Micron Technology, Inc. RoHS Certification

RoHS Certification Statement

Micron Technology, Inc. certifies that its Pb-free die/wafer and component level products meet the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, also known as the Restriction of Hazardous Substances (RoHS) Directive (Recast).

RoHS Banned Substances Compliance

Micron’s Pb-free products contain less than the following amounts of the RoHS banned substances:

• Less than 0.1% Lead – Pb
• Less than 0.1% Mercury – Hg
• Less than 0.01% Cadmium – Cd
• Less than 0.1% Hexavalent Chromium – Cr(VI)
• Less than 0.1% Polybrominated Biphenyls - PBB
• Less than 0.1% Polybrominated Diphenyl Ethers – PBDE
• Less than 0.1% Decabromodiphenyl Ether – DecaBDE
• Less than 0.1% Bis(2-ethylhexyl) phthalate / Di-2-ethylhexyl phthalate - DEHP
• Less than 0.1% Butyl benzyl phthalate - BBP
• Less than 0.1% Dibutylphthalate - DBP
• Less than 0.1% Diisobutyl phthalate - DIBP

Exemptions and Applicability

Please note that module level products may contain electronic ceramic passive parts that use lead or lead-oxides, which are exempt from Directive 2011/65/EU (as per Article 4, Annex III of the Annex thereto).

The information provided applies to all Micron products, including part number CT4000X8SSD9.

Further Inquiries

For further questions, please contact your local Micron sales representative.