Qualcomm QCA6174A Wi-Fi/Bluetooth SoC

Highlights Advanced 802.11ac combo SoC Advanced 802.11ac features such as MU-MIMO and TX Beamformee to increase network capacity, as well as maximal likelihood (ML) decoding, low-density parity

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qca6174a-product-brief
Qualcomm QCA6174A Wi-Fi/Bluetooth SoC

High performance 2x2 dual-band 802.11ac Wi-Fi with MU-MIMO and Bluetooth 5 radios in a single-chip solution.
Highly integrated and cost-effective Wi-Fi/Bluetooth combo solution for mobile and consumer electronics applications in a small form factor System-on-Chip (SoC).
Designed to deliver seamless integration of WLAN and Bluetooth Low Energy technology in a single-chip solution, the QCA6174A SoC offers one of the most cost-effective Wi-Fi/ Bluetooth solution for mobile and consumer electronics applications.
QCA6174A supports high-speed Wi-Fi connectivity and enriched media experiences. It is optimized for energy efficiency, which is critical to extending the battery life of portable devices.
QCA6174A has integrated RF front-end and single-ended design for simpler and lowcost design.
There are three variants available for QCA6174A:
QCA6174A-1: supports low power PCIe 2.1 (w/L1 substate) interface for WLAN and UART/PCM interface for Bluetooth.
QCA6174A-3: supports low-power SDIO 3.0 interface for WLAN and UART/PCM interface for Bluetooth
QCA6174A-5: supports low power PCIe 2.1 (w/L1 substate) for WLAN and USB 1.1 interface for Bluetooth.

Highlights
Advanced 802.11ac combo SoC
Advanced 802.11ac features such as MU-MIMO and TX Beamformee to increase network capacity, as well as maximal likelihood (ML) decoding, low-density parity check (LDPC), maximum ratio combining (MRC) for robust link connection.
Supports dual-mode Bluetooth 5
QCA6174A supports Classic Bluetooth as well as Bluetooth Low Energy hub and peripheral devices.
Integrated RF front-end single-ended design
QCA6174A supports single-ended RF port design for a simpler and low-cost design making it a costeffective solution for mobile and consumer electronics applications.
Power saving techniques for low power consumption
Both WLAN and Bluetooth power management use advanced power saving techniques such as: gating clocks to idle or inactive blocks, voltage scaling to specific blocks in certain states, fast start and settling circuits to reduce Tx, active duty cycles, processor frequency scaling, and other techniques to optimize power consumption across all operating states.

Materials are subject to change without notice. 87-YB799-1 Rev C

Qualcomm QCA6174A is a product of Qualcomm Technologies, Inc. and/or its subsidiaries.

QCA6174A Target IoT Applications

· Consumer Electronics · OTT/Media Streaming · Mobile

· Smart Assistant/Speaker · Home Automation · Tablets

Features
2x2 802.11ac + Bluetooth 5 in a single SoC
Supports Bluetooth 5, Bluetooth low energy and is backward compatible with Bluetooth 2.x
Integrated RF Front End and singleended design
Operates on a single 3.3 V power supply and an I/O supply of 1.8 V or 3.3 V
Advanced 11ac features: MU-MIMO, Transmit Beamformee
Both WLAN and Bluetooth power management with advanced power saving techniques
Maximal Likelihood (ML) decoding, lowdensity parity check (LDPC), maximum ratio combining (MRC) for robust link connection
256-QAM in 2.4GHz
1216KB RAM and 448KB ROM for Wi-Fi
192KB RAM and 672KB ROM for Bluetooth

Ordering Information

Product QCA6174A-1 WLNSP QCA6174A-1 WLFC QCA6174A-3 WLNSP QCA-6174A-5 WLNSP

Part Number QCA-6174A-1-172BWLNSP QCA-6174A-1-172WLFC QCA-6174A-3-172BWLNSP QCA-6174A-5-172BWLNSP

To learn more visit: qualcomm.com

QCA6174A Block Diagram

QCA6174A Specifications

Package

172B WLNSP 4.89 x 6.02 x 0.57 mm 172B WLFC 4.89 x 6.02 x 0.40 mm (QCA617A-1 only)

WLAN Technology

802.11ac 2x2

Bluetooth Technology

Bluetooth Low Energy v5.0

Process Node

40nm

Power Management

Clock Gating, Voltage scaling

Interfaces

WLAN: SDIO 3.0 or PCIe 2.1 Bluetooth: HS-UART or USB 1.0

Antenna Configuration

2-antenna configuration

WLAN Channel Bandwidths

2.4GHz: 20/40 MHz 5GHz: 20/40/80 MHz

WLAN TCP/IP Throughput

620Mbps/600Mbps TCP DL/UL (PCIe2.1) 410Mbps/330Mbps TCP DL/UL (SDIO3.0)

Bluetooth RX Sensitivity

BER: -96dBm, 8-DPSK: -89 dBm

Power Supply

3.3V power supply and 1.8V or 3.3V I/O supply

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