onsemi Miniature Reflective Object Sensor

QRE1113, QRE1113GR, QRE1114GR

Data Sheet

www.onsemi.com

Features

Maximum Ratings

Symbol Parameter Value Unit
TOPR Operating Temperature -40 to +85 °C
TSTG Storage Temperature -40 to +90 °C
TSOL-I Soldering Temperature (Iron) (Notes 2, 3, 4) 240 for 5 s °C
TSOL-F Soldering Temperature (Flow) (Notes 3, 4) 260 for 10 s °C
EMITTER
IF Continuous Forward Current 50 mA
VR Reverse Voltage 5 V
IFP Peak Forward Current (Note 5) 1 A
PD Power Dissipation (Note 1) 75 mW
SENSOR
VCEO Collector-Emitter Voltage 30 V
VEC Emitter-Collector Voltage 5 V
IC Collector Current 20 mA
PD Power Dissipation (Note 1) 50 mW

Notes:

Ordering Information

Device Package Shipping†
QRE1113 Reflective Rectangular (Through Hole) 1600/ Tube
QRE1113GR & QRE1114GR Reflective Rectangular (Surface Mount) 1000/ Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.

Electrical/Optical Characteristics

(TA = 25°C unless otherwise noted)

Symbol Parameter Conditions Min Typ Max Unit
INPUT DIODE
VF Forward Voltage IF = 20 mA 1.2 1.6 V
IR Reverse Leakage Current VR = 5 V 10 μA
λPE Peak Emission Wavelength IF = 20 mA 940 nm
OUTPUT TRANSISTOR
ID Collector-Emitter Dark Current IF = 0 mA, VCE = 20 V 100 nA
COUPLED
IC(ON) On-State Collector Current (Note 6) IF = 20 mA, VCE = 5 V QRE1113 & QRE1113GR: 0.10
QRE1114GR: 0.30
QRE1113 & QRE1113GR: 0.90
QRE1114GR: 0.60
mA
ICX Cross-Talk Collector Current (Note 7) IF = 20 mA, VCE = 5 V 1 μA
VCE(SAT) Saturation Voltage IF = 20 mA, Ic = 50 μA (Note 6) 0.3 V
tr Rise Time VCC = 5 V, IC(ON) = 100 μA, RL = 1 kΩ 20 μs
tf Fall Time 20 μs

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.

6. Measured using an aluminum alloy mirror at d = 1 mm.

7. No reflective surface at close proximity.

Reflow Profile

Temperature (°C)
^ 260°C max. for 10 sec. max.
| 1°C to 5°C/sec
| Pre-heating
| 180°C to 200°C
| 1°C to 5°C/sec
| 60 sec. max.
| above 220°C
+-------------------------------------> Time (seconds)
Figure 1. Reflow Profile

Typical Performance Curves

IC(ON) - NORMALIZED COLLECTOR CURRENT
1.0
IF = 10 mA
VCE = 5 V
TA = 25°C
0.8
0.6
0.4
0.2
0.0
0
1
2
3
4
5
d-DISTANCE (mm)
Mirror
Sensing Object:
White Paper (90% reflective)
Figure 2. Normalized Collector Current vs. Distance between Device and Reflector
IC(ON) - COLLECTOR CURRENT (mA)
1.0
QRE1113 & QRE1113GR
0.8
0.6
0.4
0.2
0.0
0
4
8
12
QRE1114GR
16
20
IF - FORWARD CURRENT (mA)
Figure 3. Collector Current vs. Forward Current
IC(ON) - NORMALIZED COLLECTOR CURRENT
2.0
1.8
d = 1 mm, 90% reflection
TA = 25°C
1.6
1.4
IF = 25mA
1.2
IF =20mA
1.0
0.8
IF =15mA
0.6
IF =10mA
0.4
IF =5mA
0.2
0.0
0.1
1
VCE - COLLECTOR EMITTER VOLTAGE (V)
Figure 4. Normalized Collector Current vs. Collector to Emitter Voltage
ICEO - NORMALIZED DARK CURRENT
102
101
Normalized to:
VCE = 10 V
TA = 25°C
10°
10-1
10-2
25
40
55
70
85
TA - AMBIENT TEMPERATURE (°C)
Figure 5. Collector Emitter Dark Current (Normalized) vs. Ambient Temperature
IF - FORWARD CURRENT (mA)
3.0
2.5
50
40
30
20
10
0
1.0
1.1
1.2
1.3
1.4
1.5
VF - FORWARD VOLTAGE (V)
Figure 6. Forward Current vs. Forward Voltage
RISE AND FALL TIME (μς)
100
Vcc = 10 V
tpw = 100 us
T=1ms
TA = 25°C
tf
Ic = 0.3 mA
tr
10
Ic = 1 mA
tr
1
0.1
1
10
RL - LOAD RESISTANCE (ΚΩ)
Figure 7. Rise and Fall Time vs. Load Resistance
VF - FORWARD VOLTAGE (V)
2.0
IF = 50 mA
1.5
IF = 20 mA
1.0
IF = 10 mA
0.5
0.0
-40
-20
0
20
40
60
80
TA - AMBIENT TEMPERATURE (°C)
Figure 8. Forward Voltage vs. Ambient Temperature
RELATIVE RADIANT INTENSITY
1.0
0.9
0.8
0.7
0.6
0.4
0.2
0
0.2
0.4
0.6
ANGULAR DISPLACEMENT
Figure 9. Radiation Diagram

Taping Dimensions for GR Option

2.0±0.05
1.75
4.0
01.5
0.25
5.5±0.05
12.0±0.3
4.75
3.73
8.0
General tolerance ±0.1
Dimensions in mm
1.98
Figure 10. Taping Dimensions for GR Option

Reel Dimensions

2.2 ± 0.5
Ø13.0 ± 0.5
Ø178.0 ± 1.0
Ø60.0 ± 0.5
12.0 ± 0.15
9.0 ± 0.5
Figure 11. Reel Dimensions

Precautionary Notes

  1. Refer to application note AND8003/D, "Storage and Handling of Dry Packed Surface Mounted Devices" for details of handling procedure.
  2. Product soldering terminals are silver plated and oxidization may occur with prolonged exposure to ambient environment. Oxidized terminal may have poor solderability performance. Keep unsealed devices in moisture barrier bag sealed with desiccant or in dry cabinet at <5% relative humidity.
  3. Store PCB in sealed moisture barrier bag together with desiccant or store in dry cabinet at <5% relative humidity. Mounted device that has been exposed to ambient environment for long period of time may suffer moisture related damage if PCB is subjected to subsequent high temperature processes.

Mechanical Case Outline - Reflective Rectangular Through Hole

CASE 100AQ, ISSUE O

DATE: 30 SEP 2016

4
2.90
2.50
1.80
1.70
1.50
0~20
1
4.20
3.80
0.40
0.60
0.40
1.00
3
2
0~20
0.94
3.60
3.20
0.94
10.4
8.4

Notes:

  1. Dimensions for all drawings are in millimeters.
  2. Tolerance of ±0.15mm on all non-nominal dimensions

Mechanical Case Outline - Reflective Rectangular Surface Mount

ARUSM-313 / CASE 100CY, ISSUE O

DATE: 31 JAN 2017

0.60
0.40
4
1.80
1
0.40
1.70
0.17
1.50
0.07
2.90
2.50
1.00
3
0.94
3.60
3.20
2.59
TOP VIEW
1.10
0.90
4.80
4.40
SIDE VIEW
0.94
2
1.66
5.66
0.61 NOM. (4X)
(0.3358) FLAT AREA
LAND PATTERN RECOMMENDATION
0.79

NOTES:

  1. NO INDUSTRY STANDARD APPLIES TO THIS PACKAGE
  2. ALL DIMENSIONS ARE IN MILLIMETERS
  3. TOLERANCE OF ±0.15MM ON ALL NON-NOMINAL DIMENSIONS

Additional Information

Technical Publications:

Online Support:

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