High-Speed Interface Layout Guidelines

Introduction to PCB Layout Best Practices

This application report from Texas Instruments provides essential guidance for system designers on implementing best practices for Printed Circuit Board (PCB) layout when working with high-speed interfaces. It is tailored for professionals familiar with PCB manufacturing, layout, and design principles.

Key Considerations for High-Speed Signals

As interface frequencies continue to increase, meticulous attention to PCB layout is crucial for ensuring robust and reliable solutions. The document focuses on critical aspects such as:

• Mitigating the impact of PCB fiber weave on signal integrity.
• Proper routing of differential signals, including spacing and length matching.
• Managing reference planes and avoiding discontinuities.
• Strategies for via discontinuity mitigation and placement.
• Addressing ESD/EMI considerations for signal quality.

By adhering to these guidelines, designers can achieve optimal performance and minimize potential issues in high-speed digital systems.