Lenovo ThinkStation P3 Tiny Gen 2

Platform Overview

Engineered to go where others can't, the Lenovo ThinkStation P3 Tiny Gen 2 offers uncompromising performance in a form factor that is 96% smaller than a traditional desktop. At only one liter in total volume, the industry's smallest workstation combines the power of Intel Core Ultra processors (Series 2) and NVIDIA RTX graphics in a simple, efficient design.

CPU

• Processor Support: Intel Arrow Lake-S Series
• Socket Type: Socket-V (LGA 1851)

Operating Systems

• Preloaded: Windows 11 Pro 64-bit, Windows 11 Home 64-bit, Windows 11 IOT LTSC, Ubuntu 24.04 LTS, Red Hat Enterprise Linux
• Supported: Ubuntu 24.04 LTS

Memory

• Slots: 2
• Channels: Supports up to 2 DIMM Sockets, 2 Channels
• Type: DDR5 ECC and non-ECC CSODIMM, DDR5 ECC and non-ECC SODIMM
• ECC Support: Yes, CPU Dependent
• Speed: Up to 6400MT/s CSODIMM, Up to 5600MT/s SODIMM
• Max DIMM Size: 64GB DDR5 CSODIMM, 48GB DDR5 SODIMM
• Max System Memory: 128GB
• Disclaimers: Memory speed impacted by number and type of DIMMs installed. Memory speed can be dependent on the individual CPU capabilities.

Storage

• M.2 PCIe: 1 x M.2 2280 PCIe Connector, Gen 5 Onboard (from CPU), 1 x M.2 2280 PCIe Connector, Gen 4 Onboard (from PCH), 1 x M.2 2280 PCIe Connector, Gen 4 Onboard (from PCH)

Video

• Integrated Graphics: Intel Graphics (CPU dependent)
• Discrete Graphics: Nvidia RTX A400 (miniDP x4) - 4GB GDDR6, PCIe4, Single-Slot; Nvidia RTX A1000 (miniDP x4) - 8GB GDDR6, PCIe4, Single-Slot
• Multi-GPU Support: Yes
• Type: PCIe Add-In-Card
• Bus Interface: PCIe x8 Gen 4 Routed From CPU

Slots

• Slot 1: PCIe 4.0 x8, Half Height, Half Length, 50W, With Latch

Front I/O

• USB: 2 x USB-A 3.2 Gen 2 (10Gb/s) - one supports 2.1A charging; 1 x USB-C 3.2 Gen 2 (20Gb/s)
• Audio: 1 x Combo Audio/Microphone Jack (3.5mm)
• Disclaimers: Actual USB throughput will vary depending on the type and quantity of USB devices used.

Rear I/O

• USB: 3 x USB-A 3.2 Gen 2 (10Gb/s), 1 x USB-A 3.2 Gen 1 (5Gb/s)
• DisplayPort: 1 x Standard DP 1.4
• HDMI: 1 x Standard HDMI 2.1
• Type-C: Optional 1 x USB-C 3.1 Gen 1 (Config dependent), via flexible I/O port card
• VGA Port: Optional 2 x VGA Port (Config dependent), via flexible I/O port card
• Serial Port: Optional 2 x Serial Port (Config dependent), via flexible I/O port card; Optional 1 x Serial Port Expansion PCIe x1 Adapter
• Ethernet: 1 x Standard
• Optional USB Adapter: Dual USB-A 3.2 Gen 1 (CPU dependent), via flexible I/O card; Quad USB-A 3.2 Gen 1 (CPU dependent), via flexible I/O card
• Optional Network Adapter: Intel 1350-T2 Dual Port Gigabit Ethernet Adapter; Intel 1350-T4 Quad Port Gigabit Ethernet Adapter; Broadcom 5720 Dual Port Gigabit Ethernet Adapter; Broadcom 5719 Quad Port Gigabit Ethernet Adapter; Intel Gale Peak 2 BE200 WIFI7 + Bluetooth 5 PCIe Adapter
• Disclaimers: Actual USB throughout will vary depending on the type and quantity of USB devices used.

Ethernet

• Vendor: Intel Jacksonville 1219-LM (w/ AMT 16.x)
• Speeds: 10/100/1000 Mbps
• Functions: PXE, ASF, WOL, Jumbo Frames, Teaming
• Connectors: 1 x RJ45

Audio

• Vendor: Realtek
• Type: Integrated Audio
• Internal Speaker: Yes, 1.5W
• Connectors: Mic + Headphone combo jack
• Chipset: ALC233VB
• Number of Channels: 2
• Number of Bits/Audio Resolution: 2 channels of DAC support 24-bit PCM format; 2 stereo of ADC support 16-bit PCM format

Thermal

• Temp Sensors: Ambient Sensor
• Fans: 1 x CPU Fans

Power Specifications

BIOS

• Vendor: AMI
• Self-Healing BIOS: Yes

Chassis Information

• Color: Raven Black
• PSU: 170W, 230W, 300W, and 330W Available, Autosensing
• Thermal Solutions: One System Fan Standard
• Dimensions: 37mm/1.5" H, 179mm/7.0" W, 182mm/7.2" D
• Weight: 1.4kg/3lbs
• Disclaimers: 1. The system dimensions may vary depending on configurations. 2. The system weight is approximate and based on results in Lenovo lab, which varies depending on the source of component, variance of the distribution of each component, and manufacturing process. It may not be the exact weight for each specific model.

Packaging Dimensions

• Height (mm/in): 141mm/5.6"
• Width (mm/in): 268mm/10.6"
• Depth (mm/in): 490mm/19.3"
• Weight (kgs/lbs): 2.8kg/6 lbs
• Disclaimers: 1. The system dimensions may vary depending on configurations. 2. The system weight is approximate and based on results in Lenovo lab, which varies depending on the source of component, variance of the distribution of each component, and manufacturing process. It may not be the exact weight for each specific model.

Security & Serviceability

• TPM: Infineon SLB9672, FW 15.23, TPM 2.0
• Asset ID: Yes, 1024 x 8bit
• vPro: Intel vPro for WS (AMT 16.x)
• Cable Lock Support: Yes, Standard
• Serial, Parallel, USB, Audio, Network, Enable/Disable Port Control: Yes
• Power-On Password: Yes
• Setup Password: Yes
• NIC LEDs (integrated): Yes
• Access Panel Key Lock: No
• Boot Sequence Control: Yes
• Padlock Support: No
• Boot without keyboard and/or mouse: Yes
• Access Panel: Tool-less Side Cover Removal
• Optical Drive: Optional via External ODD Box
• Expansion Cards: Tool-less
• Processor Socket: Tool-less
• Memory: Retained With Screws
• System Board: Retained With Screws
• Restore CD/DVD/USB Set: Not Included, Restore Media Available via Lenovo Customer Support Center

Operating Environment

• Air Temperature: Operating: 5-35 (41F to 95F); Storage: -40 C to 60 C (-40 F to 140 F) in Original Shipping Carton; Storage: -10 C to 60 C (14 F to 140 F) Without Carton
• Humidity: Relative Humidity Operating: 20% to 80% (non-condensing); Relative Humidity Storage/Transit: 10% to 90% (non-condensing); Wet Bulb Temperature Operating: 25 C (77 F) max; Wet Bulb Temperature Non-operating: 40 C (104 F) max
• Altitude: Operating: 0m to 3048m (0ft to 10000ft); Storage: 0m to 12,192m (0ft to 40000ft)
• Vibration: Package Vibration: Random, 1.04G at 2-200 Hz, 1 octave/min; Operating Vibration: Random, 0.27G at 5-500 Hz, 0.5 octave/min; Non-Operating Vibration: Random, 1.04G at 2-200 Hz, 1 octave/min
• Shock: Operating Shock: Bottom half-sine pulse with a change in velocity of 37.4 cm/sec (14.7 inches/sec); Rack Operation Shock: 45-G faired square wave with a velocity change of 441 cm/sec n/sec (173.7 inches/sec); Non-operating Shock: 45-G faired square wave with a velocity change of 441 cm/sec (173.7 inches/sec)
• Disclaimers: Extended operating temperatures are possible - please contact your Lenovo Rep

Platform Detail

• Board Size: 6.7" x 6.9" (171mm x 175mm)

Motherboard Core

• Layout: Custom ATX
• Processor Support: Intel Arrow Lake-S Series
• Socket Type: Socket-V (LGA 1851)
• Memory Support: DDR5 up to 6400MHz CSODIMM Memory (non-ECC), DDR5 up to 5600MHz SODIMM Memory (non-ECC)
• Voltage Regulator: 65W TDP Capable
• Chipset (PCH): Intel W880 Chipset
• Flash: 1 x 64MB
• Super I/O: IT5652E
• Clock: Intel Native isCLK
• Audio: Realtek ALC233VB Codec
• Ethernet: Intel Jacksonville 1219-LM

Supported Components

• Processor Level: Intel Arrow Lake
• Processor: Intel Ultra 7 265, Intel Ultra 7 265T, Intel Ultra 5 245, Intel Ultra 5 245T, Intel Ultra 5 235, Intel Ultra 5 235T, Intel Ultra 5 225, Intel Ultra 5 225T
• Memory Type: CSODIMM 6400 MHz / SODIMM 5600 MHz
• Memory: 8GB 6400MHz DDR5 non-ECC CSODIMM, 16GB 6400MHz DDR5 non-ECC CSODIMM, 32GB 6400MHz DDR5 non-ECC CSODIMM, 64GB 6400MHz DDR5 non-ECC CSODIMM, 8GB 5600MHz DDR5 ECC SODIMM, 16GB 5600MHz DDR5 ECC SODIMM, 32GB 5600MHz DDR5 ECC SODIMM, 48GB 5600MHz DDR5 ECC SODIMM
• Disclaimers: Memory speed dependent on CPU support.

Storage

• M.2 PCIe Solid State Drive (SSD): 512GB M.2 PCIe SSD, Gen 5 x4, NVMe, OPAL; 1024GB M.2 PCIe SSD, Gen 5 x4, NVMe OPAL; 2048GB M.2 PCIe SSD, Gen 5 x4, NVMe OPAL; 256GB M.2 PCIe SSD, Gen 4 x4, NVMe, OPAL; 512GB M.2 PCIe SSD, Gen 4 x4, NVMe, OPAL; 1024GB M.2 PCIe SSD, Gen 4 x4, NVMe OPAL

RAID

• RAID Levels and Requirements: NVMe Drives Support RAID 0/1/5
• Notes: Supported RAID levels for a system will vary from the stated capabilities of the RAID controller due to dependencies on the number and capacity of physical disks in the system and on customer requirements for performance, fault tolerance, or data redundancy.

Optical Drive/Removable Media

• DVD-ROM Drive: Optional via External ODD Box - Slim DVD-ROM Drive
• DVD Burner/CD-RW Drive: Optional via External ODD Box - Slim DVD Burner/CD-RW Drive

Keyboard and Pointing Devices

• Keyboard: Al Traditional USB Keyboard, Al Calliope USB Keyboard, AI EOS Wireless Keyboard
• Pointing Devices: Calliope USB Mouse

PCle Adapters

• Network: Intel 1350-T2 Dual Port Gigabit Ethernet Adapter, Intel 1350-T4 Quad Port Gigabit Ethernet Adapter, Broadcom 5720 NetXtreme PCIe 1Gb 2-port RJ45 Ethernet Adapter, Broadcom 5719 NetXtreme PCIe 1Gb 4-port RJ45 Ethernet Adapter, Intel Gale Peak 2 BE200 WIFI7 + Bluetooth 5.4 PCIe
• Parallel Card: 4-Port Serial Expansion Card PCIe x1

CPU Specifications Part 1

CPU Specifications Part 2

Solid State Storage Specifications Part 1

Solid State Storage Specifications Part 2

Integrated Graphics Adapter

• Type: Intel Graphics
• Display Interface: 1x DP 1.2, 1x HDMI 2.0
• Video Resolution (max): 4096x2304 @ 60Hz (DP), 4096x2160@60Hz (HDMI)

Discrete Graphics Adapter

Ethernet Specifications Group 1 Part 1

Ethernet Specifications Group 1 Part 2

BIOS Specifications

• WMI Support: Compliant with Microsoft WBEM and the DMTF common information model
• ROM-Based Setup Utility (F1): System configuration setup program (text/graphic interface) available at power-on with F1 key
• Bootblock Recovery: Recovers system BIOS if the flash ROM is corrupted
• Replicated Setup: Saves system configuration settings to a file that can then be used to replicate the settings to other systems
• Boot Control: Boot control available through ROM-based setup utility or with F12 key at power-on
• Memory Change Alert: Power-on error message in the event of a decrease in system memory
• Thermal Alert: Power-on error message in the event of a fan failure
• Asset Tag: Supports ability to set SMBIOS type 2 baseboard asset tag field
• System/Emergency ROM Flash Recovery with Video: Supports process to recover the system BIOS if the flash ROM is corrupted
• Remote Wakeup/Remote Shutdown: System admin can power on/off a client computer from a remote location to provide maintenance
• Quick Resume Time: Supports low power S3 (suspend to RAM) and prompt resume times
• ROM Revision Level: System UEFI (BIOS) version reported in SMBIOS type 0 structure and in BIOS setup
• Keyboard-less Operation: System can be booted without a keyboard
• Per-port Control: Allows I/O ports to be individually enabled/disabled through ROM-based setup or WMI interface
• Adaptive Cooling: Offers multiple settings for fan control ranging between better performance and better acoustics
• Security: Supervisor, user and power-on passwords can protect boot and ROM-based setup
• Chassis Intrusion Detection: Yes
• UEFI Secure Boot Support: Yes
• HDD Password Can Protect HDD Data: Yes
• Windows UEFI Firmware Update Support: Yes
• Device Guard Support: Yes
• BIOS Guard, Boot Guard Support: Yes
• Intel(R) AMT (includes ASF 2.0): Allows system to be supported from a remote location
• Intel(R) TXT: Intel(R) trusted execution technology provides a security foundation to build protections against software based attacks
• Memory Modes: Supports mirroring, lock step, and sparing memory modes
• Windows 10 Ready: Supports Windows 10 requirements for secure flash, UEFI v 2.7 device guard support spec

Industry Standard Specification Support

• UEFI: Unified Extensible Firmware Interface v2.7
• ACPI: Advanced Configuration and Power Interface v6.2
• ASF 2.0: DMTF Alert Standard Format Specification v2.0
• ATA (IDE): AT Attachment 6 with Packet Interface (ATA/ATAPI-6)
• CD Boot: El Torito Bootable CD-Rom Format Specification, v1.0
• EHCI: Enhanced Host Controller Interface for Universal Serial Bus, Revision v1.0
• PCI: PCI Local Bus v3.0
• PCI Express: PC Firmware Specification 3.1, PCI Express Base Specification v5.0
• SATA: Serial ATA Revision 3.0 Specification
• TPM: Trusted Computing Group TPM Specification v2.0
• UHCI: Universal Host Controller Interface Design Guide, Revision v1.1
• USB: Universal Serial Bus Revision v1.1, Universal Serial Bus v2.0, Universal Serial Bus v3.0, Universal Serial Bus v3.2
• SMBIOS: DMTF System Management Spec v3.2.1
• XHCI: XHCI SPEC Revision v1.2

Social and Environmental Responsibility

• Quality Control: Lenovo is a member of an eco declaration system that enforces regular independent quality control.
• Hazardous Substances and Preparation: Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenyl ethers (PBDE). (See legal reference and Note B1); Products do not contain Asbestos; Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide; Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation; Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP; Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm_/week; REACH Article 33 information about substances in articles is available at: https://www.lenovo.com/us/en/social_responsibility/social_responsibility_resources/
• Batteries: UN38.3, MSDS

Safety, EMC Connection to the Telephone Network and Labeling

• Acoustic Noise Emissions Declaration: LWAd(bels) Idle: 3.1; LWAd(bels) Oper: 3.7
• Safety, EMC Connection to the Telephone Network and Labeling: Not applicable
• Industry Standard Specifications: Not applicable
• Remote Manageability Software Solutions: Lenovo ThinkStation supports software management tools by Lenovo Vantage.
• System Software Manager: Not applicable

Regulations & Standards

• EMC & Safety: FCC/IC, VCCI, BSMI, KC, RCM, TUV-GS, cTUVus, IEC60950-1&IEC62368 CB Report/Certificate, Saudi Arabia EQM, Kuwait KUCAS, China CCC Mark, South Africa SABS, Russia/Belarus/Kazakhstan/Kyrgyzstan/Armenia-EAC, Morocco-CM, Mexico-NOM, Serbia KVALITET, Ukraine UKrCEPRO, India-BIS, China SRRC, Indonesia-SDPPI, Malaysia-SIRIM, Philippines-NTC

Environmentals

• Energy Star: ENERGY STAR 9.0
• EPEAT: EPEAT Certification Available on Select Models
• ErP Lot-3 2013: Yes
• Hazardous Substances: Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenol ethers (PBDE); Products do not contain Asbestos; Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1-trichloroethane, methyl bromide; Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation; Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP; Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm_/week
• Materials Used: System: 35% PCC recycled plastic in Front and Rear Bezel; Packaging: Carton: 90% Recycled and/or FSC certified content3, Cushion: 90% Recycled EPE

TCO Certification

• Disclaimers: EPEAT registered where applicable. EPEAT registration varies by country. See www.epeat.net for registration status by country.