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RPS9HC- R680E/Q670E/H610E

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RPS9HCR680E/Q670E/H610E

13th Gen Intel® CoreTM COM HPC® Client Size C

FCLGA1700
Intel® PCH R680E/Q670E/H610E

Front View

DDR5 SO-DIMM1 DDR5 SO-DIMM3
CPU Fan
DDR5 SO-DIMM2 DDR5 SO-DIMM4

KEY FEATURES

Bottom View

8K

DDR5
4 DDR5 SODIMM up to 128GB

8K High Resolution
DDI supports up to 8K

Quad Displays
4 Display ports: eDP + 3DDI

Multiple Expansion
1 PCIe x16 (Gen5), 4 PCIe x4 (Gen4), 2 PCIe x4 (Gen3), 2 PCIe x1 (Gen3)

RICH I/O
2 Intel 2.5GbE, 6 USB 3.2 Gen2, 8 USB 2.0

COM-HPC J1 A/B/C/D COM-HPC J2 E/F/G/H

BLOCK DIAGRAM

DDI Port 0 DDI Port 1 eDP Port
PCIE_LANE [8:11]

DDI_B DDI_C DDI_A
PCIE x4

PCIe Gen4

PCIE_LANE [0:1] PCIE_LANE [4:7] PCIE_LANE [12:15]
SATA 0/1 USB6/USB7 USB0_SS P0-P1
USB1_SS P0-P1
NBASET0 SPI
HDA SNDW0/1 ESPI

2* PCIE x1 PCIE x4 PCIE x4 SATA 3.0 x2 USB 2.0 x2

PCIe Gen3 PCIe Gen3 PCIe Gen4

USB 3.2 Gen2 x2 USB 2.0 x1
USB 3.2 Gen2 x2 USB 2.0 x1

MDI

Intel

I226

PCIE x1

SPI BUS

TPM 2.0 (Option)

HDA eSPI

SPI Flash BIOS (256M bit)

Intel Raptor-Lake CPU
LGA 1700 65W

SO-DIMM 2DPC Channel A DDR5 3600 MHz

Channel B DDR5 3600 MHz

DDI_D

PCIe Gen5

PCIe x16

HSIO P10-11 HSIO P14-16 HSIO P30-33 HSIO P26-27

x8 DMI 4.0 HSIO P22-25 PCIe Gen4 HSIO P18-21 PCIe Gen3 HSIO P34-37 PCIe Gen4

PCIe x4 PCIe x4 PCIe x4

HSIO P0-1 HSIO P6-7

HSIO P2-3 HSIO P4-5

HSIO P13

HSIO P17

SPI
Intel ADL-S PCH
HDA SNDW Q670E
ESPI

2 Ports USB 3.2 Gen2 x1 USB 2.0 x2

2 Ports USB 3.2 Gen2 x1 USB 2.0 x2

PCIe x1

Intel

MDI

I226

GPIO [0:11] UART0/1

12bits DIO Serial Port 1,2
SLP/LID

WDT

Fan PWM/TACH_IN

I2C0 USB_PD_I2C

I2C BUS
CMOS Backup EEPROM

Embedded Controller IT8528VG-I
I2C_SMB (OPTION)

I2C0

SMBUS

SMBUS

SMBUS (OPTION) SMBUS_RESUME

GSPI 0/1

GSPI

GSPI

I2C1 1.8V

I2C4

DDI Port 2 PCIE_LANE [16:31]
PCIE_LANE [32:35] PCIE_LANE [36:39] PCIE_LANE [40:43] USB2_SS P0-P1 USB3_SS P0-P1 NBASET1

MECHANICAL DRAWING

120.00 114.00

116.00

106.00 101.13

98.15

77.13

55.30 54.85
33.19

6.00 0.00

156.00 160.00

153.48

93.56 90.45 100.00 116.48 127.95

52.95

20.00 26.44

0.00

160.00

0.00

0.00 10.00

110.00 120.00
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SPECIFICATION

SYSTEM

Processor

GRAPHICS EXPANSION

Chipset Memory
BIOS Controller Feature
Display
Multiple Displays Interface

AUDIO ETHERNET I/O

Audio Codec Phy USB

WATCHDOG TIMER SECURITY POWER

SATA GPIO Output & Interval TPM Type

OS SUPPORT ENVIRONMENT

Consumption Microsoft Linux Temperature

Humidity

MECHANICAL STANDARDS AND CERTIFICATIONS

MTBF Dimensions Compliance Certification

13th Gen Intel® CoreTM Processors, LGA 1700 Socket Processors, TDP support up to 65W Intel® CoreTM I9-13900E (24 Cores, 36M Cache, up to 5.2 GHz); 65W Intel® CoreTM I9-13900TE (24 Cores, 36M Cache, up to 5.0 GHz); 35W Intel® CoreTM I7-13700E (16 Cores, 30M Cache, up to 5.1 GHz); 65W Intel® CoreTM I7-13700TE (16 Cores, 30M Cache, up to 4.8 GHz); 35W Intel® CoreTM I7-13700T (16 Cores, 30M Cache, up to 4.9 GHz); 35W Intel® CoreTM I5-13500E (14 Cores, 24M Cache, up to 4.6 GHz); 65W Intel® CoreTM I5-13500TE (14 Cores, 24M Cache, up to 4.5 GHz); 35W Intel® CoreTM I5-13500T (14 Cores, 24M Cache, up to 4.6 GHz); 35W Intel® CoreTM I5-13400E (10 Cores, 20M Cache, up to 4.6 GHz); 65W Intel® CoreTM I3-13100E (4 Cores, 12M Cache, up to 3.3 GHz); 60W Intel® CoreTM I3-13100TE (4 Cores, 12M Cache, up to 4.1 GHz); 35W Intel® CoreTM I3-13100T (4 Cores, 12M Cache, up to 4.2 GHz); 35W
Intel® R680E/Q670E/H610E Chipset

4pcs DDR5 SO-DIMM up to 128GB

Dual Channel DDR5

ECC support by R680 with i7 and i5

AMI SPI 256Mbit Intel® HD Gen 9 Graphics

OpenGL 4.5, DirectX 12, OpenCL 2.1

HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9

HW Encode: MPEG2, AVC/H264, JPEG, HEVC/H265, VP8, VP9

3 x DDI (HDMI/DP++) support to 8K

1 x eDP support to 5K

eDP + 3 DDI

1 x PCIe x16 (Gen5)

4 x PCIe x4 (Gen4)

2 x PCIe x4 (Gen3)

2 x PCIe x1 (Gen3)

1 x eSPI

1 x I2C

1 x SMBus

2 x UART (TX/RX/RTS/CTS)

HD Audio 2 x Intel® I226 series (10/100/1000Mbps/2.5G)

4 x USB 3.2 Gen2

8 x USB 2.0

2 x SATA 3.0 (up to 6Gb/s)

12 bit in/out

System Reset, Programmable via Software from 1 to 255 Seconds

TPM2.0 (Available Upon Request)

12V, 5VSB, VCC_RTC (ATX mode)

12V, VCC_RTC (AT mode)

TBD

Windows 10 IoT Enterprise 64-bit

Ubuntu 20.04

Operating: 0 to 60°C

Storage: -40 to 85°C

Operating: 5 to 90% RH

Storage: 5 to 90% RH

TBD

COM HPC® Client Size C PICMG COM HPC® R1.15, Client Size C

6.30" x 4.72" (160mm x 120mm)

CE, FCC, RoHS

ORDERING INFORMATION

Model Name RPS9HC-R680E-BS-13900E RPS9HC-Q670E-BS-13700E RPS9HC-H610E-BS-13100E

P/N 770-RPS9HC1-000G 770-RPS9HC1-100G 770-RPS9HC1-200G

Processor i9-13900E i7-13700E i3-13100E

PCH R680E Q670E H610E

Display

USB3.2 Gen2 TPM 2.0 Thermal Operating Temp.

3 DDI + 1 eDP

4

By request Cooler 0~60°C

3 DDI + 1 eDP

4

By request Cooler 0~60°C

3 DDI + 1 eDP

4

By request Cooler 0~60°C

OPTIONAL ITEMS
· COM836 carrier board kit

770-COM8361-000G

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DFI reserves the right to change the specifications at any time prior to the product's release. Changes thereafter will be based on the product's revision. Please contact your sales representative for the exact revision offered in your area. All product names mentioned are trademarks of their respective companies. © February 19, 2024 DFI Inc.