dialog SEMICONDUCTOR DA14AVDDECT SF01 Wireless Module Owner's Manual

Owner's Manual for dialog SEMICONDUCTOR models including: DA14AVDDECT SF01, DA14AVDDECT SF01 Wireless Module, Wireless Module, Module

DA14AVDDECT SF01 Datasheet

02-Jun-2020

DA14AVDDECT, SF01

Dialog Technical Publication

Users Manual

OKAYO Electronics Co., Ltd. GXTM Transmitter Module NTMGXTM NTMGXTM gxtm

File Info : application/pdf, 27 Pages, 3.28MB

GetApplicationAttachment.html?id=8370572

GX TM DA14AVDDECT SF01
DA14AVDDECT SF01 Datasheet

NDA Confidential

General Description
The DA14AVDDECT from Dialog Semiconductor is a member of the wireless module family that operates in the interference-free DECT frequency band (1.9 GHz) and can be used in hosted or embedded Audio, Voice, and Data applications. The module includes all the required radio components, antenna, a low-power audio CODEC (DA7218), and a 32 Mb FLASH memory. The module is intended for users who are familiar with application-level software programming but does not require detailed understanding of the DECT protocol to facilitate rapid design-in cycles. The module can be operated as a stand-alone device or from a host through an API interface.
The module is based on Dialog's DA14495 chip that supports DQPSK and D8PSK besides the traditional GFSK. This increases the raw air data rate by up to three times.
The module is available with 1.5 mm pitch BGA solder balls for an excellent solderability and a sufficient connectivity. The dimensions for the module are 17.0 mm × 26.65 mm.
This document describes the hardware of the DA14AVDDECT module. A separate document details the software and APIs.

Key Features

All RF components are integrated, thus no
customer tuning is required
Supported bands include EU-DECT, DECT
6.0 for North America, and Japan DECT (JDECT)
On-PCB antenna, the module also supports
an optional second external antenna)
Integrated RF shield Low power operations
Audio bandwidth from 20 Hz to 20 kHz

32 Mbit FLASH, so program memory available
for custom software
Integrated audio ADC/DAC (external audio
ADC/DAC supported through GPIO mapping)
Limited modular approval for EN301-406 (EU-
DECT), FCC Part 15 (DECT 6.0), and TELEC (J-DECT)
Supports NiMH, alkaline, and Li-Ion batteries
A Voice Data Stack or an Audio Data Stack
are available to be downloaded

Applications (Defined by SW)

Public Address solution with four microphones Wireless Intercom Systems supporting HD

Tour Guide Systems for up to 1024 listeners

Voice

Conferencing Systems with eight participants Wireless Stereo Headphones and Headsets

Wireless Low Latency Microphones

Datasheet
CFR0011-120-00

Revision 2.1
1 of 25

02-Jun-2020
© 2020 Dialog Semiconductor

GX TM

System Diagram

USB connector
Battery connector

3.3V
DCD C

L i-Ion/ NiMH jumper

HeadJack#1 HeadJack#2

Bal/unbal Jumper

Mono/Stereo/Class D speaker jumper

Stereo In Stereo Out

Speaker

Class D

1 x PDM microph.

GPIO

Audio DA14AVDDECT Modul e
GPIO

Power

USB

Radio

NDA Confidential

UFL connector

Antenna

8 x GPIO LED red
3 x PWM LED red-green-yellow
8 x Buttons

Jumper

U AR T-U SB

JT AG /U AR T USB connector

GPIO port 1 voltage config.

Digital I/O connector
1.8V or 3.3V

Figure 1: System Diagram

Datasheet
CFR0011-120-00

Revision 2.1
2 of 25

02-Jun-2020
© 2020 Dialog Semiconductor

GX TM

NDA Confidential

Contents
General Description ............................................................................................................................ 1 Key Features ........................................................................................................................................ 1 Applications (Defined by SW) ............................................................................................................ 1 System Diagram .................................................................................................................................. 2 1 References ..................................................................................................................................... 4 2 Block Diagram ............................................................................................................................... 5 3 Pinout ............................................................................................................................................. 6 1 Characteristics ............................................................................................................................ 12
1.1 Absolute Maximum Ratings ................................................................................................ 12 1.2 Recommended Operating Conditions ................................................................................. 12 1.3 Electrical Characteristics..................................................................................................... 13 2 Functional Description ............................................................................................................... 16 3 Package Information ................................................................................................................... 16 3.1 Package Outline Drawing.................................................................................................... 16 3.2 Moisture Sensitivity Level.................................................................................................... 18 3.3 Soldering Information .......................................................................................................... 18 3.4 Packaging ........................................................................................................................... 19 4 Ordering Information .................................................................................................................. 20 5 Application Information .............................................................................................................. 21 5.1 Audio Connections .............................................................................................................. 22 6 Layout Guidelines ....................................................................................................................... 23 Revision History ................................................................................................................................ 24

Figures
Figure 1: System Diagram..................................................................................................................... 2 Figure 2: Block Diagram ........................................................................................................................ 5 Figure 3: DA14AVDDECT BGA Pinout Diagram (Top View) ................................................................ 6 Figure 4: DA14AVDDECT BGA Package Outline Drawing................................................................. 17 Figure 5: Reflow Profile (Lead-Free) ................................................................................................... 18 Figure 6: DA14AVDDECT Package Marking ...................................................................................... 19 Figure 7: Connection of Analog Microphones ..................................................................................... 22 Figure 8: Keep-out Areas .................................................................................................................... 23

Tables
Table 1: Pin Description ........................................................................................................................ 7 Table 2: Pin Type Definition ................................................................................................................ 11 Table 3: Absolute Maximum Ratings................................................................................................... 12 Table 4: Recommended Operating Conditions ................................................................................... 12 Table 5: Digital I/O Characteristics ...................................................................................................... 13 Table 6: Radio Characteristics ............................................................................................................ 13 Table 7: Supply Currents (Tour Guide mode) ..................................................................................... 13 Table 8: Supply Currents (Public Address mode) .............................................................................. 14 Table 9: Supply Currents (Voice Conference mode) .......................................................................... 14

Datasheet

Revision 2.1

02-Jun-2020

CFR0011-120-00

3 of 25

GX TM

NDA Confidential

Table 10: MSL Classification ............................................................................................................... 18 Table 11: DA14AVDDECT Package Marking Table ........................................................................... 19 Table 12: Ordering Information ........................................................................................................... 20

1 References
[1] DA14495, Datasheet, Dialog Semiconductor. [2] DA7218, Datasheet, Dialog Semiconductor. [3] UM-D-011, DA14AVDDECT Production Programming and Configuration Manual, User Manual,
Dialog Semiconductor. [4] AN-D-236, DA14AVDDECT External Antenna Design, Application Note, Dialog Semiconductor. [5] DA14AVDDECT CVM software [6] DA14AVDDECT WAM software [7] UM-D-012, DA14AVDDECT Software Developer's Guide, User Manual, Dialog Semiconductor.

Datasheet
CFR0011-120-00

Revision 2.1
4 of 25

02-Jun-2020
© 2020 Dialog Semiconductor

NDA Confidential
2 Block Diagram
The DA14AVDDECT module is built around Dialog's DA14495 DECT chip. The module integrates the RF components (that is, baluns, switches, RFPA, and crystal) with an integrated antenna. It also allows an additional external antenna to be connected in order to support antenna diversity. A low-power audio CODEC from Dialog (DA7218) is integrated to support analog audio applications. A 32-Mb FLASH is integrated for custom software.

ANT1 ANT2

BALUN

RF_RXp RF_RXn

RF_TXp
PA BALUN
RF_TXn

PA _EN PA _CTRL1 PA _CTRL0
RFP2 RFP1 RFP0 RFP0n

20.736 MHz DA14AVDDECT SF01

LNA PA

DA14495
PCM_FSC PCM_CLK PCM_DO PCM_DI
SCL SDA BX TAL

DA7218

RF GPIO

CHARGER

VBUS / CHARGE NTC / ADC
VB AT

FUEL GAUG E

>4.2V

10mF

+
3.7V / Li-Ion

Ext. Charger
(External charger if charger current > 400mA)

0.1 Ohm

QSPI Flash (32 Mbit)

Figure 2: Block Diagram
Note that the block diagram shown in Figure 2 demonstrates the stereo audio capability. The hardware of the DA14AVDDECT supports these connections, but the current software implementations only supports mono audio.

Datasheet
CFR0011-120-00

Revision 2.1
5 of 25

02-Jun-2020
© 2020 Dialog Semiconductor

NDA Confidential
3 Pinout
With Figure 3 the pin functions can easily be identified. Please refer to chapter 3 for an accurate mechanical representation.

Figure 3: DA14AVDDECT BGA Pinout Diagram (Top View)
NOTE
On the bottom (ball) side of the module, at the end of the printed antenna pattern, there is a ball 'T1' (see the lower left corner of Figure 4). This is for Dialog's production test purposes only and serves no customer application use. The customer application shall not have a solder connection to T1.

Datasheet
CFR0011-120-00

Revision 2.1
6 of 25

02-Jun-2020
© 2020 Dialog Semiconductor

Table 1: Pin Description

Pin No.

Pin Name

Type (Table 2)

ANT1

AIO

T1 Power E8 B11, C11

ANT_TEST
+VRF_PA_1 +VRF_PA_2

AIO
PWR PWR

+1.8V

PWR

K3 K5, L5 K11 N7
N8 E11 Audio K1 N2
N3 N4 M1
N1

+3.3V
VBAT VDDIO
+VDCDC

PWR
PWR PWR
PWR

VBUS/CHARGE PWR

VSUPPLY

PWR

MICBIAS1

AI MIC1_P
DO

AI MIC1_N
DI

MICBIAS2

AI MIC2_P
DO

AI MIC2_N
DI

NDA Confidential

Drive Reset (mA) State

Description

RF connection ANT1
This pin is used together with the integrated printed antenna to connect an external antenna to support antenna diversity.
The PCB of a customer application shall not have a solder connection to T1.

Input supply voltage of RFPA bias stage
Input supply voltage of RFPA power stage
Output supply voltage 1.8 V It can be used to configure the GPIO voltage of bank 1 (VDDIO1), for example.
Output supply voltage 3.3 V It can be used to configure the GPIO voltage of bank 1 (VDDIO1), for example.
Main input supply voltage
Input supply voltage of GPIO bank 1
Output supply voltage of internal DCDC converter It can be used as an input when the internal DCDC is disabled.
Input supply voltage of the battery charger and/or the USB
Output voltage of DA14495

Microphone bias output 1 (requires 1 µF decoupling)
Differential analog microphone 1 input (Pos) Digital microphone 1 clock output
Differential analog microphone 1 input (Neg) Digital microphone 1 data input
Microphone bias output 2 (requires 1 µF decoupling)
Differential analog microphone 2 input (Pos) Digital microphone 2 clock output
Differential analog microphone 2 input (Neg) Digital microphone 2 data input

Datasheet
CFR0011-120-00

Revision 2.1
7 of 25

02-Jun-2020
© 2020 Dialog Semiconductor

Pin No.
M3 M5 N6

Pin Name
HPLDET HPR HPL

CODEC ADDRESS

USB M7

USBN

USBP

JTAG L8

SWCLK

SWDIO

Special Functions

RSTn

SOCN

SOCP

P0.15/PON

P2.6/LED0

Type (Table 2) AI AO AO
DI

NDA Confidential

Drive Reset (mA) State

Description
Current source for headphone detection
Single-ended headphone output (Right)
Single-ended headphone output (Left)
Connecting this pin to GND selects the I2C slave address 0x1A; Connecting this pin to pin H4 selects the I2C slave address 0x1B.

A11

Hi-Z

INPUT/OUTPUT. USB-. Typical HS output impedance is 45 .

A11

Hi-Z

INPUT/OUTPUT. USB+. Typical HS output impedance is 45 .

DI-BP DIO-BP

I_PD

4/8

I_PU

INPUT. ARM debug interface clock.
INPUT/OUTPUT. ARM debug interface data input/output.

A5
A1 A1
DI
DIO-BP DO-BP

25 k pull-up resistor connect ed to VDD1V 2
I
I

4/8

I_PD

4/8/16 I_PU

INPUT/OPEN DRAIN OUTPUT with internal pull-up.
Reset signal (active LOW). No external capacitor required.
If the internal VDD1V2 drops below 1.06 V, this pin is pulled low. An external device may not drive this pin higher than VDD1V2 (1.2V).
INPUT. Battery fuel gauge reference ground. Connect as star point.
If it is not used, connect it to GND to prevent a false power-on trigger (NEW_BAT) due to a floating pin.
INPUT. Battery fuel gauge positive input.
If it is not used, connect it to VSS to prevent a false power-on trigger (NEW_BAT) due to a floating pin.
INPUT with a selectable pull up/down resistor.
Note that P0.15 cannot be used as output.
INPUT. Device Power-on.
It can be directly connected to VBAT (max 5 V).
If PON has a fixed connection to VBAT, the PD resistor can be disabled to save power.
INPUT/OUTPUT with a selectable pull up/down resistor.
OUTPUT: Back drive protected pad for LED0 up to VSUPPLY. A series of resistors is required for LED operation.

Datasheet
CFR0011-120-00

Revision 2.1
8 of 25

02-Jun-2020
© 2020 Dialog Semiconductor

NDA Confidential

Pin No. F10

Pin Name P2.7/LED1

Type (Table 2)
DIO-BP DO-BP

P2.8/LED2

DIO-BP DO-BP

DIO-BP

P0.14/NTC

P2.5/I2C_DATA DIO

P0.10/I2C_CLK DIO

P0.11/BXTAL DIO

General Purpose IO

P0.0

DIO

P0.1

DIO

P0.2

DIO

P0.3

DIO

P0.4

DIO

M11

P0.5

DIO

Drive Reset (mA) State 4/8/16 I_PU
4/8/16 I_PU

4/8

I_PD

4/8

I_PD

4/8

I_PD

4/8

I_PD

Description
INPUT/OUTPUT with a selectable pull up/down resistor.
OUTPUT: Back drive protected pad for LED1 up to VSUPPLY. A series of resistors is required for LED operation.
INPUT/OUTPUT with a selectable pull up/down resistor. OUTPUT: Back drive protected pad for LED2 up to VSUPPLY. A series of resistors is required for LED operation.
INPUT/OUTPUT with a selectable pull up/down resistor. ANALOG INPUT: Analog to Digital Converter (ADC) input 0. ANALOG INPUT: Li-Ion/Li_Po NTC protection which is used to automatically switch off the charger circuit if this input goes beyond the specified voltage ranges. Note: Only GPIO port (I/O), digital input, and the analog function are available; no peripheral outputs are available.
INPUT/OUTPUT with a selectable pull up/down resistor.
INPUT/OUTPUT with a selectable pull up/down resistor.
INPUT/OUTPUT with a selectable pull up/down resistor. OUTPUT: PLL Codec output (12.288 MHz/24.567 MHz). Supplied from VDDIO_BXTAL.

4/8

I_PU

4/8

I_PD

4/8

I_PD

4/8

I_PD

4/8

I_PD

4/8

I_PD

INPUT/OUTPUT with a selectable pull up/down resistor.
If `0' is on the rising edge of the RSTn pin, boot the module from UART. Assign the module as UTX if the module is booted from UART
INPUT/OUTPUT with a selectable pull up/down resistor. Assign the module as URX if the module is booted from UART.
INPUT/OUTPUT with a selectable pull up/down resistor.
If `1' is on the rising edge of the RSTn pin, the Booter will wait in an endless loop for debugging purposes.
INPUT/OUTPUT with a selectable pull up/down resistor.
INPUT/OUTPUT with a selectable pull up/down resistor.
INPUT/OUTPUT with a selectable pull up/down resistor.

Datasheet
CFR0011-120-00

Revision 2.1
9 of 25

02-Jun-2020
© 2020 Dialog Semiconductor

Pin No.

Pin Name

P0.6

L10

P0.7

P0.12

P0.13

K10

P1.0

H11

P1.1

J10

P1.2

H10

P1.3

F11

P1.4

P1.5

G10

P1.6

E10

P1.7

D10

P1.8

P1.9

J11

P1.10

P1.11

L11

P1.12

P2.0

G11

P2.1

P2.2

P2.3

Ground and No Connects

Type (Table 2) DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO

NDA Confidential

Drive Reset (mA) State

4/8

I_PD

4/8

I_PD

4/8

I_PD

4/8

I_PD

4/8/12 /16

I_PD

4/8/12 /16

I_PD

4/8/12 /16

I_PD

4/8/12 /16

I_PD

4/8/12 /16

I_PD

4/8/12 /16

I_PD

4/8

I_PD

4/8

I_PD

4/8

I_PD

4/8

I_PD

4/8

I_PD

4/8

I_PD

4/8

I_PD

4/8

I_PD

4/8

I_PD

4/8

I_PD

4/8

I_PD

Description
INPUT/OUTPUT with a selectable pull up/down resistor.
INPUT/OUTPUT with a selectable pull up/down resistor.
INPUT/OUTPUT with a selectable pull up/down resistor.
INPUT/OUTPUT with a selectable pull up/down resistor.
INPUT/OUTPUT with a selectable pull up/down resistor.
INPUT/OUTPUT with a selectable pull up/down resistor.
INPUT/OUTPUT with a selectable pull up/down resistor.
INPUT/OUTPUT with a selectable pull up/down resistor.
INPUT/OUTPUT with a selectable pull up/down resistor.
INPUT/OUTPUT with a selectable pull up/down resistor.
INPUT/OUTPUT with a selectable pull up/down resistor.
INPUT/OUTPUT with a selectable pull up/down resistor.
INPUT/OUTPUT with a selectable pull up/down resistor.
INPUT/OUTPUT with a selectable pull up/down resistor.
INPUT/OUTPUT with a selectable pull up/down resistor.
INPUT/OUTPUT with a selectable pull up/down resistor.
INPUT/OUTPUT with a selectable pull up/down resistor.
INPUT/OUTPUT with a selectable pull up/down resistor.
INPUT/OUTPUT with a selectable pull up/down resistor.
INPUT/OUTPUT with a selectable pull up/down resistor.
INPUT/OUTPUT with a selectable pull up/down resistor.

Datasheet
CFR0011-120-00

Revision 2.1
10 of 25

02-Jun-2020
© 2020 Dialog Semiconductor

NDA Confidential

Pin No.

Pin Name

A1, A2, A3, A4, A5, A6, A7, A8, A9, A10, A11, B2, B3, B4, B5, B6, B7, B8, B9, B10, C1, C2, C3, C4, C5, C6, C7, C8, C9, C10, D2, D3, D4, D5, D6, D7, D8, D9, D11, E1, E2, E3, E4, E5, E6, E7, F1, F2, F3, F4, F5, F6, F7, G1, G2, G3, G4, G5, G7, H1, H3, J1, J3, J4, L3, M2, N5, N9, N11

GND

G9, H7, J6,

M4, M10,

N10

H2, J2, L4 Keep out

Type (Table 2)

Drive Reset (mA) State

Description

GND

Analog and digital ground.
They are connected together on a solid ground plane.

Not connected. No package ball/pin available on the package.

Not connected, but package balls/pins

are available: implement keep-out on

application PCBs to ensure balls/pins are

not connected to anything or close to any

noise signals.

Table 2: Pin Type Definition

Pin Type

Description

Digital input

Digital output

DIO

Digital input/output

DIOD

Digital input/output open drain

Pull-up resistor (fixed)

Pull-down resistor (fixed)

PWR

Power

Pin Type AI AO AIO BP SPU SPD GND

Description Analog input Analog output Analog input/output Back drive protection Switchable pull-up resistor Switchable pull-down resistor Ground

Datasheet
CFR0011-120-00

Revision 2.1
11 of 25

02-Jun-2020
© 2020 Dialog Semiconductor

NDA Confidential

1 Characteristics

1.1 Absolute Maximum Ratings
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, so functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specification are not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.

Table 3: Absolute Maximum Ratings

Parameter Description

VESD

Maximum ESD voltage

VBAT

Battery voltage

VBUS

BUS voltage

Conditions HBM

Min

Max

Unit

4.6

6.5

1.2 Recommended Operating Conditions

Table 4: Recommended Operating Conditions

Parameter Description

Conditions

Min

Typ

Max

Unit

VBAT

Battery supply voltage

Limited by the supply

voltage requirements of the SKY77762 power amplifier

1.9

module from SYKWORKS

4.2

VBUS +VRF_PA_1 +VRF_PA_2

USB voltage Bias supply SKY77762 Power supply SKY77762

< 10 mA current draw
Up to ~350 mA current draw

4.2

5.75

3.0

4.2

1.9

3.3

3.6

Ambient operating temperature range

-20

+60

VSUPPLY

Output voltage of DA14495

1.9

3.45

3.6

VDCDC

Output voltage of the DA14495 DCDC converter.
When the DCDC is disabled, the same pin can be connected to an external supply, overriding the internal DCDC converter

1.4

1.89

Datasheet
CFR0011-120-00

Revision 2.1
12 of 25

02-Jun-2020
© 2020 Dialog Semiconductor

NDA Confidential

1.3 Electrical Characteristics

Table 5: Digital I/O Characteristics

Parameter Description

Conditions

VDDIO

Supply voltage of IO band

VPIN_NEG

Negative voltage on IO pin

VPIN_POS VPIN_PON VPIN_USB

Positive voltage on IO pin
Voltage on pin P0.15/PON
Voltage on pins USBp and USBn

VIH

High level input voltage

VIL VDDIO0_2
VDDIO1

Low level input voltage IO voltage bank0/2
IO voltage bank 1

User programmable by connecting the 3V3 (pin K3) or 1V8 (pin H4) from the module to VDDIO1

Min

Typ

Max Unit

1.6

3.45

GND 0.3

VDDIO + 0.2

3.6

0.7 × VDDIO

0.3 × VDDIO

1.8

1.8 3.3

Table 6: Radio Characteristics

Parameter Description

Foperating

Frequency bands supported

RXsense

Receiver sensitivity

Conditions

Min

Typ

Max

Unit

EU-DECT, US-DECT, and J-DECT (K-DECT is not supported)

GFSK, EU-DECT ch5

-93

dBm

Po Pspur TXACPR1 TXACPR3 TXEVM

Transmitted output power GFSK, EU-DECT ch5

+22

Spurious emissions

ETSI/FCC compliant

Transmitter adjacent channel power ratio M = 1

Po = +16dBm, /4 DQPSK

Transmitter adjacent channel power ratio M = 3

Po = +16dBm, /4 DQPSK

Transmitter error vector magnitude

Po = +16dBm, /4 DQPSK

dBm

-33

dBc

-66

dBc

Table 7: Supply Currents (Tour Guide mode)

Parameter Description

Conditions (Note 1)

Iavg_TG_stby

Standby supply current (Tour Guide mode)

FP (TX); HPM FP (TX); HPM/U PP (RX); HPM

Iavg_TG_talk

Talk mode supply current FP (TX); LPM

Datasheet
CFR0011-120-00

Revision 2.1
13 of 25

Min Typ 23 20 8 53

Max Unit mA mA mA mA

NDA Confidential

Parameter Description (Tour Guide mode)

Conditions (Note 1) FP (TX); HPM

Min Typ 71

Max Unit mA

FP (TX); HPM; Question call

FP (TX); HPM/U

FP (TX); HPM/U; Question call

PP (RX); LPM; RX only

PP (RX); LPM; Return channel

PP (RX); HPM; RX only

PP (RX); HPM; Return channel

PP (RX); HPM/U; RX only

PP (RX); HPM/U; Return channel

Note 1

VBAT, +VRF_PA_1 and +VRF_PA_2 pins connected to +3.3V supply; Iavg: current drawn from the +3.3V supply.
SW configuration by default example appplication. Standby mode: no PP locked to FP.

Table 8: Supply Currents (Public Address mode)

Parameter Description

Conditions (Note 1)

Iavg_PA_stby

Standby supply current (Public Address mode)

FP (RX); HPM FP (RX); HPM/U PP (TX); HPM

FP (RX); LPM; 1PP (TX)

FP (RX); LPM; 2PPs (TX)

FP (RX); LPM; 3PPs (TX)

FP (RX); LPM; 4PPs (TX)

FP (RX); HPM; 1PP (TX)

FP (RX); HPM; 2PPs (TX)

Iavg_PA_talk

Talk mode supply current (Public Address mode)

FP (RX); HPM; 3PPs (TX) FP (RX); HPM; 4PPs (TX) FP (RX); HPM/U; 1PP (TX)

FP (RX); HPM/U; 2PPs (TX)

FP (RX); HPM/U; 3PPs (TX)

FP (RX); HPM/U; 4PPs (TX)

PP (TX); LPM

PP (TX); HPM

PP (TX); HPM/U

Min Typ Max Unit

Table 9: Supply Currents (Voice Conference mode)

Parameter Description

Conditions (Note 1)

Standby supply current Iavg_CVM_stby (Voice Conference mode)

FP; HPM PP; HPM

Datasheet

Revision 2.1

CFR0011-120-00

14 of 25

Min Typ Max Unit

02-Jun-2020

Parameter Description Talk mode supply current
Iavg_CVM_talk (Voice Conference mode)

Conditions (Note 1) FP; HPM; 1PP FP; HPM; 2PPs FP; HPM; 3PPs FP; HPM; 4PPs FP; HPM; 5PPs FP; HPM; 6PPs FP; HPM; 7PPs FP; HPM; 8PPs FP; HPM/U; 1PP FP; HPM/U; 2PPs FP; HPM/U; 3PPs FP; HPM/U; 4PPs FP; HPM/U; 5PPs FP; HPM/U; 6PPs FP; HPM/U; 7PPs FP; HPM/U; 8PPs PP; HPM

NDA Confidential

Min Typ Max Unit

104

Datasheet
CFR0011-120-00

Revision 2.1
15 of 25

NDA Confidential
2 Functional Description
The DA14AVDDECT module is a hardware platform capable of serving multiple functions. The functions fall into two categories, Cordless Voice Module (CVM) and Wireless Audio Module (WAM), and they are defined in the software. These two functions of the DA14AVDDECT are described in their separate CVM and WAM software documents. Please consult with your Dialog representative for further details. Please also note that the module is supplied without any software pre-loaded in FLASH. Please refer to [3] for programming and configuring the module.
3 Package Information
3.1 Package Outline Drawing

Datasheet
CFR0011-120-00

Revision 2.1
16 of 25

NDA Confidential

Datasheet
CFR0011-120-00

Figure 4: DA14AVDDECT BGA Package Outline Drawing Revision 2.1
17 of 25

NDA Confidential

3.2 Moisture Sensitivity Level
The Moisture Sensitivity Level (MSL) is an indicator for the maximum allowable time period (floor lifetime) in which a moisture sensitive plastic device, once removed from the dry bag, can be exposed to an environment with a specified maximum temperature and a maximum relative humidity before the solder reflow process. The MSL classification is defined in Table 10.
For detailed information on MSL levels refer to the IPC/JEDEC standard J-STD-020, which can be downloaded from http://www.jedec.org.
The DA14AVDDECT is qualified for MSL 3.

Table 10: MSL Classification MSL Level MSL 4 MSL 3 MSL 2A MSL 2 MSL 1

Floor Lifetime 72 hours 168 hours 4 weeks 1 year Unlimited

Conditions 30 °C / 60 % RH 30 °C / 60 % RH 30 °C / 60 % RH 30 °C / 60 % RH 30 °C / 85 % RH

3.3 Soldering Information
The DA14AVDDECT should be soldered using a lead-free reflow soldering profile as shown in Figure 5. Adjustments to the profile may be necessary, depending on process requirements.
The recommended solder paste for lead-free soldering is Sn 96.5%, Ag 3.0%, and Cu 0.5%.

Datasheet
CFR0011-120-00

Figure 5: Reflow Profile (Lead-Free) Revision 2.1
18 of 25

3.4 Packaging
The DA14AVDDECT is packaged in trays.

NDA Confidential

Figure 6: DA14AVDDECT Package Marking

Table 11: DA14AVDDECT Package Marking Table

Row/Column 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20

Manufacturer Part Number

Dialog

Date Code

TELEC License Number

Logo

Assembly Lot Number

TELEC

mark

Qualification Code

RF License (FCC)

RF License (Industry Canada)

Pin1 Orientation

Datasheet
CFR0011-120-00

Revision 2.1
19 of 25

NDA Confidential

4 Ordering Information
The ordering number consists of the part number followed by a suffix indicating the packing method. For details and availability, please consult Dialog Semiconductor's customer support portal or your Dialog Semiconductor local sales representative.

Table 12: Ordering Information

Part Number

Package

DA14AVDDECT SF01

PCB Module

Size Module(mm) 17.0 mm × 26.65 mm

Shipment Form Tray

Datasheet
CFR0011-120-00

Revision 2.1
20 of 25

NDA Confidential
5 Application Information
As mentioned in chapter 2, the DA14AVDDECT functionality is defined in software and the software specifics are detailed in separate documents. The DA14AVDDECT can be operated stand-alone or controlled from a host application through the API interface. The on-board FLASH memory can be used to store the custom code.
The following points highlight some hardware-specific aspects of application implementation:
Antennas: The module includes an integrated printed antenna (ANT1) Optionally, an additional external antenna (ANT2) can be connected to support antenna
diversity
For an optimal wireless performance, it is recommended to always use two antennas, that
is, the internal antenna combined with an external antenna
A special build option may be ordered with a special ordering code that disconnects ANT1
from the internal printed antenna and allows two external antennas to be used
Supply voltage of RFPA: +VRF_PA_1 and +VRF_PA_2 need to be connected to external supply voltages In order to be able to leverage the Limited Modular Approval certification (for more
information please refer to [4]), the supply circuit should be copied from the reference application used for certification. If it is desired to deviate from the reference application, please note the following, and it may not be possible to leverage the Limited Modular Approval any more:
+VRF_PA_1 requires a minimum input voltage of 3.0 V (current draw 10 mA), so an
external DCDC boost converter will be required if two AA applications are targeted
Typically, +VRF_PA_2 is connected to an external 3.3 V supply voltage (up to 350 mA
current draw depending on the RF TX output power levels). An optimal battery efficiency is obtained if +VRF_PA_2 is sourced from a DCDC power supply adjusted within 0.5 V to 3.5 V based on the target output power levels
The DA14AVDDECT module includes an integrated battery charger and the associated power
dissipation increases the module's temperature. Please make sure that the chip temperature does not exceed its operational temperature range, especially when other functions are also enabled. Since the module includes an on-board temperature sensor to facilitate chip temperature detection, how to protect the chip from overheating needs to be implemented in software and is not described in further detail in this document
The DA14AVDDECT module includes an integrated audio CODEC. To support an external audio
CODEC, please map the GPIOs accordingly. It is implemented in software and is not described in further detail in this document
An external protection IC may be required to protect VBUS from supply circuits with possible high
overshoot

Datasheet
CFR0011-120-00

Revision 2.1
21 of 25

5.1 Audio Connections
Analog microphones can be connected as shown in Figure 7.

NDA Confidential

Figure 7: Connection of Analog Microphones
The bias resistor value shall be selected depending on the microphone requirements and MICBIAS1/2 must be decoupled with 1 µF capacitors.
Alternatively, up to four digital microphones can be supported by reusing the MIC1_P and MIC2_P pins as clock outputs and the MIC1_N and MIC2_N pins as digital data inputs. The IO voltage level of DMIC1 is set by the voltage present on MICBIAS1 and the IO voltage level of DMIC2 is set by the voltage present on MICBIAS2. The voltage present on MICBIAS1/MICBIAS2 can be either an output of the MICBIAS LDO or the IO voltage of the DMIC that is connected as an input on the appropriate MICBIAS pin for a minimum power consumption. The configuration of MICBIAS is through software and thus is not detailed further in this document.
The DA14AVDDECT module can support headphone detection. Document UM-D-012 [7] explains how to control this feature in the software. Please contact your Dialog representative for further details.

Datasheet
CFR0011-120-00

Revision 2.1
22 of 25

NDA Confidential
6 Layout Guidelines
The module pinout of DA14AVDDECT has been specifically designed to accommodate easy integration with the PCBs of customer applications without having to adding expensive PCB components to increase the cost due to, for example, blind vias or small line/space dimensions.
All standard practice layout rules and guidelines apply. Additional special care may be paid to the antenna and USB areas:
The application PCB may not extend underneath the antenna area (see Figure 8) Signals from the application PCB containing high harmonic content (for example, clock signals or
memory buses) must be kept away from the antenna
No metal objects should be placed in the vicinity of the antenna (see Figure 8) The USB data lines should be routed with 90 differential impedance lines and the line lengths
must match
Appropriate trace width and number of vias should be used for all power supply paths A common ground plane should be used to allow proper electrical and thermal performances Noise-sensitive analog signals, such as feedback lines or clock connections, should be kept
away from the traces carrying pulsed analog or digital signals. This can be achieved by separation (distance) or by shielding the sensitive signals with quiet signals or ground traces
Decoupling capacitors should be X5R ceramics and should be placed as near to the module as
possible

Figure 8: Keep-out Areas
It is also advised to use the HW layout of the DA14AVDDECT evaluation kit as a guideline for customer products. This HW was used during the certification process and should be regarded as a reference.
Please see reference document [4] for more information on the Limited Modular Approval certification and how it can be used, so that no new radio certification needs to be obtained for the end customer products.

Datasheet
CFR0011-120-00

Revision 2.1
23 of 25

Revision History

Revision 2.1 2.0 1.9

Date 02-Jun-2020 14-May-2020 18-Sep-2019

1.8

9-Sep-2019

1.7

13-Aug-2019

1.6

8-Aug-2019

1.5

6-Jun-2019

1.4

19-Mar-2019

1.3

7-Mar-2019

1.2

20-Feb-2019

1.1

26-Nov-2018

1.0

31-Oct-2018

NDA Confidential
Description Added supply current tables Preliminary datasheet Added 'P2.5' to I2C-DATA pin name Added reflow profile Changed pin name I2C-DATA Revised H2/J2 in figure 3 to correspond with table 1 Updated figure 9 to the latest EVK schematic snapshot Added text at LMA section Corrected pin L4 in the pin diagram (1.6 was erroneously reverted to GND), also corrected some pin naming typos Added wording about SW supporting only mono whereas the HW supports stereo Updated pin diagram and table (E11 = Vsupply and others) Corrected B1 and D1 pin descriptions Changed pin L4 to NC, added comment about pin T1 Updated POD Added keepout area drawing in ch9, changed pins H2, J2 to NC Updated package outline drawing; minor cosmetic edits Added package outline drawing First version of target datasheet

Datasheet
CFR0011-120-00

Revision 2.1
24 of 25

NDA Confidential

Status Definitions

Revision 1.<n>

Datasheet Status Target

2.<n>

Preliminary

3.<n>

Final

4.<n>

Obsolete

Product Status Development Qualification
Production Archived

Definition
This datasheet contains the design specifications for product development. Specifications may be changed in any manner without notice.
This datasheet contains the specifications and preliminary characterization data for products in pre-production. Specifications may be changed at any time without notice in order to improve the design.
This datasheet contains the final specifications for products in volume production. The specifications may be changed at any time in order to improve the design, manufacturing and supply. Major specification changes are communicated via Customer Product Notifications. Datasheet changes are communicated via www.dialog-semiconductor.com.
This datasheet contains the specifications for discontinued products. The information is provided for reference only.

Disclaimer
Unless otherwise agreed in writing, the Dialog Semiconductor products (and any associated software) referred to in this document are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of a Dialog Semiconductor product (or associated software) can reasonably be expected to result in personal injury, death or severe property or environmental damage. Dialog Semiconductor and its suppliers accept no liability for inclusion and/or use of Dialog Semiconductor products (and any associated software) in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk.
Information in this document is believed to be accurate and reliable. However, Dialog Semiconductor does not give any representations or warranties, express or implied, as to the accuracy or completeness of such information. Dialog Semiconductor furthermore takes no responsibility whatsoever for the content in this document if provided by any information source outside of Dialog Semiconductor.
Dialog Semiconductor reserves the right to change without notice the information published in this document, including, without limitation, the specification and the design of the related semiconductor products, software and applications. Notwithstanding the foregoing, for any automotive grade version of the device, Dialog Semiconductor reserves the right to change the information published in this document, including, without limitation, the specification and the design of the related semiconductor products, software and applications, in accordance with its standard automotive change notification process.
Applications, software, and semiconductor products described in this document are for illustrative purposes only. Dialog Semiconductor makes no representation or warranty that such applications, software and semiconductor products will be suitable for the specified use without further testing or modification. Unless otherwise agreed in writing, such testing or modification is the sole responsibility of the customer and Dialog Semiconductor excludes all liability in this respect.
Nothing in this document may be construed as a license for customer to use the Dialog Semiconductor products, software and applications referred to in this document. Such license must be separately sought by customer with Dialog Semiconductor.
All use of Dialog Semiconductor products, software and applications referred to in this document is subject to Dialog Semiconductor's Standard Terms and Conditions of Sale, available on the company website (www.dialog-semiconductor.com) unless otherwise stated.
Dialog, Dialog Semiconductor and the Dialog logo are trademarks of Dialog Semiconductor Plc or its subsidiaries. All other product or service names and marks are the property of their respective owners.
© 2020 Dialog Semiconductor. All rights reserved.
RoHS Compliance
Dialog Semiconductor's suppliers certify that its products are in compliance with the requirements of Directive 2011/65/EU of the European Parliament on the restriction of the use of certain hazardous substances in electrical and electronic equipment. RoHS certificates from our suppliers are available on request.

Contacting Dialog Semiconductor

United Kingdom (Headquarters) Dialog Semiconductor (UK) LTD Phone: +44 1793 757700
Germany Dialog Semiconductor GmbH Phone: +49 7021 805-0
The Netherlands Dialog Semiconductor B.V. Phone: +31 73 640 8822
Email: enquiry@diasemi.com

North America Dialog Semiconductor Inc. Phone: +1 408 845 8500
Japan Dialog Semiconductor K. K. Phone: +81 3 5769 5100
Taiwan Dialog Semiconductor Taiwan Phone: +886 281 786 222
Web site: www.dialog-semiconductor.com

Hong Kong Dialog Semiconductor Hong Kong Phone: +852 2607 4271
Korea Dialog Semiconductor Korea Phone: +82 2 3469 8200

China (Shenzhen) Dialog Semiconductor China Phone: +86 755 2981 3669
China (Shanghai) Dialog Semiconductor China Phone: +86 21 5424 9058

Datasheet
CFR0011-120-00

Revision 2.1
25 of 25

FCC Statement
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.
The device has been evaluated to meet general RF exposure requirement. The device can be used in portable exposure condition without restriction.
If the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: "Contains Transmitter Module FCC ID: NTMGXTM Or Contains FCC ID: NTMGXTM"
When the module is installed inside another device, the user manual of the host must contain below warning statements; 1. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference. (2) This device must accept any interference received, including interference that may cause undesired operation.
2. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.
The devices must be installed and used in strict accordance with the manufacturer's instructions as described in the user documentation that comes with the product.
Any company of the host device which install this modular with Single modular approval should perform the test of radiated emissionand spurious emission according to FCC part 15C : 15.247 and 15.209 requirement,Only if the test result comply with FCC part 15C : 15.247 and 15.209 requirement, then the host can be sold legally.

FCC RF Exposure Information and Statement
The SAR limit of USA (FCC) is 1.6 W/kg averaged over one gram of tissue. Device types: Transmitter Module (FCC ID:NTMGXTM) has also been tested against this SAR limit. The highest SAR value reported under this standard during product certification for use properly worn on the body is 0.382W/kg. This device was tested for typical body-worn operations with the back of the handset kept 0mm from the body. To maintain compliance with FCC RF exposure requirements, use accessories that maintain a 0mm separation distance between the user's body and the back of the handset. The use of belt clips, holsters and similar accessories should not contain metallic components in its assembly. The use of accessories that do not satisfy these requirements may not comply with FCC RF exposure requirements, and should be avoided.
Body-worn Operation
This device was tested for typical body-worn operations. To comply with RF exposure requirements, a minimum separation distance of 0mm must be maintained between the user's body and the handset, including the antenna. Third-party belt-clips, holsters, and similar accessories used by this device should not contain any metallic components. Body-worn accessories that do not meet these requirements may not comply with RF exposure requirements and should be avoided. Use only the supplied or an approved antenna.

References

Microsoft Word for Office 365