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Analog Devices Product/Process Change Notice - PCN 25_0043 Rev. A

Analog Devices, Inc. One Analog Way, Wilmington, MA 01887, USA

This notice informs recipients of a change to certain Analog Devices products purchased within the last two years. Responses regarding acceptance or concerns should be submitted promptly to ADI. Requests for samples of changed material or additional information must be made within 30 days of notification. In accordance with JEDEC Standard 046, customers should acknowledge receipt of the PCN within 30 days of delivery. ADI contact information is provided below. Revised fields are indicated by a red field name. See Appendix B for revision history.

Lack of acknowledgment of the PCN within 30 days constitutes acceptance of the change. After acknowledgment, a lack of additional requests within 90 days constitutes acceptance of the change.

PCN Title: Change of Gold to Copper Wire and BOM

Publication Date: 09-Jun-2025

Effectivity Date: 11-Sep-2025 (the earliest date that a customer could expect to receive changed material)

Revision Description: Adding and Removing parts

Description Of Change

Change of bond wire from Gold to Copper wire for LFCSP/SO/TSSOP pkg family built in UTAC (Thailand). LFCSP BOM will be changed from Sumitomo G770HCD/Albestik8200 to Sumitomo G700/Ablestik8600. TSSOP Die attach will be changed from Ablestik8200 to Atrox 558. All materials have qualified and are in production for ADI devices.

Reason For Change

The conversion to Cu wire aligns with industry trend and ADI current and future corporate directives. UTAC has been in Cu wire production for 10+ years and over billion units shipped to commercial and automotive customers.

Impact of the change (positive or negative) on fit, form, function & reliability

This change has no impact on fit, form, function & reliability.

Product Identification

Analog Device maintains full traceability by device marking/labeling/shipment documents.

Summary of Supporting Information

Qualification has been performed per AEC-Q100, Stress Test Qualification for Integrated Circuits. See attached Qualification Results Summary.

Supporting Documents

Note: If applicable, the device material declaration will be updated due to material change.

ADI Contact Information

For questions on this PCN, please send an email to the regional contacts below or contact your local ADI sales representatives.

Appendix A - Affected ADI Models

Existing Parts - Product Family / Model Number (423)

Added Parts On This Revision - Product Family / Model Number (4)

Removed Parts On All Revisions - Product Family / Model Number (12)

Appendix B - Revision History

RevPublish DateEffectivity DateRev Description
Rev.-17-Apr-202520-Jul-2025Initial Release
Rev. A09-Jun-202511-Sep-2025Adding and Removing parts

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