Infineon Linux FMAC Wi-Fi Driver (v2025_0602) Release Notes

About this document

Scope and purpose

This document provides an overview and updates for Infineon's AIROC™ Wi-Fi – Bluetooth® combo devices for the Infineon Linux FMAC Wi-Fi Driver (v2025_0602 release).

Intended audience

This document is intended for users configuring AIROC™ Wi-Fi – Bluetooth® combo devices over a Linux-based environment.

Overview

Brief summary

The Infineon Linux FMAC Wi-Fi Driver Release (v2025_0602) includes the following:

All the above files are also available on the Infineon Developer community.

This release also includes patch updates for Wi-Fi with FMAC bring-up on EA iMX8 Nano host for kernel 6.6.23. Download the patches from the Infineon Developer community.

This document is intended to provide information of the following in the Infineon Linux FMAC Wi-Fi Driver Release (v2025_0602):

Device firmware revision details

Firmware revision details

Note: Contact the local Infineon Technologies distribution channel (FAE or local sales representative) to get the latest hardware, NVRAM, and software files.

Note: Devices with firmware updated in this release are highlighted bold.

Device Wi-Fi firmware version
CYW4373 PCle
SDIO
Industrial
13.35.205.100
13.10.246.356
CYW43439 USB
SDIO
7.95.98
CYW43455 SDIO 7.45.286
CYW43012 SDIO 13.10.271.339
CYW43022 SDIO 13.34.107.148
CYW55571
CYW55572
CYW55573
PCle
SDIO
18.53.469.31
CYW54591 PCle
SDIO
13.35.369
CYW55511
CYW55512
CYW55513
SDIO 28.10.522.8

Updates

Key FMAC Driver Updates

Hostapd/Supplicant Updates

Firmware Updates

CYW43022

New features

WFA certification

Chipset Quick track CID WFA program supported
CYW43022 WFA133143 11n, 11ac, WPA3, PMF, vulnerability and Forward Compatibililty

WFA certification support fixes

Test Plan Supported Test Case Description
Forward Compatibility 5.2.3.3 STAUT forward compatibility to an AP with various AKMs in RSN IE

Bug fixes

Known issues

N/A

Note: Deep Sleep state/feature is specific to CYW43022 which is an added state for improved low power performance.

CYW43012

New features

WFA certification

Chipset Quick track CID WFA program supported
CYW43012 WFA127567 11n, 11ac, WPA3, PMF, vulnerability and Forward Compatibility

WFA certification support fixes

Test Plan Supported Test Case Description
Forward Compatibility 5.2.3.3 STAUT forward compatibility to an AP with various AKMs in RSN IE

Bug fixes

Known issues

N/A

CYW55571/CYW55572/CYW55573

New features

WFA certification

Chipset Quick track CID WFA program supported
CYW55572 WFA131807 11ax – R2, 6E
MBO, OCE, OWE
WPA3 (192 bits, TLS 1.3, PSK, SCV)
11n, 11ac, PMF, P2P, and vulnerability
Forward Compatibility
CYW55573 N/A 11ax – R2, 6E
MBO, OCE, OWE
WPA3 (192 bits, TLS 1.3, PSK, SCV)
11n, 11ac, PMF, P2P, and vulnerability
Forward Compatibility

WFA certification support fixes

Test Plan Supported Test Case Description
FC 5.2.3.3 STAUT forward compatibility to an AP with various AKMs in RSN IE
FC 5.2.3.6 STAUT forward compatibility to an AP with various AKMs in RSN IE with WPA3-Enterprise
WPA3 9.2.1 STAUT Interop with CTT AP that has H2E disabled
MBO 5.2.3 STAUT Beacon report test
Wi-Fi 6 5.83.1 STAUT UL MU MIMO with HE Single Stream Pilot HE-LTF Mode test

Bug fix

CYW55511/CYW55512/CYW55513

New features

WFA certification

Chipset WFA program supported
CYW55513 11ax - R2, 6E
MBO, OCE, OWE
WPA3 (192 bits, TLS 1.3, PSK, SCV)
11n, 11ac, PMF, P2P, and vulnerability
Forward Compatibility

WFA certification support fixes

Test Plan Supported Test Case Description
Forward Compatibility 5.2.3.3 STAUT forward compatibility to an AP with various AKMs in RSN IE
WPA3 5.2.9 STAUT Interop with CTT AP that has H2E disabled
MBO 5.2.3_6G STAUT Beacon report test

Bug fix

Updates

Regulatory changes

NVRAM updates

Note: Contact the module vendor or local Infineon distribution channel (FAE or local sales representative) to get the NVRAM changes.

Known issues

Further Reading

For more details on features and integration, please refer the following documents:

Glossary

Abbreviation Extended Form
AKM Authentication Key Management
APSTA Access Point and Station
BSS Basic Service Set
CLM Country Locale Matrix
CSI Channel State Information
DLTRO DHCP Lease Time Request Offload
DTIM Delivery Traffic Indication Message
EA Embedded Artists
FTM Fine Timing Measurement (802.11mc)
GTKOE Group Temporal Key Offload
H2E Hash-to-Element
ICMP Internal Control Message Protocol
ILPO Internal Low Power Oscillator
MBO Multi-band Operation
P2P Peer-to-Peer
PMF Protected Management Frame
RPI Raspberry Pi
RSNXE Robust Security Network X Element
SAE Simultaneous Authentication of Equals
SSID Service Set Identifier
STAUT Station Under Test
WFA Wi-Fi Alliance
WMM Wireless Multimedia
WNM Wireless Network Management (802.11v)

Trademarks

All referenced product or service names and trademarks are the property of their respective owners.

The Bluetooth® word mark and logos are registered trademarks owned by Bluetooth SIG, Inc., and any use of such marks by Infineon is under license.

Important notice

The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics ("Beschaffenheitsgarantie").

With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party.

In addition, any information given in this document is subject to customer's compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customer's products and any use of the product of Infineon Technologies in customer's applications.

The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer's technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application.

Warnings

Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office.

Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies' products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury.

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