Infineon AIROC™ Wi-Fi and Bluetooth® Wireless Connectivity
Delivering differentiated capabilities purpose-built for the IoT.
Industry's Broadest Portfolio of Wi-Fi and Wi-Fi + Bluetooth® Combo Devices
- Infineon offers ideal Wi-Fi solutions for any application, supporting single- and dual-band 802.11n/ac/ax SISO and MIMO devices.
- Infineon provides Wi-Fi + Bluetooth® combo chipsets, integrating world-class Wi-Fi with powerful Bluetooth®/Bluetooth® LE for easy onboarding of cloud-connected IoT devices via mobile apps.
- Infineon offers AIROC™ Wi-Fi connectivity processors and PSoC™ Bluetooth® MCUs with Bluetooth® LE.
Key advantages include:
- Over 1 billion Wi-Fi devices in the field.
- High-performance RF architecture for longer range and better interference rejection.
- Ultra-low power consumption (very low sleep, transmit, and receive current).
- Continuous improvements to battery life through real-world power consumption visibility.
- Widely vetted Wi-Fi/Bluetooth® devices with extensive security research focus on Infineon.
- Deep domain knowledge and processes to help customers secure products throughout their lifecycle.
Infineon Wireless Module Partner Ecosystem
Our global partner ecosystem enables development of IoT applications on time, on budget, and with minimized risk.
Key Areas of Partner Support:
- Hardware: Avoid complicated and costly chip-down designs with pre-built wireless modules offering multiple antenna options and services.
- Software: Leverage pre-configured connectivity software for common MPUs, operating systems, and development tools.
- Certifications: Simplify compliance with full modular and reference-certified RF modules (CE, IC, FCC, etc.).
- Support: Access partner support and services for production, including antenna and plastics design, EMC testing, and more.
Partner logos (visual representation): muRata, Laird Connectivity, AzureWave, USI, LANTRONIX, Inventek Systems.
Infineon IoT Software Solutions
Infineon provides reliable and consistently updated software development platforms for flexible and rapid development of connected products.
Solutions for RTOS Designs
Infineon delivers compute, connectivity, and HMI capabilities in a single unified platform: The ModusToolbox™ software environment.
- ModusToolbox™ is a set of multi-platform tools and middleware libraries enabling industry-leading feature-sets like CAPSENSE™ capacitive-sensing, mesh, and system power optimization.
- Enables an immersive development experience for Infineon MCU and wireless devices. Supports Eclipse IDE for ModusToolbox™, or 3rd-party IDEs like Visual Studio Code, IAR Embedded Workbench, and Keil µVision.
- Extensive support for 3rd-party cloud ecosystems, including Infineon's own cloud management solution using ultra-low-power AIROC™ Wi-Fi connectivity processors.
Solutions for Linux/Android Designs
Delivering integrated wireless products for Linux and Android designs. Infineon partners with the open-source community for quality and secure connectivity.
- Enables a broad set of Wi-Fi and Bluetooth®/Bluetooth® LE advanced feature sets for various designs.
- Supports the latest Linux and Android distributions, with backward compatibility for previous versions.
- Infineon RF and regulatory tools accelerate Linux- or Android-based prototype development to production.
Visual representation: Penguin mascot for Linux, Android robot logo.
802.11ac Wi-Fi + Dual-Mode Bluetooth® Combo Partner Module Portfolio
| Partner | PN | Wi-Fi/Bluetooth® PN | Wi-Fi/Bluetooth® Support | MCU | CPU (MHz) | Area (mm) | Regulatory | Linux | Interfaces | Highlights |
|---|---|---|---|---|---|---|---|---|---|---|
| Azurewave | AW-AH306 | CYW43012 | 2.4/5 GHz, 802.11a/b/g/n with ac friendly, Bluetooth®/ Bluetooth® LE | Radio Only | N/A | 8.5 x 7 | N | Y | SDIO, UART | Bluetooth® 5.0, WLCSP, ultra-low power |
| Azurewave | AW-AM497 | CYW43012 | 2.4/5 GHz, 802.11a/b/g/n with ac friendly, Bluetooth®/ Bluetooth® LE | Radio Only | N/A | 12 x 12 | N | Y | SDIO, UART | Bluetooth® 5.0, WLBGA, ultra-low power |
| Azurewave | AW-CB511NF | CYW54591 | 2.4/5 GHz, 802.11a/b/g/n/ac, Bluetooth®/ Bluetooth® LE 5.0 | Radio Only | N/A | M.2 2230 | CE/FCC/IC/ NCC/Japan/ AU/NZ | Y | WLAN: PCIe, Bluetooth®: UART | Certified Wi-Fi + Bluetooth® module with RSDB |
| Azurewave | AW-CM467 | CYW4373 | 2.4/5 GHz, 802.11a/b/g/n/ac, Bluetooth®/ Bluetooth® LE 5.1 | Radio Only | N/A | 12 x 12 | FCC/CE | Y | WLAN: SDIO/ USB, Bluetooth®: USB | Support SDIO or USB for Wi-Fi, UART, or USB for Bluetooth® |
| Azurewave | AW-CM572 | CYW54591 | 2.4/5 GHz, 802.11a/b/g/n/ac, Bluetooth®/Bluetooth® LE 5.0 | Radio Only | N/A | 13 x 15 | N | Y | WLAN: SDIO, Bluetooth®: UART | RSDB Wi-Fi + Bluetooth® module |
| Azurewave | AM-342SM | CYW43012 | 2.4/5 GHz, 802.11a/b/g/n/ac, Bluetooth®/ Bluetooth® LE | Radio Only | N/A | 12 x 12 | N | Y | SDIO, UART | SiP on FR4; ultra-low power |
| Azurewave | AW-CM555 | CYW4373 | 2.4/5 GHz, 802.11a/b/g/n/ac, Bluetooth®/ Bluetooth® LE 5.1 | Radio Only | N/A | 12 x 12 | N | Y | WLAN: SDIO / USB, Bluetooth®: UART / USB | XTAL inside; 3-wire co-ex w/ Zigbee |
| Azurewave | AW-CM467-USB-I | CYW4373E | 2.4/5 GHz, 802.11a/b/g/n/ac, Bluetooth®/ Bluetooth® LE 5.1 | Radio Only | N/A | 12 x 12 | CE/FCC/IC/ NCC/Japan/ AU/NZ | Y | WLAN: SDIO / USB, Bluetooth®: UART / USB | XTAL inside; I-temp |
| Azurewave | AW-CM467-SUR-I | CYW4373E | 11a/b/g/n/ac, Bluetooth® 5.2 | Radio Only | N/A | 12 x 12 | CE/FCC/IC/ NCC/Japan/ AU/NZ | Y | WLAN: SDIO, Bluetooth®: UART | XTAL inside; I-temp |
| Azurewave | AW-CM590 | CYW54590 | 11a/b/g/n/ac, Bluetooth® 5.1 | Radio Only | N/A | 13 x 15 | CE/FCC/IC/ NCC/Japan/ AU/NZ | Y | WLAN: SDIO, Bluetooth®: UART | XTAL inside; VSDB |
| Inventek | ISM54907-WBM-L170 | CYW54907, CYW20707 | 2.4/5 GHz, 802.11a/b/g/n + ac, Bluetooth®/ Bluetooth® LE | Arm® Cortex®-R4-Internal | 160/ 320 MHz | 11 x 11 | N | N | UART, SPI, USB | Supported with SDK |
| Laird Connectivity | Sterling-LWB5+ (453-00045C) | CYW4373E | 2.4/5 GHz, 802.11a/b/g/n + ac, Bluetooth®/ Bluetooth® LE | Radio Only | N/A | 12 x 17 | FCC/IC/ ETSI/Giteki/ RCM | Y | SDIO, UART, USB | Industrial temperature (-40° C to +85°C). Integrated chip antenna (Cut Tape) |
| Laird Connectivity | Sterling-LWB5+ (453-00045R) | CYW4373E | 2.4/5 GHz, 802.11a/b/g/n + ac, Bluetooth®/ Bluetooth® LE | Radio Only | N/A | 12 x 17 | FCC/IC/ ETSI/Giteki/ RCM | Y | SDIO, UART, USB | Industrial temperature (-40°C to +85°C). Integrated chip antenna (Tape and Reel) |
| Laird Connectivity | Sterling-LWB5+ (453-00046C) | CYW4373E | 2.4/5 GHz, 802.11a/b/g/n + ac, Bluetooth®/ Bluetooth® LE | Radio Only | N/A | 12 x 17 | FCC/IC/ ETSI/Giteki/ RCM | Y | SDIO, UART, USB | Next-gen dual band wireless IoT with 802.11ac. Industrial temperature (-40°C to +85°C), variety of different modular form factors, and industry-leading RF performance. MHF4 (Cut Tape) |
| Laird Connectivity | Sterling-LWB5+ (453-00046R) | CYW4373E | 2.4/5 GHz, 802.11a/b/g/n + ac, Bluetooth®/ Bluetooth® LE | Radio Only | N/A | 12 x 17 | FCC/IC/ ETSI/Giteki/ RCM | Y | SDIO, UART, USB | Next-gen dual band wireless IoT with 802.11ac. Industrial temperature (-40°C to +85°C), variety of different modular form factors, and industry-leading RF performance. MHF4 (Tape and Reel) |
| Laird Connectivity | Sterling-LWB5+ (453-00048) | CYW4373E | 2.4/5 GHz, 802.11a/b/g/n + ac, Bluetooth®/ Bluetooth® LE | Radio Only | N/A | 22 x 30 | FCC/IC/ ETSI/Giteki/ RCM | Y | SDIO, UART | Industrial temperature (-40°C to +85°C). M.2 (E-Key) with SDIO (Wi-Fi) and UART (Bluetooth®) |
| Laird Connectivity | Sterling-LWB5+ (453-00049) | CYW4373E | 2.4/5 GHz, 802.11a/b/g/n + ac, Bluetooth®/ Bluetooth® LE | Radio Only | N/A | 22 x 30 | FCC/IC/ ETSI/Giteki/ RCM | Y | USB | Industrial temperature (-40°C to +85°C). M.2 (E-Key) with USB for Wi-Fi and Bluetooth® |
| Lantronix | XPC270100B | CYW54907, CYW20707 | 2.4/5 GHz, 802.11a/b/g/n + ac, Bluetooth®/ Bluetooth® LE | Arm® Cortex®-R4-Internal | 160/ 320 MHz | 25 x 17 | FCC/IC/CE | N | UART x 1, Eth (RMII), USB (Host or Device), SPI Master, SDIO, I2C, 11 GPIOS | XPICO 270 embedded IoT gw, 802.11a/b/g/n + ac Wi-Fi, ETH, Bluetooth®, dual U.FL, ind. temp., LGA, 250 pc |
| Lantronix | XPC270100S | CYW54907, CYW20707 | 2.4/5 GHz, 802.11a/b/g/n + ac, Bluetooth®/ Bluetooth® LE | Arm® Cortex®-R4-Internal | 160/ 320 MHz | 25 x 17 | FCC/IC/CE | N | UART x 1, Eth (RMII), USB (Host or Device), SPI Master, SDIO, I2C, 11 GPIOS | XPICO 270 embedded IoT gw, 802.11a/b/g/n + ac Wi-Fi, ETH, Bluetooth®, dual U.FL, ind. temp., LGA, 25 pc |
| Lantronix | XPC270300B | CYW54907, CYW20707 | 2.4/5 GHz, 802.11a/b/g/n + ac, Bluetooth®/ Bluetooth® LE | Arm® Cortex®-R4-Internal | 160/ 320 MHz | 35 x 22 | FCC/IC/CE | N | UART x 1, Eth (RMII), USB (Host or Device), SPI Master, SDIO, I2C, 11 GPIOS | XPICO 270 embedded IoT gw, 802.11a/b/g/n + ac Wi-Fi, ETH, Bluetooth®, dual U.FL, ind. temp., edge, tray, 100 pc |
| Lantronix | XPC270300S | CYW54907, CYW20707 | 2.4/5 GHz, 802.11a/b/g/n + ac, Bluetooth®/ Bluetooth® LE | Arm® Cortex®-R4-Internal | 160/ 320 MHz | 25 x 17 | FCC/IC/CE | N | UART x 1, Eth (RMII), USB (Host or Device), SPI Master, SDIO, I2C, 11 GPIOS | XPICO 270 embedded IoT gw, 802.11a/b/g/n + ac Wi-Fi, ETH, Bluetooth®, dual U.FL, ind. temp., edge, single |
| Murata | Type 1LV (LBEE59B1LV-278) | CYW43012 | 2.4/5 GHz, 802.11a/b/g/n with ac friendly, Bluetooth®/ Bluetooth® LE | Radio only | N/A | 10 x 7.2 | CE/FCC/IC/ TELEC | Y | WLAN: SDIO, Bluetooth®: UART | 1x1 SISO 11ac + Bluetooth® solution with SDIO interface, -20°C to +70°C, Bluetooth® 5.0 |
| Murata | Type 2AE (LBEE5PK2AE-564) | CYW4373E | 2.4/5 GHz, 802.11a/b/g/n+ ac, Bluetooth®/ Bluetooth® LE | Radio only | N/A | 8.0 x 7.8 | CE/FCC/IC/ TELEC | Y | WLAN: SDIO, Bluetooth®: UART (USB) | 1x1 SISO 11ac + Bluetooth® solution (Bluetooth® 5.0) High throughput on 11ac, -40°C to +85°C |
| Murata | Type 2BC (LBEE5PK2BC-771) | CYW4373 | 2.4/5 GHz, 802.11a/b/g/n+ ac, Bluetooth®/ Bluetooth® LE | Radio only | N/A | 8.0 x 7.8 | CE/FCC/IC/ TELEC | Y | WLAN: SDIO Bluetooth®: UART (USB) | 1x1 SISO 11ac + Bluetooth® solution (Bluetooth® 5.0) High throughput on 11ac, -20°C to +70°C |
| Murata | Type 1XA (LBEE5XV1XA-540) | CYW54591 | 2.4/5 GHz, 802.11a/b/g/n + ac MIMO/ RSDB, Bluetooth®/ Bluetooth® LE | Radio only | N/A | 11.4 x 8.9 | FCC/IC/CE/ TELEC | Y | WLAN: PCIe, Bluetooth®: UART | 2x2 MIMO RSDB + Bluetooth® solution with SDIO interface, -30°C to +85°C |
| Murata | Type 1XZ (LBEE5XV1XZ-892) | CYW54591 | 2.4/5 GHz, 802.11a/b/g/n + ac MIMO/ RSDB, Bluetooth®/ Bluetooth® LE | Radio only | N/A | 11.4 x 8.9 | FCC/IC/CE/ TELEC | Y | WLAN:SDIO, Bluetooth®: UART | 2x2 MIMO RSDB + Bluetooth® solution with SDIO interface, -30°C to +85°C |
| Quectel | FC80A | CYW54591 | 2.4/5 GHz, 802.11a/b/g/n/ac , Bluetooth®/ Bluetooth® LE | Radio Only | N/A | 13 x 15 x 2.2 | FCC/CE/ ROHS | Y | SDIO, UART , PCM | External antenna, supports STA & SoftAP mode, Fast Roaming & EAP |
| USI | WM-BA-CYW-50 | PSoC™ 6 CYW43012 | 2.4/5 GHz, 802.11a/b/g/n + ac, Bluetooth®/ Bluetooth® LE | Arm® Cortex®-M4 + Cortex®-M0 Internal | 150/ 100 MHz | 10.9 x 10.9 | N | N | SDIO interface, Radio only SiP | 1MB MCU FLASH+ 288KB RAM |
| USI | WM-BN-CYW-62 | CYW43012 | 2.4/5 GHz, 802. 11a/b/g/n + ac, Bluetooth® 5.0 | N/A | N/A | 6.5 x 5.8 | N | Y | - | - |
| Lantronix | XPC240100B-02 | CYW43907 | 2.4/5 GHz, 802.11n | Arm® Cortex®-R4-Internal | 160/ 320 MHz | 25 x 17 | FCC/IC/ CE/TELEC/ SRRC | N | UART x 1, Eth (RMII), USB (Host or Device), SPI, SDIO, I2C, 11 GPIOS | XPICO 240 embedded IoT gw, 802.11a/b/g/n + ac , ETH, dual U.FL, ind. temp., LGA, 250 |
| Lantronix | XPC240200B-02 | CYW43907 | 2.4/5 GHz, 802.11a/b/g/n | Arm® Cortex®-R4-Internal | 160/ 320 MHz | 25 x 17 | FCC/IC/ CE/TELEC/ SRRC | N | UART x 1, Eth (RMII), USB (Host or Device), SPI (Master and Slave), SDIO, I2C, 11 GPIOS | XPICO 240 embedded IoT gw, 802.11a/b/g/n, ETH, 0n-module ant, ind. temp., LGA, 250 |
| Lantronix | XPC240300B-02 | CYW43907 | 2.4/5 GHz, 802.11a/b/g/n | Arm® Cortex®-R4-Internal | 160/ 320 MHz | 25 x 17 | FCC/IC/ CE/TELEC/ SRRC | N | UART x 1, Eth (RMII), USB (Host or Device), SPI, SDIO, I2C, 11 GPIOS | XPICO 240 embedded IoT gw, 802.11a/b/g/n, ETH, dual U.FL, ind. temp., edge conn, 100 pc |
| Lantronix | XPC240400B-02 | CYW43907 | 2.4/5 GHz, 802.11a/b/g/n | Arm® Cortex®-R4-Internal | 160/ 320 MHz | 25 x 17 | FCC/IC/ CE/TELEC/ SRRC | N | UART x 1, Eth (RMII), USB (Host or Device), SPI, SDIO, I2C, 11 GPIOS | XPICO 240 embedded IoT gw, 802.11a/b/g/n, ETH, 0n-module ant, ind. temp., edge conn, 100 pc |
| Murata | Type 1GC (LB-WA1UZ1GC-958) | CYW43907 | 2.4/5 GHz, 802.11a/b/g/n | Arm® Cortex®-R4-Internal | 160/ 320 MHz | 10 x 10 | CE/FCC/IC | N | UART, SPI, I2C, I2S, PWM, GPIO, USB, Ethernet | High performance CPU. Gateway for WLAN and Ethernet. Audio streaming. Modular Cert. RAM 2 MB, -20°C to +70°C, Arrow Quicksilver EVK support |
| Murata | Type 1PS (LB-WA1UZ1PS-241) | CYW54907 | 2.4/5 GHz, 802.11a/b/g/n + ac | Arm® Cortex®-R4-Internal | 160/ 320 MHz | 10 x 10 | CE/FCC/IC | N | UART, SPI, I2C, I2S, PWM, GPIO, USB, Ethernet | High performance CPU. Gateway for WLAN and Ethernet. Audio streaming. Modular Cert. RAM 2 MB, -20°C to +70°C, Pin compatible with type 1GC (adds 802.11ac) |
| Murata imp | Type 1GC Imp005 (LB-WA1UZ1GC-901) | CYW43907 | 2.4/5 GHz, 802.11a/b/g/n | Arm® Cortex®-R4-Internal | 160/ 320 MHz | 10 x 10 | CE/FCC/IC | N | UART, SPI, I2C, PWM, GPIO, USB, Ethernet | Electric Imp, High performance CPU. Gateway for WLAN and Ethernet. Audio streaming. Modular Cert. RAM 2 MB, -20°C to +70°C |
| Murata | Type 1YN (LBEE5KL1YN) | CYW43439 | 802.11b/g/n + Bluetooth® 5.2 BR/EDR/LE | Radio Only | N/A | 6.95 x 5.15 x 1.1 | FCC/IC | Y | WLAN-SDIOv2.0, UART & PCM | Small form factor, high-performance module with up to 65 Mbps PHY data rate on Wi-Fi and 3 Mbps PHY data rate on Bluetooth® |
| Quectel | FC909A | CYW43439 | 2.4 GHz, 802.11b/g/n, Bluetooth®/ Bluetooth® LE | Radio Only | N/A | 12 x 12 x 1.95 | FCC/CE/ ROHS | Y | SDIO, UART, PCM | External antenna, supports STA & SoftAP mode, Fast Roaming & EA |
| USI | WM-AN-BM-23 | CYW43907 | 2.4/5 GHz, 802.11a/b/g/n | Arm® Cortex®-R4-Internal | 160/ 320 MHz | 10 x 10 | CE/FCC/IC | N | QSPI, PWM, USB, SDIO, UART, I2C, I2S, MII, RMII | 2 MB RAM |
| USI | WM-BN-BM-26_ REF1 | CYW43439 | 2.4 GHz, 11b/g/n/ Bluetooth® 5.2 | Radio Only | N/A | 15 x 9.5 | N | Y | SDIO (WPA3) | - |
Bluetooth® & Bluetooth®LE (Dual-Mode) Partner Module Portfolio
| Partner | PN | Wi-Fi/ Bluetooth® PN | Wi-Fi/Bluetooth® Support | MCU | CPU (MHz) | Area (mm) | Regulatory | Linux | Interfaces | Highlights |
|---|---|---|---|---|---|---|---|---|---|---|
| Alinket | ALX41X | CYW20736 | Bluetooth® LE | Arm® Cortex®-M3-Internal | 24 MHz | 19 x 13.5 | FCC/CE | N | UART, SPI ADC, GPIO | PCB antenna, 1 MB Flash, Bluetooth® LE MIDI support, master mode (up to 8 slaves) & bridge mode. |
| Alinket | ALX420 | CYW20706 | Bluetooth®/ Bluetooth® LE | Arm® Cortex®-M3-Internal | 96 MHz | 8 x 8 | N | N | HCI UART, PUART SPI, I2S, I2C, ADC | Custom antenna designs supported, supports master/ slave mode, A2DP SRC & SNK & iAP2, MFi (HomeKit). |
| Alinket | ALX420A | CYW20706 | Bluetooth®/ Bluetooth® LE | Arm® Cortex®-M3-Internal | 96 MHz | 16 x 10 | FCC/CE | N | HCI UART, PUART SPI, I2S, I3C, ADC | Onboard antenna, 1 MB Flash, supports Master/Slave mode, A2DP SRC & SNK & iAP2, MFi (HomeKit). |
| Alinket | ALX421A | CYW20707 | Bluetooth®/ Bluetooth® LE | Arm® Cortex®-M4-STM32F411 | 100 MHz | 19 x 12 | FCC/CE | N | UART, SPI, USB, SDIO, I2S, I2C | Onboard antenna, 1 MB Flash, supports master/Slave mode, A2DP SRC & SNK & iAP2, MFi (HomeKit). |
| Alinket | ALX422A | CYW20707 | Bluetooth®/ Bluetooth® LE | Arm® Cortex®-M4-STM32F412 | 100 MHz | 21 x 12 | FCC/CE | N | UART, SPI, USB, SDIO, I2S, I2C | Bluetooth® 4.2, onboard antenna, 1 MB Flash, support both slave & master mode, A2DP SRC & SNK, HFP & iAP2, MFi (HomeKit). |
| Alinket | ALXG30 | CYW20706 | Bluetooth®/ Bluetooth® LE | Arm® Cortex®-M4-STM32F411 | 100 MHz | 80 x 55 | FCC/CE | Y | RS485 | Onboard or external antenna (with U.FL connector), 1 MB Flash, supports Bluetooth® slave mode, SPP, MFi, RS485 to Bluetooth®, RS-485 to 2G. |
| Azurewave | AW-BT315W | CYW20721 | Bluetooth® 5.1 | Arm® Cortex® - M4 | 96 MHz | 4 x 4 | N | Y | UART | Small form-factor Bluetooth® SiP module. |
| Inventek | ISM20706A2S | CYW20706 | Bluetooth®/ Bluetooth® LE | Arm® Cortex®-M3-Internal | 96 MHz | 6.0 x 8.6 | N | N | SPI, I2C, JTAG | Embedded antenna Bluetooth®4.2+HS SiP module. |
| Inventek | ISM20732S | CYW20732 | Bluetooth® LE | Arm® Cortex®-M3-Internal | 24 MHz | 6.5 x 6.5 | FCC/IC/CE | N | SPI, I2C, JTAG | Lowest cost Bluetooth® LE SiP module solution. |
| Inventek | ISM20736S | CYW20736 | Bluetooth® LE | Arm® Cortex®-M3-Internal | 24 MHz | 6.5 x 6.5 | FCC/IC/CE | N | SPI, I2C, JTAG | Wireless charging, simultaneous central and peripheral operation. |
| Iton | BB2706-30 | CYW20707 | Bluetooth®/ Bluetooth® LE | Radio Only | N/A | 15 x 12 | N | Y | SPI, UART, I2C | Bluetooth® 4.2, supported profile: HFP with WBS, HID, SPP, GATT, AVRCP, HOGP, A2DP, HID, etc; supports SiG Bluetooth® LE mesh, customized flow control for portable printers. |
| Laird Connectivity | Bluetooth®-850-SA | CYW20704 | Bluetooth®/ Bluetooth® LE | Radio Only | N/A | 8.5 x 13 | FCC/IC/CE/ RCM/Giteki/ Korea | Y | USB, HCI, I2S, PCM, GPIO | The Bluetooth® 85x series of USB HCI modules and adapters that leverages the CYW20704 A2 chipset to provide exceptionally low power consumption with outstanding range for OEMs needing both classic Bluetooth® and Bluetooth® LE support. The Bluetooth® v5 core specification shortens your development time and provides enhanced throughput, security and privacy. The Bluetooth® 850 modules are ideal when designers need both performance and minimum size. For maximum flexibility in integration, they support a host USB interface, I2S and PCM audio interfaces, GPIO, and GCI coexistence (2-Wire). The modules provide excellent RF performance and identical footprint options for integrated antenna or an external antenna via a trace pin. |
| Laird Connectivity | Bluetooth®-850-ST | CYW20704 | Bluetooth®/ Bluetooth® LE | Radio Only | N/A | 8.5 x 13 | FCC/IC/CE/ RCM/Giteki/ Korea | Y | USB, HCI, I2S, PCM, GPIO | The Bluetooth® 85x series of USB HCI modules and adapters that leverages the CYW20704 A2 chipset to provide exceptionally low power consumption with outstanding range for OEMs needing both classic Bluetooth® and Bluetooth® LE support. The Bluetooth® v5 core specification shortens your development time and provides enhanced throughput, security and privacy. The Bluetooth® 850 modules are ideal when designers need both performance and minimum size. For maximum flexibility in integration, they support a host USB interface, I2S and PCM audio interfaces, GPIO, and GCI coexistence (2-Wire). The modules provide excellent RF performance and identical footprint options for integrated antenna or an external antenna via a trace pin. |
| Laird Connectivity | Bluetooth® 851 | CYW20704 | Bluetooth®/ Bluetooth® LE | Radio Only | N/A | 17.4 x 46.75 | FCC/IC/CE/ RCM/Giteki | Y | USB, HCI, I2S, PCM, GPIO | The Bluetooth® 851 is a packaged USB adapter that leverages the CYW20704 A2 chipset to provide exceptionally low power consumption with outstanding range for OEMs needing both classic Bluetooth® and Bluetooth® LE support. The Bluetooth® v5 core specification shortens your development time and provides enhanced throughput, security and privacy. |
| Laird Connectivity | Bluetooth®-860-SA | CYW20704 | Bluetooth®/ Bluetooth® LE | Radio Only | N/A | 8.5 x 12.85 | FCC/IC/CE/ RCM/Giteki | Y | UART, HCI, I2S, PCM, GPIO | The Bluetooth® 86x series of UART HCI modules that leverages the CYW20704 A2 chipset to provide exceptionally low power consumption with outstanding range for OEMs needing both Classic Bluetooth® and Bluetooth® LE support. The Bluetooth® v5 core specification shortens your development time and provides enhanced throughput, security and privacy. The Bluetooth® 860 modules are ideal when designers need both performance and minimum size. For maximum flexibility in integration, they support a host UART interface, I2S and PCM audio interfaces, GPIO, and GCI coexistence (2-Wire). The modules provide excellent RF performance and identical footprint options for integrated antenna or an external antenna via a trace pin. |
| Laird Connectivity | Bluetooth®-860-ST | CYW20704 | Bluetooth®/ Bluetooth® LE | Radio Only | N/A | 8.5 x 12.85 | FCC/IC/CE/ RCM/Giteki | Y | UART, HCI, I2S, PCM, GPIO | The Bluetooth® 86x series of UART HCI modules that leverages the CYW20704 A2 chipset to provide exceptionally low power consumption with outstanding range for OEMs needing both Classic Bluetooth® and Bluetooth® LE support. The Bluetooth® v5 core specification shortens your development time and provides enhanced throughput, security and privacy. The Bluetooth® 860 modules are ideal when designers need both performance and minimum size. For maximum flexibility in integration, they support a host UART interface, I2S and PCM audio interfaces, GPIO, and GCI coexistence (2-Wire). The modules provide excellent RF performance and identical footprint options for integrated antenna or an external antenna via a trace pin. |
| Murata | Type 1GR (LBCA1ZZ1GR-084) | CYW20736 | Bluetooth® LE | Arm® Cortex®-M3-Internal | 24 MHz | 9.0 x 7.0 | CE/FCC/IC | N | UART, SPI | Bluetooth® 4.1, includes antenna |
| Murata | Type1WA | CYW20721 | Bluetooth®/ Bluetooth® LE | Arm® Cortex®-M4-Internal | N/A | 5.9 x 5.1 | FCC/IC/CE | Y | UART, SPI | Bluetooth® 5.1, Performance Audio |
| Pairlink | Dragon-B | CYW20706 | Bluetooth®/ Bluetooth® LE | Arm® Cortex®-M3-Internal | 96 MHz | 11 x 16.8 | BQB/MIC/ FCC/IC/CE/ ROHS | N | UART, 4*PWM, MFI, IIS | Chip antenna, 1 MB Flash, supports connected mesh, SIG mesh |
| Pairlink | Dragon-C | CYW20706 | Bluetooth®/ Bluetooth® LE | Arm® Cortex®-M3-Internal | 96 MHz | 11 x 16.8 | BQB/MIC/ FCC/IC/CE/ ROHS | N | UART, 4*PWM, MFI, IIS | IPEX connecter, 1 MB Flash, supports connected mesh, SIG mesh |
| Pairlink | Mouselet-B | CYW20736 | Bluetooth® LE | Arm® Cortex®-M3-Internal | 24 MHz | 14 x 18 | BQB/MIC | N | UART, 4*PWM | Chip antenna, 512 KB Flash, supports connected mesh |
| Pairlink | Mouselet-C | CYW20736 | Bluetooth® LE | Arm® Cortex®-M3-Internal | 24 MHz | 14 x 18 | BQB/MIC | N | UART, 4*PWM | IPEX connecter, 512 KB Flash, supports connected mesh |
Resources and Contact Information
- Connectivity Devices: Wi-Fi + Bluetooth® Combo Devices - www.infineon.com/wi-fi-and-bluetooth-combos
- Software and Support: ModusToolbox™ software environment - www.infineon.com/modustoolbox
- Infineon Partner Network: www.infineon.com/partnerfinder
- Infineon Developer Community: https://community.infineon.com
- Wi-Fi MCU Devices: www.infineon.com/wi-fi-mcu
- Bluetooth® and Bluetooth® LE Devices: www.infineon.com/airoc-bluetooth-le-bluetooth-multiprotocol
- Technical Forum for ModusToolbox™: www.infineon.com/modustoolbox-community
- Technical Forum for Linux: www.infineon.com/wi-fi-bluetooth-linux-drive-community
Published by: Infineon Technologies AG, 81726 Munich, Germany
© 2022 Infineon Technologies AG. All Rights Reserved.
Document Number: 002-33054 Rev. **
Date: 09 / 2022
General Disclaimer: This document is for informational purposes only. Information herein is not a warranty or guarantee. Technical specifications are subject to change and refer to product data sheets. Customers must evaluate product suitability for their intended application.
Additional Information: For further details on technologies, products, delivery terms, and prices, contact your nearest Infineon Technologies office (www.infineon.com).
Warnings: Products may contain dangerous substances. Contact Infineon Technologies office for details. Products are not intended for life-endangering applications (medical, nuclear, military, life-critical) where failure could result in personal injury. Sales transactions for partner modules are between the customer and the partner.
