Dymax Light-Curable Materials for Electronics Assembly
Dymax offers expert solutions for modern electronics manufacturing, enhancing process efficiency and product quality.
Introduction to Dymax Light-Cure Technology
Dymax is a leader in light-cure technology, offering a comprehensive array of products and expertise. The company is committed to developing collaborative partnerships by applying extensive process knowledge to specific application challenges. Dymax creates custom solutions, ensuring chemistry and equipment work seamlessly for maximum efficiency, covering product and process design, equipment selection, integration, testing, evaluation, and pre-production trials. The Dymax laboratory is equipped for mechanical, electrical, and specialty testing, including resistance to sulfur, salt spray, and thermal shock, as well as a variety of curing and dispensing systems for evaluation.
Key Dymax Capabilities
- Expertise in light-cure technology
- Collaborative partnerships
- Custom solutions for specific applications
- Comprehensive laboratory services for testing and evaluation
- Wide range of curing and dispensing systems
Dymax Light-Curable Materials for Electronics Assembly
Dymax offers a broad range of light-curable materials for circuit protection and electronic assembly applications. These materials cure in seconds for faster processing and higher throughput, featuring innovative technologies that address challenges like shadow areas, cure confirmation, and inspection difficulties. The materials are electrically insulating, suitable for conformal coating, encapsulation, bonding, thermal management, masking, and other electronic assembly processes. Dymax light-curable materials are one-part, requiring no mixing or preparation. Most products are available in multiple viscosity grades to tailor material flow to specific applications. IPC approved, MIL-I-46058C, and UL listed self-extinguishing grades are available.
Environmental Benefits
- Materials with no added solvents
- Halogen-free materials
- RoHS compliance
- Eco-friendly, one-component materials
Dymax halogen-free conformal coatings, encapsulants, and adhesives are documented by an independent laboratory to meet or exceed standards set forth in IEC 61249-2-21, defining halogen-free as less than 900 ppm for chlorine, less than 900 ppm for bromine, and less than 1,500 ppm total level of both combined. The current test method used for certification is BS EN 14582:2007.
Regulatory Compliance
Dymax endorses the outcome of the REACH program and has registered all affected substances used at Dymax with the centralized database maintained by the European Chemical Agency (ECHA) in Helsinki.
Typical Applications for Printed Circuit Boards
Dymax light-curable materials are utilized in various PCB assembly processes:
- 1. Thermal Interface
- 2. Wire Tacking
- 3. Encapsulation
- 4. Staking
- 5. Ruggedization/Cornerbond
- 6. Reinforcement
- 7. Encapsulation
- 8. Masking
- 9. Strain Relief
- 10. Cure-In-Place Gasket
- 11. Conformal Coating
- 12. Peelable Mask
- 13. Glob Top Encapsulant
[Diagram Description: A printed circuit board with various electronic components. Numbered callouts indicate specific application areas for Dymax materials, such as thermal interface, wire tacking, encapsulation, masking, and conformal coating.]
Product Categories and Specifications
Camera Module Assembly Materials
[Image Description: A close-up view of a camera module assembly, highlighting the integration of components.]
| Product Number | Features | Viscosity, cP | Durometer Hardness | Tensile at Break, MPa [psi] | Modulus of Elasticity, MPa [psi] | Halogen Free? |
|---|---|---|---|---|---|---|
| 3094-T-REV-A | UV/Visible light cure; fast curing; low shrinkage and stress | 11,750 | D65 | 12.4 [1,800] | 179 [26,000] | HF |
| 9801 | Low shrink epoxy; LED curable; UV/Visible light cure and/or low temp. (80-85°C) heat cure; moisture and thermal cycle resistant; cold storage/ship | 60,000 | D90 | 45 [6,600] | 1,600 [230,600] | Not Tested |
| 3094-GEL-REV-A | UV/Visible light cure; fast curing; low shrinkage | 30,000 | D67 | 14 [2,000] | 698 [101,300] | HF |
| 3094-T-TF* | UV/Visible light cure with secondary heat cure; fast curing; low shrinkage and stress | 6,500 | D67 | 13.8 [2,000] | 650 [94,317] | HF |
| 9202-W | IBOA-free positioning adhesive for wearable devices; designed for optical alignment; low shrinkage; low CTE; heat cycle stable | 260,000 | D88 | 35.9 [5,200] | 4,214 [611,150] | HF |
| 9211-W | IBOA-free adhesive for wearable devices; low stress; adheres to a wide range of plastics | 20,000 | D63 | 16.4 [2,378] | 700 [101,540] | HF |
| 9803 | Very low shrink epoxy; LED curable; UV/Visible light cure and/or low temp. (80-85°C) heat cure; moisture and thermal cycle resistant; cold storage/ship | 86,000 | D94 | 36.7 [5,328] | 3,983 [578,000] | Not Tested |
| 9008 | UV/Visible light cure; remains flexible to -40°C; moisture resistant | 4,500 | D35 | 10 [1,500] | 45 [6,500] | HF |
| 9101 | UV/Visible light cure with secondary moisture cure; flexible; moisture and thermal resistant | 7,000 | D30-D50 | 5.06 [735] | 17.5 [2,550] | HF |
Key Attributes
- UV/Visible light cures in seconds
- Low shrinkage
- Good resistance to moisture and shock
- Secondary heat or moisture cure available
Conformal Coatings
[Image Description: A printed circuit board with a protective conformal coating applied.]
| Product Number | Description | Nominal Viscosity, cP | Durometer Hardness | Tensile at Break, MPa [psi] | Modulus of Elasticity, MPa [psi] | Approvals | Halogen Free? |
|---|---|---|---|---|---|---|---|
| 9483 | Room-temperature secondary moisture cure for shadow areas; blue fluorescing; temperature/humidity performance; corrosion and thermal shock resistance | 750 | D60 | 276 [40,000] | 1,500 | MIL-I-46058C, IPC-CC-830, UL 94V-0, UL 746E | HF |
| 9-20557 | Medium viscosity for wetting components; low modulus for thermal cycling; performance; blue fluorescing; secondary heat cure for shadow areas | 2,300 | D60 | 37.9 [5,500] | >1,500 | MIL-I-46058C, IPC-CC-830, UL 94V-1, UL 746 | HF |
| 9451 | True black coating ideal for covering sensitive information; secondary heat cure for shadow areas; optimized for single pass coating | 6,000 | D80 | 717 [104,000] | 1,200 | UL 94V-0 | HF |
| 9-20557-LV | Low viscosity; low modulus for thermal cycling; performance; blue fluorescing; secondary heat cure for shadow areas | 850 | D70 | 310 [45,000] | >1500 | MIL-I-46058C, IPC-CC-830, UL 94V-0 | HF |
| 9-20558-REV-A | Thixotropic; secondary heat cure; flexible | 24,000 | D35 | 2.3 [340] | 1,100 | UL 94V-0* | HF |
| 984-LVUF | Rigid for high chemical and abrasion resistance; secondary heat cure for shadow areas | 160 | D85 | 724 [105,100] | 1,800 | MIL-I-46058C, IPC-CC-830, UL 94V-0 | HF |
| 9452-FC | Extremely low viscosity for film/flow coating applications; very good thermal shock resistance; LED curable; secondary heat cure for shadow areas; blue fluorescing | 20 | D60 | 1,137 [165,000] | 1,000 | MIL-I-46058, IPC-CC-830, UL 94V-0, UL 746E | HF |
| 9481-E | Room-temperature secondary moisture cure for shadow areas; highest chemical and abrasion resistance; low viscosity for thin coatings | 125 | D75 | 150 [21,800] | >1,500 | MIL-I-46058, IPC-CC-830, UL 94V-0, UL 746E | HF |
| 9482 | Room-temperature secondary moisture; cure for shadow areas; superior re-workability; chemical and thermal shock resistance | 1,100 | D70 | 275 [40,000] | 1,100 | MIL-I-46058, IPC-CC-830, UL 94V-0, UL 746E | HF |
| 9771 | Low ionic content; low outgassing; corrosion and temperature/humidity resistance; blue fluorescing | 750 | D72 | 910.3 [132,026] | 665 | MIL-STD-883 Method 5011, ASTM-E595 Low Outgas, MIL-I-46058C, IPC-CC-830-B, UL 746E, UL 94V-0, NASA MAPTIS material number 09841 | HF |
Key Attributes
- No added solvents
- Adhesion to flex circuit substrates
- Tack-free UV cures in seconds
- Low stress under thermal cycling
- Excellent environmental resistance
- Rigid and flexible coatings available
Chip Encapsulants and Wire Bonders
[Image Description: A close-up of a semiconductor chip bonded to a circuit board, showcasing encapsulant application.]
| Product Number | Description | Applications | Durometer Hardness | Nominal Viscosity, cP | Elongation at Break, % | Modulus of Elasticity, MPa [psi] | Halogen Free? |
|---|---|---|---|---|---|---|---|
| 9014 | UV/Visible light cure with secondary moisture cure for shadow areas; flexible; room temperature stable | Chip-on-board; Chip-on-flex; Chip-on-glass; Wire bonding | A70 | 12,500 | 63 | 119 [17,300] | HF |
| 9037-F | UV/Visible light cure with secondary heat cure for shadow areas; moisture and thermal resistance; blue fluorescing | Chip-on-board; Chip-on-flex; Chip-on-glass; Wire bonding | D40 | 50,000 | 173 | 10.7 [1,554] | HF |
| 9-20558-REV-A | UV/Visible light cure with secondary heat cure for shadow areas; high viscosity, thixotropic coating; UL VO flammability rating | Conformal coating; Chip encapsulation; Wire bonding | D35 | 24,000 | 160 | 2.3 [340] | HF |
| 9001-E-V3.1 | UV/Visible light cure with secondary heat cure for shadow areas; low modulus for wire bonding | Chip-on-board; Chip-on-flex; Chip-on-glass; Wire bonding; Bare-die encapsulation | D45 | 4,500 | 150 | 17 [2,500] | HF |
| 9008 | Flexible; highly moisture-resistant bonds to diverse surfaces such as polyimide, DAP, glass, epoxy board, metal, PET; high adhesion, even at -40°C | Chip-on-flex; Flex circuit bonding and attachment to PCB and glass | D35 | 4,500 | 270 | 45 [6,500] | HF |
| 9101 | UV/Visible light cure with secondary moisture cure for shadow areas; flexible; moisture and thermal resistance | Chip-on-board; Chip-on-flex; Chip-on-glass; Wire bonding | D30-D50 | 7,000 | 38 | 17.5 [2,550] | HF |
| 9102 | IBOA free for wearable devices; UV/Visible light cure with secondary moisture cures; LED optimized; high viscosity; moisture, thermal, and impact resistance; excellent protection against chemical or environmental exposure | Chip-on-board; Chip-on-flex; Wire bond encapsulation | D30-D50 | 25,000 | 36 | 18.4 [2,670] | HF |
| 9103 | IBOA-free for wearable devices; UV/Visible light cure with secondary moisture cure; moisture resistance; great reliability testing performance | Chip-on-board; Chip-on-flex; Wire bond encapsulation | D20-D40 | 32,000 | 178 | 322 [46,790] | HF |
| 9201-W | IBOA-free for wearable devices; UV/Visible light cure with secondary moisture cures; LED optimized; high viscosity; moisture, thermal, and impact resistance; excellent protection against chemical or environmental exposure | Component encapsulation; FPC reinforcement; Selective protection | D55-D75 | 29,000 | 28.2 | 561 [81,369] | HF |
| 9210-W | IBOA-free for wearable devices; UV/Visible light cure with secondary moisture cure; moisture resistance; great reliability testing performance | Component encapsulation; FPC reinforcement; Selective protection | D55-D75 | 29,000 | 28.2 | 561 [81,369] | HF |
Key Attributes
- No added solvents
- Low stress under thermal cycling
- Instant UV/Visible cures
- Electrically insulating
- High ionic purity
- Room-temperature storage
- Tenacious adhesion to flex circuit substrates (polyimide and PET)
- Thermal shock and moisture resistance
Display Bonding and Laminating
[Image Description: A person holding a tablet device, illustrating the application of adhesives in display technology.]
| Product | Description | Applications | Volumetric Shrinkage, % | Nominal Viscosity, cP | Halogen Free? |
|---|---|---|---|---|---|
| 9701 | Excellent re-workability; good thermal shock resistance; low shrinkage; non-yellowing | Optical display lamination and touch screen bonding | 4.9 | 200 | HF |
| 9702 | Excellent re-workability; good thermal shock resistance; low shrinkage; non-yellowing | Optical display lamination and touch screen bonding | 4.2 | 950 | HF |
| 9703 | Excellent re-workability; good thermal shock resistance; low shrinkage; non-yellowing | Optical display lamination and touch screen bonding | 4.2 | 30,000 | HF |
Key Attributes
- One component, no mixing required
- Flexible
- Fast cure
- Bonds various substrates
- Resistant to yellowing
- High optical clarity
Form-In-Place/Cure-In-Place Gaskets
[Image Description: A close-up of electronic components on a printed circuit board, showing where gaskets are applied for sealing.]
| Product | Description | Durometer Hardness | Nominal Viscosity, cP | Tensile at Break, MPa [psi] | Modulus of Elasticity, MPa [psi] |
|---|---|---|---|---|---|
| GA-140 | Moisture and chemical resistant; cures soft and tack free; low outgassing; excellent tear resistance | A35 | 39,000 | 1.5 [211] | 0.71 [104] |
| GA-201 | Tack-free after proper cure; moisture and chemical resistant; soft and durable; UL 157 certified | A35 | 65,000 | 0.93 [135] | 0.75 [110] |
Key Attributes
- Designed for automated dispense
- Conform to complex and intricate channels
- Accommodates engineering changes without expensive tooling investments
- Silicone free
LED Encapsulating
[Image Description: LEDs with Dymax encapsulant applied, showing clarity and protection.]
| Product | Description | Applications | Linear Shrinkage, % | Nominal Viscosity, cP | Halogen Free? |
|---|---|---|---|---|---|
| Light Cap® 9622 | UV/Visible light cure in seconds; no mixing required; heat resistant to 100°C; resistant to long-term UV exposure; high light transmittance; durometer between silicone and epoxy | Instant casting of LEDs; Rapid forming of protective optical lens | 1.6% | 12,000 | HF |
| Light Cap® 9624 | UV light cure in seconds; no mixing or refrigeration required; heat resistant to 100°C; resistant to long-term UV exposure; low viscosity for thin coatings | Conformal coating for LED arrays; Colorless encapsulation of COB LEDs; Instant forming of protective lens for high-intensity LEDs | 1.0% | 120 | HF |
Key Attributes
- One component - no mixing required
- Enhances light transmittance
- Fast cure
- No added solvents
- Resistant to heat-induced yellowing
- Optically clear
Potting and Sealing Materials
[Image Description: A close-up of potting material being applied to electronic components for protection and sealing.]
| Product | Description and Applications | Recommended Substrates | UV Cure* Speed (sec)/Depth (mm [in]) | Durometer Hardness | Nominal Viscosity, cP | Halogen Free? |
|---|---|---|---|---|---|---|
| 921-T | Translucent bonds with high adhesion; applications: tamper proofing, connectors, and thermal switches | ABS, filled nylon, metal, glass | 30/6.4 [0.25] | D75 | 11,000 | HF |
| 921-VT | Translucent bonds with high adhesion; applications: tamper proofing, connectors, and thermal switches | ABS, PC, PVC, FR-4, metals | 15/6.4 [0.25] | D45 | 25,000 | HF |
| 9001-E V3.1 | Excellent adhesion to engineering plastics; flexible; applications: sensors | ABS, PC, PVC, FR-4, metals | 15/6.4 [0.25] | D45 | 4,500 | HF |
Key Attributes
- Full UV/Visible cure in seconds
- No added solvents
- High adhesion to substrates
- Flexible and rigid products available
Ruggedizing/Edgebond Materials for BGAs & VGAs
[Image Description: Close-up views of Ball Grid Arrays (BGAs) and Vulnerable Graphics Accelerators (VGAs) on printed circuit boards, highlighting edgebond applications for protection.]
| Product Number | Description | Nominal Viscosity, cP | Durometer Hardness | Tensile at Break, MPa [psi] | Cure Depth, mm [in] | Halogen Free? |
|---|---|---|---|---|---|---|
| 9309-SC | Highly thixotropic; formulated with See-Cure technology for easy visual confirmation of full cure | 45,000 | D57 | 22 [3,000] | 6.5 [0.26] | HF |
| 9-911-REV-B | UV/Visible light curing high-tensile strength adhesive with secondary heat cure; ideal for rapid tacking of repair wire on PCBs | 25,000 | D80 | 24 [3,500] | HF |
Key Attributes
- Fast dispense and cure
- Holds shape after dispense
- Simple visual inspection with See-Cure Technology
- Improved bond strength for die and pry testing
- Easy rework
- Reduce stress on interconnects during push, pull, shock, drop, and vibration
- Engineered bead shape for wetting both board surface and component edge without seeping into shadow area
- Jettable
SpeedMask® Peelable Masks
[Image Description: A printed circuit board with a peelable mask applied, showing a technician carefully applying the mask to protect areas during soldering.]
| Product Number | Description and Applications | Cure Depth, mm [in] | Durometer Hardness | Cure Speed, sec | Nominal Viscosity, cP | Halogen Free? |
|---|---|---|---|---|---|---|
| 9-20479-B-REV-A | Wave-solder resistant; blue color for easy visual inspection; highly thixotropic for manual or automated dispensing | 4.90 [0.19] | A70 | 1 | 150,000 | HF |
| 9-7001 | Wave-solder resistant; visible pink color in uncured state; lower shrinkage | 8.36 [0.33] | A70 | 1 | 40,000 | HF |
| 9-318-F | Wave-solder resistant; fluoresces blue for easy inspection; very fast curing | 6.40 [0.25] | A55 | <4 | 50,000 | HF |
Key Attributes
- No added solvents
- Fluorescing and blue grades
- UV/Visible cure in seconds
- One part - no mixing
- No ionic contamination
Structural Adhesives
[Image Description: A close-up of a battery pack assembly, illustrating the use of structural adhesives for robust bonding.]
| Product | Description | Applications | Durometer Hardness | Nominal Viscosity, cP |
|---|---|---|---|---|
| 9501-F | Excellent adhesion to metals and plastics; blue fluorescing; LED curable at 385 nm | Structural Bonding, Battery Pack Assembly | D60 | 10,000 |
Key Attributes
- Sets in seconds with light exposure
- High-strength bonds to metals and plastics
- Thermal shock resistant
- Retains strength in high temperature and high humidity environments
Thermal Interface Adhesives
[Image Description: A heat sink mounted on a PCB, showing thermal interface material applied for efficient heat transfer.]
| Product | Description | Applications | Thermal Conductivity | Nominal Viscosity, cP | Halogen Free? |
|---|---|---|---|---|---|
| 9-20801 | Light cure in seconds; secondary activator or heat cure for shadow areas*; highly thixotropic for optimal placement | Mounting heat sinks on PCBs; LED heat dissipation | 0.9 W/m*K | 110,000 | HF |
Key Attributes
- Sets in seconds with light exposure
- Low stress for mismatched CTE's
- High-strength bonds
- Cure shadow areas with activator or heat
- Room-temperature storage and cure
Wire Tacking Adhesives
[Image Description: A close-up of wires being precisely tacked onto a circuit board using Dymax adhesive.]
| Product | Description | Nominal Viscosity, cP | Durometer Hardness | Tensile at Break, MPa [psi] | Halogen Free? |
|---|---|---|---|---|---|
| 9-911-REV-B | On-demand cure for optimal positioning; Exposed areas cure in seconds for immediate strength | 25,000 | D80 | 24 [3,500] | HF |
Key Attributes
- Instant UV cure
- No added solvents
- Fluorescing additive for in-line quality control
- One part - no mixing
- Excellent adhesion to solder masks and wires
- Thermal shock, solvent, and moisture resistance
- Unlimited pot life
Innovative Technologies
Dymax develops advanced technologies to enhance electronics assembly processes, improve quality control, and reduce manufacturing costs.
See-Cure Technology
This technology provides built-in cure validation. See-Cure adhesives change color after curing, making it easy for operators or automated inspection equipment to confirm a complete cure, simplifying inspection and improving quality control.
Ultra-Red® Fluorescing Technology
Ultra-Red® technology enhances bond-line inspection and product authentication. Adhesives formulated with this technology remain clear until exposed to low-intensity UV light, at which point they fluoresce bright red. This is particularly effective when bonding plastics that naturally fluoresce blue, such as PVC and PET. The technology also produces a unique spectral signature for product authentication.
Multi-Cure® Light/Heat-Cure Technology
Multi-Cure® adhesives combine the high-speed cure of UV or UV/Visible light with secondary cure mechanisms, such as thermal (heat) cure or activator cure. These secondary mechanisms enhance polymerization and are useful when light can only reach a portion of the bond line, or for tacking a part prior to thermal cure to allow easier handling and transport.
Dual-Cure Light/Moisture-Cure Technology
Dual-Cure coatings are formulated to ensure complete cure in applications where shadow areas on high-density circuit boards are a concern. These materials cure over time with moisture, eliminating the need for a secondary heat-cure process and avoiding potential component life degradation due to temperature exposure.
LED Light-Curable Adhesives & Coatings
Dymax offers specially formulated LED light-curable adhesives and coatings designed for use with Dymax LED UV/Visible light-curing systems. These materials range from fast to ultra-fast cure speeds to accommodate specific electronic assembly needs.
Dispensing Equipment
Dymax has developed high-quality, field-proven dispensing systems to fit many types of adhesive and fluid dispensing applications. These systems include automated and manual dispensing valves, spray valves and guns, controllers, material reservoirs, and related components for seamless integration into assembly processes. The systems provide accurate, consistent dispense for a range of low- to high-viscosity fluids.
SD-200 Digital Syringe Dispenser
This dispensing system is ideal for operator workstations and can be integrated into automated processes. It provides an accurate way to dispense low-to-high viscosity materials from a syringe and is easy to set up and operate.
eco-PEN450 Dosing System
The eco-PEN 450 is ideally suited for dispensing very precise volumes of low- to medium-viscosity materials. It offers maximum volumetric precision for both dot and bead applications, making it an excellent choice for masking components on PCB boards or other small-area applications.
eco-SPRAY Precision Micro-Spray System
This micro-spray system is excellent for a wide range of applications and for use with a variety of low- to high-viscosity spray media. Users can achieve a variety of spray volumes, from dot to endless spraying.
SG-200 Super-Flow Spray Gun System
Dymax SG-200 super-flow spray gun systems are designed for masking and coating applications where a significantly higher flow rate is required. The systems are ideal for dispensing fluids with viscosities up to 80,000 cP.
Model 400 Hand-Held Needle Valve System
The Model 400 needle valve is designed for dispensing very precise dots or fine beads of low- to medium-viscosity materials. The valve is hand-held but is compact and lightweight, making it easy and comfortable to handle.
Light-Cure Systems
Dymax designs and manufactures a wide range of curing equipment, including spot lamps, flood lamps, and conveyor systems, as well as radiometers and other accessories. Dymax systems are optimized to work with light-curable adhesives to gain process efficiencies by targeting rapid surface curing, depth of cure, and speed of cure, all while delivering light in a rapid and economical way. CE marked equipment is available.
Spot Lamps
Spot lamps provide a variety of methods to deliver light to a very precise location. They can be used manually by an operator or incorporated into a high-speed automated assembly line. Dymax offers multi-spectrum light-emitting lamps which use high-pressure mercury vapor bulbs, as well as light-emitting diode spot lamps, which use an array of surface-mounted LEDs instead of traditional metal halide or mercury bulbs.
Flood Lamps
Static flood-lamp systems are suited for area curing or for curing multiple assemblies. Dymax offers UV models which use moderate- to high-intensity, multi-spectrum UV/Visible light and LED models that use light-emitting diodes for fast curing. Dymax flood lamps can be easily integrated into existing manufacturing processes by mounting the lamps above high-speed assembly lines to achieve rapid cures. Shutter assemblies, mounting stands, and shields are available to create a custom curing system.
Conveyor Systems
Conveyor systems consist of a moving belt that passes through a curing tunnel with multi-spectrum lamps mounted above or on each side for rapid curing of parts. These conveyor systems are designed to offer consistent, fast, and safe curing. They can be outfitted with standard metal halide (longwave UV), mercury (shortwave UV), visible bulbs, or LED flood arrays. Consistent line speed, lamp height, and intensity provide a consistent light-curing process for high throughput.
Radiometers
Measurement of the lamp intensity and dosage is critical to the successful implementation of light-curing technology. Dymax radiometers allow operators to monitor and document a light-curing process.
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