M8MP553
NXP® i.MX 8M Plus Series 3.5" SBC
Certifications: FCC, CE, RoHS, UKCA
Key Features
- NXP i.MX8M plus: 30% performance enhancement [performance boost]
- Wide Voltage: Support 9~36VDC [voltage range]
- 2 GbE LAN: For automation application [2 gigabit Ethernet]
- CAN bus: For automation equipments integration [CAN communication]
- 2 M.2 Expansions: 1 M.2 E key 2230, 1 M.2 B key 3052/2242 [M.2 slots]
Technical Overview
Block Diagram Description
The M8MP553 features the NXP i.MX 8M Plus ARM Cortex processor. Key interfaces include DDR4 memory, eMMC and uSD slots, LVDS dual channel display output, HDMI output, multiple USB ports (USB 3.1 Gen2, USB 3.0 Hub, USB 2.0), Gigabit Ethernet (RJ45), CAN bus 2.0, M.2 slots (E key for PCIe x1/USB 2.0, B key for USB 3.1 Gen2/USB 2.0), and a Nano SIM slot. It also supports audio via an SGTL5000 audio codec, I2C/Touch, DIO, and serial communication (RS232, RS485).
Specific I/O includes:
- HDMI
- LVDS Dual Channel & BL Conn
- eMMC, uSD slot
- PCIe x1 Gen3
- USB 3.1 Gen2, USB 3.0 Hub, USB 2.0 ports
- M.2 2230 E key, M.2 3052/2242 B key
- Nano SIM slot
- Gigabit Ethernet (RJ45)
- CAN Bus 2.0
- Audio (Line-out/Mic in) via SGTL5000 codec
- I2C / Touch
- DIO (8-bit)
- Serial: RS232, RS485 (2-wire), RS232/422/485
- Micro USB 2.0 (Download Mode)
Mechanical Drawing Description
The M8MP553 is a 3.5" SBC with dimensions of 146mm (width) x 102mm (depth). The drawing indicates the placement of various connectors and mounting holes with precise measurements, such as 18.98mm, 49.06mm, 94.93mm, 97.20mm, 140mm, 146mm, and distances between mounting points like 6mm, 14.50mm, 35mm, 53mm, 68mm, 84.50mm, 106mm, 126mm, 140mm, 146mm. The PCB thickness is 1.6mm. Top side component height is up to 15mm, and bottom side height is up to 4mm.
Specifications
| Category | Details |
|---|---|
| Processor | i.MX 8M plus applications processors: MIMX8ML6CVNKZAB (Industrial, Quad 1.6GHz, VPU/ISP/CAN FD, -40~105°C), MIMX8ML3CVNKZAB (Industrial, Dual 1.6GHz, VPU/ML/ISP/CAN FD, -40~105°C) |
| Memory | 2GB/4GB/8GB LPDDR4 Memory Down |
| Graphics Controller | GC7000UL |
| Graphics Feature | HW Decode: 1080p60 H.265, H.264, VP9, VP8; HW Encode: 1080p60 H.265, H.264 |
| Display | 1 x HDMI (resolution up to 1920x1080@60Hz); 1 x LVDS (resolution up to 1920x1200 @60Hz) |
| Dual Display | LVDS + HDMI (Android: support single output) |
| Expansion Interface | 1 x M.2 B key 3052/2242 (USB 3.1 Gen2/USB 2.0); 1 x M.2 E key 2230 (PCIe x1/USB 2.0); 1 x Nano SIM slot |
| Audio | Audio codec SGTL5000 |
| Ethernet | 2 x GbE (RJ-45) |
| Rear I/O | Serial: 1 x RS485 (2-wire); USB: 2 x USB 3.1 Gen1, 2 x USB 2.0; Display: 1 x HDMI; Serial: 1 x RS232; Serial: 1 x RS232/422/485 (2.0mm pitch) |
| Internal I/O | USB: 2 x USB 2.0 (2.00mm pitch, 2nd USB shared with M.2 B Key); Micro USB 2.0 (Download Mode); Display: 1 x LVDS LCD Panel connector, 1 x LCD/Inverter Power; Audio: 1 x Audio (Line-out/Mic-in); SD: 1 x uSD card; DIO: 1 x 8-bit DIO; I2C: 1 x I²C / Touch |
| Storage | CANBus: 2 x CAN bus 2.0b (Industrial CPU sku); eMMC: 1 x eMMC 5.1 with default 16GB (up to 64GB) |
| Watchdog Timer | System Reset, Programmable via Software from 1 to 255 Seconds |
| Power | Wide Range 9~36VDC. Note1: Support 9V~24VDC in -30~80°C operating temperature. Note2: Support 36VDC within 70°C operating temperature. Connector: 2-pole terminal block (default), Co-lay 4-pin vertical power connector. |
| OS Support | RTC Battery: CR2032 Coin Cell; Microsoft/Linux: Linux Yocto 5.0 (default), Debian 12 (upon request), Android 10 (upon request) |
| Environment | Temperature: Operating: -30 to 80 °C, Storage: -40 to 85°C; Humidity: Operating: 5 to 90% RH, Storage: 5 to 90% RH |
| MTBF | i.MX 8M Plus Quad: 632,710 hrs @ 25°C; 386,370 hrs @ 45°C; 252,204 hrs @ 60°C; 138,544 hrs @ 80°C (Calculation model: Telcordia Issue 4, Environment: GB, GC - Ground Benign, Controlled) |
| Mechanism | 3.5" SBC Form Factor; Dimensions: 146mm (5.75") x 102mm (4.02"); PCB: 1.6mm; Height: Top Side: 15mm, Bottom Side: 4mm |
| Standards and Certifications | Certifications: CE, FCC, RoHS, UKCA |
Ordering Information
| Model Name | P/N | Processor | Memory | eMMC | GbE | RS-232 | RS-232/422/485 | USB 3.1 Gen1 | USB 2.0 | Power | Thermal Temp. |
|---|---|---|---|---|---|---|---|---|---|---|---|
| M8MP553-ECC-41QDI | 770-8MP5532-200G | Quad core | 4 GB | 16 GB | 2 | 1 | 1 | 2 | 4 | 9~36VDC | Fanless -30 to 80°C |
| M8MP553-ECC-21DLI | 770-8MP5532-300G | Dual core | 2 GB | 16 GB | 2 | 1 | 1 | 2 | 4 | 9~36VDC | Fanless -30 to 80°C |
| M8MP553-ECC-81QDI | 770-8MP5532-400G | Quad core | 8 GB | 16 GB | 2 | 1 | 1 | 2 | 4 | 9~36VDC | Fanless -30 to 80°C |
Packing List
- 1 x M8MP553 board
- 1 x Terminal block for RS485 (COM3) [342-361021-000G]
- 1 x Heatsink (Height: 21mm) [A71-008168-000G]
Optional Items
- 2 pole terminal to DC jack cable [A81-004013-000G]
- Power adapter (60W, 12V, DC Jack) [671-106012-000G]
- USB 2.0 cable (Length: 200mm) [A81-001032-016G]
- COM port cable (Length: 250mm, COM1/4) [A81-009595-016G]
- Audio cable (Length: 300mm) [A81-022031-016G]
- Heat spreader (Height: 11mm) [A71-808351-000G]
- Debug console with cable (Length: 500mm) [770-IMX8M1-000G]
