Honeywell SEMI F20 13mm Pressure Sensor

High Purity and Ultra-High Purity Applications

Ensuring process integrity and enhancing product yield through controlled environments and contamination-free processes.

Products under High Purity (HP) and Ultra-High Purity (UHP) applications follow strict cleanliness standards and are exposed to a controlled manufacturing environment. These applications include semiconductor manufacturing, thin-film deposition, food and beverage processing & packaging, aircraft manufacturing, medical device manufacturing, nano drug development, biopharmaceutical production, material analysis labs, and research and development labs.

The presence of impurities in these applications, above certain size or concentration, can negatively impact the end outcome. Special steps should be taken when selecting raw materials or process components, or when designing cleanrooms, as unexpected elements in the manufacturing flow can produce product with poor quality and low yield, resulting in financial losses. In certain processes, the reaction process can be compromised, resulting in undesirable byproducts.

For example, in thin-film deposition or sub-micron layer deposition for semiconductor wafers, solar panels, or LED displays, impurities from gases, liquids, or components can result in defective integrated circuits and panels. The yield fallout, which typically happens during the late stages of manufacturing, can increase product cost. Similarly, the presence of certain impurities above defined concentration levels in food and beverage or biopharmaceutical manufacturing can result in process contamination.

In material analysis labs or R&D labs, impurities introduced by raw materials or components can result in erroneous results and interpretation. As a result, the manufacturing setup for HP and UHP products adheres to very strict universal cleanliness standards. These standards are followed not only by raw material suppliers but also by component and sensor manufacturers that are part of the process flow and instrumentation systems design.

Semiconductor Production

Universal Standards

For HP and UHP applications, commonly used standards and notations are considered below. These standards specify cleanliness requirements for raw materials (air, liquid, gases, material composition percentages) as well as tools and components. Some key specifications are covered below:

• Raw material composition and process flow components: The SEMI standard is highly relevant for sensors and component suppliers serving the semiconductor industry. Established in 1973, it standardized wafer dimensions. Over time, multiple other specifications have been incorporated.
• SEMI F19: This specification covers the surface condition requirements for wetted surfaces of stainless-steel components. For more details, visit the SEMI F19 link.
• SEMI F20: This specification covers the requirements for 316L components used in HP and UHP applications. For more details, visit the SEMI F20 link.
• Air: ISO14644-1 is a universally recognized standard for establishing air cleanliness in cleanrooms. It defines classifications ISO1 to ISO 9, with ISO 1 being the cleanest. Classifications range from Class 1 to Class 100,000, depending on the size and concentration of impurities. More details can be found via an ISO link.
• Industrial gas: The "nines" scale or "N" nomenclature uses a logarithmic scale to define gas purity levels, denoted by the number of consecutive nines expressed as a percentage. For example, N1.0 represents 90% purity, N2.0 represents 99% purity, and N6.0 represents 99.9999% purity.

SEMI F20 Compatible Pressure Sensor

The Honeywell latest oil-filled, media-isolated 13V Series stainless-steel pressure sensor is specially designed for UHP applications involving measurement of gases and liquid flow in harsh environments. The rugged, media-isolated package incorporates a Honeywell-proven piezoresistive semiconductor chip in an oil-isolated housing, a design proven to be highly reliable, stable, and accurate.

Designed with a SEMI F20-compatible ring and diaphragm, this sensor exhibits exceptional corrosion resistance and can withstand the aggressive nature of halogenated gases commonly encountered in semiconductor manufacturing processes. The 13V Series is specifically designed to minimize offset drift under prolonged vacuum conditions, making it an ideal choice for critical industrial applications where vacuum conditions are common between multiple runs.

Laser welding of the ring and ball ensures reliable sealing and protection against environmental factors while maintaining accurate pressure measurement. These sensors feature high life-cycle capability and are designed for further package integration in OEM (Original Equipment Manufacturer) applications.

Key Specifications

1. Offset drift under extreme vacuum conditions

In semiconductor wafer processing, precise quantities of multiple gas types need to be delivered at different flow rates during etching and vapor deposition processes. Precise flow measurement is essential for accurate control of gas mixtures used for deposition, passivation, or preventing oxidation. The outlet pressure can vary from extreme vacuum (<0.001 Pascal) to above atmospheric pressure (1200 Torr). In addition to Total Error Output, offset drift directly influences measurement accuracy, calibration stability, environmental sensitivity, performance consistency, and long-term reliability.

The 13V sensor is specifically designed to operate reliably under extreme vacuum conditions and elevated temperatures, making it versatile for etching and vapor deposition applications. The graph above shows excellent offset drift (< ±0.1% FSR) of SEMI F20 sensors for 90 days at high-temperature vacuum (<0.001 Pascal, 90°C).

2. Output change due to re-orientation

The orientation of an oil-filled pressure sensor can significantly influence its readings due to gravity acting on the internal oil column. The additional pressure exerted by the oil-fill layer can vary due to the impact of gravity. Depending on the sensor orientation, this pressure can be opposing, orthogonal, or aiding the applied pressure. The summation of this error pressure, along with the applied pressure, gets transmitted from the diaphragm to the piezoresistive element. For a poorly designed pressure sensor, the offset can change significantly going from one orientation to the other.

3. SEMI F20 material composition

The graph above shows minimal change to sensor output when the product orientation is changed. The 13V pressure sensor is designed with optimized oil volume for efficient pressure transfer with minimal impact on the offset, ensuring minimal output variation and consistent performance regardless of orientation. The graph on the previous page shows minimal shift to the sensor output when the product is re-oriented.

This specification outlines the metallurgical cleanliness standards and material composition requirements for 316L stainless steel intended for use in the production of components in general-purpose, high-purity, and ultra-high-purity chemical (gas or liquid) distribution systems. The wettable media of the 13V pressure sensor uses raw materials that adhere to the strict standards shown in the table above, ensuring the sensor is of the highest quality.

Conclusion

Exceeding expectations: The 13V pressure sensor redefines excellence.

The SEMI F20 13V pressure sensor sets the benchmark for both performance and quality, as evidenced by the data presented. Rigorous testing and analysis highlight Honeywell's commitment to excellence, ensuring the product consistently meets and exceeds customer expectations.

The 13V pressure sensor enhances process integrity by ensuring ultra-clean performance, significantly reducing contamination risks. It boosts production yield and cost-efficiency by minimizing fallout in late-stage manufacturing. It also ensures accurate results in R&D and material analysis, while supporting compliance with global cleanliness standards.

For detailed specifications, refer to the Datasheet, and for applications, refer to the Flyer.

Safety and Warranty Information

WARNING: IMPROPER INSTALLATION

• Consult with local safety agencies and their requirements when designing a machine control link, interface, and all control elements that affect safety.
• Strictly adhere to all installation instructions.

Failure to comply with these instructions could result in death or serious injury.

WARRANTY/REMEDY

Honeywell warrants goods of its manufacture as being free of defective materials and faulty workmanship during the applicable warranty period. Honeywell's standard product warranty applies unless agreed to otherwise by Honeywell in writing; please refer to your order acknowledgement or consult your local sales office for specific warranty details. If warranted goods are returned to Honeywell during the period of coverage, Honeywell will repair or replace, at its option, without charge, those items that Honeywell, in its sole discretion, finds defective. The foregoing is the buyer's sole remedy and is in lieu of all other warranties, expressed or implied, including those of merchantability and fitness for a particular purpose. In no event shall Honeywell be liable for consequential, special, or indirect damages.

While Honeywell may provide information or engineering support for its products through Honeywell personnel, literature, and website, it is the buyer's sole responsibility to determine the suitability of the Honeywell product(s) for the buyer's requirements.

Specifications may change without notice. The information supplied is believed to be accurate as of this writing. However, Honeywell assumes no responsibility for its use.

For more information

Honeywell Sensing Solutions services its customers through a worldwide network of sales offices and distributors. For application assistance, current specifications, pricing, or the nearest Authorized Distributor, visit our website or call:

• USA/Canada: +1 302 613 4491
• Latin America: +1 305 805 8188
• Europe: +44 1344 238258
• Japan: +81 (0) 3-6730-7152
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