Manuals+

Analog Devices Product Change Notice: Gold to Copper Wire Conversion

This notice informs customers of a material change affecting certain Analog Devices (ADI) products purchased within the last two years. Customers are requested to respond with acceptance or concerns promptly. Requests for samples or additional information must be submitted within 30 days of notification. In accordance with JEDEC Standard 046, acknowledgment of this Product Change Notification (PCN) is required within 30 days of delivery. Failure to acknowledge within 30 days implies acceptance of the change; further requests within 90 days also constitute acceptance.

PCN Details

PCN Title: Gold to Copper Wire Conversion

Publication Date: 01-Jul-2025

Effectivity Date: 03-Oct-2025 (earliest date for receipt of changed material)

Revision Description: Initial Release

Description of Change

The bond wire material for all listed parts will be changed from Gold wire to Copper wire. The Bill of Materials (BOM) will be updated to be compatible with Copper wire. Specific sub-contractor details are as follows:

All materials have been qualified and are in production for ADI devices.

Reason for Change

The conversion to Copper wire aligns with industry trends and ADI's current and future corporate directives. ASE, Amkor, and UTAC have over 10 years of experience in Copper wire production, with billions of units shipped to commercial and automotive customers.

Impact of Change

This change has no impact on the fit, form, function, or reliability of the affected products.

Product Identification

Analog Devices maintains full traceability for changed material through device marking, labeling, and shipment documents.

Summary of Supporting Information

Qualification has been performed according to Industry Standard Test Methods. Qualification Results Summaries are attached.

Device material declarations will be updated if applicable due to this material change.

ADI Contact Information

For questions regarding this PCN, please email the regional contacts or your local ADI sales representatives:

Appendix A - Affected ADI Models

The following are the affected ADI models (130 parts listed):

Appendix B - Revision History

Rev Publish Date Effectivity Date Rev Description
Rev.- 01-Jul-2025 03-Oct-2025 Initial Release

PDF preview unavailable. Download the PDF instead.

ADI PCN 25 0162 Rev - Form activePDF WebGrabber WebGrabber http://www.activepdf.com

Related Documents

Preview Analog Devices PCN 25_0055 Rev. A: Gold Wire to Copper Wire Conversion
Product/Process Change Notice (PCN) from Analog Devices regarding the conversion of bond wire from Gold to Copper for LFCSP package family, detailing affected parts, reason for change, and impact.
Preview Analog Devices Product/Process Change Notice PCN 25_0043 Rev. A
Notification of a change in ADI products, specifically the transition from Gold to Copper wire and Bill of Materials (BOM) updates for LFCSP/SO/TSSOP package families built in UTAC (Thailand). This change affects numerous Analog Devices part numbers.
Preview Analog Devices PCN 21_0001 Rev. - Addition of Amkor Philippines as Alternate Assembly Site
Product Change Notice from Analog Devices regarding the addition of Amkor Philippines as an alternate assembly site for Singulated MSOP and MSOP_EP products. This change aims to ensure continuous supply to meet volume requirements.
Preview Analog Devices CN-0382 电路笔记：隔离式4-20mA/HART工业变送器
本电路笔记CN-0382介绍了Analog Devices设计的一款隔离式、低功耗、高精度24位Σ-Δ ADC工业温度和压力变送器。该设计支持4-20mA模拟输出和HART数字通信，适用于工业自动化和过程控制应用，并集成了AD7124-4 ADC、AD5421 DAC和AD5700 HART调制解调器等关键组件。
Preview Analog Devices Inc. Certificate of Compliance for Optoisolators
Certificate of Compliance for Analog Devices Inc. products, specifically optoisolators and non-optical isolating devices, detailing their acceptance for use in certified equipment.
Preview Analog Devices PCN 13_0223 Rev. C: Assembly and Test Transfer to STATS ChipPAC China
Product/Process Change Notice (PCN) from Analog Devices regarding the transfer of assembly and test for select LFCSP products to STATS ChipPAC China. Details include reasons, impact, affected models, and contact information.
Preview DS28E30 Evaluation Kit: Secure Authenticator Setup and Usage Guide
Explore the Analog Devices DS28E30 Evaluation Kit for the DS28E30 DeepCover ECDSA Secure Authenticator. This guide details hardware setup, driver installation, and software operation for engineers.
Preview Analog Devices PCN 10_0146 Rev. A: Halogen Free Material Change for 14/16L SOIC_N Products
Product Change Notice from Analog Devices regarding a material change to halogen-free die attach and mold compound for 14/16L SOIC_N products. Details include affected part numbers, description of change, reason for change, and revision history.