1. Overview
The T3-U module is a Wi-Fi 6 and Bluetooth Low Energy (LE) combo module developed by Tuya Smart. It integrates a highly efficient RFID chip, T3, with peripheral components, supporting both Station (STA) and Access Point (AP) modes. It features a built-in 32-bit MCU running at up to 320 MHz, 4 MB flash memory, and 640 KB SRAM. The module is designed for cloud connectivity and includes extended instructions for signal processing, enabling efficient audio encoding and decoding. It offers various peripherals such as PWM, UART, and SPI, with up to five channels of 32-bit PWM output ideal for high-quality LED control.
1.1. Features
- Built-in low-power 32-bit CPU (application processor)
- Clock rate: 320 MHz
- Operating voltage range: 2.0 V to 3.6 V
- Peripherals: 5 PWM pins, 3 UARTs, 1 SPI
- Wi-Fi connectivity: IEEE 802.11b/g/n/ax (Channels 1-14 at 2.4 GHz), supports WEP, WPA/WPA2, WPA/WPA2 PSK (AES), WPA3 security modes. Average output power +18 dBm for IEEE 802.11b. Supports STA, AP, STA + AP combo, and direct working modes.
- Bluetooth connectivity: Bluetooth Core Specification v5.4. Transmitter power is 7 dBm. Integral Wi-Fi and Bluetooth coexistence interface.
- Onboard PCB antenna with a peak gain of -1.04 dBi.
- Operating temperature range: -40°C to 105°C.
- Two pairing modes: Bluetooth and Wi-Fi AP mode, compatible with Android and iOS.
1.2. Scope of applications
- Smart building
- Smart home and electrical appliances
- Smart sockets and lights
- Industrial wireless control
- Baby monitors
- IP cameras
- Smart buses
2. Module Interfaces
2.1. Dimensions and Footprint
The T3-U module dimensions are 15.8 ± 0.35 mm (W) x 20.3 ± 0.35 mm (L) x 2.5 ± 0.15 mm (H). Detailed mechanical dimensions and recommended footprint are provided in the datasheet.
2.2. Pin Definition
The datasheet provides a comprehensive pin definition table, detailing each pin's number, symbol, I/O type, and description, including reuse as SPI_SCK, SPI_MOSI, SPI_MISO, and SPI_CS. It also specifies power pins (GND, 3.3V) and various I/O pins for UART, ADC, and PWM functionalities.
3. Electrical Parameters
3.1. Absolute Electrical Parameters
Key parameters include storage temperature (-55°C to 125°C), supply voltage (-0.3V to 3.9V), and electrostatic discharge voltage ratings.
3.2. Normal Operating Conditions
Specifies operating temperature (-40°C to 105°C), supply voltage (2.0V to 3.6V), and I/O level specifications.
3.3. Radio Frequency (RF) Power
Details transmit and receive power and current consumption for various Wi-Fi standards (802.11b/g/n/ax) and data rates.
3.4. Operating Current
Outlines average and maximum current consumption in different operating modes, including quick pairing, connected, weakly connected, disconnected, and module disabled states. Low power long standby current is typically 150 μA @ DTIM10.
4. RF Parameters
4.1. Basic RF Features
Covers operating frequency (2.412 to 2.484 GHz), Wi-Fi standards (IEEE 802.11b/g/n/ax), data transmission rates, and antenna type (PCB antenna).
4.2. Wi-Fi Transmitter (TX) Performance
Provides RF average output power and frequency error specifications for different Wi-Fi modes and data rates.
4.3. Wi-Fi Receiver (RX) Performance
Details Packet Error Rate (PER) and RX sensitivity for 802.11b, 802.11g, 802.11n, and Bluetooth modes.
4.4. Bluetooth Transmitter (TX) Performance
Specifies operating frequency, transmission rate, transmission power, and frequency error for Bluetooth mode.
4.5. Bluetooth Receiver (RX) Performance
Provides RX sensitivity, maximum RF signal input, intermodulation, and adjacent-channel rejection ratio for Bluetooth.
5. Antenna Information
5.1. Antenna Type
The T3-U module utilizes an onboard PCB antenna.
5.2. Antenna Interference Reduction
Recommendations are provided for optimizing Wi-Fi performance by maintaining a distance of at least 15 mm from other metal components and ensuring the enclosure surrounding the antenna is free of copper traces.
6. Packing and Production Instructions
6.1. Mechanical Dimensions
Details the mechanical dimensions of the T3-U PCB and provides recommended footprint diagrams for mounting.
6.2. Production Instructions
Offers guidance on SMT and wave soldering processes, including required instruments, baking procedures for moisture-sensitive devices, and recommended oven temperature curves for both reflow and wave soldering. It emphasizes ESD protection measures and quality monitoring using SPI and AOI.
6.3. Recommended Oven Temperature Curve
Presents detailed temperature curves for reflow soldering (SMT process) and wave soldering, including preheat, liquidus, peak temperatures, and ramp-up/down slopes, with specific parameters for SAC305 solder paste.
6.4. Storage Conditions
Highlights moisture sensitivity and provides storage guidelines, including shelf life in sealed bags, handling after opening, and conditions requiring baking before mounting, referencing IPC/JEDEC J-STD-033 standards.
7. MOQ and Packaging Information
Specifies the Minimum Order Quantity (MOQ) for the T3-U module as 4,400 pcs, with details on shipping packaging (tape and reel) and carton configurations.
8. Appendix: Statement
Includes FCC and ISED compliance statements, radiation exposure information, and important notes for OEM integrators regarding co-location, antenna installation, and end-product labeling. It also provides Declaration of Conformity for EU directives and WEEE disposal information.
