SEMI F20 13MM PRESSURE SENSOR

Application Brief

HIGH PURITY AND ULTRA-HIGH PURITY APPLICATIONS

Ensuring process integrity and enhancing product yield through controlled environments and contamination-free processes.

Products under High Purity (HP) and Ultra-High Purity (UHP) applications follow strict cleanliness standards and are exposed to a controlled manufacturing environment. These applications include semiconductor manufacturing, thin-film deposition, food and beverage processing & packaging, aircraft manufacturing, medical device manufacturing, nano drug development, biopharmaceutical production, material analysis labs, and research and development labs.

The presence of impurities, above certain size or concentration, can negatively impact the end outcome. Special steps should be taken when selecting raw materials or process components, or when designing cleanrooms, as unexpected elements can lead to poor product quality and low yield, resulting in financial losses. In certain processes, reaction outcomes can be compromised, leading to undesirable byproducts.

For example, in thin-film deposition or sub-micron layer deposition for semiconductor wafers, solar panels, or LED displays, impurities from gases, liquids, or components can result in defective integrated circuits and panels. Yield fallout during late-stage manufacturing can increase product cost. Similarly, impurities in food and beverage or biopharmaceutical manufacturing can cause process contamination.

In material analysis or R&D labs, impurities can lead to erroneous results and interpretation. Therefore, HP and UHP product manufacturing adheres to very strict universal cleanliness standards, followed by raw material suppliers, component manufacturers, and sensor manufacturers involved in the process flow and instrumentation systems.

A line graph titled 'Sensor offset drift under prolonged vacuum condition' shows multiple colored lines representing sensor readings over approximately 2200 hours. The Y-axis is 'Offset Drift [%FSS]' ranging from -0.15 to 0.15, with Upper Specification Limit (USL) and Lower Specification Limit (LSL) lines marked. The data shows minimal drift, staying close to zero and within the specified limits.

SEMICONDUCTOR PRODUCTION

A circular diagram illustrating the semiconductor manufacturing process. It depicts key stages such as Atomic Layer Deposition, Plasma Treatment, Testing, Microscope Check, X-Ray Inspection System, Laser Check, Automatic Dry Storage Cabinet, and Silicon Wafer, connected by arrows to show a typical workflow. A technician is shown handling a component rack.

UNIVERSAL STANDARDS

For HP and UHP applications, common standards and notations are used to specify cleanliness requirements for raw materials (air, liquid, gases, composition) and tools/components.

SEMI F20 COMPATIBLE PRESSURE SENSOR

The Honeywell 13V Series stainless-steel pressure sensors are oil-filled and media-isolated, specifically designed for UHP applications involving gas and liquid flow measurement in harsh environments. The rugged package incorporates a Honeywell piezoresistive semiconductor chip in an oil-isolated housing, ensuring high reliability, stability, and accuracy.

Featuring a SEMI F20-compatible ring and diaphragm, the sensor offers exceptional corrosion resistance, capable of withstanding aggressive halogenated gases common in semiconductor manufacturing. The 13V Series is engineered to minimize offset drift under prolonged vacuum conditions, making it ideal for critical industrial applications where vacuum is prevalent.

Laser welding of the ring and ball ensures reliable sealing and protection against environmental factors, maintaining accurate pressure measurement. These sensors offer high life-cycle capability and are designed for integration into OEM applications.

KEY SPECIFICATIONS

1. Offset drift under extreme vacuum conditions

In semiconductor wafer processing, precise control of multiple gas types at various flow rates is crucial for etching and vapor deposition. Accurate flow measurement is essential for controlling gas mixtures used in deposition, passivation, or oxidation prevention. Outlet pressure can range from extreme vacuum (<0.001 Pascal) to above atmospheric pressure (1200 Torr). Beyond total error output, offset drift directly impacts measurement accuracy, calibration stability, environmental sensitivity, performance consistency, and long-term reliability.

The 13V sensor is designed for reliable operation under extreme vacuum and elevated temperatures, suitable for etching and vapor deposition. The graph shows excellent offset drift (< ±0.1% FSR) over 90 days at high-temperature vacuum (<0.001 Pascal, 90°C).

A line graph titled 'Sensor offset drift under prolonged vacuum condition' similar to the one on page 2, showing minimal drift over time within specified limits.

2. Output change due to re-orientation

Three diagrams illustrate the effect of sensor orientation on output. 'Vertical Down' shows applied pressure and gravity acting downwards on the oil column. 'Horizontal' shows applied pressure and gravity acting sideways. 'Vertical Up' shows applied pressure and gravity acting upwards, with the oil column potentially opposing the applied pressure.

The orientation of an oil-filled pressure sensor can significantly influence its readings due to gravity acting on the internal oil column. The additional pressure exerted by the oil-fill layer can vary depending on gravity's impact, potentially opposing, aiding, or being orthogonal to the applied pressure. This error pressure, combined with the applied pressure, is transmitted to the piezoresistive element. Poorly designed sensors may show significant offset changes with orientation.

3. SEMI F20 material composition

A histogram titled 'Histogram of Accuracy (%FSS) at 25°C'. The X-axis represents accuracy values, and the Y-axis represents density. Different colored bars show the distribution of accuracy for sensors tested in Horizontal, Vertical Down, and Vertical Up orientations. The data indicates minimal variation in accuracy across orientations, with a Mean and Standard Deviation provided in a legend.

The 13V pressure sensor is designed with optimized oil volume for efficient pressure transfer with minimal impact on offset, ensuring minimal output variation and consistent performance regardless of orientation.

TABLE 1. SEMI F20 MATERIAL COMPOSITION
Element (wt%)CMnPSSiCrNiMo
SEMI F20 UHP≤0.03≤1.50≤0.045≤0.010≤0.7516-1810-152-3
Element (wt%)CuTiCaSeAlNNbFe
ACB40RGL≤0.30≤0.02≤0.02≤0.02≤0.01≤0.10≤0.05Balance

This specification outlines the metallurgical cleanliness standards and material composition requirements for 316L stainless steel used in components for general-purpose, high-purity, and ultra-high-purity chemical (gas or liquid) distribution systems. The wettable media of the 13V pressure sensor uses raw materials adhering to these strict standards, ensuring high quality.

CONCLUSION

Exceeding expectations: The 13V pressure sensor redefines excellence.

The SEMI F20 13V pressure sensor sets a benchmark for performance and quality, as evidenced by the data presented. Rigorous testing and analysis highlight Honeywell's commitment to excellence, ensuring the product consistently meets and exceeds customer expectations.

The 13V pressure sensor enhances process integrity through ultra-clean performance, significantly reducing contamination risks. It boosts production yield and cost-efficiency by minimizing late-stage manufacturing fallout. It also ensures accurate results in R&D and material analysis, supporting compliance with global cleanliness standards.

For detailed specifications, refer to the Datasheet. For applications, refer to the Flyer.

Further information can be found at automation.honeywell.com/hss.

IMPORTANT SAFETY INFORMATION

WARNING: IMPROPER INSTALLATION

Failure to comply with these instructions could result in death or serious injury.

WARRANTY/REMEDY

Honeywell warrants its manufactured goods to be free of defective materials and faulty workmanship during the applicable warranty period. Honeywell's standard product warranty applies unless otherwise agreed in writing. If warranted goods are returned during the coverage period, Honeywell will repair or replace, at its option, items found defective. This is the buyer's sole remedy and is in lieu of all other warranties, expressed or implied, including those of merchantability and fitness for a particular purpose. Honeywell shall not be liable for consequential, special, or indirect damages.

While Honeywell may provide information or engineering support, it is the buyer's sole responsibility to determine the suitability of Honeywell products for their requirements. Specifications may change without notice. Honeywell assumes no responsibility for the use of the information provided.

For more information

Honeywell Sensing Solutions services customers through a worldwide network of sales offices and distributors. For application assistance, current specifications, pricing, or the nearest Authorized Distributor, visit the website or call:

Honeywell Sensing Solutions
830 East Arapaho Road
Richardson, TX 75081
www.honeywell.com

Document reference: 008363-1-EN | Version: 07/25 | © 2025 Honeywell International Inc. All rights reserved.

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