Bridgelux SMD 2835 0.2W 3V

Product Data Sheet DS502

Introduction

The Bridgelux SMD 2835 LED series offers industry-standard package sizes and follows ANSI binning standards. These LEDs are optimized for cost and performance, providing highly competitive system lumen per dollar performance while meeting stringent efficacy and reliability standards for modern lighting applications.

Features

Industry-standard 2835 footprint
5 bin color control
Enables 3- and 6-step MacAdam ellipse custom binning kits
RoHS compliant and lead free
Multiple CCT configurations for a wide range of lighting applications

Benefits

Lower operating and manufacturing cost
Ease of design and rapid go-to-market
Uniform, consistent white light
Reliable and constant white point
Compliant with environmental standards
Design flexibility

Product Feature Map

The Bridgelux SMD LED products utilize industry-standard package sizes and adhere to ANSI binning standards. They are engineered for optimal cost and performance, aiming to deliver competitive system lumen per dollar while satisfying the rigorous efficacy and reliability requirements for contemporary lighting solutions.

The LED package features a Cathode Mark and a Yellow phosphor Light Emitting Surface (LES).

Product Nomenclature

The part number designation for Bridgelux SMD 2835 follows a structured format: BXFN-XXG-11L-3C3-00-0-0. This designation includes:

Product Family: BXFN
Nominal CCT: Example: 40 = 4,000K
Minimum CRI: Example: G = 90 CRI
Color Bin Options
Forward Voltage Bins
Flux Bins
Product Version
Typical Forward Voltage
Low Power
Die count in series
Die count in parallel

Product Selection Guide

The following product configurations are available:

Table 1: Selection Guide, Pulsed Measurement Data at 65mA (T_sp=25°C)

Part Number	Nominal CCT (K)	CRI	Nominal Drive Current (mA)	Forward Voltage (V)			Typical Pulsed Flux (lm)	Typical Power (W)	Typical Efficacy (lm/W)
				Min	Typical	Max
BXFN-27G-11L-3C3-00-0-0	2700	89	65	2.70	2.82	3.20	33.2	0.2	181
BXFN-30G-11L-3C3-00-0-0	3000	89	65	2.70	2.82	3.20	33.7	0.2	184
BXFN-35G-11L-3C3-00-0-0	3500	89	65	2.70	2.82	3.20	33.9	0.2	185
BXFN-40G-11L-3C3-00-0-0	4000	88	65	2.70	2.82	3.20	34.5	0.2	188
BXFN-50G-11L-3C3-00-0-0	5000	88	65	2.70	2.82	3.20	34.5	0.2	188
BXFN-57G-11L-3C3-00-0-0	5700	88	65	2.70	2.82	3.20	33.9	0.2	185
BXFN-65G-11L-3C3-00-0-0	6500	88	65	2.70	2.82	3.20	33.9	0.2	185

Table 2: Selection Guide, Pulsed Test Performance (T_sp = 85°C)

Part Number	Nominal CCT (K)	CRI	Nominal Drive Current (mA)	Forward Voltage (V)			Typical Pulsed Flux (lm)	Typical Power (W)	Typical Efficacy (lm/W)
				Min	Typical	Max
BXFN-27G-11L-3C3-00-0-0	2700	90	65	2.59	2.71	3.09	30.2	0.2	172
BXFN-30G-11L-3C3-00-0-0	3000	90	65	2.59	2.71	3.09	30.7	0.2	174
BXFN-35G-11L-3C3-00-0-0	3500	90	65	2.59	2.71	3.09	30.9	0.2	175
BXFN-40G-11L-3C3-00-0-0	4000	90	65	2.59	2.71	3.09	31.4	0.2	178
BXFN-50G-11L-3C3-00-0-0	5000	90	65	2.59	2.71	3.09	31.4	0.2	178
BXFN-57G-11L-3C3-00-0-0	5700	90	65	2.59	2.71	3.09	30.9	0.2	175
BXFN-65G-11L-3C3-00-0-0	6500	90	65	2.59	2.71	3.09	30.9	0.2	175

Notes for Tables 1 & 2:

The last 6 characters (including hyphens `-`) refer to flux bins, forward voltage bins, and color bin options, respectively. "00-0-0" denotes the full distribution of flux, forward voltage, and color bin.
Product CCT is the nominal CCT at T_sp = 60°C as defined by ANSI C78.377-2011.
Listed CRIs are minimum values.
Products tested under pulsed condition (10ms pulse width) at nominal Test current.
Bridgelux maintains a ±7.5% tolerance on flux measurements, ±0.1V tolerance on forward voltage measurements, and ±2 tolerance on CRI measurements for the SMD 2835.
Refer to Table 6 and Table 7 for Bridgelux SMD 2835 flux Binning and Forward Voltage Binning information.
Typical pulsed test performance values are provided as reference only and are not a guarantee of performance.
Typical performance is estimated based on operation under pulsed current with LED emitter mounted onto a heat sink with thermal interface material and the solder point temperature maintained at 85°C. Based on Bridgelux test setup, values may vary depending on the thermal design of the luminaire and/or the exposed environment to which the product is subjected.
For accurate testing with an integrating sphere, a conventional test preheat of 30ms with a 20ms integrating time is suggested. For pulse mode, a pulse width of 80-90% is recommended. Hot/cold testing requires conventional test conditions and wavelength accuracy within 1nm. Test conditions must be consistent.

Performance at Commonly Used Drive Currents

SMD 2835 LEDs are tested to the specifications shown using the nominal drive currents in Table 1. SMD 2835 may also be driven at other drive currents dependent on specific application design requirements. The performance at any drive current can be derived from the current vs. voltage characteristics shown in Figure 2 and the relative luminous flux vs. current characteristics shown in Figure 3. The performance at commonly used drive currents is summarized in Table 3.

Table 3: Performance at Commonly Used Drive Currents

Part Number	Drive Current (mA)	Typical V_f T_sp = 25°C (V)			Typical Power T_sp = 25°C (W)	Typical Pulsed Flux² T_sp = 25°C (lm)		Typical DC Flux³ T_sp = 85°C (lm)	Typical Efficacy T_sp = 25°C (lm/W)
Part Number	Drive Current (mA)	Min	Typical	Max	Typical Power T_sp = 25°C (W)			Typical DC Flux³ T_sp = 85°C (lm)	Typical Efficacy T_sp = 25°C (lm/W)
BXFN-27G-11L-3C3-00-0-0	40	2.75	2.81	2.91	0.1	20.9	19.0	190
	60	2.81	2.91	2.95	0.2	30.8	28.1	183
	100	2.91	3.02	2.95	0.3	49.5	45.1	170
	120	2.95	3.02	3.02	0.4	58.4	53.1	165
	150	3.02	3.10	3.02	0.5	71.7	65.2	158
BXFN-30G-11L-3C3-00-0-0	40	2.75	2.81	2.91	0.1	21.2	19.3	192
	60	2.81	2.91	2.95	0.2	31.3	28.5	186
	100	2.91	3.02	2.95	0.3	50.7	46.2	174
	120	2.95	3.02	3.02	0.4	60.0	54.6	169
	150	3.02	3.10	3.02	0.5	73.5	66.9	162
BXFN-35G-11L-3C3-00-0-0	40	2.75	2.81	2.91	0.1	21.3	19.3	193
	60	2.81	2.91	2.95	0.2	31.5	28.6	187
	100	2.91	3.02	2.95	0.3	51.0	46.4	175
	120	2.95	3.02	3.02	0.4	60.3	54.9	170
	150	3.02	3.10	3.02	0.5	73.9	67.2	163
BXFN-40G-11L-3C3-00-0-0	40	2.75	2.81	2.91	0.1	21.8	19.8	198
	60	2.81	2.91	2.95	0.2	32.4	29.5	192
	100	2.91	3.02	2.95	0.3	52.6	47.8	181
	120	2.95	3.02	3.02	0.4	62.3	56.7	176
	150	3.02	3.10	3.02	0.5	76.4	69.6	169
BXFN-50G-11L-3C3-00-0-0	40	2.75	2.81	2.91	0.1	21.8	19.8	198
	60	2.81	2.91	2.95	0.2	32.4	29.5	192
	100	2.91	3.02	2.95	0.3	52.6	47.8	181
	120	2.95	3.02	3.02	0.4	62.3	56.7	176
	150	3.02	3.10	3.02	0.5	76.4	69.6	169
BXFN-57G-11L-3C3-00-0-0	40	2.75	2.81	2.91	0.1	21.3	19.4	194
	60	2.81	2.91	2.95	0.2	31.7	28.9	189
	100	2.91	3.02	2.95	0.3	51.5	46.9	177
	120	2.95	3.02	3.02	0.4	61.0	55.6	172
	150	3.02	3.10	3.02	0.5	74.9	68.2	165
BXFN-65G-11L-3C3-00-0-0	40	2.75	2.81	2.91	0.1	21.3	19.4	194
	60	2.81	2.91	2.95	0.2	31.7	28.9	189
	100	2.91	3.02	2.95	0.3	51.5	46.9	177
	120	2.95	3.02	3.02	0.4	61.0	55.6	172
	150	3.02	3.10	3.02	0.5	74.9	68.2	165

Notes for Table 3:

Alternate drive currents in Table 3 are provided for reference only and are not a guarantee of performance.
Bridgelux maintains a ± 7.5% tolerance on flux measurements.
Typical stabilized DC performance values are provided as reference only and are not a guarantee of performance.

Electrical Characteristics

Table 4: Electrical Characteristics

Part Number	Drive Current (mA)	Forward Voltage (V)^1,2			Typical Temperature Coefficient of Forward Voltage ΔV_f/ΔT (mV/°C)	Typical Thermal Resistance Junction to Solder Point³ R_θj-sp (°C/W)
		Minimum	Typical	Maximum
BXFN-xxG-11L-3C3-00-0-0	65	2.70	2.82	3.20	-1.88	17.6

Notes for Table 4:

Bridgelux maintains a tolerance of ± 0.1V on forward voltage measurements. Voltage minimum and maximum values at the nominal Test current are guaranteed by 100% test.
Products tested under pulsed condition (10ms pulse width) at nominal Test current where T_sp = 25°C.
Thermal resistance value was calculated using total electrical input power; optical power was not subtracted from input power.
Thermal resistance is only for the LED test values.

Absolute Maximum Ratings

Table 5: Maximum Ratings

Parameter	Maximum Rating
LED Junction Temperature (T_j)	125°C
Storage Temperature	-40°C to +105°C
Operating Solder Point Temperature (T_sp)	-40°C to +105°C
Soldering Temperature	260°C or lower for a maximum of 10 seconds
Maximum Drive Current	240mA³
Maximum Peak Pulsed Forward Current¹	360mA
Maximum Reverse Voltage²	-
Moisture Sensitivity Rating	MSL 4
Electrostatic Discharge	2kV HBM. JEDEC-JS-001-HBM and JEDEC-JS-001-2012

Notes for Table 5:

Bridgelux recommends a maximum duty cycle of 10% and pulse width of 10 ms when operating LED SMD at maximum peak pulsed current specified. Maximum peak pulsed current indicate values where LED SMD can be driven without catastrophic failures.
Light emitting diodes are not designed to be driven in reverse voltage and will not produce light under this condition. No rating is provided.
The product is sensitive to moisture. It's not good to use for outdoor application or damp environment.

Product Bin Definitions

Table 6 lists the standard photometric luminous flux bins for Bridgelux SMD 2835 LEDs. Although several bins are listed, product availability in a particular bin varies by production run and by product performance. Not all bins are available in all CCTs.

Table 6: Luminous flux Bin Definitions at 65mA, T_sp=25°C

Bin Code	Minimum	Maximum	Unit	Condition
1E	30	32	lm	I_F=65mA
1F	32	34	lm	I_F=65mA
1G	34	36	lm	I_F=65mA
1H	36	38	lm	I_F=65mA

Note for Table 6: Bridgelux maintains a tolerance of ± 7.5% on flux measurements.

Table 7: Forward Voltage Bin Definition at 65mA, T_sp=25°C

Bin Code	Minimum	Maximum	Unit	Condition
9	2.7	2.8	V	I_F=65mA
A	2.8	2.9	V	I_F=65mA
B	2.9	3.0	V	I_F=65mA
C	3.0	3.1	V	I_F=65mA
D	3.1	3.2	V	I_F=65mA

Note for Table 7: Bridgelux maintains a tolerance of ± 0.1V on forward voltage measurements.

Table 8: 3- and 6-step MacAdam Ellipse Color Bin Definitions

CCT	Color Space	Center Point		Major Axis	Minor Axis	Ellipse Rotation Angle	Color Bin
		X	Y
2700K	3 SDCM	0.4578	0.4101	0.0081	0.0042	53.70	1
	6 SDCM	0.4578	0.4101	0.0162	0.0084	53.70	1/A/B/C/D
3000K	3 SDCM	0.4338	0.4030	0.00834	0.00408	53.22	1
	6 SDCM	0.4338	0.4030	0.01668	0.00816	53.22	1/A/B/C/D
3500K	3 SDCM	0.4073	0.3917	0.00927	0.00414	54.00	1
	6 SDCM	0.4073	0.3917	0.01854	0.00828	54.00	1/A/B/C/D
4000K	3 SDCM	0.3818	0.3797	0.00939	0.00402	53.72	1
	6 SDCM	0.3818	0.3797	0.01878	0.00804	53.72	1/A/B/C/D
5000K	3 SDCM	0.3447	0.3553	0.00822	0.00354	59.62	1
	6 SDCM	0.3447	0.3553	0.01644	0.00708	59.62	1/A/B/C/D
5700K	3 SDCM	0.3287	0.3417	0.00746	0.00320	59.09	1
	6 SDCM	0.3287	0.3417	0.01492	0.00640	59.09	1/A/B/C/D
6500K	3 SDCM	0.3123	0.3282	0.00669	0.00285	58.57	1
	6 SDCM	0.3123	0.3282	0.01338	0.00570	58.57	1/A/B/C/D

Notes for Table 8:

Color binning at T_sp=60°C unless otherwise specified.
Bridgelux maintains a tolerance of ± 0.007 on x and y color coordinates in the CIE 1931 color space.

Figure 1: C.I.E. 1931 Chromaticity Diagram (5 Color Bin Structure, Hot-color Targeted at T_sp=60°C). This figure displays chromaticity diagrams for various Correlated Color Temperatures (CCTs) from 2700K to 6500K. Each diagram shows the 3 SDCM and 6 SDCM color bins, represented by ellipses, with center points, major and minor axes, and rotation angles defined in Table 8. The diagrams illustrate the color distribution regions for the LEDs.

Performance Curves

Figure 2: Test Current vs. Forward Voltage (T_sp=25°C). This graph plots Forward Current (mA) on the y-axis against Forward Voltage (V) on the x-axis, showing a typical curve for the LED's electrical characteristics.

Figure 3: Relative Luminous Flux vs. Forward Current (T_sp=25°C). This graph illustrates the relationship between Forward Current (mA) and Relative Luminous Flux (%), indicating how luminous output changes with current. A note advises that Pulse Width Modulation (PWM) is recommended for dimming effects.

Figure 4: Relative Flux vs. Solder Point Temperature. This graph shows how Relative Luminous Flux changes with Solder Point Temperature (°C) for warm white, neutral white, and cool white LEDs.

Figure 5: Typical ccx Shift vs. Solder Point Temperature. This graph displays the typical ccx shift in color coordinates as a function of Solder Point Temperature (°C) for different white color temperatures.

Figure 6: Typical ccy Shift vs. Solder Point Temperature. This graph illustrates the typical ccy shift in color coordinates as a function of Solder Point Temperature (°C) for different white color temperatures.

Notes for Figures 4 & 5:

Characteristics shown for warm white are based on 3000K and 90 CRI.
Characteristics shown for neutral white are based on 4000K and 90 CRI.
Characteristics shown for neutral white are based on 5700K and 90 CRI.
For other color SKUs, the shift in color will vary. Please contact your Bridgelux Sales Representative for more information.

Notes for Figure 6:

Characteristics shown for warm white are based on 3000K and 90 CRI.
Characteristics shown for neutral white are based on 4000K and 90 CRI.
Characteristics shown for neutral white are based on 5700K and 90 CRI.
For other color SKUs, the shift in color will vary. Please contact your Bridgelux Sales Representative for more information.

Typical Radiation Pattern

Figure 7: Typical Spatial Radiation Pattern at 65mA, T_sp=25°C. This graph shows Relative Intensity (%) versus Angular Displacement (°), illustrating the spatial distribution of light emitted by the LED. The typical viewing angle is 120°.

Figure 8: Typical Polar Radiation Pattern at 65mA, T_sp=25°C. This polar plot displays Relative Luminosity against Radiation Angle, providing a visual representation of the LED's radiation pattern.

Typical Color Spectrum

Figure 9: Typical Color Spectrum. This graph shows Relative Radiant Power (%) versus Wavelength (nm) for different CCTs (3000K, 4000K, 5700K). It illustrates the spectral power distribution of the LEDs, with measurements taken at nominal current for T_sp = 25°C and shown for 90 CRI products.

Mechanical Dimensions

Figure 10: Drawing for SMD 2835. This section provides dimensional drawings of the SMD 2835 LED package (Top view, Side view, Bottom view) and the Recommended PCB Soldering Pad Pattern. All dimensions are in millimeters, with typical tolerances of ± 0.10mm. The drawings are not to scale.

Reliability

Table 9: Reliability Test Items and Conditions

No.	Items	Reference Standard	Test Conditions	Test Current	Test Duration	Units Failed/Tested
1	Moisture/Reflow Sensitivity	J-STD-020E	T_sld = 260°C, 10sec, Precondition: 30°C, 60%RH, 72hr	-	3 reflows	0/20
2	Low Temperature Storage	JESD22-A119	T_a=-40°C	-	1000 hours	0/20
3	High Temperature Storage	JESD22-A103D	T_a= 105°C	-	1000 hours	0/20
4	Low Temperature Operating Life	JESD22-A108D	T_a=-40°C	65mA	1000 hours	0/20
5	Temperature Humidity Operating Life	JESD22-A101C	T_sp=85°C, RH=85%	65mA	1000 hours	0/20
6	High Temperature Operating Life	JESD22-A108D	T_sp=85°C	240mA	1000 hours	0/20
7	Power switching	IEC62717:2014	T_sp= 85°C 30 sec on, 30 sec off	240mA	30000 cycles	0/20
8	Thermal Shock	JESD22-A106B	T_a=-40°C~105°C; Dwell : 15min; Transfer: 10sec	-	200 cycles	0/20
9	Temperature Cycle	JESD22-A104E	T_a=-40°C~100°C; Dwell at extreme temperature: 15min; Ramp rate < 105°C/min	-	200 cycles	0/20
10	Electrostatic Discharge	JS-001-2012	HBM, 2KV, 1.5kΩ, 100pF, Alternately positive or negative	-	-	0/20

Passing Criteria

Item	Symbol	Test Condition	Passing Criteria
Forward Voltage	V_f	65mA	ΔV_f<10%
Luminous Flux	F_v	65mA	ΔF_v<30%
Chromaticity Coordinates	(x, y)	65mA	Δu'v'<0.007

Notes for Table 9:

Measurements are performed after allowing the LEDs to return to room temperature.
T_sld : reflow soldering temperature; T_a : ambient temperature.

Reflow Characteristics

Figure 11: Reflow Profile (Reflow frequency 2 times max). This diagram illustrates the recommended temperature profile for lead-free reflow soldering, detailing preheat, liquidus, and peak temperature stages with associated times and ramp rates.

Profile Feature	Lead Free Assembly
Temperature Min. (T_{s_min})	160°C
Temperature Max. (T_{s_max})	205°C
Time (t_s) from T_{s_min} to T_{s_max}	60-150 seconds
Ramp-Up Rate (T_L to T_p)	3 °C/second
Liquidus Temperature (T_L)	220 °C
Time (T_L) Maintained Above T_L	60-150 seconds
Peak Temp(T_p)	260 °C max 10 sec
Time (T_p) Within 5 °C of the Specified Classification Temperature (T_c)	25 seconds max.
Ramp-Down Rate (T_p to T_L)	5 °C/second max.
Time 25 °C to Peak Temperature	10 minutes max.

Packaging

Figure 12: Emitter Reel Drawings. This figure shows the dimensions for the emitter reels, including outer diameter, hub diameter, and width. Drawings are not to scale and dimensions are in millimeters.

Figure 13: Emitter Tape Drawings. This figure illustrates the emitter tape dimensions, including tape width, pitch, and pocket dimensions, for both package1 and package2 configurations. It also shows the user feeder direction and the placement of LEDs within the tape. Drawings are not to scale and dimensions are in millimeters.

Figure 14: Emitter Reel Packaging Drawings. This figure depicts the packaging process for the LEDs, showing reels placed into aluminum moisture-proof bags, which are then sealed and placed into outer boxes. It details the quantities per package (e.g., 17K, 4.25K, 323K, 55.25K). Drawings are not to scale.

Design Resources

Please contact your Bridgelux sales representative for assistance.

Precautions

CAUTION: CHEMICAL EXPOSURE HAZARD

Exposure to some chemicals commonly used in luminaire manufacturing and assembly can cause damage to the LED emitter. Please consult Bridgelux Application Note AN51 for additional information.

CAUTION: EYE SAFETY

Eye safety classification for the use of Bridgelux SMD LED emitter is in accordance with IEC specification EN62471: Photobiological Safety of Lamps and Lamp Systems. SMD LED emitters are classified as Risk Group 1 when operated at or below the maximum Test current. Please use appropriate precautions. It is important that employees working with LEDs are trained to use them safely.

CAUTION: RISK OF BURN

Do not touch the SMD LED emitter during operation. Allow the emitter to cool for a sufficient period of time before handling. The SMD LED emitter may reach elevated temperatures such that could burn skin when touched.

CAUTION

CONTACT WITH LIGHT EMITTING SURFACE (LES)

Avoid any contact with the LES. Do not touch the LES of the emitter or apply stress to the LES (yellow phosphor resin area). Contact may cause damage to the emitter. Optics and reflectors must not be mounted in contact with the LES (yellow phosphor resin area).

Disclaimers

MINOR PRODUCT CHANGE POLICY

The rigorous qualification testing on products offered by Bridgelux provides performance assurance. Slight cosmetic changes that do not affect form, fit, or function may occur as Bridgelux continues product optimization.

STANDARD TEST CONDITIONS

Unless otherwise stated, LED emitter testing is performed at the nominal Test current.

About Bridgelux: Bridging Light and Life™

At Bridgelux, we help companies, industries and people experience the power and possibility of light. Since 2002, we've designed LED solutions that are high performing, energy efficient, cost effective and easy to integrate. Our focus is on light's impact on human behavior, delivering products that create better environments, experiences and returns--both experiential and financial. And our patented technology drives new platforms for commercial and industrial luminaires.

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Bridgelux, Inc.
46410 Fremont Boulevard
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Tel (925) 583-8400
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©2025 Bridgelux, Inc. All rights reserved 2025. Product specifications are subject to change without notice. Bridgelux and the Bridgelux stylized logo design are registered trademarks of Bridgelux, Inc. All other trademarks are the property of their respective owners.

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