Bridgelux SMD 3838 RGBW 3V

Introduction

The Bridgelux SMD 3838 low power LED is cold-color targeted, ensuring LEDs fall within specified color bins at typical application conditions of 25°C. The SMD 3838 is an ideal drop-in replacement for emitters with an industry-standard 3.8mm x 3.8mm footprint.

Product Feature Map

Bridgelux SMD LED products come in industry-standard package sizes. These LEDs are optimized for cost and performance, helping to ensure highly competitive system lumen per dollar performance while addressing the stringent efficacy and reliability standards required for modern lighting applications.

A visual representation of the LED shows four distinct colored dies labeled R (Red), G (Green), B (Blue), and W (White). A cathode mark is also indicated.

Product Nomenclature

The part number designation for Bridgelux SMD 3838 RGBW is explained as follows:

Example: BXET-RGBW-25C-03EA

• Product Family: BXET
• Emitting light colors: RGBW (Example: R = Red, G = Green, B = Blue, W = White)
• W Nominal CCT: 25 = 2500K
• Product Version: 03
• Typical Forward Voltage: EA (example value)
• W Minimum CRI: C for 70 (example value)

Product Test Conditions

Bridgelux SMD 3838 LEDs are tested and binned with a 10ms pulse of 120mA at T_j (junction temperature) = T_sp (solder point temperature) = 25°C. Luminous flux, color, and forward voltage are binned at T_j=T_sp=25°C.

Product Selection Guide

The following product configurations are available:

Table 1: Selection Guide, RGB Pulsed Measurement Data at 120mA (T_j=T_sp=25°C)

Table 2: Selection Guide, W Pulsed Measurement Data at 120mA (T_j=T_sp=25°C)

Table 3: Selection Guide, RGB Pulsed Measurement Data at 120mA (T_j=T_sp=85°C)

Table 4: Selection Guide, W Pulsed Measurement Data at 120mA (T_j=T_sp=85°C)

Notes for Tables 1, 2, 3 and 4:

• Products tested under pulsed condition (10ms pulse width) at nominal drive current.
• Bridgelux maintains a ±7.5% tolerance on luminous flux measurements, ±0.1V tolerance on forward voltage measurements, and ±1nm tolerance on dominant wavelength measurements for SMD 3838.
• Refer to Tables 12, 13 and 14 for Bridgelux SMD 3838 flux Binning and Forward Voltage Binning and Dominant Wavelength Binning information.

Performance at Commonly Used Drive Currents

SMD 3838 RGBW specifications at nominal drive current are shown in Tables 1 & 2. SMD 3838 RGBW may also be driven at other drive currents dependent on specific application design requirements. The performance at any drive current can be derived from the current vs. voltage characteristics shown in Figure 2 and the relative luminous flux vs. current characteristics shown in Figure 3. The performance at commonly used drive currents is summarized in Table 9.

Table 9: Performance at Commonly Used Drive Currents

Notes for Table 9:

• Alternate drive currents in Table 9 are provided for reference only and are not a guarantee of performance.
• Bridgelux maintains a ± 7.5% tolerance on flux measurements.
• Typical pulsed performance values are provided as reference only and are not a guarantee of performance.

Electrical and Thermal Characteristics

Table 10: Electrical and Thermal Characteristics

Notes for Table 10:

• Products tested under pulsed condition (10ms pulse width) where T_sp = 25°C.
• Bridgelux maintains a tolerance of ± 0.1V on forward voltage measurements.
• Products measured between 25°C and 85°C under pulsed condition (10ms pulse width).
• Thermal resistance value was calculated using total electrical input power; optical power was not subtracted from input power.

Absolute Maximum Ratings

Table 11: Maximum Ratings

Notes for Table 11:

• Bridgelux recommends a maximum duty cycle of 10% and pulse width of 10 ms when operating SMD 3838 at maximum peak pulsed current specified. Maximum peak pulsed currents indicate values where SMD 3838 can be driven without catastrophic failures.
• Light emitting diodes are not designed to be driven in reverse voltage and will not produce light under this condition. Maximum rating provided for reference only.

Product Bin Definitions

Table 12 lists the standard photometric luminous flux bins for SMD 3838 RGBW. Although several bins are outlined, product availability in a particular bin varies by production run and by product performance.

Table 12: Luminous Flux Bin Definitions at 120mA, T_sp=25°C

Note for Table 12:

• Bridgelux maintains a tolerance of ± 7.5% on luminous flux measurements.

Table 13: Forward Voltage Bin Definitions at 120mA, T_sp=25°C

Note for Table 13:

• Bridgelux maintains a tolerance of ± 0.1V on forward voltage measurements.

Table 14: Dominant Wavelength Bin Definitions at 120mA, T_sp=25°C

Note for Table 14:

• Bridgelux maintains a tolerance of ± 1nm on dominant wavelength measurements.

Table 15: RGW MacAdam Ellipse Color Bin Definitions (T_sp=25°C)

Notes for Table 15:

• Color binning at T_sp=25°C unless otherwise specified.
• Bridgelux maintains a tolerance of ± 0.007 on x and y color coordinates in the CIE 1931 color space.

Figure 1: C.I.E. 1931 Chromaticity Diagram (Color Bin Structure, T_sp=25°C)

This figure displays chromaticity diagrams for Red (R), Green (G), and White (W) LEDs, illustrating their respective color bins within the CIE 1931 color space. The diagrams show ellipses representing the color bins, with center points and axes defined.

Performance Curves

Figure 2: Drive Current vs. Voltage (T_sp=25°C)

This graph shows the relationship between drive current (mA) and forward voltage (V) for White, Red, Green, and Blue LEDs at a solder point temperature of 25°C. The lines indicate a generally linear increase in current with voltage.

Figure 3: Typical Relative Luminous Flux vs. Drive Current (T_sp=25°C)

This graph illustrates the typical relative luminous flux (%) as a function of forward current (mA) for White, Red, Green, and Blue LEDs at 25°C. It shows an increasing trend of luminous flux with higher drive currents. Pulse width modulation (PWM) is recommended for dimming effects.

Figure 4: Typical Relative Flux vs. Solder Point Temperature_120mA

This graph displays the typical relative luminous flux (%) versus solder point temperature (°C) for White, Red, Green, and Blue LEDs at a drive current of 120mA. It shows how flux changes with temperature, with most colors experiencing a decrease in flux as temperature rises.

Figure 5: Chromaticity Coordinate Group (Color Targeted at T_sp=25°C & 85°C)

This figure presents chromaticity diagrams for 0.5W Tunable Spectrum (CRI90, 25C) and 0.5W Tunable Spectrum (CRI95, 25C). It shows the color bins for various Correlated Color Temperatures (CCTs) from 1800K to 6500K at both 25°C and 85°C solder point temperatures.

Figure 6: Drive Current vs Solder Point Temperature

This graph illustrates the relationship between drive current (mA) and solder point temperature (°C) for WRG (White, Red, Green) and B (Blue) LEDs. It indicates maximum drive currents at different temperatures, showing that higher temperatures require lower drive currents to maintain performance and prevent damage.

Typical Radiation Pattern

Figure 7: Typical Spatial Radiation Pattern at 120mA, T_sp=25°C

This graph shows the relative intensity of light emitted by the LEDs at different angular displacements from the centerline. The WRG typical viewing angle is 114°, and the Blue typical viewing angle is 133°. The viewing angle is defined as the off-axis angle from the centerline where the intensity (Iv) is half of the peak value.

Figure 8: Typical Polar Radiation Pattern at 120mA, T_sp=25°C

This polar plot illustrates the relative luminosity of the LEDs at various radiation angles. It provides a visual representation of the light distribution pattern.

Typical Color Spectrum

Figure 9: Typical Color Spectrum at 120mA, T_sp=25°C

This graph shows the relative radiant power (%) as a function of wavelength (nm) for Blue, White, Red, and Green LEDs at 120mA and 25°C. It displays the spectral distribution of light for each color.

Figure 10: Tunable White Spectrum, T_sp=25°C

These graphs show the tunable white spectrum for 0.5W LEDs at 25°C for both CRI90 and CRI95. The intensity is plotted against wavelength (nm) for various CCTs ranging from 1800K to 6500K, demonstrating how the spectral output changes with CCT.

Mechanical Dimensions

Figure 11: Drawing for SMD 3838

This figure provides detailed mechanical drawings of the SMD 3838 LED, including top, side, and front views, with dimensions in millimeters. It also shows the pinout for the Red, White, Green, and Blue emitters. The drawings are not to scale, and dimensions have tolerances of ± 0.10mm unless otherwise specified. The optical center of the LED emitter is nominally defined by the mechanical center of the emitter to a tolerance of ± 0.2 mm.

Recommended PCB Soldering Pad Pattern

This diagram illustrates the recommended PCB soldering pad pattern for the SMD 3838 LED, with dimensions provided in millimeters.

Reliability

Table 14: Reliability Test Items and Conditions

This table outlines various reliability tests performed on the LEDs, including Moisture Sensitivity Level, Low and High Temperature Storage, Operating Life tests under different conditions, Thermal Shock, and Temperature Cycling. It specifies the reference standards, test conditions, drive currents, test durations, and passing criteria.

Passing Criteria:

Notes for Table 14:

• Measurements are performed after allowing the LEDs to return to room temperature.
• T_sld: reflow soldering temperature; T_j: junction temperature.

Reflowing Characteristics

Figure 12: Reflow Profile

This figure illustrates the recommended reflow profile for lead-free assembly, detailing temperature stages such as Preheat Area (T_{s_min} to T_{s_max}), Liquidus Temperature (T_L), and Peak Temperature (T_p). It also specifies ramp-up and ramp-down rates, and time durations at various temperature points, adhering to IPC/JEDEC J-STD-020 standards.

Profile Feature | Lead Free Assembly
Temperature Min. (T_{s_min}) | 160°C
Temperature Max. (T_{s_max}) | 205°C
Time (t_s) from T_{s_min} to T_{s_max} | 60-150 seconds
Ramp-Up Rate (T_L to T_p) | 3 °C/second
Liquidus Temperature (T_L) | 220 °C
Time (T_L) Maintained Above T_L | 60-150 seconds
Peak Temp(T_p) | 260 °C max.
Time (T_p) Within 5 °C of the Specified Classification Temperature (T_c) | 25 seconds max.
Ramp-Down Rate (T_p to T_L) | 5 °C/second max.
Time 25 °C to Peak Temperature | 10 minutes max.

Packaging

Figure 13: Emitter Reel Drawings

This figure shows drawings of the emitter reels, including side and front views, with dimensions and capacity information. The reels are designed to hold the LEDs for automated assembly processes.

Figure 14: Emitter Tape Drawings

This figure details the emitter tape dimensions and layout, showing the arrangement of LEDs on the tape, leader/trailer portions, and cathode marks. The dimensions are provided in millimeters, and the tape is designed for use in automated pick-and-place machines.

Figure 15: Emitter Reel Packaging Drawings

This figure illustrates the packaging process for the emitters, showing how reels are placed into aluminum moisture-proof bags and then into outer boxes. It details the quantities per package (e.g., 1.9K, 9.5K) and the final packaging configurations (package1, package2).

Design Resources

Optical Source Models

For optical source models, please contact a Bridgelux sales representative for assistance.

Precautions

CAUTION: CHEMICAL EXPOSURE HAZARD

Exposure to certain chemicals used in luminaire manufacturing can damage the LED emitter. Consult Bridgelux Application Note AN51 for details.

CAUTION: EYE SAFETY

The eye safety classification for Bridgelux SMD LED emitters is in accordance with IEC specification EN62471. Precautions should be taken when the blue light is active, as it poses an eye safety risk. The blue light is classified as Risk Group 2 when operated at or below the maximum drive current. Employees working with LEDs should be trained in safe usage.

CAUTION: RISK OF BURN

Do not touch the SMD LED emitter during operation. Allow it to cool sufficiently before handling, as it may reach temperatures that can cause skin burns.

CAUTION

CONTACT WITH LIGHT EMITTING SURFACE (LES)

Avoid contact with or applying stress to the LES, as this may cause damage. Optics and reflectors should not be mounted in contact with the LES.

Disclaimers

MINOR PRODUCT CHANGE POLICY

Bridgelux provides performance assurance through rigorous qualification testing. Minor cosmetic changes that do not affect form, fit, or function may occur as Bridgelux optimizes its products.

STANDARD TEST CONDITIONS

Unless otherwise stated, LED emitter testing is performed at the nominal drive current.

About Bridgelux: Bridging Light and Life™

Bridgelux designs LED solutions that are high-performing, energy-efficient, cost-effective, and easy to integrate. Their focus is on light's impact on human behavior, creating better environments and experiences. Their patented technology drives new platforms for commercial and industrial luminaires.

For more information about the company, please visit:

• bridgelux.com
• twitter.com/Bridgelux
• facebook.com/Bridgelux
• WeChat ID: BridgeluxInChina

Bridgelux
46410 Fremont Boulevard
Fremont, CA 94538 U.S.A.
Tel (925) 583-8400
www.bridgelux.com

©2025 Bridgelux, Inc. All rights reserved. Product specifications are subject to change without notice. Bridgelux and the Bridgelux stylized logo design are registered trademarks of Bridgelux, Inc. All other trademarks are the property of their respective owners.