ModusToolbox™ run-time software release notes

ModusToolbox™ tools package version 3.2.0

About this document

Scope and purpose

With the ModusToolbox™ run-time software, you can rapidly develop applications for Infineon MCUs, as well as AIROC™ Wi-Fi and Bluetooth® devices.

This document lists the new and updated features included with this release of ModusToolbox™ run-time software. For details about these and other features and libraries, refer to the ModusToolbox™ run-time software reference guide.

Document conventions

Convention Explanation
Bold Emphasizes heading levels, column headings, menus and sub-menus
Italics Denotes file names and paths
Courier New Denotes APIs, functions, interrupt handlers, events, data types, error handlers, file/folder names, directories, command line inputs, and code snippets
File > New Indicates that a cascading sub-menu opens when you select a menu item

Reference documents

Refer to the following links for more information:

What's new/changed in this release

Features

New libraries

Updated libraries

New code examples

Updated code examples

Revision history

Revision Date Description
** 2020-04-30 Initial Release.
*A 2020-05-18 Added BTSTACK issue. Added bluetooth-freertos btstack libraries.
*B 2020-06-29 Updated for version 1.1.
*C 2020-08-30 Removed sentence about BTSTACK supports Bluetooth BR/EDR and BLE core protocols.
*D 2020-09-30 Updated for version 1.2.
*E 2020-12-20 Updated for version 1.3.
*F 2021-05-11 Updated for version 1.4.
*G 2021-05-24 Updated for version 1.4.1.
*H 2021-10-06 Updated for version 1.5.
*I 2021-12-15 Updated for January 2022.
*J 2022-04-01 Updated for April 2022.
*K 2022-08-05 Updated for August 2022.
*L 2022-10-19 Updated for October 2022.
*M 2022-12-20 Updated for December 2022.
*N 2023-03-31 Updated for March 2023.
*O 2023-06-30 Updated for June 2023.
*P 2023-09-25 Updated for September 2023.
*Q 2023-12-13 Updated for December 2023.
*R 2024-03-25 Updated for March 2024.
*S 2024-06-26 Updated for June 2024.

Notices

Trademarks
All referenced product or service names and trademarks are the property of their respective owners. The Bluetooth® word mark and logos are registered trademarks owned by Bluetooth SIG, Inc., and any use of such marks by Infineon is under license.

IMPORTANT NOTICE
The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics ("Beschaffenheitsgarantie"). With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. In addition, any information given in this document is subject to customer's compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customer's products and any use of the product of Infineon Technologies in customer's applications. Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies' products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer's technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. For further information on the product, technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies office (www.infineon.com). WARNINGS
Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office.

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