1/4.2-inch 5 MP CMOS Digital Image Sensor AR0544
Brand: onsemi
Publication Order Number: AR0544-PD/D
Document Revision: December, 2024 - Rev. 4
General Description
The onsemi AR0544 is a stacked 1/4.2-inch back side illuminated (BSI) CMOS active-pixel digital image sensor. It features a pixel array of 2592 x 1944 (2608H x 1960V including border pixels) and enhanced Near-Infrared (NIR) response. The sensor incorporates sophisticated on-chip camera functions such as Wake on Motion (WOM), context switching, and multiple subsampling modes. It is programmable via a simple I2C interface and offers very low power consumption. The AR0544 utilizes onsemi’s low-noise CMOS imaging technology and can generate full resolution images at up to 60 frames per second (fps) in 10-bit linear mode, and 30 fps in line-interleaved high dynamic range (LI-HDR) mode. It also supports enhanced Dynamic Range (eDR) mode.
Key Features
- 5 MP CMOS Sensor with Advanced 1.4 µm Pixel Stacked BSI Technology
- Enhanced NIR Response at 850 nm and 940 nm Wavelength
- LI-HDR: Supports Line Interleaved T1/T2 Readout for HDR Processing in ISP Chip
- Enhanced Dynamic Range (eDR)
- Super Low Power Mode
- Wake on Motion (WOM)/Motion Detection
- Subsampling Modes: Skipping, Binning, Summing
- Data Interfaces: 2-lane MIPI D-PHY
- Bit-depth Compression Available for MIPI Interface
- Various Trigger Modes for Multi-sensor Synchronization
- Electronic Rolling Shutter (ERS) and Global Reset Release (GRR) Modes Supported
- 2360 bytes One-Time Programmable Memory (OTPM) for Storing Shading Correction Coefficients and Module Information
- Programmable Controls: Gain, Horizontal and Vertical Blanking, Frame Size/Rate, Exposure, Window Size
- On-chip Temperature Sensor
- Simple Two-wire Fast-mode+ Serial Interface
- On-chip Lens Shading Correction
Applications
- Videoconferencing Endpoints
- Webcams
- Machine Vision Cameras
- Video Doorbells
- Retail In-store Cameras, Bodycams, etc.
- 3D and Stereo Cameras
Key Performance Parameters
Parameter | Value |
---|---|
Optical format | 1/4.2-inch 5 MP (4:3) |
Active pixels | 2592 x 1944 |
Pixel size | 1.4 µm Back Side Illuminated (BSI) |
Chief ray angle (CRA) | 11° |
Color Filter Array | RGB, Monochrome |
Input clock frequency | 6-48 MHz |
Interface | 2-lane MIPI using D-PHY @; Max data rate: 1.72 Gbps/lane |
ADC resolution | 10-bits, on die |
Gain Control: Gain Table | Linear Mode: 0- 50.62 dB (Analog gain range: 0 ~ 27.37 dB, Digital gain range: 0 ~ 23.25 dB) |
Subsampling | Subsampling: Skipping (RGB, Mono), Binning (RGB), Summing (Mono) |
Temperature sensor | 10-bit, controlled by two-wire serial I/F |
Frame Rate (Full Size, Linear Mode) | 60 fps |
Compression | DPCM: 10-8 |
3D support | Frame rate and exposure synchronization |
Supply voltage (Analog, Pixel) | 2.8 V (2.7 V < Vsupply < 2.9 V) |
Supply voltage (I/O) | 1.8 V (1.7 V < Vsupply < 1.9 V) |
Supply voltage (PLL, MIPIphy) | 1.05 V (1 V < Vsupply < 1.1 V) |
Power Consumption | 158 mW at 5 MP 60 fps |
Responsivity | 8.7 ke-/lux-sec (Green in RGB) 17.3 ke-/lux-sec (Clear in Mono) |
SNRMAX | 39.9 dB |
Dynamic Range | 73 dB (eDR 1-exp) 100 dB (LI-HDR Mode) |
Operating Temperature Range (at junction) – TJ | -30°C to +85°C |
Optimal Performance Temperature Range (at junction) – TJ | 0°C to +60°C |
Package Options | CSP-47 (4.67 x 3.68) Bare Die |
θJA (Note 1) | 46°C/W |
θJB | 17°C/W |
Note 1: θJA is dependent on the customer module design and should not be used for calculating junction temperature.
Modes of Operation
10-bit Modes
Mode Name | Mode Description | Resolution | Frame Rate |
---|---|---|---|
Native | 5 MP Linear Mode Full Resolution | 2592 x 1944 | 60 |
LI Native | 5 MP LI-HDR Mode | 2592 x 1944 | 30 |
Crop | 1080P Linear | 1920 x 1080 | 110 |
SLP Native | 5M Linear Mode Full Resolution, Lowest Power | 2592 x 1944 | 1 |
Bin4 | 0.3 MP Linear, Lowest Power | 648 x 486 | 1 |
WoM Bin4 | Wake On Motion w/ Streaming | 648 x 486 | 1 |
WoM Bin4Skip2 (Note 2) | Wake On Motion without Streaming | 324 x 243 | 1 |
Note 2: Sensor resolution is actually 648 x 486. GB columns are skipped which helps reduce power consumption. The stream output of the sensor cannot be used in this mode.
12-bit Modes
Mode Name | Mode Description | Resolution | Frame Rate |
---|---|---|---|
eDR Native | 5M eDR Mode | 2592 x 1944 | 30 |
Ordering Information
Part Number | Product Description | Orderable Product Attribute Description |
---|---|---|
AR0544CSSC11SMKA1-CP | 5 MP 1/4.2" CMOS Image sensor RGB 11° CRA | CSP with Protective Film |
AR0544CSSC11SMKA1-CP2 | 5 MP 1/4.2" CMOS Image sensor RGB 11° CRA | CSP with Protective Film Low MOQ |
AR0544CSSC11SMKA1-CR | 5 MP 1/4.2" CMOS Image sensor RGB 11° CRA | CSP without Protective Film |
AR0544CSSC11SMKAH3-GEVB | 5 MP 1/4.2" CMOS Image sensor RGB 11° CRA | Demo3 Headboard |
AR0544CSSM11SMKA1-CP | 5 MP 1/4.2" CMOS Image sensor Mono 11° CRA | CSP with Protective Film |
AR0544CSSM11SMKA1-CP2 | 5 MP 1/4.2" CMOS Image sensor Mono 11° CRA | CSP with Protective Film Low MOQ |
AR0544CSSM11SMKA1-CR | 5 MP 1/4.2" CMOS Image sensor Mono 11° CRA | CSP without Protective Film |
AR0544CSSM11SMKAH3-GEVB | 5 MP 1/4.2" CMOS Image sensor Mono 11° CRA | Demo3 Headboard |
AR0544CSSC33SMKA1-CP | 5 MP 1/4.2" CMOS Image sensor RGB 33° CRA | CSP with Protective Film |
AR0544CSSC33SMKA1-CP2 | 5 MP 1/4.2" CMOS Image sensor RGB 33° CRA | CSP with Protective Film Low MOQ |
AR0544CSSC33SMKA1-CR | 5 MP 1/4.2" CMOS Image sensor RGB 33° CRA | CSP without Protective Film |
AR0544CSSC33SMKAH3-GEVB | 5 MP 1/4.2" CMOS Image sensor RGB 33° CRA | Demo3 Headboard |
AR0544CSSH11SMKA1-CP | 5 MP 1/4.2" CMOS Image sensor RGBIR 11° CRA | CSP with Protective Film |
AR0544CSSH11SMKA1-CP2 | 5 MP 1/4.2" CMOS Image sensor RGBIR 11° CRA | CSP with Protective Film Low MOQ |
AR0544CSSH11SMKA1-CR | 5 MP 1/4.2" CMOS Image sensor RGBIR 11° CRA | CSP without Protective Film |
AR0544CSSH11SMKAH3-GEVB | 5 MP 1/4.2" CMOS Image sensor RGBIR 11° CRA | Demo Headboard |
Note 3: Refer to AR0544 Die Data Sheet for Die Part Numbers & Ordering Information.
Block Diagram
The AR0544 block diagram shows the sensor's internal structure, divided into an 'Image sensor core' and 'Signal Processing' sections. The 'Image sensor core' includes the Row Driver, Pixel Array, Analog Signal Chain, ADC Gain Chain, Temperature Sensor, and Gain Control. Input signals like EXTCLK, XSHUTDOWN, GPIOs, I2C (SCL, SDA), and power supplies (VAA_ANA_ACORE, VAA_ANA_PIX, VDD_DIG_ACORE, VAA18_ANA_ACORE) connect to this core. The 'Signal Processing' section contains Timing Control, PLL, Test pattern Generator, Data Correction, Digital Gain, LSC (Lens Shading Correction), FIFO & Optional compression, and MIPI output. The output stage provides MIPI serial data output, supported by power supplies VDD_DIG_DCORE, VDD_DIG_PLL, VDD_DIG_PHY, and VDDIO1V8.
Mechanical Case Outline and Package Dimensions
The ODCSP47 package, CASE 570DD, has dimensions specified in millimeters. The overall package outline is 4.67x3.68x0.63 mm with a 0.50P pitch. Key dimensions include:
Dim | Min | Nom | Max | Unit |
---|---|---|---|---|
A | 0.762 | mm | ||
A1 | 0.081 | 0.101 | 0.121 | mm |
A2 | 0.606 | 0.631 | 0.656 | mm |
A3 | 0.426 | 0.440 | 0.454 | mm |
A4 | 0.180 | 0.191 | 0.202 | mm |
b | 0.184 | 0.204 | 0.224 | mm |
D | 4.645 | 4.670 | 4.695 | mm |
D1 | 3.629 (REF) | mm | ||
D2 | 2.344 | 2.369 | 2.394 | mm |
E | 3.657 | 3.682 | 3.707 | mm |
E1 | 2.722 (REF) | mm | ||
E2 | 1.821 | 1.846 | 1.871 | mm |
e | 0.500 BSC | |||
F | 0.050 C |
Notes on Dimensions:
- Dimensioning and tolerancing per ASME Y14.5M, 2018.
- Controlling dimension: Millimeters [mm].
- Solder ball diameter is measured at the maximum solder ball diameter parallel to the seating plane.
- Coplanarity applies to the spherical crowns of the solder balls.
- Datum C, the seating plane, is defined by the spherical crowns of the solder balls.
- Glass thickness: 0.400 mm; Refractive index = 1.52.
- Air gap between glass and pixel array: 0.040 mm thickness.
- Parallelism applies only to the active array.
- Maximum rotation of active array relative to datums A and B is ±0.1°.
- Refer to the device data sheet for total pixel array definitions.
- Package center (X, Y) = (0.000, 0.000).
- Optical center relative to package center (X, Y) = (0.034, -0.005).
Recommended Mounting Footprint: A diagram shows the recommended footprint with ball positions and pitch.
Additional Information
For technical publications, visit the Technical Library at: www.onsemi.com/design/resources/technical-documentation
Visit the onsemi website at: www.onsemi.com
For online support, visit: www.onsemi.com/support
For additional information or to contact sales representatives, visit: www.onsemi.com/support/sales
Distributor Information
Mouser Electronics is an authorized distributor. Click to view pricing, inventory, delivery & lifecycle information.
onsemi Part Numbers:
AR0544CSSC11SMKA1-CP, AR0544CSSC11SMD20-RC1, AR0544CSSM11SMKA1-CP, AR0544CSSC11SMKA1-CP2, AR0544CSSC11SMD20, AR0544CSSM11SMKA1-CR, AR0544CSSC11SMKA1-CR, AR0544CSSM11SMKA1-CP2