DFI F8000 SMARC Module with NXP i.MX8M Plus Processor

Model: F8000

Processor: NXP i.MX8M Plus Processor

Form Factor: SMARC

Key Features

Images showing the top and bottom views of the F8000 SMARC module are available in the original document.

Block Diagram

The block diagram illustrates the connectivity of the NXP ARM Cortex-A53 i.MX8M Plus processor:

Specifications

Category Detail
SYSTEM
Processor NXP i.MX 8M plus Cortex-A53 processors (MIMX8ML6CVNKZAB (Industrial), Quad 1.6GHz; MIMX8ML8CVNKZAB (Industrial), Quad 1.6GHz)
Memory On-board 2/4/8GB LPDDR4
NPU 2.3 TOPS
GRAPHICS GC7000UL
Feature HW Decode: 1080p60 H.265, H.264, VP9, VP8
HW Encode: 1080p60 H.265, H.264
EXPENSION
Display 1 x single-channel LVDS
1 x HDMI
Interface 1 x PCIe x1 (Gen 3)
1 x SDIO 3.0
1 x I2C
2 x SPI
2 x 4-wire UART and 2 x 2-wire UART
2 x CAN bus
1 x 4-lanes MIPI-CSI, 1 x 2-lanes MIPI-CSI
2 x I2S
AUDIO 2 x 10/100/1000Mbps GbE
ETHERNET 2 x 10/100/1000Mbps GbE
WIRELESS IEEE 802.11 ac/a/b/g/n wireless LAN + Bluetooth 5.0 (available upon request)
I/O
USB 1 x USB OTG
2 x USB 3.0
2 x USB 2.0 or 4 x USB2.0 thru USB HUB (available upon request)
eMMC Supports eMMC 5.1 up to 128GB
GPIO 1 x 14-bit GPIO
TPM TPM 2.0 (available upon request)
POWER 5V DC-In
OS SUPPORT Linux Yocto
ENVIRONMENT
Temperature Operating: -40 to 85°C
Storage: 5 to 90% RH
Humidity Operating: 5 to 90% RH
MTBF TBD
MECHANISM
Dimensions SMARC form factor
82 mm (3.23") x 50 mm (1.97")
Compliance SMARC specification revision 2.2 compliance
STANDARDS AND CERTIFICATIONS
Certifications CE, FCC, RoHS

Ordering Information

Model Name P/N CPU Cores Memory Display TPM USB 2.0 eMMC Operating Temp.
F8000-TC41 TBD 4 4GB LVDS NA 2 16GB -40 to 85°C

Packing List

Optional Items

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DFI-F8000-SMARC-DataSheet Adobe PDF Library 17.0 Adobe InDesign 19.5 (Windows)

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