Product Change Notice
PCN #: 2745-REV1
Notification Details
| Notification Date: | June 13, 2025 | Implementation Date: | September 12, 2025 |
|---|---|---|---|
| Product Family: | Discrete Semiconductor | Change Type: | Additional Wafer Source, Metallization System |
Title
Additional Wafer Source for Select Automotive Products
Description of Change
This PCN is being issued to notify customers that in order to assure continuity of supply, Diodes Incorporated has qualified Diodes internal GFAB in Greenock, Scotland as an additional wafer source with wafer top metal (NiAu) for clip bonded devices and wafer back metal being processed at Diodes internal Assembly and Test site in Chengdu, China (CAT) for select automotive products listed below.
Full electrical characterization and reliability testing have been completed on representative part numbers to ensure there is no change to product reliability, device functionality or electrical specifications in the datasheet.
There will be no change to the Form, Fit, or Function of affected products.
Impact
No change in datasheet parameters
Products Affected
Table 1 - Affected part list
| SBR0240LPWQ-7B* | BSS8402DWQ-13 | DMG1016VQ-13 | DMN601WKQ-7 | DMP510DLQ-7 | SBR2A40P1Q-7 |
| 2N7002AQ-13 | BSS8402DWQ-7 | DMG1016VQ-7 | DMN61D9UDWQ-13 | DMP610DLQ-13 | SBR2M60S1FQ-7 |
| 2N7002AQ-7 | BSS84DWQ-13 | DMG1023UVQ-13 | DMN61D9UDWQ-7 | DMP610DLQ-7 | SBR2U60S1FQ-7 |
| 2N7002DWQ-13-F | BSS84DWQ-7 | DMG1023UVQ-7 | DMN63D1LVQ-7 | MMBF170Q-13-F | SBR3U40P1Q-7 |
| 2N7002DWQ-7-F | BSS84Q-13-F | DMG3402LQ-13 | DMN63D8LDWQ-7 | MMBF170Q-7-F | SBR3U40S1FQ-7 |
| 2N7002EQ-7-F | BSS84Q-7-F | DMG3402LQ-7 | DMN65D8LDWQ-7 | SBR1045SP5Q-13 | SBR3U60P1Q-13 |
| 2N7002KQ-13 | BSS84WQ-7-F | DMN2004WKQ-7 | DMN65D8LQ-13 | SBR10A45SP5Q-13 | SBR3U60P1Q-7 |
| 2N7002KQ-7 | DMC62D2SVQ-13 | DMN3055LFDBQ-7 | DMN65D8LQ-7 | SBR10U45SP5Q-13 | SBR3U60P5Q-13 |
| 2N7002Q-7-F | DMC62D2SVQ-7 | DMN601DWKQ-7 | DMP3021SFVWQ-13 | SBR10U45SP5Q-13D | SBR3U60P5Q-13D |
| 2N7002TQ-7-F | DMG1013UWQ-13 | DMN601TKQ-7 | DMP3021SFVWQ-7 | SBR140S1FQ-7 | SBR8U60P5Q-13 |
| BS870Q-7-F | DMG1013UWQ-7 | DMN601WKQ-13 | DMP510DLQ-13 | SBR15U30SP5Q-13 | SBR8U60P5Q-13D |
Note: "*" With wafer back metal being processed at Diodes internal Assembly & Test site in Shanghai, China (SAT)
Web Links
Disclaimer
Unless a Diodes Incorporated Sales representative is contacted in writing within 30 days from the notification date of this PCN, all changes described in this announcement are considered approved.
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