (6 Cores, 18M Cache, up to 4.5 GHz); Core™ i5-12500TE (6 Cores, 18M Cache, up to 4.3 GHz); Core™ i3-12100E (4 Cores, 12M Cache, up to 4.2 GHz); Core™ i3-12100TE (4 Cores, 12M Cache, up to 4.0 GHz); Pentium® G7400E (2 Cores, 6M Cache, 3.6 GHz); Pentium® G7400TE (2 Cores, 6M Cache, 3.0 GHz); Celeron® G6900E (2 Cores, 4M Cache, 3.0 GHz); Celeron® G6900TE (2 Cores, 4M Cache, 2.4 GHz). |
RPS183-H610E | 14th Generation Intel® LGA 1700 Socket Processors (TDP up to 65W): Core™ i5-14500 (14 Cores, 24M Cache, up to 5.0 GHz); Core™ i5-14500T (14 Cores, 24M Cache, up to 4.8 GHz); Core™ i5-14400 (10 Cores, 20M Cache, up to 4.7 GHz); Core™ i5-14400T (10 Cores, 20M Cache, up to 4.5 GHz); Core™ i3-14100 (4 Cores, 12M Cache, up to 4.7 GHz); Core™ i3-14100T (4 Cores, 12M Cache, up to 4.4 GHz); Intel® 300 (2 Cores, 6M Cache, 3.9 GHz); Intel® 300T (2 Cores, 4M Cache, 3.4 GHz). 13th Generation Intel® LGA 1700 Socket Processors (TDP up to 65W): Core™ i5-13500E (14 Cores, 24M Cache, up to 4.6 GHz); Core™ i5-13500TE (14 Cores, 24M Cache, up to 4.5 GHz); Core™ i5-13500T (14 Cores, 24M Cache, up to 4.6 GHz); Core™ i5-13400E (10 Cores, 20M Cache, up to 4.6 GHz); Core™ i3-13100E (4 Cores, 12M Cache, up to 3.3 GHz); Core™ i3-13100TE (4 Cores, 12M Cache, up to 4.1 GHz); Core™ i3-13100T (4 Cores, 12M Cache, up to 4.2 GHz). 12th Generation Intel® LGA 1700 Socket Processors (TDP up to 65W): Core™ i5-12500E (6 Cores, 18M Cache, up to 4.5 GHz); Core™ i5-12500TE (6 Cores, 18M Cache, up to 4.3 GHz); Core™ i3-12100E (4 Cores, 12M Cache, up to 4.2 GHz); Core™ i3-12100TE (4 Cores, 12M Cache, up to 4.0 GHz); Pentium® G7400E (2 Cores, 6M Cache, 3.6 GHz); Pentium® G7400TE (2 Cores, 6M Cache, 3.0 GHz); Celeron® G6900E (2 Cores, 4M Cache, 3.0 GHz); Celeron® G6900TE (2 Cores, 4M Cache, 2.4 GHz). |
Chipset, Memory & BIOS
Category | RPS183-Q670E | RPS183-H610E |
---|---|---|
Chipset | Intel® Q670E Chipset | Intel® H610E Chipset |
Memory | 2x 262-pin SODIMM up to 64GB, Dual Channel DDR5 4800MHz | 2x 262-pin SODIMM up to 64GB, Dual Channel DDR5 4800MHz |
BIOS | AMI SPI 256Mbit | AMI SPI 256Mbit |
Graphics
Category | Controller | Feature | Display Outputs | Multiple Display |
---|---|---|---|---|
Graphics | Intel® UHD Graphics 700 series | OpenGL 4.5, DirectX 12, OpenCL 2.1 HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9 HW Encode: MPEG2, AVC/H264, JPEG, HEVC/H265, VP8, VP9 | 1 x DP++(CPU): Resolution up to 4096x2304 @ 60Hz 1 x DP++(MXM): Resolution by MXM 1 x USB Type C: DP Alt-mode, Resolution up to 4096x2304 @60Hz 1 x eDP(MXM): Resolution by MXM 1 x Internal HDMI: Resolution by MXM | 1 DP++(CPU) + 1 DP++(MXM) + 1 USB Type C(DP Alt-mode) + 1 eDP(MXM) + 1 internal HDMI(MXM) |
Expansion Interface
Category | RPS183-Q670E | RPS183-H610E |
---|---|---|
Expansion Slots | 1 x PCIe Gen4 x4 (side) 1 x M.2 2280 M Key (PCIE Gen3x4, SATA3) 1 x M.2 2230 E Key (PCIE Gen3x1, USB 2.0, support Intel® CNVi) 1 x MXM Type-A/B/B+ 1 x M.2 2242/3042/3052 B Key (PCIE Gen3x1, USB 3.2 Gen2, USB 2.0) | 1 x M.2 2280 M Key (PCIE Gen3x4, SATA3) 1 x M.2 2230 E Key (PCIE Gen3x1, USB 2.0, support Intel® CNVi) 1 x MXM Type-A/B/B+ 1 x M.2 2242/3042/3052 B Key (PCIE Gen3x1, USB 3.2 Gen1, USB 2.0) |
Audio & Ethernet
Category | RPS183-Q670E | RPS183-H610E |
---|---|---|
Audio Codec | Realtek ALC888S | Realtek ALC888S |
Ethernet Controller | 1 x Intel® I226LM(vPro)(10/100/1000/2500Mbps) 1 x Intel® I226V (10/100/1000/2500Mbps) | 1 x Intel® I219V (10/100/1000/2500Mbps) 1 x Intel® I226V (10/100/1000/2500Mbps) |
Rear I/O
Category | RPS183-Q670E | RPS183-H610E |
---|---|---|
Audio | 1 Audio Jack (Line-out/Mic-in) (Audio header by opt.) | 1 Audio Jack (Line-out/Mic-in) (Audio header by opt.) |
USB | 2 x USB 3.2 Gen2, 1 x USB Type C | 2 x USB 3.2 Gen2, 2 x USB 2.0 Type A |
Display | 1 x DP++, 1 DP++(MXM), 1 x USB Type C | 1 x DP++, 1 DP++(MXM), 1 x USB Type C |
Serial | 2 x RS-232/422/485 | 2 x RS-232/422/485 |
SATA | 1 x SATA 3.0 | 1 x SATA 3.0 |
LAN | 2 x 2.5GbE RJ45 | 2 x 2.5GbE RJ45 |
Internal I/O
Category | RPS183-Q670E | RPS183-H610E |
---|---|---|
USB | 2 x USB 3.2 Gen1 Header, 1 x USB 2.0 Type A | 2 x USB 3.2 Gen1 Header, 1 x USB 2.0 Type A |
Display | 1 x eDP(MXM), 1 x HDMI(MXM) | 1 x eDP(MXM), 1 x HDMI(MXM) |
DIO | 1 x 8-bit DIO (BOX HEADER 1*10P/1.00mm) | 1 x 8-bit DIO (BOX HEADER 1*10P/1.00mm) |
SPI | 1 x SPI (BOX HEADER 1*7P/1.25mm)(For OOB) | 1 x SPI (BOX HEADER 1*7P/1.25mm)(For OOB) |
I2C | 2 x I2C (BOX HEADER, 1*5P/1.0m) | 2 x I2C (BOX HEADER, 1*5P/1.0m) |
FAN | 1 x CPU, 2 x System (WAFER, 1*4P/1.25mm) | 1 x CPU, 2 x System (WAFER, 1*4P/1.25mm) |
Watchdog Timer, Security & Power
Category | Details |
---|---|
Watchdog Timer | System Reset, Programmable via Software from 1 to 255 Seconds |
Security | dTPM (default), fTPM (option) |
Power Type | DC IN |
Power Connector | 4-pin Terminal 19~24V DC-In |
Power Consumption (Idle/Max Example: i9-13900E 65W with MXM A4500) | Idle: 24V @ 2.03A (48.72W), 19V @ 2.50A (47.50W) / Max: 24V @ 11.66A (279.84W), 19V @ 14.73A (279.87W) |
Power Consumption (Idle/Max Example: i9-13900E 65W) | Idle: 24V @ 2.60A (62.40W), 19V @ 3.13A (59.47W) / Max: 24V @ 6.40A (153.60W), 19V @ 8.08A (153.52W) |
OS Support, Environment & Certification
Category | RPS183-Q670E | RPS183-H610E |
---|---|---|
RTC Battery | CR2032 Coin Cell | CR2032 Coin Cell |
OS Support (Microsoft) | Windows 10 IoT Enterprise 64-bit Windows 11 LTSC | Windows 10 IoT Enterprise 64-bit Windows 11 LTSC |
OS Support (Linux) | Linux Ubuntu 22.04 | Linux Ubuntu 22.04 |
Temperature (Operating w/o MXM) | -5°C ~ 65°C | -5°C ~ 65°C |
Temperature (Operating w/ MXM) | By MXM spec | By MXM spec |
Temperature (Storage) | -40°C ~ 85°C | -40°C ~ 85°C |
Humidity (Operating) | 5% ~ 90% RH | 5% ~ 90% RH |
Humidity (Storage) | 5% ~ 90% RH | 5% ~ 90% RH |
MTBF (Calculated) | 480,169 hrs @ 25°C; 281,641 hrs @ 45°C; 182,084 hrs @ 60°C (Telcordia Issue 4) | 480,169 hrs @ 25°C; 281,641 hrs @ 45°C; 182,084 hrs @ 60°C (Telcordia Issue 4) |
Dimensions | 195mm (7.7") x 170mm (6.7") | 195mm (7.7") x 170mm (6.7") |
Height | PCB: 1.6mm Top Side: 26.0mm (Audio); 25.79mm(RJ45) Bottom Side: 13.53mm | PCB: 1.6mm Top Side: 26.0mm (Audio); 25.79mm(RJ45) Bottom Side: 13.53mm |
Certification | CE, FCC, RoHS, UKCA | CE, FCC, RoHS, UKCA |
Ordering Information
Model Name | P/N | Memory | Display | 2.5 GbE | USB | Internal I/O (PCIE, M.2, Display, USB) | TPM | Power | Operating Temp. |
---|---|---|---|---|---|---|---|---|---|
RPS183-H610EDB | 770-RPS1831-000G | 2 DDR5 | 2 DP*++ | N/A | 2 USB 3.2 Gen2, 1 USB Type C | 1 PCIEx4 (side), 1 M.2 M/B/E Key, 1 eDP*, 1 HDMI* | w/TPM | 19~24V DC | -5 to 65°C |
RPS183-Q670EDB | 770-RPS1831-100G | 2 DDR5 | 2 DP*++ | 2.5 GbE | 3 USB 3.2 Gen2, 1 USB Type C | 1 PCIEx4 (side), 1 M.2 M/B/E Key, 1 eDP*, 1 HDMI* | w/TPM | 19~24V DC | -5 to 65°C |
RPS183-H610EDB | 770-RPS1831-200G | 2 DDR5 | 2 DP*++ | N/A | 2 USB 3.2 Gen2, 2 USB 2.0 Type A | 1 PCIEx4 (side), 1 M.2 M/B/E Key, 1 eDP*, 1 HDMI* | N/A | 19~24V DC | -5 to 65°C |
RPS183-Q670EDB | 770-RPS1831-300G | 2 DDR5 | 2 DP*++ | 2.5 GbE | 4 USB 3.2 Gen2 | 1 PCIEx4 (side), 1 M.2 M/B/E Key, 1 eDP*, 1 HDMI* | N/A | 19~24V DC | -5 to 65°C |
(NOTE: * Full functionality requires MXM implementation)
Optional Items
- Active Thermal Solution (65W): P/N A71-101137-000G (Thermal solution for 65W, Height: 46mm)
- Active Thermal Solution (35W): P/N A71-101136-000G (Thermal solution for 35W, Height: 39mm)
- PSU (450W, 24V): P/N 671-745001-000G (Meanwell HRP-450-24)
- Power adapter (360W, 24V): P/N 671-136001-000G (Meanwell GST360B24-C6P)
- Power adapter (160W, 24V): P/N 671-116005-000G (Meanwell GST160A24-DFIA)
- Power terminal converting cable (Spade-to-Phoenix 4P): P/N A81-004398-018G (20cm, for Meanwell HRP-450-24)
- Power terminal converting cable (ATX 6P-to-Phoenix 4P): P/N A81-004397-018G (20cm, for Meanwell GST360B24-C6P)
- Power terminal converting cable (DC5.5-to-ATX 2x2P): P/N A81-004110-009G (20cm, for Meanwell GST160A24-DFIA)
Packing List
- 1 RPS183 motherboard
- 1 Serial ATA data cable (Length: 500mm)
- 2 M.2 screws
- 3 WIRE FAN CABLE 4P/1.25mm to 2.54mm, L=150mm
- 1 COM PORT CABLE, L=250mm