ASL968 COM Express Compact
Intel® Core™ 3 & N series Processor Twin Lake & Atom® Processor Amston Lake
Overview
The DFI ASL968 is a COM Express® Compact module designed for demanding embedded applications. It leverages the power of Intel® Core™ 3 and Intel® Atom® processors, offering a balance of performance and efficiency.
Key Features
- DDR5 Memory: Supports single channel DDR5 4800MHz SODIMM up to 16GB.
- 4K High Resolution: Supports 4K / 2K resolution for advanced visual output.
- Triple Displays: Offers 1 LVDS/eDP and 2 DDI interfaces for multi-display configurations.
- Multiple Expansion: Provides up to 8 PCIe x1 lanes for flexible expansion.
- RICH I/O: Features 1 Intel 2.5GbE LAN, up to 4 USB 3.2 ports, and 2 SATA 3.0 ports.
Visual Description
The ASL968 module is presented with front and bottom views. The front view highlights the DDR5 SODIMM slot and the processor area. The bottom view shows connector placements and board markings, including "ASL968", "MADE IN TAIWAN", and regulatory certifications like [FCC Certified], [CE Marked], and [RoHS Compliant].
Block Diagram
The block diagram illustrates the system architecture, connecting the Intel Amston Lake/Alder Lake-N series processor (35x24mm, BGA1264, TDP 6W-15W) to various interfaces. Key connections include:
- Memory: DDR5 SODIMM (Channel A, DDR5-4800, NON-ECC).
- Displays: eDP, LVDS/24bit, eDP/DP, DDI A, DDI B, DDI1/USB4_P1, DDI2, DP++. Supports up to triple displays (1 LVDS/eDP, 2 DDI).
- Expansion: Multiple PCIe lanes (e.g., PCIe 3.0 Lane 0/1, 2/3, 4, 5, 7, 9/10, 11, 12) and SATA Gen3 ports.
- I/O: 2.5GbE LAN (Intel I226 series), USB 3.2 Gen2, USB 2.0, SPI, LPC/eSPI, UART, I2C, SMBUS, HD Audio, and an Embedded Controller (IT5782VG-I).
- Storage: eMMC 5.1 interface (32G/64G/128G) and MIPI CSI-2 connector are also shown.
The diagram shows the COM Express Row A/B (Type 6) and COM Express Row C/D (Type 6) interfaces connecting to the processor and other components.
Mechanical Drawing
The mechanical drawing provides the physical dimensions of the COM Express Compact module. The overall dimensions are 95mm x 95mm (3.74" x 3.74"). The drawing indicates mounting hole locations and their respective distances, crucial for integration into carrier boards and enclosures. Key dimensions shown include 12.60mm, 23.54mm, 81.40mm, 91mm, 87.03mm, 52.75mm, 45.25mm, 37.75mm, 47.04mm, 70.54mm, 80mm, and 95mm.
Technical Specifications
| Category | Specification |
|---|---|
| Processor | Intel® Atom x7000RE series (Amston Lake): x7835RE (8 Cores, 1.3~3.6GHz, 12W), x7433RE (4 Cores, 1.5~3.4GHz, 9W), x7211RE (2 Cores, 1.0~3.2GHz, 6W). Intel® Core™ 3 (N-series): N355 (8 Cores, 1.8~3.9GHz, 9/15W), N150 (4 Cores, 1.0~3.6GHz, 6W). |
| Memory | One 262-pin SODIMM slot, supports Single Channel DDR5 4800MHz up to 16GB. In-band ECC (IBECC) supported. |
| BIOS | AMI SPI 256MHz |
| Graphics Controller | Intel® UHD |
| Graphics Feature | DX12, Open GL 4.6, Vulkan 1.2. HW Decode: 4K60 10b 4:2:0, 4:4:4 HEVC/VP9/SCC, 4K60 10b 4:2:0 AV1. HW Encode: 4K60 10b 4:2:0, 4:4:4 HEVC/VP9/SCC. |
| Display | 1 x LVDS/eDP, 2 x DDI. LVDS: dual channel 1920x1200 @60Hz. eDP: 4096x2160 @60Hz. |
| Triple Displays | LVDS/eDP + 2 DDI |
| Expansion Interface | Up to 8x PCIe x1 (Gen3). (3x PCIe x1 co-layout w/Ethernet and SATA available upon request). |
| I/O Interface | 1 x I²C, 1 x SMBus, 1 x LPC/eSPI, 2 x UART, 1 x CAN (co-layout with UART). |
| Audio | HD Audio |
| Ethernet | 1 x Intel® I226 series (10/100/1000/2500Mbps), co-lay 1 x PCIe x1 (available upon request). |
| USB | 2 x USB 3.2 Gen2 (option to 4 ports by USB hub). 8 x USB 2.0. |
| SATA | 2 x SATA 3.0 (up to 6Gb/s), co-lay 2 x PCIe x1 (available upon request). |
| eMMC 5.1 | 1 x 64GB eMMC. |
| DIO | 1 x 8-bit DIO. |
| Watchdog Timer | System Reset, Programmable via Software from 1 to 255 Seconds. |
| Security | TPM 2.0 (Option: fTPM). |
| Power Consumption | 8.5~20V, 5VSB, VCC_RTC (ATX mode); 8.5~12V, VCC_RTC (AT mode). |
| OS Support | Windows 11/10 IoT Enterprise 64-bit, Linux. |
| Environment | Temperature: Operating: -40°C~85°C (Amston Lake CPU sku), 0°C~60°C (Twin Lake CPU sku); Storage: -40°C~85°C. Humidity: Operating: 10%~90% RH; Storage: 10%~90% RH. |
| MTBF | TBD |
| Mechanical | Dimensions: COM Express® Compact, 95mm (3.74") x 95mm (3.74"). Compliance: PICMG COM Express® R3.1, Type 6. |
| Standards and Certifications | Certification: CE, FCC, RoHS. |
Packing List
- Cooler (A71-108312-000G)
- Heatspreader (CPU block only) (A71-810417-000G)
- Thermal grease (912-077832-000G)
Optional Items
- Heat Spreader (all-in-one, upon request, MOQ: 50pcs)
- COM335 Carrier Board Kit (770-CM3351-000G)
DFI reserves the right to change the specifications at any time prior to the product's release. Changes thereafter will be based on the product's revision. Please contact your sales representative for the exact revision offered in your area. All product names mentioned are trademarks of their respective companies. © July 17, 2025 DFI Inc.
