dialog SEMICONDUCTOR DA14AVDDECT SF01 Wireless Module
General Description
The DA14AVDDECT from Dialog Semiconductor is a member of the wireless module family that operates in the interference-free DECT frequency band (1.9 GHz) and can be used in hosted or embedded Audio, Voice, and Data applications. The module includes all the required radio components, antenna, a low-power audio CODEC (DA7218), and a 32 Mb FLASH memory. The module is intended for users who are familiar with application-level software programming but does not require detailed understanding of the DECT protocol to facilitate rapid design-in cycles. The module can be operated as a stand-alone device or from a host through an API interface.
The module is based on Dialog’s DA14495 chip that supports DQPSK and D8PSK besides the traditional GFSK. This increases the raw air data rate by up to three times.
The module is available with 1.5 mm pitch BGA solder balls for an excellent solderability and sufficient connectivity. The dimensions for the module are 17.0 mm × 26.65 mm.
This document describes the hardware of the DA14AVDDECT module. A separate document details the software and APIs.
Key Features
- All RF components are integrated, thus no customer tuning is required
- Supported bands include EU-DECT, DECT 6.0 for North America, and Japan DECT (JDECT)
- On-PCB antenna, the module also supports an optional second external antenna)
- Integrated RF shield
- Low power operations
- Audio bandwidth from 20 Hz to 20 kHz
- 32 Mbit FLASH, so program memory available for custom software
- Integrated audio ADC/DAC (external audio ADC/DAC supported through GPIO mapping)
- Limited modular approval for EN301-406 (EU-DECT), FCC Part 15 (DECT 6.0), and TELEC (J-DECT)
- Supports NiMH, alkaline, and Li-Ion batteries
- A Voice Data Stack or an Audio Data Stack are available to be downloaded
Applications (Defined by SW)
- Public Address solution with four microphones
- Tour Guide Systems for up to 1024 listeners
- Conferencing Systems with eight participants
- Wireless Intercom Systems supporting HD Voice
- Wireless Stereo Headphones and Headsets
- Wireless Low Latency Microphones
System Diagram
Block Diagram
The DA14AVDDECT module is built around Dialog’s DA14495 DECT chip. The module integrates the RF components (that is, baluns, switches, RFPA, and crystal) with an integrated antenna. It also allows an additional external antenna to be connected in order to support antenna diversity.
A low-power audio CODEC from Dialog (DA7218) is integrated to support analog audio applications. A 32-Mb FLASH is integrated for custom software. 
Note that the block diagram shown in Figure 2 demonstrates the stereo audio capability. The hardware of the DA14AVDDECT supports these connections, but the current software implementations only supports mono audio.
Pinout
With Figure 3 the pin functions can easily be identified. Please refer to chapter 3 for an accurate mechanical representation. 
NOTE
On the bottom (ball) side of the module, at the end of the printed antenna pattern, there is a ball ‘T1’ (see the lower left corner of Figure 4). This is for Dialog’s production test purposes only and serves no customer application use. The customer application shall not have a solder connection to T1.
Table 1: Pin Description
| Pin No. | Pin Name | Type (Table 2) | Drive (mA) | Reset State | Description |
| RF | |||||
| D1 | ANT1 | AIO | RF connection ANT1
This pin is used together with the integrated printed antenna to connect an external antenna to support antenna diversity. |
||
| T1 | ANT_TEST | AIO | The PCB of a customer application shall not have a solder connection to T1. | ||
| Power | |||||
| E8 | +VRF_PA_1 | PWR | Input supply voltage of RFPA bias stage | ||
| B11, C11 | +VRF_PA_2 | PWR | Input supply voltage of RFPA power stage | ||
| H4 | +1.8V | PWR | Output supply voltage 1.8 V
It can be used to configure the GPIO voltage of bank 1 (VDDIO1), for example. |
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| K3 | +3.3V | PWR | Output supply voltage 3.3 V
It can be used to configure the GPIO voltage of bank 1 (VDDIO1), for example. |
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| K5, L5 | VBAT | PWR | Main input supply voltage | ||
| K11 | VDDIO | PWR | Input supply voltage of GPIO bank 1 | ||
| N7 | +VDCDC | PWR | Output supply voltage of internal DCDC converter
It can be used as an input when the internal DCDC is disabled. |
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| N8 | VBUS/CHARGE | PWR | Input supply voltage of the battery charger and/or the USB | ||
| E11 | VSUPPLY | PWR | Output voltage of DA14495 | ||
| Audio | |||||
| K1 | MICBIAS1 | AO | Microphone bias output 1 (requires 1 µF decoupling) | ||
| N2 | MIC1_P | AI DO | Differential analog microphone 1 input (Pos)
Digital microphone 1 clock output |
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| N3 | MIC1_N | AI DI | Differential analog microphone 1 input (Neg)
Digital microphone 1 data input |
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| N4 | MICBIAS2 | AO | Microphone bias output 2 (requires 1 µF decoupling) | ||
| M1 | MIC2_P | AI DO | Differential analog microphone 2 input (Pos)
Digital microphone 2 clock output |
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| N1 | MIC2_N | AI DI | Differential analog microphone 2 input (Neg)
Digital microphone 2 data input |
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| Pin No. | Pin Name | Type (Table 2) | Drive (mA) | Reset State | Description |
| M3 | HPLDET | AI | Current source for headphone detection | ||
| M5 | HPR | AO | Single-ended headphone output (Right) | ||
| N6 | HPL | AO | Single-ended headphone output (Left) | ||
| L1 | CODEC ADDRESS | DI | Connecting this pin to GND selects the I2C slave address 0x1A; Connecting this pin to pin H4 selects the I2C slave address 0x1B. | ||
| USB | |||||
| M7 | USBN | A11 | Hi-Z | INPUT/OUTPUT. USB-. Typical HSoutput impedance is 45 Ω. | |
| M8 | USBP | A11 | Hi-Z | INPUT/OUTPUT. USB+. Typical HSoutput impedance is 45 Ω. | |
| JTAG | |||||
| L8 | SWCLK | DI-BP | I_PD | INPUT. ARM debug interface clock. | |
| M9 | SWDIO | DIO-BP | 4/8 | I_PU | INPUT/OUTPUT. ARM debug interface data input/output. |
| Special Functions | |||||
| G6 | RSTn | A5 | 25 kΩpull-up resistor connect ed to VDD1V 2 | INPUT/OPEN DRAIN OUTPUT withinternal pull-up.Reset signal (active LOW). No external capacitor required.If the internal VDD1V2 drops below 1.06 V, this pin is pulled low. An external device may not drive this pin higher than VDD1V2 (1.2V). | |
| J5 | SOCN | A1 | I | INPUT. Battery fuel gauge reference ground. Connect as star point.If it is not used, connect it to GND to prevent a false power-on trigger (NEW_BAT) due to a floating pin. | |
| K6 | SOCP | A1 | INPUT. Battery fuel gauge positive input.If it is not used, connect it to VSS to prevent a false power-on trigger (NEW_BAT) due to a floating pin. | ||
| K4 | P0.15/PON | DI | 4/8 | I_PD | INPUT with a selectable pull up/down resistor.Note that P0.15 cannot be used as output.INPUT. Device Power-on.It can be directly connected to VBAT (max 5 V).If PON has a fixed connection to VBAT, the PD resistor can be disabled to save power. |
| F9 | P2.6/LED0 | DIO-BP DO-BP | 4/8/16 | I_PU | INPUT/OUTPUT with a selectable pull up/down resistor.OUTPUT: Back drive protected pad for LED0 up to VSUPPLY. A series of resistors is required for LED operation. |
| Pin No. | Pin Name | Type (Table 2) | Drive (mA) | Reset State | Description |
| F10 | P2.7/LED1 | DIO-BP DO-BP | 4/8/16 | I_PU | INPUT/OUTPUT with a selectable pull up/down resistor.OUTPUT: Back drive protected pad for LED1 up to VSUPPLY. A series of resistors is required for LED operation. |
| H8 | P2.8/LED2 | DIO-BP DO-BP | 4/8/16 | I_PU | INPUT/OUTPUT with a selectable pull up/down resistor.OUTPUT: Back drive protected pad for LED2 up to VSUPPLY. A series of resistors is required for LED operation. |
| H5 | P0.14/NTC | DIO-BP AIAI | 4/8 | I_PD | INPUT/OUTPUT with a selectable pull up/down resistor.ANALOG INPUT: Analog to Digital Converter (ADC) input 0.ANALOG INPUT: Li-Ion/Li_Po NTCprotection which is used to automatically switch off the charger circuit if this input goes beyond the specified voltage ranges.Note: Only GPIO port (I/O), digital input, and the analog function are available; no peripheral outputs are available. |
| L2 | P2.5/I2C_DATA | DIO | 4/8 | I_PD | INPUT/OUTPUT with a selectable pull up/down resistor. |
| J8 | P0.10/I2C_CLK | DIO | 4/8 | I_PD | INPUT/OUTPUT with a selectable pull up/down resistor. |
| M6 | P0.11/BXTAL | DIO | 4/8 | I_PD | INPUT/OUTPUT with a selectable pull up/down resistor.OUTPUT: PLL Codec output (12.288 MHz/24.567 MHz).Supplied from VDDIO_BXTAL. |
| General Purpose IO | |||||
| J7 | P0.0 | DIO | 4/8 | I_PU | INPUT/OUTPUT with a selectable pull up/down resistor.If ‘0’ is on the rising edge of the RSTn pin, boot the module from UART. Assign the module as UTX if the module is booted from UART |
| K7 | P0.1 | DIO | 4/8 | I_PD | INPUT/OUTPUT with a selectable pull up/down resistor. Assign the module as URX if the module is booted from UART. |
| L7 | P0.2 | DIO | 4/8 | I_PD | INPUT/OUTPUT with a selectable pull up/down resistor.If ‘1’ is on the rising edge of the RSTn pin, the Booter will wait in an endless loop for debugging purposes. |
| L6 | P0.3 | DIO | 4/8 | I_PD | INPUT/OUTPUT with a selectable pull up/down resistor. |
| K8 | P0.4 | DIO | 4/8 | I_PD | INPUT/OUTPUT with a selectable pull up/down resistor. |
| M11 | P0.5 | DIO | 4/8 | I_PD | INPUT/OUTPUT with a selectable pull up/down resistor. |
| Pin No. | Pin Name | Type (Table 2) | Drive (mA) | Reset State | Description |
| L9 | P0.6 | DIO | 4/8 | I_PD | INPUT/OUTPUT with a selectable pull up/down resistor. |
| L10 | P0.7 | DIO | 4/8 | I_PD | INPUT/OUTPUT with a selectable pull up/down resistor. |
| K2 | P0.12 | DIO | 4/8 | I_PD | INPUT/OUTPUT with a selectable pull up/down resistor. |
| H6 | P0.13 | DIO | 4/8 | I_PD | INPUT/OUTPUT with a selectable pull up/down resistor. |
| K10 | P1.0 | DIO | 4/8/12
/16 |
I_PD | INPUT/OUTPUT with a selectable pull up/down resistor. |
| H11 | P1.1 | DIO | 4/8/12
/16 |
I_PD | INPUT/OUTPUT with a selectable pull up/down resistor. |
| J10 | P1.2 | DIO | 4/8/12
/16 |
I_PD | INPUT/OUTPUT with a selectable pull up/down resistor. |
| H10 | P1.3 | DIO | 4/8/12
/16 |
I_PD | INPUT/OUTPUT with a selectable pull up/down resistor. |
| F11 | P1.4 | DIO | 4/8/12
/16 |
I_PD | INPUT/OUTPUT with a selectable pull up/down resistor. |
| H9 | P1.5 | DIO | 4/8/12
/16 |
I_PD | INPUT/OUTPUT with a selectable pull up/down resistor. |
| G10 | P1.6 | DIO | 4/8 | I_PD | INPUT/OUTPUT with a selectable pull up/down resistor. |
| E10 | P1.7 | DIO | 4/8 | I_PD | INPUT/OUTPUT with a selectable pull up/down resistor. |
| D10 | P1.8 | DIO | 4/8 | I_PD | INPUT/OUTPUT with a selectable pull up/down resistor. |
| K9 | P1.9 | DIO | 4/8 | I_PD | INPUT/OUTPUT with a selectable pull up/down resistor. |
| J11 | P1.10 | DIO | 4/8 | I_PD | INPUT/OUTPUT with a selectable pull up/down resistor. |
| J9 | P1.11 | DIO | 4/8 | I_PD | INPUT/OUTPUT with a selectable pull up/down resistor. |
| L11 | P1.12 | DIO | 4/8 | I_PD | INPUT/OUTPUT with a selectable pull up/down resistor. |
| F8 | P2.0 | DIO | 4/8 | I_PD | INPUT/OUTPUT with a selectable pull up/down resistor. |
| G11 | P2.1 | DIO | 4/8 | I_PD | INPUT/OUTPUT with a selectable pull up/down resistor. |
| G8 | P2.2 | DIO | 4/8 | I_PD | INPUT/OUTPUT with a selectable pull up/down resistor. |
| E9 | P2.3 | DIO | 4/8 | I_PD | INPUT/OUTPUT with a selectable pull up/down resistor. |
| Ground and No Connects | |||||
| Pin No. | Pin Name | Type (Table 2) | Drive (mA) | Reset State | Description |
| A1, A2, A3,
A4, A5, A6, A7, A8, A9, A10, A11, B2, B3, B4, B5, B6, B7, B8, B9, B10, C1, C2, C3, C4, C5, C6, C7, C8, C9, C10, D2, D3, D4, D5, D6, D7, D8, D9, D11, E1, E2, E3, E4, E5, E6, E7, F1, F2, F3, F4, F5, F6, F7, G1, G2, G3, G4, G5, G7, H1, H3, J1, J3, J4, L3, M2, N5, N9, N11 |
GND | GND | Analog and digital ground.
They are connected together on a solid ground plane. |
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| G9, H7, J6, M4, M10, N10 | NC | NC | Not connected. No package ball/pin available on the package. | ||
| H2, J2, L4 | Keep out | NC | Not connected, but package balls/pins are available: implement keep-out on application PCBs to ensure balls/pins are not connected to anything or close to any noise signals. |
Table 2: Pin Type Definition
| Pin Type | Description | Pin Type | Description |
| DI | Digital input | AI | Analog input |
| DO | Digital output | AO | Analog output |
| DIO | Digital input/output | AIO | Analog input/output |
| DIOD | Digital input/output open drain | BP | Back drive protection |
| PU | Pull-up resistor (fixed) | SPU | Switchable pull-up resistor |
| PD | Pull-down resistor (fixed) | SPD | Switchable pull-down resistor |
| PWR | Power | GND | Ground |
Characteristics
Absolute Maximum Ratings
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, so functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specification are not implied.
Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.
Table 3: Absolute Maximum Ratings
| Parameter | Description | Conditions | Min | Max | Unit |
| VESD | Maximum ESD voltage | HBM | 2 | kV | |
| VBAT | Battery voltage | 4.6 | V | ||
| VBUS | BUS voltage | 6.5 | V |
Recommended Operating Conditions
Table 4: Recommended Operating Conditions
| Parameter | Description | Conditions | Min | Typ | Max | Unit |
|
VBAT |
Battery supply voltage |
Limited by the supply voltage requirements of the SKY77762 power amplifier module from SYKWORKS |
1.9 |
4.2 |
V |
|
| VBUS | USB voltage | 4.2 | 5.75 | V | ||
| +VRF_PA_1 | Bias supply SKY77762 | < 10 mA current draw | 3.0 | 4.2 | V | |
| +VRF_PA_2 | Power supply SKY77762 | Up to ~350 mA current draw | 1.9 | 3.3 | 3.6 | V |
| TA | Ambient operating temperature range | -20 | +60 | °C | ||
| VSUPPLY | Output voltage of DA14495 | 1.9 | 3.45 | 3.6 | V | |
| VDCDC | Output voltage of the DA14495 DCDC converter.
When the DCDC is disabled, the same pin can be connected to an external supply, overriding the internal DCDC converter |
.4 | 1.89 | V |
Electrical Characteristics
Table 5: Digital I/O Characteristics
| Parameter | Description | Conditions | Min | Typ | Max | Unit |
| VDDIO | Supply voltage of IO band | 1.6 | 3.45 | V | ||
| VPIN_NEG | Negative voltage on IO pin | GND – 0.3 | V | |||
| VPIN_POS | Positive voltage on IO pin | VDDIO
+ 0.2 |
V | |||
| VPIN_PON | Voltage on pin P0.15/PON | 5 | V | |||
| VPIN_USB | Voltage on pins USBp and USBn | 3.6 | V | |||
| VIH | High level input voltage | 0.7 × VDDIO | V | |||
| VIL | Low level input voltage | 0.3 × VDDIO | V | |||
| VDDIO0_2 | IO voltage bank0/2 | 1.8 | V | |||
|
VDDIO1 |
IO voltage bank 1 |
User programmable by connecting the 3V3 (pin K3) or 1V8 (pin H4) from the module to VDDIO1 |
1.8 3.3 |
V |
Table 6: Radio Characteristics
| Parameter | Description | Conditions | Min | Typ | Max | Unit |
| Foperating | Frequency bands supported | EU-DECT, US-DECT, and J-DECT (K-DECT is not supported) | ||||
| RXsense | Receiver sensitivity | GFSK, EU-DECT ch5 | -93 | dBm | ||
| Po | Transmitted output power | GFSK, EU-DECT ch5 | +22 | dBm | ||
| Pspur | Spurious emissions | ETSI/FCC compliant | ||||
| TXACPR1 | Transmitter adjacent channel power ratio M = 1 | Po = +16dBm, π/4 DQPSK | -33 | dBc | ||
| TXACPR3 | Transmitter adjacent channel power ratio M = 3 | Po = +16dBm, π/4 DQPSK | -66 | dBc | ||
| TXEVM | Transmitter error vector magnitude | Po = +16dBm, π/4 DQPSK | 6 | % | ||
Table 7: Supply Currents (Tour Guide mode)
| Parameter | Description | Conditions (Note 1) | Min | Typ | Max | Unit |
| Iavg_TG_stby | Standby supply current (Tour Guide mode) | FP (TX); HPM | 23 | mA | ||
| FP (TX); HPM/U | 20 | mA | ||||
| PP (RX); HPM | 8 | mA | ||||
| Iavg_TG_talk | Talk mode supply current | FP (TX); LPM | 53 | mA |
| Parameter | Description | Conditions (Note 1) | Min | Typ | Max | Unit |
| (Tour Guide mode) | FP (TX); HPM | 71 | mA | |||
| FP (TX); HPM; Question call | 91 | mA | ||||
| FP (TX); HPM/U | 61 | mA | ||||
| FP (TX); HPM/U; Question call | 76 | mA | ||||
| PP (RX); LPM; RX only | 31 | mA | ||||
| PP (RX); LPM; Return channel | 38 | mA | ||||
| PP (RX); HPM; RX only | 42 | mA | ||||
| PP (RX); HPM; Return channel | 49 | mA | ||||
| PP (RX); HPM/U; RX only | 37 | mA | ||||
| PP (RX); HPM/U; Return channel | 46 | mA |
Note 1 VBAT, +VRF_PA_1 and +VRF_PA_2 pins connected to +3.3V supply; Iavg: current drawn from the +3.3V supply.
SW configuration by default example appplication. Standby mode: no PP locked to FP.
Table 8: Supply Currents (Public Address mode)
| Parameter | Description | Conditions (Note 1) | Min | Typ | Max | Unit |
|
Iavg_PA_stby |
Standby supply current (Public Address mode) |
FP (RX); HPM | 26 | mA | ||
| FP (RX); HPM/U | 20 | mA | ||||
| PP (TX); HPM | 8 | mA | ||||
| Iavg_PA_talk | Talk mode supply current (Public Address mode) | FP (RX); LPM; 1PP (TX) | 35 | mA | ||
| FP (RX); LPM; 2PPs (TX) | 42 | mA | ||||
| FP (RX); LPM; 3PPs (TX) | 50 | mA | ||||
| FP (RX); LPM; 4PPs (TX) | 56 | mA | ||||
| FP (RX); HPM; 1PP (TX) | 38 | mA | ||||
| FP (RX); HPM; 2PPs (TX) | 48 | mA | ||||
| FP (RX); HPM; 3PPs (TX) | 56 | mA | ||||
| FP (RX); HPM; 4PPs (TX) | 63 | mA | ||||
| FP (RX); HPM/U; 1PP (TX) | 34 | mA | ||||
| FP (RX); HPM/U; 2PPs (TX) | 43 | mA | ||||
| FP (RX); HPM/U; 3PPs (TX) | 51 | mA | ||||
| FP (RX); HPM/U; 4PPs (TX) | 60 | mA | ||||
| PP (TX); LPM | 32 | mA | ||||
| PP (TX); HPM | 44 | mA | ||||
| PP (TX); HPM/U | 38 | mA |
Table 9: Supply Currents (Voice Conference mode)
| Parameter | Description | Conditions (Note 1) | Min | Typ | Max | Unit |
|
Iavg_CVM_stby |
Standby supply current (Voice Conference mode) | FP; HPM | 16 | mA | ||
| PP; HPM | 8 | mA |
| Parameter | Description | Conditions (Note 1) | Min | Typ | Max | Unit |
| Iavg_CVM_talk | Talk mode supply current (Voice Conference mode) | FP; HPM; 1PP | 39 | mA | ||
| FP; HPM; 2PPs | 47 | mA | ||||
| FP; HPM; 3PPs | 58 | mA | ||||
| FP; HPM; 4PPs | 68 | mA | ||||
| FP; HPM; 5PPs | 76 | mA | ||||
| FP; HPM; 6PPs | 86 | mA | ||||
| FP; HPM; 7PPs | 95 | mA | ||||
| FP; HPM; 8PPs | 104 | mA | ||||
| FP; HPM/U; 1PP | 37 | mA | ||||
| FP; HPM/U; 2PPs | 45 | mA | ||||
| FP; HPM/U; 3PPs | 54 | mA | ||||
| FP; HPM/U; 4PPs | 62 | mA | ||||
| FP; HPM/U; 5PPs | 69 | mA | ||||
| FP; HPM/U; 6PPs | 77 | mA | ||||
| FP; HPM/U; 7PPs | 85 | mA | ||||
| FP; HPM/U; 8PPs | 91 | mA | ||||
| PP; HPM | 31 | mA |
Functional Description
The DA14AVDDECT module is a hardware platform capable of serving multiple functions. The functions fall into two categories, Cordless Voice Module (CVM) and Wireless Audio Module (WAM), and they are defined in the software. These two functions of the DA14AVDDECT are described in their separate CVM and WAM software documents. Please consult with your Dialog representative for further details.
Please also note that the module is supplied without any software pre-loaded in FLASH. Please refer to [3] for programming and configuring the module.
Package Information
Package Outline Drawing
Moisture Sensitivity Level
The Moisture Sensitivity Level (MSL) is an indicator for the maximum allowable time period (floor lifetime) in which a moisture sensitive plastic device, once removed from the dry bag, can be exposed to an environment with a specified maximum temperature and a maximum relative humidity before the solder reflow process. The MSL classification is defined in Table 10.
For detailed information on MSL levels refer to the IPC/JEDEC standard J-STD-020, which can be downloaded from http://www.jedec.org
The DA14AVDDECT is qualified for MSL 3.
Table 10: MSL Classification
| MSL Level | Floor Lifetime | Conditions |
| MSL 4 | 72 hours | 30 °C / 60 % RH |
| MSL 3 | 168 hours | 30 °C / 60 % RH |
| MSL 2A | 4 weeks | 30 °C / 60 % RH |
| MSL 2 | 1 year | 30 °C / 60 % RH |
| MSL 1 | Unlimited | 30 °C / 85 % RH |
Soldering Information
The DA14AVDDECT should be soldered using a lead-free reflow soldering profile as shown in Figure 5. Adjustments to the profile may be necessary, depending on process requirements.
The recommended solder paste for lead-free soldering is Sn 96.5%, Ag 3.0%, and Cu 0.5%. 
Packaging
Figure 6: DA14AVDDECT Package Marking
Table 11: DA14AVDDECT Package Marking Table
| Row/Column | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 | 16 | 17 | 18 | 19 | 20 |
| 1. | Manufacturer Part Number | |||||||||||||||||||
| 2. | Dialog Logo | Date Code | TELEC License Number | |||||||||||||||||
| 3. | Assembly Lot Number | TELEC
mark |
||||||||||||||||||
| 4. | CE
mark |
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| 5. | Qualification Code | |||||||||||||||||||
| 6. | RF License (FCC) | |||||||||||||||||||
| 7. | RF License (Industry Canada) | |||||||||||||||||||
| 8. | Pin1 Orientation | |||||||||||||||||||
Ordering Information
The ordering number consists of the part number followed by a suffix indicating the packing method. For details and availability, please consult Dialog Semiconductor’s customer support portal or your Dialog Semiconductor local sales representative.
Table 12: Ordering Information
| Part Number | Package | Size Module(mm) | Shipment Form |
| DA14AVDDECT SF01 | PCB Module | 17.0 mm × 26.65 mm | Tray |
Application Information
As mentioned in chapter 2, the DA14AVDDECT functionality is defined in software and the software specifics are detailed in separate documents. The DA14AVDDECT can be operated stand-alone or controlled from a host application through the API interface. The on-board FLASH memory can be used to store the custom code.
The following points highlight some hardware-specific aspects of application implementation:
- Antennas:
- The module includes an integrated printed antenna (ANT1)
- Optionally, an additional external antenna (ANT2) can be connected to support antenna diversity
- For an optimal wireless performance, it is recommended to always use two antennas, that is, the internal antenna combined with an external antenna
- A special build option may be ordered with a special ordering code that disconnects ANT1 from the internal printed antenna and allows two external antennas to be used
- Supply voltage of RFPA:
- +VRF_PA_1 and +VRF_PA_2 need to be connected to external supply voltages
- In order to be able to leverage the Limited Modular Approval certification (for more information please refer to [4]), the supply circuit should be copied from the reference application used for certification. If it is desired to deviate from the reference application, please note the following, and it may not be possible to leverage the Limited Modular Approval any more:
- +VRF_PA_1 requires a minimum input voltage of 3.0 V (current draw 10 mA), so an external DCDC boost converter will be required if two AA applications are targeted
- Typically, +VRF_PA_2 is connected to an external 3.3 V supply voltage (up to 350 mA current draw depending on the RF TX output power levels). An optimal battery efficiency is obtained if +VRF_PA_2 is sourced from a DCDC power supply adjusted within 0.5 V to 3.5 V based on the target output power levels
- The DA14AVDDECT module includes an integrated battery charger and the associated power dissipation increases the module’s temperature. Please make sure that the chip temperature does not exceed its operational temperature range, especially when other functions are also enabled. Since the module includes an on-board temperature sensor to facilitate chip temperature detection, how to protect the chip from overheating needs to be implemented in software and is not described in further detail in this document
- The DA14AVDDECT module includes an integrated audio CODEC. To support an external audio CODEC, please map the GPIOs accordingly. It is implemented in software and is not described in further detail in this document
- An external protection IC may be required to protect VBUS from supply circuits with possible high overshoot
Audio Connections
Analog microphones can be connected as shown in Figure 7.
The bias resistor value shall be selected depending on the microphone requirements and MICBIAS1/2 must be decoupled with 1 µF capacitors.
Alternatively, up to four digital microphones can be supported by reusing the MIC1_P and MIC2_P pins as clock outputs and the MIC1_N and MIC2_N pins as digital data inputs. The IO voltage level of DMIC1 is set by the voltage present on MICBIAS1 and the IO voltage level of DMIC2 is set by the voltage present on MICBIAS2. The voltage present on MICBIAS1/MICBIAS2 can be either an output of the MICBIAS LDO or the IO voltage of the DMIC that is connected as an input on the appropriate MICBIAS pin for a minimum power consumption. The configuration of MICBIAS is through software and thus is not detailed further in this document.
The DA14AVDDECT module can support headphone detection. Document UM-D-012 [7] explains how to control this feature in the software. Please contact your Dialog representative for further details.
Layout Guidelines
The module pinout of DA14AVDDECT has been specifically designed to accommodate easy integration with the PCBs of customer applications without having to adding expensive PCB components to increase the cost due to, for example, blind vias or small line/space dimensions.
All standard practice layout rules and guidelines apply. Additional special care may be paid to the antenna and USB areas:
- The application PCB may not extend underneath the antenna area (see Figure 8)
- Signals from the application PCB containing high harmonic content (for example, clock signals or memory buses) must be kept away from the antenna
- No metal objects should be placed in the vicinity of the antenna (see Figure 8)
- The USB data lines should be routed with 90 Ω differential impedance lines and the line lengths must match
- Appropriate trace width and number of vias should be used for all power supply paths
- A common ground plane should be used to allow proper electrical and thermal performances
- Noise-sensitive analog signals, such as feedback lines or clock connections, should be kept away from the traces carrying pulsed analog or digital signals. This can be achieved by separation (distance) or by shielding the sensitive signals with quiet signals or ground traces
- Decoupling capacitors should be X5R ceramics and should be placed as near to the module as possible
It is also advised to use the HW layout of the DA14AVDDECT evaluation kit as a guideline for customer products. This HW was used during the certification process and should be regarded as a reference.
Please see reference document [4] for more information on the Limited Modular Approval certification and how it can be used, so that no new radio certification needs to be obtained for the end customer products.
Revision History
| Revision | Date | Description |
| 2.1 | 02-Jun-2020 | Added supply current tables |
| 2.0 | 14-May-2020 | Preliminary datasheet |
| 1.9 | 18-Sep-2019 | Added ‘P2.5’ to I2C-DATA pin name |
|
1.8 |
9-Sep-2019 |
Added reflow profile
Changed pin name I2C-DATA Revised H2/J2 in figure 3 to correspond with table 1 Updated figure 9 to the latest EVK schematic snapshot |
|
1.7 |
13-Aug-2019 |
Added text at LMA section
Corrected pin L4 in the pin diagram (1.6 was erroneously reverted to GND), also corrected some pin naming typos Added wording about SW supporting only mono whereas the HW supports stereo |
|
1.6 |
8-Aug-2019 |
Updated pin diagram and table (E11 = Vsupply and others) Corrected B1 and D1 pin descriptions |
| 1.5 | 6-Jun-2019 | Changed pin L4 to NC, added comment about pin T1 |
| 1.4 | 19-Mar-2019 | Updated POD |
| 1.3 | 7-Mar-2019 | Added keepout area drawing in ch9, changed pins H2, J2 to NC |
| 1.2 | 20-Feb-2019 | Updated package outline drawing; minor cosmetic edits |
| 1.1 | 26-Nov-2018 | Added package outline drawing |
| 1.0 | 31-Oct-2018 | First version of target datasheet |
Status Definitions
| Revision | Datasheet Status | Product Status | Definition |
| 1.<n> | Target | Development | This datasheet contains the design specifications for product development. Specifications may be changed in any manner without notice. |
| 2.<n> | Preliminary | Qualification | This datasheet contains the specifications and preliminary characterization data for products in pre-production. Specifications may be changed at any time without notice in order to improve the design. |
| 3.<n> | Final | Production | This datasheet contains the final specifications for products in volume production. The specifications may be changed at any time in order to improve the design, manufacturing and supply. Major specification changes are communicated via Customer Product Notifications. Datasheet changes are communicated via www.dialog-semiconductor.com |
| 4.<n> | Obsolete | Archived | This datasheet contains the specifications for discontinued products. The information is provided for reference only. |
Disclaimer
- Unless otherwise agreed in writing, the Dialog Semiconductor products (and any associated software) referred to in this document are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of a Dialog Semiconductor product (or associated software) can reasonably be expected to result in personal injury, death or severe property or environmental damage. Dialog Semiconductor and its suppliers accept no liability for inclusion and/or use of Dialog Semiconductor products (and any associated software) in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.
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- Dialog Semiconductor reserves the right to change without notice the information published in this document, including, without limitation, the specification and the design of the related semiconductor products, software and applications. Notwithstanding the foregoing, for any automotive grade version of the device, Dialog Semiconductor reserves the right to change the information published in this document, including, without limitation, the specification and the design of the related semiconductor products, software and applications, in accordance with its standard automotive change notification process.
- Applications, software, and semiconductor products described in this document are for illustrative purposes only. Dialog Semiconductor makes no representation or warranty that such applications, software and semiconductor products will be suitable for the specified use without further testing or modification. Unless otherwise agreed in writing, such testing or modification is the sole responsibility of the customer and Dialog Semiconductor excludes all liability in this respect.
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Dialog Semiconductor’s suppliers certify that its products are in compliance with the requirements of Directive 2011/65/EU of the European Parliament on the restriction of the use of certain hazardous substances in electrical and electronic equipment. RoHS certificates from our suppliers are available on request.
Contacting Dialog Semiconductor
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Germany
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FCC Statement
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
- This device may not cause harmful interference, and
- his device must accept any interference received, including interference that may cause undesired operation.
Any Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.
The device has been evaluated to meet general RF exposure requirement. The device can be used in portable exposure condition without restriction.
If the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following:
“Contains Transmitter Module FCC ID: NTMGXTM Or Contains FCC ID: NTMGXTM”
When the module is installed inside another device, the user manual of the host must contain below warning statements;
The devices must be installed and used in strict accordance with the manufacturer’s instructions as described in the user documentation that comes with the product.
Any company of the host device which install this modular with Single modular approval should perform the test of radiated emissionand spurious emission according to FCC part 15C : 15.247 and 15.209 requirement,Only if the test result comply with FCC part 15C : 15.247 and 15.209 requirement, then the host can be sold legally.
FCC RF Exposure Information and Statement
The SAR limit of USA (FCC) is 1.6 W/kg averaged over one gram of tissue. Device types: Transmitter Module (FCC ID:NTMGXTM) has also been tested against this SAR limit. The highest SAR value reported under this standard during product certification for use properly worn on the body is 0.382W/kg. This device was tested for typical body-worn operations with the back of the handset kept 0mm from the body. To maintain compliance with FCC RF exposure requirements, use accessories that maintain a 0mm separation distance between the user’s body and the back of the handset. The use of belt clips, holsters and similar accessories should not contain metallic components in its assembly. The use of accessories that do not satisfy these requirements may not comply with FCC RF exposure requirements, and should be avoided.
Body-worn Operation
This device was tested for typical body-worn operations. To comply with RF exposure requirements, a minimum separation distance of 0mm must be maintained between the user’s body and the handset, including the antenna. Third-party belt-clips, holsters, and similar accessories used by this device should not contain any metallic components. Body-worn accessories that do not meet these requirements may not comply with RF exposure requirements and should be avoided. Use only the supplied or an approved antenna.
Documents / Resources
 |
dialog SEMICONDUCTOR DA14AVDDECT SF01 Wireless Module [pdf] Owner's Manual DA14AVDDECT SF01, DA14AVDDECT SF01 Wireless Module, Wireless Module, Module |