Bridgelux SMD 3838 Triple CCT F90 3V

Product Data Sheet DS1424

Introduction

The Bridgelux SMD 3838 low power LED is cold-color targeted, ensuring LEDs fall within their specified color bin at typical application conditions of 25°C. The SMD 3838 is ideal as a drop-in replacement for emitters with an industry-standard 3.8mm x 3.8mm footprint.

Features

  • Industry-standard 3838 footprint
  • RoHS compliant and lead free
  • Triple CCT 4 in 1
  • Triple CCT color tunable along BBC to mix 2200K-6500K CRI90

Benefits

  • Lower operating and manufacturing cost
  • Ease of design and rapid go-to-market
  • Compliant with environmental standards
  • Design flexibility

Product Feature Map

Bridgelux SMD LED products come in industry-standard package sizes. These LEDs are optimized for cost and performance, helping to ensure highly competitive system lumen per dollar performance while addressing the stringent efficacy and reliability standards required for modern lighting applications.

Cathode Mark

[Image of Bridgelux SMD 3838 LED with four distinct color quadrants and labels C1, C2, C3, C4 indicating chip positions and a cathode mark.]

Product Nomenclature

The part number designation for Bridgelux SMD 3838 is explained as follows:

[Diagram illustrating product nomenclature: BXET-T2265G-H-03EA, with labels for Product Family, Triple CCT, Mix CCT 2200K-6500K, CRI90, Product Version, Typical Forward Voltage, High Power.]

Product Selection Guide

The following product configurations are available:

Table 1: Selection Guide, 3838 pulsed Measurement Data at 120mA (Tsp=25°C)

Color¹ Nominal Drive Current (mA) Forward Voltage² ³ (V) Typical Pulsed Flux (lm)² ³
Min Typical Max
C1⁴ 120 2.78 2.98 3.18 47.5
C1⁵ 120 2.8 3.0 3.2 45.3
C2 120 2.8 3.0 3.2 62.5
C3 120 2.8 3.0 3.2 49.0

Table 2: Selection Guide, 3838 pulsed Measurement Data at 120mA (Tsp=85°C)

Color¹ Nominal Drive Current (mA) Forward Voltage² ³ (V) Typical Pulsed Flux (lm)² ³
Min Typical Max
C1⁴ 120 2.74 2.94 3.13 43.7
C1⁵ 120 2.76 2.96 3.15 41.7
C2 120 2.76 2.96 3.15 57.3
C3 120 2.76 2.96 3.15 44.0

Notes for Table 1 & 2:

Performance at Each CCT

Table 3: Tunable White with CRI90

CCT C1 ratio C2 ratio C3 ratio Power (W) C1 Drive Current (mA) C2 Drive Current (mA) C3 Drive Current (mA) CIE_x¹ CIE_y¹ CRI¹ Rg¹ Power² (W) Flux² (lm) Efficacy² (lm/W)
C1 C1 C1 C1 C2 C2 C2 C2 C3 C3 C3 C3
1800 50.00% 50.00% 0.00% 0.00% 75.0 75.0 0.0 0.0 0.5433 0.4092 84.4 19.0 0.429 60.12 140.2
2200 38.64% 38.64% 18.55% 4.17% 58.0 58.0 27.8 6.3 0.5028 0.4162 91.1 42.4 0.417 66.19 158.6
2700 28.26% 28.26% 32.61% 10.87% 42.4 42.4 48.9 16.3 0.4585 0.4102 94.2 58.8 0.413 70.28 170.1
3000 23.08% 23.08% 38.46% 15.38% 34.6 34.6 57.7 23.1 0.4345 0.4035 94.7 64.6 0.414 71.77 173.4
3500 18.21% 18.21% 42.22% 21.37% 27.3 27.3 63.3 32.1 0.4078 0.3922 94.7 69.2 0.415 72.69 175.2
4000 13.69% 13.69% 44.69% 27.93% 20.5 20.5 67.0 41.9 0.3823 0.3798 94.0 70.9 0.414 73.29 176.9
5000 8.60% 8.60% 43.01% 39.78% 12.9 12.9 64.5 59.7 0.3451 0.3557 92.9 68.0 0.419 73.16 174.5
5700 7.34% 7.34% 39.45% 45.87% 11.0 11.0 59.2 68.8 0.3293 0.3423 92.8 70.3 0.421 72.48 172.1
6500 5.95% 5.95% 35.71% 52.38% 8.9 8.9 53.6 78.6 0.3138 0.3291 92.2 69.2 0.423 71.47 169.0
1800 50.00% 50.00% 0.00% 0.00% 150.0 150.0 0.0 0.0 0.5419 0.4090 83.7 15.8 0.917 111.20 121.3
2200 38.64% 38.64% 18.55% 4.17% 115.9 115.9 55.6 12.5 0.5002 0.4149 90.5 40.2 0.877 125.96 143.6
2700 28.26% 28.26% 32.61% 10.87% 84.8 84.8 97.8 32.6 0.4566 0.4076 93.7 56.7 0.861 134.54 156.3
3000 23.08% 23.08% 38.46% 15.38% 69.2 69.2 115.4 46.2 0.4332 0.4004 94.4 63.1 0.861 137.20 159.3
3500 18.21% 18.21% 42.22% 21.37% 54.6 54.6 126.6 64.1 0.4074 0.3892 94.7 68.6 0.861 139.28 161.7
4000 13.69% 13.69% 44.69% 27.93% 41.1 41.1 134.1 83.8 0.3823 0.3770 94.2 70.8 0.870 139.84 160.8
5000 8.60% 8.60% 43.01% 39.78% 25.8 25.8 129.0 119.4 0.3460 0.3534 93.3 69.6 0.881 138.99 157.8
5700 7.34% 7.34% 39.45% 45.87% 22.0 22.0 118.3 137.6 0.3314 0.3410 93.5 73.0 0.885 137.66 155.6
6500 5.95% 5.95% 35.71% 52.38% 17.9 17.9 107.1 157.1 0.3164 0.3286 93.1 73.2 0.892 135.44 151.8

Notes for Table 3:

Absolute Maximum Ratings

Table 4: Maximum Ratings

Parameter Maximum Rating
LED Junction Temperature (Tj) 125°C
Storage Temperature -40°C to +105°C
Operating Solder Point Temperature (Tsp) -40°C to +105°C
Soldering Temperature 260°C or lower for a maximum of 10 seconds
Maximum Drive Current C1: 160mA, C2: 160mA, C3: 160mA
Peak Pulsed Forward Current¹ 200mA
Maximum Power 1W
Maximum Reverse Voltage² -5V
Moisture Sensitivity Rating MSL 3
Electrostatic Discharge 2kV HBM, JEDEC-JS-001-HBM and JEDEC-JS-001-2012

Notes for Table 4:

Product Bin Definitions

Table 5: MacAdam Ellipse Color Bin Definitions

Color Center Point Major Axis Minor Axis Ellipse Rotation Angle Color Bin
X Y
C1³ 0.5445 0.4099 0.01545 0.0069 5.0° 3/A/B
C2 0.4523 0.5122 0.01545 0.0069 70.0° 5
C3³ 0.2228 0.2458 0.01545 0.0069 3/A/B

Notes for Table 5:

Figure 1: Chromaticity Coordinate Group (Color Bin Structure, Color Targeted at Tsp=25°C)

[Diagram showing chromaticity coordinate groups for 3838-C1, 3838-C2, and 3838-C3, illustrating MacAdam ellipses and color bins A, B, and 3.]

Notes for Figure 1:

  • The performance is based on both C1 lighting up simultaneously in parallel.

Product Bin Definitions

Table 6 lists the standard photometric luminous flux bins for SMD 3838 Triple CCT Fgo. Although several bins are outlined, product availability in a particular bin varies by production run and by product performance.

Table 6: Luminous Flux Range Definitions at 120mA, Tsp=25°C

Color Luminous Flux¹ Unit Condition
Minimum Maximum
C1² 46 52 lm I=120mA
C2 60 70
C3 46 55

Note for Table 6:

Table 7: Forward Voltage Range Definitions at 120mA, Tsp=25°C

VF Bin Forward Voltage¹ Unit Condition
Minimum Maximum
E 2.98 3.05 V I=120mA
F 3.05 3.15 V I=120mA

Note for Table 7:

Table 8: Color Bin in combination at 120mA

Bin Code C1 C2 C3
GE1 3 5 3
GE2 3 5 A
GE3 3 5 B
GE4 A 5 3
GE5 A 5 A
GE6 A 5 B
GE7 B 5 3
GE8 B 5 A
GE9 B 5 B

Note for Table 8:

Performance Curves

Figure 2: Drive Current vs. Voltage (Tsp=25°C)

[Graph showing Drive Current (mA) on the y-axis and Forward Voltage (V) on the x-axis, with a line indicating the relationship.]

Figure 3: Typical Relative Luminous Flux vs. Drive Current (Tsp=25°C)

[Graph showing Relative Luminous Flux (%) on the y-axis and Forward Current (mA) on the x-axis, with separate lines for C1, C2, and C3.]

Note for Figure 3:

Performance Curves

Figure 4: Typical Relative Flux vs. Solder Point Temperature

[Graph showing Relative Luminous Flux (%) on the y-axis and Solder Point Temperature (°C) on the x-axis, with separate lines for C1, C2, and C3.]

Performance Curves

Figure 5: Chromaticity Coordinate Group (Color Targeted at Tsp=25°C&55°C&85°C)

[Graph showing Chromaticity Coordinate Group for 0.5W Triple CCT F90 and 1W Triple CCT F90, with different CCTs (1800K to 6500K) plotted at various temperatures (25°C, 55°C, 85°C).]

Typical Radiation Pattern

Figure 6: Typical Spatial Radiation Pattern at 120mA, Tsp=25°C

[Graph showing Relative Intensity on the y-axis and Angular Displacement (°) on the x-axis, with curves for C1, C2, and C3.]

Notes for Figure 6:

Figure 7: Typical Polar Radiation Pattern at 120mA, Tsp=25°C

[Diagram showing a polar radiation pattern with Relative Luminosity on the radial axis and Radiation Angle on the angular axis, with curves for C1, C2, and C3.]

Typical Color Spectrum

Figure 8: Typical Color Spectrum

[Graph showing Relative Radiant Power (%) on the y-axis and Wavelength (nm) on the x-axis, with curves for C1, C2, and C3.]

Notes for Figure 8:

Figure 9: Tunable White Spectrum

[Graphs showing tunable white spectrum for 0.5W Triple F90 and 1W Triple F90, with Intensity (W/nm) on the y-axis and Wavelength (nm) on the x-axis, showing different CCTs.]

Mechanical Dimensions

Figure 10: Drawing for SMD 3838

[Diagram showing mechanical dimensions of the SMD 3838 package, including top view, side view, and bottom view with dimensions and pin assignments C1, C2, C3.]

Notes for Figure 10:

Recommended PCB Soldering Pad Pattern

[Diagrams showing recommended PCB soldering pad pattern for copper and solder mask layers.]

Please try to enlarge the copper foil design of the large pad. The copper design shown in red above is for reference only.

Reliability

Table 9: Reliability Test Items and Conditions

No. Items Reference Standard Test Conditions Drive Current Test Duration Units Failed/Tested
1 Moisture Sensitivity Level J-STD-020D.1 Tsld = 260°C, 10sec, Precondition: 85°C, 60%RH, 168hr 3 reflows 0/22
2 Low Temperature Storage JESD22-A119 Tsp=-40°C 1000 hours 0/22
3 High Temperature Storage JESD22-A103 Tsp=105°C 1000 hours 0/22
4 Low Temperature Operating Life JESD22-A108 Tsp=-40°C 120mA 1000 hours 0/22
5 Temperature Humidity Operating Life JESD22-A101 Tsp=85°C, RH=85% 120mA 1000 hours 0/22
6 High Temperature Operating Life JESD22-A108 Tsp=105°C total 300mA 1000 hours 0/22
7 Thermal Shock JESD22-A104 T=-40°C~100°C, Dwell: 15min; Transfer: 10sec 200 Cycles 0/22
8 Temperature Cycle JESD22-A104 T=-40°C~100°C, Dwell at extreme temperature: 15min; Ramp rate < 105°C/min 200 Cycles 0/22

Passing Criteria

Item Symbol Test Condition Passing Criteria
Forward Voltage Vf 120mA ΔVf<10%
Luminous Flux Iv 120mA ΔIv<30%
Chromaticity Coordinates (x, y) 120mA Δu'v'<0.007

Notes for Table 9:

Reflowing Characteristics

Figure 11: Reflow Profile

[Diagram illustrating reflow profiles for lead-free assembly, showing temperature on the y-axis and time on the x-axis, with key stages like Preheat Area, Liquidus Temperature, and Peak Temperature indicated.]

Profile Feature Lead Free Assembly
Temperature Min. (Ts_min) 160°C
Temperature Max. (Ts_max) 205°C
Time (ts) from Ts_min to Ts_max 60-150 seconds
Ramp-Up Rate (TL to Tp) 3°C/second
Liquidus Temperature (TL) 220 °C
Time (TL) Maintained Above TL 60-150 seconds
Peak Temp(Tp) 260 °C max.
Time (Tp) Within 5 °C of the Specified Classification Temperature (Tc) 25 seconds max.
Ramp-Down Rate (Tp to TL) 5 °C/second max.
Time 25 °C to Peak Temperature 10 minutes max.

Packaging

Figure 12: Emitter Reel Drawings

[Diagrams showing emitter reel dimensions.]

Note for Figure 12:

Figure 13: Emitter Tape Drawings

[Diagrams illustrating emitter tape dimensions and features, including tape width, pitch, and pocket dimensions for A0, B0, K0, P0, P1, P2, D0, D1, E, F, W, T.]

Note for Figure 13:

Packaging

Figure 14: Emitter Reel Packaging Drawings

[Diagrams illustrating the packaging process for Bridgelux SMD 3838 LEDs, showing reels, aluminum moisture-proof bags, and outer boxes with quantities.]

Note for Figure 14:

Design Resources

Please contact your Bridgelux sales representative for assistance.

Precautions

CAUTION: CHEMICAL EXPOSURE HAZARD

Exposure to some chemicals commonly used in luminaire manufacturing and assembly can cause damage to the LED emitter. Please consult Bridgelux Application Note AN51 for additional information.

CAUTION: EYE SAFETY

Eye safety classification for the use of Bridgelux SMD LED emitter is in accordance with IEC specification EN62471: Photobiological Safety of Lamps and Lamp Systems. SMD LED emitters are classified as Risk Group 1 when operated at or below the maximum drive current. Please use appropriate precautions. It is important that employees working with LEDs are trained to use them safely.

CAUTION: RISK OF BURN

Do not touch the SMD LED emitter during operation. Allow the emitter to cool for a sufficient period of time before handling. The SMD LED emitter may reach elevated temperatures such that could burn skin when touched.

CAUTION

CONTACT WITH LIGHT EMITTING SURFACE (LES)

Avoid any contact with the LES. Do not touch the LES of the emitter or apply stress to the LES (yellow phosphor resin area). Contact may cause damage to the emitter.

Optics and reflectors must not be mounted in contact with the LES (yellow phosphor resin area).

Disclaimers

MINOR PRODUCT CHANGE POLICY

The rigorous qualification testing on products offered by Bridgelux provides performance assurance. Slight cosmetic changes that do not affect form, fit, or function may occur as Bridgelux continues product optimization.

STANDARD TEST CONDITIONS

Unless otherwise stated, LED emitter testing is performed at the nominal drive current.

About Bridgelux: Bridging Light and Life™

At Bridgelux, we help companies, industries and people experience the power and possibility of light. Since 2002, we've designed LED solutions that are high performing, energy efficient, cost effective and easy to integrate. Our focus is on light's impact on human behavior, delivering products that create better environments, experiences and returns-both experiential and financial. And our patented technology drives new platforms for commercial and industrial luminaires.

For more information about the company, please visit:

[Bridgelux logo]

46410 Fremont Boulevard
Fremont, CA 94538 USA
Tel (925) 583-8400
Fax (925) 583-8401
www.bridgelux.com

©2024 Bridgelux, Inc. All rights reserved 2020. Product specifications are subject to change without notice. Bridgelux and the Bridgelux stylized logo design are registered trademarks of Bridgelux, Inc. All other trademarks are the property of their respective owners.

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