MBa8MP-RAS314 Embedded Single Board Computer
Product Information
Specifications
- Model: MBa8MP-RAS314
- User’s Manual: UM 0003
- Date: 02.08.2024
Product Usage Instructions
1. Climatic and Operational Conditions
1.1 Protection against External Effects
Ensure the device is protected from dust, moisture, and extreme
temperatures.
1.2 Reliability and Service Life
Follow recommended maintenance schedules to ensure optimal
performance and longevity.
2. Environment Protection
2.1 RoHS Compliance
Product complies with RoHS standards for environmental
protection.
2.2 EuP Regulations
Adhere to EuP regulations for energy efficiency and
environmental impact reduction.
2.3 Packaging
Dispose of packaging responsibly according to local
regulations.
2.4 Batteries
Handle and dispose of batteries following proper guidelines to
minimize environmental impact.
3. Appendix
3.1 Acronyms and Definitions
Refer to the appendix for explanations of technical terms and
acronyms used in the manual.
3.2 References
Consult the reference section for additional information and
resources related to the product.
Frequently Asked Questions (FAQ)
Q: How do I clean the device?
A: Use a soft, dry cloth to gently wipe the surface of the
device. Avoid using harsh chemicals or abrasive materials.
Q: What should I do if the device stops working?
A: Check the power source, connections, and user manual
troubleshooting section. If issues persist, contact customer
support.
MBa8MP-RAS314 Preliminary User’s Manual
MBa8MP-RAS314 UM 0003 02.08.2024
Preliminary User’s Manual l MBa8MP-RAS314 UM 0003 l © 2024, TQ-Systems GmbH
TABLE OF CONTENTS
Page i
1. 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2. 2.1 2.2 3. 3.1 3.1.1 3.1.2 3.1.3 3.1.4 3.1.5 3.1.6 3.2 3.2.1 3.2.2 3.3 3.3.1 3.3.2 3.3.3 3.3.4 3.3.5 3.3.6 3.3.7 3.3.8 3.3.9 3.3.10 3.3.11 3.3.12 3.3.13 3.3.14 3.3.15 3.3.16 3.3.17 3.3.18 3.4 3.4.1 3.4.2 3.4.3 3.4.4 4. 5. 5.1 5.2 5.3 5.4 6. 6.1 6.2 6.3
ABOUT THIS MANUAL…………………………………………………………………………………………………………………………………………………………..6 Copyright and license expenses …………………………………………………………………………………………………………………………..6 Registered trademarks ……………………………………………………………………………………………………………………………………………6 Disclaimer …………………………………………………………………………………………………………………………………………………………………. 6 Imprint ………………………………………………………………………………………………………………………………………………………………………. 6 Tips on safety ……………………………………………………………………………………………………………………………………………………………7 Symbols and typographic conventions ………………………………………………………………………………………………………………7 Handling and ESD tips…………………………………………………………………………………………………………………………………………….7 Naming of signals…………………………………………………………………………………………………………………………………………………….8 Further applicable documents / presumed knowledge…………………………………………………………………………………..8 BRIEF DESCRIPTION ……………………………………………………………………………………………………………………………………………………………… 9 MBa8MP-RAS314 block diagram…………………………………………………………………………………………………………………………..9 MBa8MP-RAS314 interfaces, overview …………………………………………………………………………………………………………….. 10 ELECTRONICS……………………………………………………………………………………………………………………………………………………………………… 11 MBa8MP-RAS314 functional groups…………………………………………………………………………………………………………………. 11 TQMa8MPxL overview ………………………………………………………………………………………………………………………………………………………. 11 TQMa8MPxL pinout…………………………………………………………………………………………………………………………………………………………… 11 I2C devices, address mapping…………………………………………………………………………………………………………………………………………… 12 RTC backup ………………………………………………………………………………………………………………………………………………………………………… 13 Temperature sensor ………………………………………………………………………………………………………………………………………………………….. 13 Reset……………………………………………………………………………………………………………………………………………………………………………………. 13 Power supply ………………………………………………………………………………………………………………………………………………………… 14 Protective circuitry…………………………………………………………………………………………………………………………………………………………….. 15 Shared power budgets ……………………………………………………………………………………………………………………………………………………… 15 Communication interfaces …………………………………………………………………………………………………………………………………. 16 Ethernet 1000 Base-T (RGMII) …………………………………………………………………………………………………………………………………………… 16 SD card interface ……………………………………………………………………………………………………………………………………………………………….. 17 USB 3.0 Hub………………………………………………………………………………………………………………………………………………………………………… 18 USB 3.0 Device / Serial Downloader ………………………………………………………………………………………………………………………………… 18 WiFi ……………………………………………………………………………………………………………………………………………………………………………………… 19 Debug UART ………………………………………………………………………………………………………………………………………………………………………. 19 Camera Interface ……………………………………………………………………………………………………………………………………………………………….. 19 Display Interface ………………………………………………………………………………………………………………………………………………………………… 20 LVDS ……………………………………………………………………………………………………………………………………………………………………………………. 20 HDMI …………………………………………………………………………………………………………………………………………………………………………………… 22 Audio…………………………………………………………………………………………………………………………………………………………………………………… 23 ECSPI……………………………………………………………………………………………………………………………………………………………………………………. 23 SPDIF …………………………………………………………………………………………………………………………………………………………………………………… 23 GPT………………………………………………………………………………………………………………………………………………………………………………………. 23 PWM ……………………………………………………………………………………………………………………………………………………………………………………. 23 UART……………………………………………………………………………………………………………………………………………………………………………………. 23 USDHC ………………………………………………………………………………………………………………………………………………………………………………… 24 GPIO header……………………………………………………………………………………………………………………………………………………………………….. 24 User interfaces and diagnostic…………………………………………………………………………………………………………………………… 25 Boot Mode configuration …………………………………………………………………………………………………………………………………………………. 25 Reset buttons……………………………………………………………………………………………………………………………………………………………………… 25 Status LEDs …………………………………………………………………………………………………………………………………………………………………………. 25 JTAG® ………………………………………………………………………………………………………………………………………………………………………………….. 26 SOFTWARE………………………………………………………………………………………………………………………………………………………………………….. 27 MECHANICS………………………………………………………………………………………………………………………………………………………………………… 27 MBa8MP-RAS314 dimensions ……………………………………………………………………………………………………………………………. 27 Embedding in the overall system ……………………………………………………………………………………………………………………… 27 Thermal management…………………………………………………………………………………………………………………………………………. 27 Component placement & labeling……………………………………………………………………………………………………………………. 28 SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS …………………………………………………………………………………………… 30 EMC…………………………………………………………………………………………………………………………………………………………………………. 30 ESD ………………………………………………………………………………………………………………………………………………………………………….. 30 Operational safety and personal security………………………………………………………………………………………………………… 30
Preliminary User’s Manual l MBa8MP-RAS314 UM 0003 l © 2024, TQ-Systems GmbH
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7.
CLIMATIC AND OPERATIONAL CONDITIONS ………………………………………………………………………………………………………………….. 31
7.1
Protection against external effects …………………………………………………………………………………………………………………… 31
7.2
Reliability and service life……………………………………………………………………………………………………………………………………. 31
8.
ENVIRONMENT PROTECTION……………………………………………………………………………………………………………………………………………. 32
8.1
RoHS ……………………………………………………………………………………………………………………………………………………………………….. 32
8.2
WEEE® …………………………………………………………………………………………………………………………………………………………………….. 32
8.3
REACH®…………………………………………………………………………………………………………………………………………………………………… 32
8.4
EuP ………………………………………………………………………………………………………………………………………………………………………….. 32
8.5
Packaging………………………………………………………………………………………………………………………………………………………………. 32
8.6
Batteries …………………………………………………………………………………………………………………………………………………………………. 32
8.7
Other entries …………………………………………………………………………………………………………………………………………………………. 32
9.
APPENDIX …………………………………………………………………………………………………………………………………………………………………………… 33
9.1
Acronyms and definitions…………………………………………………………………………………………………………………………………… 33
9.2
References……………………………………………………………………………………………………………………………………………………………… 35
Preliminary User’s Manual l MBa8MP-RAS314 UM 0003 l © 2024, TQ-Systems GmbH
TABLE DIRECTORY
Page iii
Table 1: Table 2: Table 3: Table 4: Table 5: Table 6: Table 7: Table 8: Table 9: Table 10: Table 11: Table 12: Table 13: Table 14: Table 15: Table 16: Table 17: Table 18: Table 19: Table 20: Table 21: Table 22: Table 23:
Terms and conventions………………………………………………………………………………………………………………………………………………………..7 Data interfaces …………………………………………………………………………………………………………………………………………………………………… 10 Diagnostic and user interfaces…………………………………………………………………………………………………………………………………………. 10 I2C devices, address mapping on TQMa8MPxL and MBa8MP-RAS314………………………………………………………………………… 12 Temperature sensor SE97BTP, D1 ……………………………………………………………………………………………………………………………………. 13 Reset signals……………………………………………………………………………………………………………………………………………………………………….. 14 Pinout RJ45 Ethernet connector X15, X16 ………………………………………………………………………………………………………………………. 16 Pinout microSD card, X2 …………………………………………………………………………………………………………………………………………………… 17 Pinout Camera Interface, X5 …………………………………………………………………………………………………………………………………………….. 20 Pinout Display Interface, X6 ……………………………………………………………………………………………………………………………………………… 20 Pinout LVDS data, X7…………………………………………………………………………………………………………………………………………………………. 21 Pinout LVDS control, X8 ……………………………………………………………………………………………………………………………………………………. 21 Pinout HDMI connector, X9………………………………………………………………………………………………………………………………………………. 22 Pinout audio connector X3 ………………………………………………………………………………………………………………………………………………. 23 SPDIF signal usage …………………………………………………………………………………………………………………………………………………………….. 23 Pinout GPIO header, X1 …………………………………………………………………………………………………………………………………………………….. 24 Boot Source options TQMa8MPxL …………………………………………………………………………………………………………………………………… 25 Status LEDs …………………………………………………………………………………………………………………………………………………………………………. 25 Pinout JTAG® pin header, X17………………………………………………………………………………………………………………………………………….. 26 Labels on MBa8MP-RAS314 ……………………………………………………………………………………………………………………………………………… 29 Climatic and operational conditions MBa8MP-RAS314 ………………………………………………………………………………………………… 31 Acronyms……………………………………………………………………………………………………………………………………………………………………………. 33 Further applicable documents…………………………………………………………………………………………………………………………………………. 35
Preliminary User’s Manual l MBa8MP-RAS314 UM 0003 l © 2024, TQ-Systems GmbH
FIGURE DIRECTORY
Page iv
Figure 1: Figure 2: Figure 3: Figure 4: Figure 5: Figure 6: Figure 7: Figure 8: Figure 9: Figure 10: Figure 11: Figure 12: Figure 13: Figure 14: Figure 15: Figure 16: Figure 17: Figure 18: Figure 19:
Block diagram MBa8MP-RAS314 ………………………………………………………………………………………………………………………………………… 9 Block diagram TQMa8MPxL ……………………………………………………………………………………………………………………………………………… 11 Block diagram I2C bus ……………………………………………………………………………………………………………………………………………………….. 12 Block diagram MBa8MP-RAS314 Reset structure…………………………………………………………………………………………………………… 13 Block diagram power supply MBa8MP-RAS314 …………………………………………………………………………………………………………….. 14 MBa8MP-RAS314 protective circuit…………………………………………………………………………………………………………………………………. 15 Block diagram Ethernet 1000 Base-T ………………………………………………………………………………………………………………………………. 16 Block diagram SD card interface, MBa8MP-RAS314 ………………………………………………………………………………………………………. 17 Block diagram USB 3.0 Hub………………………………………………………………………………………………………………………………………………. 18 Block diagram WiFi ……………………………………………………………………………………………………………………………………………………………. 19 Block diagram UARTs ………………………………………………………………………………………………………………………………………………………… 19 Block diagram MIPI CSI ……………………………………………………………………………………………………………………………………………………… 19 Block diagram LVDS ………………………………………………………………………………………………………………………………………………………….. 21 Block diagram HDMI………………………………………………………………………………………………………………………………………………………….. 22 Block diagram audio interface …………………………………………………………………………………………………………………………………………. 23 Block diagram JTAG…………………………………………………………………………………………………………………………………………………………… 26 Dimensions MBa8MP-RAS314 ………………………………………………………………………………………………………………………………………….. 27 MBa8MP-RAS314 component placement top ……………………………………………………………………………………………………………….. 28 MBa8MP-RAS314 component placement bottom ………………………………………………………………………………………………………… 29
Preliminary User’s Manual l MBa8MP-RAS314 UM 0003 l © 2024, TQ-Systems GmbH
REVISION HISTORY
Rev. 0001 0002
0003
Date 11.10.2023 04.03.2024
02.08.2024
Name Kreuzer Kreuzer
Kreuzer
Pos.
Figure 17 3.2 6.4, 6.5, 6.6, 6.7, 8.5
Modification First edition added Range corrected added
Page v
Preliminary User’s Manual l MBa8MP-RAS314 UM 0003 l © 2024, TQ-Systems GmbH
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1.
ABOUT THIS MANUAL
1.1
Copyright and license expenses
Copyright protected © 2024 by TQ-Systems GmbH.
This Preliminary User’s Manual may not be copied, reproduced, translated, changed or distributed, completely or partially in electronic, machine readable, or in any other form without the written consent of TQ-Systems GmbH.
The drivers and utilities for the components used as well as the BIOS are subject to the copyrights of the respective manufacturers. The licence conditions of the respective manufacturer are to be adhered to.
Bootloader-licence expenses are paid by TQ-Systems GmbH and are included in the price.
Licence expenses for the operating system and applications are not taken into consideration and must be calculated / declared separately.
1.2
Registered trademarks
TQ-Systems GmbH aims to adhere to copyrights of all graphics and texts used in all publications, and strives to use original or license-free graphics and texts.
All brand names and trademarks mentioned in this Preliminary User’s Manual, including those protected by a third party, unless specified otherwise in writing, are subjected to the specifications of the current copyright laws and the proprietary laws of the present registered proprietor without any limitation. One should conclude that brand and trademarks are rightly protected by a third party.
1.3
Disclaimer
TQ-Systems GmbH does not guarantee that the information in this Preliminary User’s Manual is up-to-date, correct, complete or of good quality. Nor does TQ-Systems GmbH assume guarantee for further usage of the information. Liability claims against TQSystems GmbH, referring to material or non-material related damages caused, due to usage or non-usage of the information given in this Preliminary User’s Manual, or due to usage of erroneous or incomplete information, are exempted, as long as there is no proven intentional or negligent fault of TQ-Systems GmbH.
TQ-Systems GmbH explicitly reserves the rights to change or add to the contents of this Preliminary User’s Manual or parts of it without special notification.
Important Notice:
Before using the MBa8MP-RAS314 or parts of the MBa8MP-RAS314 schematics, you must evaluate it and determine if it is suitable for your intended application. You assume all risks and liability associated with such use. TQ-Systems GmbH makes no other warranties including, but not limited to, any implied warranty of merchantability or fitness for a particular purpose. Except where prohibited by law, TQ-Systems GmbH will not be liable for any indirect, special, incidental or consequential loss or damage arising from the usage of the MBa8MP-RAS314 or schematics used, regardless of the legal theory asserted.
1.4
Imprint
TQ-Systems GmbH Gut Delling, Mühlstraße 2 D-82229 Seefeld
Tel: Fax: E-Mail: Web:
+49 8153 93080 +49 8153 93084223 Info@TQ-Group.com TQ-Group
Preliminary User’s Manual l MBa8MP-RAS314 UM 0003 l © 2024, TQ-Systems GmbH
1.5
Tips on safety
Improper or incorrect handling of the product can substantially reduce its life span.
Page 7
1.6
Symbols and typographic conventions
Table 1: Terms and conventions
Symbol
Meaning
This symbol represents the handling of electrostatic-sensitive modules and / or components. These components are often damaged / destroyed by the transmission of a voltage higher than about 50 V. A human body usually only experiences electrostatic discharges above approximately 3,000 V.
This symbol indicates the possible use of voltages higher than 24 V. Please note the relevant statutory regulations in this regard. Non-compliance with these regulations can lead to serious damage to your health and cause damage / destruction of the component.
This symbol indicates a possible source of danger. Acting against the procedure described can lead to possible damage to your health and / or cause damage / destruction of the material used.
This symbol represents important details or aspects for working with TQ-products.
Command
A font with fixed-width is used to denote commands, file names, or menu items.
1.7
Handling and ESD tips
General handling of your TQ-products
The TQ-product may only be used and serviced by certified personnel who have taken note of the information, the safety regulations in this document and all related rules and regulations.
A general rule is not to touch the TQ-product during operation. This is especially important when switching on, changing jumper settings or connecting other devices without ensuring beforehand that the power supply of the system has been switched off.
Violation of this guideline may result in damage / destruction of the MBa8MP-RAS314 and be dangerous to your health.
Improper handling of your TQ-product would render the guarantee invalid.
Proper ESD handling
The electronic components of your TQ-product are sensitive to electrostatic discharge (ESD).
Always wear antistatic clothing, use ESD-safe tools, packing materials etc., and operate your TQproduct in an ESD-safe environment. Especially when you switch modules on, change jumper settings, or connect other devices.
Preliminary User’s Manual l MBa8MP-RAS314 UM 0003 l © 2024, TQ-Systems GmbH
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1.8
Naming of signals
A hash mark (#) at the end of the signal name indicates a low-active signal. Example: RESET#
If a signal can switch between two functions and if this is noted in the name of the signal, the low-active function is marked with a hash mark and shown at the end.
Example: C / D#
If a signal has multiple functions, the individual functions are separated by slashes when they are important for the wiring. The identification of the individual functions follows the above conventions. Example: WE2# / OE#
1.9
Further applicable documents / presumed knowledge
· Specifications and manual of the modules used: These documents describe the service, functionality and special characteristics of the module used (incl. BIOS).
· Specifications of the components used: The manufacturer’s specifications of the components used, for example CompactFlash cards, are to be taken note of. They contain, if applicable, additional information that must be taken note of for safe and reliable operation. These documents are stored at TQ-Systems GmbH.
· Chip errata: It is the user’s responsibility to make sure all errata published by the manufacturer of each component are taken note of. The manufacturer’s advice should be followed.
· Software behaviour: No warranty can be given, nor responsibility taken for any unexpected software behaviour due to deficient components.
· General expertise: Expertise in electrical engineering / computer engineering is required for the installation and the use of the device.
The following documents are required for full comprehension of this Preliminary User’s Manual:
· MBa8MP-RAS314 schematics
· TQMa8MPxL Preliminary User’s Manual
· i.MX 8M Plus Data Sheet
· i.MX 8M Plus Reference Manual
· U-Boot documentation:
www.denx.de/wiki/U-Boot/Documentation
· Yocto documentation:
www.yoctoproject.org/docs/
· TQ-Support Wiki:
https://support.tq-group.com/en/arm/tqma8mp-ras314
Preliminary User’s Manual l MBa8MP-RAS314 UM 0003 l © 2024, TQ-Systems GmbH
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2.
BRIEF DESCRIPTION
This Preliminary User’s Manual describes the hardware of the MBa8MP-RAS314 as of revision 01xx. The MBa8MP-RAS314 is designed as a carrier board for the TQMa8MPxL. The TQMa8MPxL is directly soldered on the MBa8MPRAS314. Core of the MBa8MP-RAS314 is the TQMa8MPxL with an NXP i.MX 8M Plus CPU based on a Dual or Quad Cortex®-A53. The TQMa8MPxL connects all peripheral components. In addition to the standard communication interfaces such as USB, Ethernet, SD card, etc., most other available TQMa8MPxL signals are routed on 100 mil pin headers on the MBa8MP-RAS314. CPU features and interface can be evaluated, software development for a TQMa8MPxL-based project can start immediately. Currently four i.MX 8M Plus derivatives are supported:
1) i.MX 8M Plus Dual (Dual Cortex®-A53) 2) i.MX 8M Plus Quad 4 Lite (Quad Cortex®-A53) 3) i.MX 8M Plus Quad 6 Video (Quad Cortex®-A53) 4) i.MX 8M Plus Quad 8 ML/AI (Quad Cortex®-A53)
2.1
MBa8MP-RAS314 block diagram
µSD-Card
SDHC
Micro-USB
Bus bridge
TQMa8MPxL (LGA module) uSDHC #2 USB3.0 #1
RAM NOR Flash
E-MMC
UART #3/4
USB3.0 #2
USB
USB
USB DEV
4x USB3.0
USB Hub optional
Touch (LVDS)
GPIO header
1 x 3,5 mm jack
Camera interface
I2C
Audio Codec
MIPI-CSI
I2C #3/5 ECSPI #3 uSDHC #1 UART #1
GPIO
PCIe UART #2
PCIe Data
HDMI
HDMI
HDMI signal conditioning
LVDS
LVDS
I2C #4
MIPI DSI
DSI
SAI #5 MIPI CSI1
ENET TSN RGMII ENET QOS RGMII
Gigabit ETH PHY
Gigabit ETH PHY
WiFi
HDMI
LVDS
Display interface Ethernet 10/100/1k Ethernet 10/100/1k
Power IN 12 V DC/DC
Module
5 V
Power Rails
Boot
Figure 1: Block diagram MBa8MP-RAS314
Boot Config
Preliminary User’s Manual l MBa8MP-RAS314 UM 0003 l © 2024, TQ-Systems GmbH
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2.2
MBa8MP-RAS314 interfaces, overview
The following interfaces/functions and user interfaces are available on the MBa8MP-RAS314:
Table 2: Data interfaces
Interface Audio Camera interface Display Interface
Eth. 1000 Base-T
GPIO HDMI JTAG LVDS CMD LVDS Data SD card USB 3.0 USB Debug USB 3.0 DEV WiFi
Connector
Type
X3
1 × 3.5 mm jack
X5
1-1734248-5, TE Connectivity
X6
1-1734248-5, TE Connectivity
X15, X16 RJ45
X1 X9 X17 X8 X7 X2 X12, X13 X4 X14 X10, X11
SL-22-124-40-G, 2,54 mm HDMI 10-pin, 50 mil pin header 14-pin, DF19G 20-pin, DF19G Micro-SD Stacked Type A Micro USB AB Micro USB Type B U.FL-R-SMT-1(10)
Remark MIC (mono), headphone (stereo) Gigabit PHY DP83867 and socket with integrated transformers Connected to IO bank (GPIO) JTAG ZIF connector ZIF connector USDHC2, optional boot source UART3, UART4 USB 3.0 Device or Serial Downloader
The MBa8MP-RAS314 provides the following diagnostic and user interfaces:
Table 3: Diagnostic and user interfaces
Interface
Reference
Status LEDs
S1
Power / Reset
S2
S3
Boot-Mode
S4
Component 1 × Red LED 5 × Green LED 1 × Green LED 1 × Orange LED 1 x Green LED 1 x Green LED 4 x Green LED 4 x Green LED
3 × Pushbutton
1 × 4-fold DIP switch
Remark Reset Voltages on MBa8MP-RAS314 General purpose LED General purpose LED SD-Card Debug-USB USB V_VBUS30_H1…H4 Ethernet link / activity Reset PMIC reset CPU-ON/OFF Boot Device selection
Preliminary User’s Manual l MBa8MP-RAS314 UM 0003 l © 2024, TQ-Systems GmbH
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3.
ELECTRONICS
3.1
MBa8MP-RAS314 functional groups
The following chapters describe the interfaces of the MBa8MP-RAS314 in connection with a TQMa8MPxL.
3.1.1
TQMa8MPxL overview
The MBa8MP-RAS314 provides all power supplies and configurations required for the operation of the TQMa8MPxL. The TQMa8MPxL is the central system on the MBa8MP-RAS314. It provides LPDDR4 SDRAM, eMMC, NOR flash, RTC, an EEPROM, power supply and power management functionality. All TQMa8MPxL internal voltages are derived from the 5 V supply voltage. All functionally relevant pins of the i.MX 8M Plus are routed to the TQMa8MPxL connectors or LGA pads. This enables to use the TQMa8MPxL with all the freedom that comes with a customer-specific design-in solution. Further information can be found in the TQMa8MPxL User’s Manual. On the MBa8MP-RAS314 the standard interfaces like USB, Ethernet, etc., provided by the TQMa8MPxL are routed to industry standard connectors. Most other relevant signals and buses provided by the TQMa8MPxL are routed to 100 mil pin headers on the MBa8MP-RAS314. The boot behaviour of the TQMa8MPxL can be controlled. The boot mode configuration is set with a DIP switch on the MBa8MPRAS314.
PMIC NXP PCA9450C
Supervisor MAX803SQ438T1G
i.MX 8M Plus
LPDDR4-RAM
e-MMC 5.1 (optional)
1x QSPI-NORFlash (optional)
RTC (optional) TPM (optional) EEPROM (option.)
Temperaturesensor / EEPROM
PCIe RGMII USB3.0 UART
I2C GPIO SPI HDMI CSI DSI
5 V
5 V
Figure 2: Block diagram TQMa8MPxL
366 LGA-Pads
3.1.2
TQMa8MPxL pinout
The most relevant TQMa8MPxL signals that are not already used are routed out to a header on the MBa8MP-RAS314.
Note: Available interfaces
Depending on the TQMa8MPxL derivative, not all interfaces are available. More information about available interfaces can be found in the TQMa8MPxL User’s Manual and pinout tables.
Preliminary User’s Manual l MBa8MP-RAS314 UM 0003 l © 2024, TQ-Systems GmbH
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3.1.3
I2C devices, address mapping
The TQMa8MPxL provides five I2C buses. Of these, only I2C3 and I2C5 are provided on a pin header. All other buses are used by different components on the module or the mainboard.
The following block diagram shows the I2C bus structure.
TQMa8MPxL I2C1
PCA9450
3V3
PCF85063
24LC64T
SE97BTP
SE050
I2C2
I2C4
1V8
I2C3
3V3
I2C5
3V3
optional
USB-Hub
AudioCodec
Camera interface Display interface
GPIO header
Figure 3: Block diagram I2C bus
The following table shows the addresses used on the TQMa8MPxL and the MBa8MP-RAS314.
Table 4: I2C devices, address mapping on TQMa8MPxL and MBa8MP-RAS314
Location TQMa8MPxL
Device PCA9450 PCF85063 24LC64T
SE97BTP
Function
Bus
System Controller RTC EEPROM Temperature sensor I2C1
EEPROM
SE050
Trust Secure Element
TLV320AIC3204 Audio Codec
I2C4
TUSB8041
USB 3.0 hub
X5 MBa8MP-RAS314
X6
Camera interface
I2C2
Display interface
I2C3
X1
GPIO header
I2C5
7-bit address 0x25 / 010 0101b 0x51 / 101 0001b 0x57 / 101 0111b 0x1B / 001 1011b
0x33 / 011 0011b
0x53 / 101 0011b 0x48 / 100 1000b 0x18 / 001 1000b 0x44 / 100 0100b (Device dependent) (Device dependent) (Device dependent) (Device dependent)
Remark
Should not be altered Optional Optional R/W access in Protected Mode R/W access in Normal Mode Optional N1 D10
Preliminary User’s Manual l MBa8MP-RAS314 UM 0003 l © 2024, TQ-Systems GmbH
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3.1.4
RTC backup
In case of power failure or power down, a Goldcap capacitor on the MBa8MP-RAS314 supplies the RTC on the TQMa8MPxL. The TQMa8MPxL features an i.MX 8M Plus-internal RTC or a discrete RTC PCF85063A. The RTC is supplied in either way.
3.1.5
Temperature sensor
The SE97BTP sensor is used to monitor the temperature of the TQMa8MPxL. The sensor is connected to I2C1; see Table 4.
Table 5: Temperature sensor SE97BTP, D1
Manufacturer
Device
Resolution
NXP
SE97BTP
11 bits
Accuracy Max. ±1 °C Max. ±2 °C Max. ±3 °C
Temperature range +75 °C to +95 °C +40 °C to +125 °C 40 °C to +125 °C
3.1.6
Reset
The RESET_OUT# signal of the TQMa8MPxL is available on the MBa8MP-RAS314. A red LED (V1) on the MBa8MP-RAS314 indicates a reset condition; see Table 26.
On the MBa8MP-RAS314 a partial reset of the TQMa8MPxL is possible, e.g. with signal RESET_IN#.
TQMa8MPxL
IMX_ONOFF
Button
PMIC_RST#
Button
RESET_IN#
Button
JTAG Header
RESET_OUT#
LED
Figure 4: Block diagram MBa8MP-RAS314 Reset structure
Attention: RESET_OUT# / PMIC_RST#
Attention: The signal RESET_OUT# is designed as a reset triggering signal. To feed a reset signal into the system, it is mandatory to use the signal PMIC_RST#.
Preliminary User’s Manual l MBa8MP-RAS314 UM 0003 l © 2024, TQ-Systems GmbH
Page 14
Table 6: Signal
RESET_OUT#
Reset signals
Dir.
Source
O TQMa8MPxL
IMX_ONOFF
I MBa8MP-RAS314
PMIC_RST# RESET_IN#
I MBa8MP-RAS314 I MBa8MP-RAS314
PMIC_WDOG_IN#
I MBa8MP-RAS314
PMIC_WDOG_OUT# O TQMa8MPxL
Default
Remark
High · Requires pull-up on carrier board (max. 6.5 V)
High
· ON/OFF function; see i.MX 8M Plus data sheet (1) · No pull-up on carrier board required; low-active · Connect 5 s to GND to activate
High · No pull-up on carrier board required; low-active · Programmable PMIC response (warm reset, cold reset)
High · Activates POR_B of the i.MX 8M Plus; low-active · Connect to GND to activate
High
· No pull-up on carrier board required; low-active · Disabled by default on PMIC side · Programmable PMIC response (warm reset, cold reset)
· Multiplexed to GPIO1_IO02 pin of i.MX 8M Plus
· Connected to PMIC_WDOG_IN# via 0 bridge
3.2
Power supply
At X18, the MBa8MP-RAS314 has to be supplied with 12 V +/-10 % (10.8 V to 13.2 V). All other voltages required on the MBa8MPRAS314 are derived from this supply voltage. The MBa8MP-RAS314 has a theoretical maximum power consumption of approx. 42 W at its 12 V supply connection. This corresponds to a maximum typical current of 3.5 A at 12 V. The power supply unit used must be selected accordingly. In most applications, however, the power consumption will be significantly lower and the MBa8MP-RAS314 including TQMa8MPxL consumes approx. 5 W to 6 W when the i.MX 8M Plus operates at 100 % load. Most of the theoretically possible power consumption results from the standard-compliant supply of the USB and LVDS interfaces, as well as from the power available at the pin headers. It must be ensured that the permissible limit values of the input circuitry are not exceeded.
V_in (max. 3.5 A)
V_12V
V_3V3_SD (max. 0.4 A)
TPS54335
V_5V_MOD (max. 3 A)
TQMa8MPxL (PCA9450)
V_1V8_MOD (max. 0.5 A)
V_3V3_MOD (max. 0.5 A)
PFET
PFET
Key: Buck
TPS54335
V_3V3_MB (max. 3 A)
LDO/Switch
Power Rail
Figure 5: Block diagram power supply MBa8MP-RAS314
V_5V_SW
AP7361C AP7361C AP7361C
V_1V8
V_2V5_ETH V_1V0_ETH V_1V1_USB
Preliminary User’s Manual l MBa8MP-RAS314 UM 0003 l © 2024, TQ-Systems GmbH
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3.2.1
Protective circuitry
The protective circuit (see Figure 8) features the following characteristics:
· Overcurrent protection by fuse 7 A, Slow Blow · Overvoltage protection · PI filter · Reverse polarity protection · Capacitors for voltage smoothing
V_12V (max. 3.5 A)
4 A fuse, Slow Blow
TVS Diode
Figure 6: MBa8MP-RAS314 protective circuit
Filter
Reverse Polarity Protection
3.2.2
Shared power budgets
Ensure maximum listed power budget for IO interfaces is not exceeded. Observe maximum current rating on the individual connectors.
Voltage Rail V_3V3_MB V_5V_SW
Power Budget (mA) 1500 1000
Available on connector X5 (Camera), X6 (Display), X7 & X8 (LVDS), X1 (GPIO Header) X7 & X8 (LVDS), X9 (HDMI), X1 (GPIO Header)
Attention: Maximum current of 3.3 V and 5 V rails
The currents load of the 3.3 V and 5 V rails add up to the current consumption of the MBa8MP-RAS314. The additional power required must be provided by the power supply of the MBa8MP-RAS314. The maximum load of the fuse must be observed.
Preliminary User’s Manual l MBa8MP-RAS314 UM 0003 l © 2024, TQ-Systems GmbH
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3.3
Communication interfaces
3.3.1
Ethernet 1000 Base-T (RGMII)
The i.MX 8M Plus CPU has two independent RGMII interfaces. On the MBa8MP-RAS314 both interfaces are used to provide two Gigabit Ethernet ports by means of two DP83867 Ethernet PHYs.
The PHY has boot straps to start with adjustable default values. Some boot straps can be customized with placement options. More information is available in the latest MBa8MP-RAS314 schematic.
ENET0
RGMII0
TQMa8MPxL
ENET1
RGMII1
Figure 7: Block diagram Ethernet 1000 Base-T
PHY #0 DP83867
PHY #1 DP83867
RJ45 RJ45
Table 7: Pinout RJ45 Ethernet connector X15, X16
X15
Pin
Pin name
1 GND
2 TD0+
3 TD0
6 TD1+
4 TD1
5 TD2+
7 TD2
8 TD3+
9 TD4
10 CHS.GND
11 GREEN_ANODE
12 GREEN_CATHODE
13 GREEN_ANODE
14 GREEN_CATHODE
Signal GND ENET0_A+ ENET0_A ENET0_B+ ENET0_B ENET0_C+ ENET0_C ENET0_D+ ENET0_D GND V_3V3_MB ENET0_LED_0 V_3V3_MB ENET0_LED_2
X16
Pin
Pin name
1 GND
2 TD0+
3 TD0
6 TD1+
4 TD1
5 TD2+
7 TD2
8 TD3+
9 TD4
10 CHS.GND
11 GREEN_ANODE
12 GREEN_CATHODE
13 GREEN_ANODE
14 GREEN_CATHODE
Signal GND ENET1_A+ ENET1_A ENET1_B+ ENET1_B ENET1_C+ ENET1_C ENET1_D+ ENET1_D GND V_3V3_MB ENET1_LED_0 V_3V3_MB ENET1_LED_2
Remark
120 in series Switched by transistor 120 in series Switched by transistor
Preliminary User’s Manual l MBa8MP-RAS314 UM 0003 l © 2024, TQ-Systems GmbH
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3.3.2
SD card interface
The MBa8MP-RAS314 offers a microSD card slot that can also be used as boot source. All signals are directly connected to the USDHC2 interface of the i.MX 8M Plus.
The TQMa8MPxL voltage V_3V3_SD supplies the microSD card slot. This voltage is controlled by SD_RESET#, therefore the microSD card is automatically reset in case of a Reset. An external switch is not required. Signal USDHC2_CD# has a pull-up on the MBa8MP-RAS314. All data lines are ESD protected.
Standard, High and Extended capacity card types are supported. Default Speed, High Speed, and SD UHS-1 Speed Mode SDR104 with theoretically max.104 MB/s are supported. UHS-1 Speed Modes SDR12, SDR25, SDR50 and DDR50 are theoretically supported but not verified.
The TQMa8MPxL sets USDHC2 is to 1.8 V or 3.3 V automatically, depending on the transfer mode. The corresponding driver handles the changeover; it does not have to be done explicitly.
USDHC2_WP is not used and is terminated accordingly.
TQMa8MPxL
USDHC2 V_3V3_SD
3.3 V / 400 mA
SD Card Slot
Figure 8: Block diagram SD card interface, MBa8MP-RAS314
Table 8:
Pin 1 2 3 4 5 6 7 8 SW1 SW2 M1…4
Pinout microSD card, X2
Pin name DAT2 DAT3 CMD VDD CLK GND DAT0 DAT1 CD# CD# Shield
Signal USDHC2_DATA2 USDHC2_DATA3 USDHC2_CMD V_3V3_SD USDHC2_CLK GND USDHC2_DATA0 USDHC2_DATA1 GND USDHC2_CD# GND
Remark 10 k PU 10 k PU 10 k PU Supply from TQMa8MPxL 10 k PU 10 k PU 10 k PU
Preliminary User’s Manual l MBa8MP-RAS314 UM 0003 l © 2024, TQ-Systems GmbH
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3.3.3
USB 3.0 Hub
A USB 3.0 hub TUSB8041 is connected to the USB2 interface on the MBa8MP-RAS314, which provides four USB 3.0 / 2.0 host interfaces.
USB Host 1 & 2 of the TUSB8041 are connected to a Dual USB 3.0 Type A socket (X12) on the MBa8MP-RAS314. USB Host 3 & 4 are routed to the connector X13.
USB Host 4 can be routed to the LVDS-CMD connector X8 on the MBa8MP-RAS314 by changing the resistor placement R152/153 (STD) and R156/157 (OPT).
The USB hub is programmed via bootstrapping or as a placement option via I2C. Further information can be found in the TUSB8041 data sheet and the MBa8MP-RAS314 schematics.
TQMa8MPxL
USB
USB 3.0
V_5V_SW
USB_VBUS
TUSB8041
USB
Host 1
Host 2
Host 3 Host 4
USB 3.0 USB 3.0
USB 3.0
USB3.0
STD
USB Stacked Type A
USB Stacked Type A
I2C2
OPT
I2C
GPIO1_IO11
RESET#
OPT
LVDS CMD
Figure 9: Block diagram USB 3.0 Hub
The USB connectors are supplied with 5 V via power switches. The current is monitored and can be switched off in case of an overload and/or overheating.
The USB 3.0 port of the TQMa8MPxL provides a theoretical data rate of 5 Gbit/s. This is divided among the connected ports on the MBa8MP-RAS314. Depending on the software and hardware used, the effective read and write rates of the ports may vary.
3.3.4
USB 3.0 Device / Serial Downloader
The USB1 interface of the TQMa8MPxL is configured as USB 3.0 Device and routed to USB Micro-B connector X14 on the MBa8MPRAS314. This interface can be used for the Serial Download Mode of the TQMa8MPxL. It can be used as a normal USB 3.0 or USB 2.0 device interface.
The USB1 interface of the TQMa8MPxL provides a theoretical data rate of 5 Gbit/s. Depending on the software and hardware used, the effective read and write rates of the ports may vary.
Preliminary User’s Manual l MBa8MP-RAS314 UM 0003 l © 2024, TQ-Systems GmbH
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3.3.5
WiFi
A WiFi module (LBEE5XV1YM from Murata) is available on the MBa8MP-RAS314. It supports IEEE 802.11 a/b/g/n/ac and offers a dual-band RF interface (2.4 / 5 GHz).
The LBEE5XV1YM is connected to the MBa8MP-RAS314 via PCIe (for WiFi) and UART (for a wireless function). The theoretically achievable maximum data rate of the LBEE5XV1YM is 866 Mbit/s.
The antennas have to be connected separately to the U.FL-R-SMT-1(10) sockets (X10, X11) and are not part of the MBa8MPRAS314.
TQMa8MPxL
PCIE
WiFi module
PCIE
RF_A
UART2
UART
GPIO
6
Control
RF_B
U.FL U.FL
Figure 10:
Block diagram WiFi
3.3.6
Debug UART
For debug functionalities UART3 and UART4 are provided as virtual COM ports via USB.
TQMa8MPxL UART4 UART3
Level translator
Bridge UART UART
USB
USB-Debug (Micro-USB)
Figure 11: Block diagram UARTs
The CP2105-bridge is bus-powered so that the COM port on the PC side is maintained even if the mainboard power supply is interrupted.
3.3.7
Camera Interface
A camera interface provided by the TQMa8MPxL is routed to connector X5 (Type 1-1734248-5) on the MBa8MP-RAS314. The GPIO signals of the interface are connected to the GPIO2 signals (GPIO2_6/_7) of the TQMa8MPxL. The I2C bus operate at 1.8 V and is connected to I2C2 on the MBa8MP-RAS314. Common mode chokes have to be located at the source on camera module. “Camera Module v2” and “HQ Camera” from raspberrypi.org have common mode chokes onboard.
TQMa8MPxL
MIPI_CSI1 I2C2
CAM_GPIO1
CAM_GPIO2
OPT
Camera
Figure 12: Block diagram MIPI CSI
Preliminary User’s Manual l MBa8MP-RAS314 UM 0003 l © 2024, TQ-Systems GmbH
Table 9:
Pinout Camera Interface, X5
Pin
Signal
1 GND 2 MIPI_CSI1_DATA0_N 3 MIPI_CSI1_DATA0_P 4 GND 5 MIPI_CSI1_DATA1_N 6 MIPI_CSI1_DATA1_P 7 GND 8 MIPI_CSI1_CLK_N 9 MIPI_CSI1_CLK_P 10 GND 11 CAM_GPIO1 12 CAM_GPIO2 13 I2C2_SCL 14 I2C2_SDA 15 V_3V3_MB
Remark
Enable LED (optional) max. 1.0 A
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3.3.8
Display Interface
A display interface provided by the TQMa8MPxL is routed to connector X6 (Type 1-1734248-5) on the MBa8MP-RAS314.
Table 10: Pinout Display Interface, X6
Pin
Signal
1 GND 2 MIPI_DSI1_DATA1_N_L 3 MIPI_DSI1_DATA1_P_L 4 GND 5 MIPI_DSI1_CLK_N_L 6 MIPI_DSI1_CLK_P_L 7 GND 8 MIPI_DSI1_DATA0_N_L 9 MIPI_DSI1_DATA0_P_L
10 GND
11 I2C2_SCL
12 I2C2_SDA
13 GND
14 15
V_3V3_MB
Remark
max. 1.0 A
3.3.9
LVDS
The i.MX 8M Plus offers an LVDS controller with a dual LVDS interface. Each of the interfaces uses four differential lanes. On the MBa8MP-RAS314 there is one interface for connecting Single LVDS. In addition, two GPIO (BLT_EN, RESET#), a PWR_EN and a PWM signal are provided. GPIO1_IO03, GPIO1_IO01, GPIO1_IO07 and GPIO1_IO09 are used for these four 3.3 V signals. Both LVDS interfaces – Data and CMD use DF19 connectors.
The USB signals of the CMD connector are optional connected to port 4 of the USB 3.0 hub (see 3.3.3).
Preliminary User’s Manual l MBa8MP-RAS314 UM 0003 l © 2024, TQ-Systems GmbH
TQRMESaE8TM, BPLxTL_EN,
PWRL_VEDNS,0 CONTRAST/PWM
5 V / 3.3 V
LVDS Data
USB
5 V / 12 V
LVDS Control USB 3.0 Hub optional
Figure 13: Block diagram LVDS
Table 11:
Pinout LVDS data, X7
Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
Signal LVDS0_D0_N LVDS0_D0_P LVDS0_D1_N LVDS0_D1_P LVDS0_D2_N LVDS0_D2_P
GND LVDS0_CLK_N LVDS0_CLK_P LVDS0_D3_N LVDS0_D3_P
GND
V_5V_LVDS0
V_3V3_LVDS0
Table 12: Pinout LVDS control, X8
Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14
Signal
V_12V
GND V_5V_SW
GND V_VBUS30_H4_LVDS
GND USB_LVDS_DN USB_LVDS_DP
GND LVDS0_RESET# LVDS0_BLT_EN LVDS0_PWR_EN LVDS_PWM
Remark
max. 1.0 A
max. 1.0 A
Remark max. 1.0 A
max. 0.5 A
optional optional 10 k PD 10 k PD 10 k PD
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Preliminary User’s Manual l MBa8MP-RAS314 UM 0003 l © 2024, TQ-Systems GmbH
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3.3.10 HDMI
The HDMI_TX interface of the TQMa8MPxL is provided on the MBa8MP-RAS314 on an HDMI connector. Between TQMa8MPxL and HDMI socket is a “HDMI signal conditioning chip”, which converts the levels and provides ESD protection. The HDMI_ARC_N and HDMI_ARC_P signals have capacitors between the module and the connector according to the EARC specification.
TQMa8MPxL
HDMI
Figure 14: Block diagram HDMI
HDMI signal conditioning
HDMI socket
Table 13:
Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 M1…M4
Pinout HDMI connector, X9
Signal HDMI_DATA2_P GND HDMI_DATA2_N HDMI_DATA1_P GND HDMI_DATA1_N HDMI_DATA0_P GND HDMI_DATA0_N HDMI_CLK_P GND HDMI_CLK_N HDMI_CEC HDMI_ARC_P HDMI_DDC_SCL HDMI_DDC_SDA GND HDMI_5V_OUT HDMI_ARC_N Shield/GND
Remark 1.87 k PU to HDMI_5V_OUT 1.87 k PU to HDMI_5V_OUT max. 0.5 A
Preliminary User’s Manual l MBa8MP-RAS314 UM 0003 l © 2024, TQ-Systems GmbH
3.3.11 Audio A Texas Instruments TLV320 audio codec is assembled. It is configured via SAI5 and controlled by the I2C4 bus. The audio codec provides microphone (mono) and headphone at a 3.5 mm jack on the MBa8MP-RAS314. The supply voltage and signal level operate at 1.8 V. The jack socket is ESD protected. Headphone can become Line out by replacement of resistors R75/76 to R72/74.
TQMA8MPxL
SAI5 I2C4
Audio Codec TLV320
Figure 15: Block diagram audio interface
Headphone MIC
3.5 mm Jack
Page 23
Table 14: Pinout audio connector X3
Pin 1 4A, 4B 3 2
Signal MIC_IN HEADPHONE_L HEADPHONE_R AGND_AUDIO
Remark Optional connection to LOL Optional connection to LOR
3.3.12 ECSPI
The ECSPI3 interface signals from the TQMa8MPxL are connected to the GPIO header X1. There they can be also used as GPIO control signals.
3.3.13 SPDIF
The SPDIF interface is not used as such on the MBa8MP-RAS314, but can be provided on the GPIO header if required. By default these module signals are configured as I2C5 and GPIO.
Table 15: SPDIF signal usage
TQMa8MPxL signal SPDIF_EXT_CLK SPDIF_IN SPDIF_OUT
MBa8MP-RAS314 usage GPIO21 GPIO2 / I2C5_SDA GPIO3 / I2C5_SCL
Remark 2.2 k PU to V_3V3_MB 2.2 k PU to V_3V3_MB
3.3.14 GPT The MBa8MP-RAS314 provides up to three general purpose timer signals. They are connected to the GPIO header.
3.3.15 PWM The MBa8MP-RAS314 provides two PWM signals. They are connected to the GPIO header.
3.3.16 UART The MBa8MP-RAS314 provides one UART interface connected to the GPIO header. The interface includes besides RXD and TXD also CTS and RTS signals.
Preliminary User’s Manual l MBa8MP-RAS314 UM 0003 l © 2024, TQ-Systems GmbH
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3.3.17 USDHC
The USDHC1 interface of the TQMa8MPxL is provided at the GPIO header of the MBa8MP-RAS314. It can be used as a 4-bit wide SDIO interface.
3.3.18 GPIO header
Nearly all GPIOs provided by the TQMa8MPxL are used as control signals on the MBa8MP-RAS314 and are therefore not available. GPIOs can however be configured from signals available at the pin header. The GPIO signal level is 3.3 V.
A complete list of all possible GPIO pins can be found in the i.MX 8M Plus data sheet (1).
Table 16: Pinout GPIO header, X1
Alternative
GPIO21 GPIO31 GPIO4
GPIO17 GPIO27 GPIO22
GPIO10 GPIO9 GPIO11
GPIO0 GPIO5 GPIO6 GPIO13
GPIO26
Signal V_3V3_MB
I2C5_SDA I2C5_SCL GPT1_CLK GND UART1_RTS USDHC1_DATA3 USDHC1_CLK V_3V3_MB ECSPI3_MOSI ECSPI3_MISO ECSPI3_SCLK GND I2C3_SDA (ID) GPT2_CLK GPT3_CLK
PWM4 GPIO19
USDHC1_DATA2 GND
Pin Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40
Signal
V_5V_SW
GND UART1_TXD UART1_RXD
GPIO18 GND
USDHC1_CMD USDHC1_DATA0
GND USDHC1_DATA1
(SS1) ECSPI3_SS0 I2C3_SCL (ID)
GND PWM3
GND UART1_CTS
GPIO20 GPIO21
Alternative
GPIO14 GPIO15
GPIO23 GPIO24 GPIO25 GPIO8 GPIO7 GPIO1 GPIO12 GPIO16
1 2.2 k PU to V_3V3_MB
Preliminary User’s Manual l MBa8MP-RAS314 UM 0003 l © 2024, TQ-Systems GmbH
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3.4
User interfaces and diagnostic
3.4.1
Boot Mode configuration
The Boot Mode is set with the 4-fold DIP switch S4 at the four i.MX 8M Plus pins Boot_Mode[3:0]. Information on the boot configuration of the i.MX 8M Plus can be found in the i.MX 8M Plus documentation; see Table 31.
Table 17:
Boot Source options TQMa8MPxL Boot Mode[3:0] 0 0 0 0 0 0 0 1 0 0 1 0 0 0 1 1 0 1 0 x 0 1 1 0 0 1 1 1 1 0 0 0
Boot Source Boot from eFuses USB Serial Downloader Boot from eMMC (USDHC3) Boot from SD card (USDHC2) Boot from NAND (not supported) Boot from QSPI (3-Byte Read) Boot from Hyperflash 3.3 V (not supported) Boot from eCSPI (not supported)
3.4.2
Reset buttons
More information can be found in chapter 3.1.6
3.4.3
Status LEDs
The MBa8MP-RAS314 offers diagnosis and status LEDs (plus the ones in the RJ45 connectors) to signal the system status.
Table 18: Interface
USB
USB debug User LED
Power
Reset SD-Card Ethernet
Status LEDs
Ref.
Colour
Indication
V6
Green Status V_VBUS30_H1 (lit when USB 3.0 port 1 is active)
V7
Green Status V_VBUS30_H2 (lit when USB 3.0 port 2 is active)
V8
Green Status V_VBUS30_H3 (lit when USB 3.0 port 3 is active)
V9
Green Status V_VBUS30_H4 (lit when USB 3.0 port 4 is active)
V5
Green Status 3.45 V Debug (lit when 3.45 V of Silicon Labs chip is active)
V2
Green USER_LED1 (lit when ENET_RX_ER is active)
V3
Orange USER_LED2 (lit when ENET_TX_ER is active)
V11
Green Status V_5V_MOD (lit when active)
V12
Green Status V_3V3_MB (lit when active)
V13
Green Status 12 V MBa8MP-RAS314 (lit when 12 V for MBa8MP-RAS314 is active)
V14
Green Status V_5V_SW (lit when active)
V15
Green Status V_1V8 (lit when active)
V1
Red
Reset LED (lit when RESET_OUT# is low)
V4
Green Status V_3V3_SD (lit when active)
X15
Green/Green ETH0 – Link/Activity
X16
Green/Green ETH1 – Link/Activity
Preliminary User’s Manual l MBa8MP-RAS314 UM 0003 l © 2024, TQ-Systems GmbH
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3.4.4
JTAG®
The JTAG® port of the i.MX 8M Plus is routed to a standard ARM® 10-pin JTAG® connector (X17) on the MBa8MP-RAS314. JTAG_SRST# is connected to RESET_IN# via a buffer. The same reset can be executed as with reset button S1. The JTAG® interface is not ESD protected.
TQMa8MPxL
JTAG_TCK JTAG_TDI JTAG_TDO JTAG_TMS
Figure 16: Block diagram JTAG
10-pin Header
The following table shows the JTAG® connector pinout.
Table 19: Pinout JTAG® pin header, X17
Pin
Signal
1
Vref / VCC
2
JTAG_TMS
3
GND
4
JTAG_TCK
5
GND
6
JTAG_TDO
7
Key
8
JTAG_TDI
9
GND_DETECT
10
JTAG_SRST#
3.3 V (NC) 10 k PD RESET_IN#, 10 k PU
Remark
Preliminary User’s Manual l MBa8MP-RAS314 UM 0003 l © 2024, TQ-Systems GmbH
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4.
SOFTWARE
No software is required for the MBa8MP-RAS314. Suitable software is only required on the TQMa8MPxL and is not a part of this Preliminary User’s Manual. More information can be found in the TQ-Support Wiki for the TQMa8MPxL.
5.
MECHANICS
5.1
MBa8MP-RAS314 dimensions
The MBa8MP-RAS314 has overall dimensions (length × width) of 100 mm × 100 mm. The height without heatspreader and heatsink is approximately 20.5 mm. The MBa8MP-RAS314 including TQMa8MPxL weighs approximately 95 grams.
Figure 17:
Dimensions MBa8MP-RAS314
5.2
Embedding in the overall system
The MBa8MP-RAS314 serves as a design base for customer products, as well as a platform to support during development.
5.3
Thermal management
The combination of MBa8MP-RAS314 and TQMa8MPxL has a power consumption of approximately TBD watts. Further power consumption occurs mainly at externally connected devices.
Attention: TQMa8MPxL heat dissipation
The i.MX 8M Plus belongs to a performance category in which a cooling system is essential. It is the user’s sole responsibility to define a suitable heat sink (weight and mounting position) depending on the specific mode of operation (e.g., dependence on clock frequency, stack height, airflow, and software). Particularly the tolerance chain (PCB thickness, board warpage, BGA balls, BGA package, thermal pad, heatsink) as well as the maximum pressure on the TQMa8MPxL must be taken into consideration when connecting the heat sink. The TQMa8MPxL is not the highest component. Inadequate cooling connections can lead to overheating of the TQMa8MPxL or the MBa8MP-RAS314 and thus malfunction, deterioration or destruction.
Preliminary User’s Manual l MBa8MP-RAS314 UM 0003 l © 2024, TQ-Systems GmbH
5.4
Component placement & labeling
Page 28
Figure 18: MBa8MP-RAS314 component placement top
Preliminary User’s Manual l MBa8MP-RAS314 UM 0003 l © 2024, TQ-Systems GmbH
Page 29
AK1 AK2
Figure 19: MBa8MP-RAS314 component placement bottom
The labels on the MBa8MP-RAS314 show the following information:
Table 20: Label
AK1 AK2
Labels on MBa8MP-RAS314 Content
MBa8MP-RAS314 version and revision, tests performed Serial number
Preliminary User’s Manual l MBa8MP-RAS314 UM 0003 l © 2024, TQ-Systems GmbH
6.
SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS
6.1
EMC
Since the MBa8MP-RAS314 is a development platform, no EMC tests have been performed.
Page 30
6.2
ESD
Most interfaces provide ESD protection. Details are to be taken from the MBa8MP-RAS314 schematics.
6.3
Operational safety and personal security
Tests for operational safety and personal protection were not carried out due to the voltages 30 V DC.
6.4
Cyber Security
A Threat Analysis and Risk Assessment (TARA) must always be performed by the customer for their individual end application, as the MBa8MP-RAS314 is only a sub-component of an overall system.
6.5
Intended Use
TQ DEVICES, PRODUCTS AND ASSOCIATED SOFTWARE ARE NOT DESIGNED, MANUFACTURED OR INTENDED FOR USE OR RESALE FOR THE OPERATION IN NUCLEAR FACILITIES, AIRCRAFT OR OTHER TRANSPORTATION NAVIGATION OR COMMUNICATION SYSTEMS, AIR TRAFFIC CONTROL SYSTEMS, LIFE SUPPORT MACHINES, WEAPONS SYSTEMS, OR ANY OTHER EQUIPMENT OR APPLICATION REQUIRING FAIL-SAFE PERFORMANCE OR IN WHICH THE FAILURE OF TQ PRODUCTS COULD LEAD TO DEATH, PERSONAL INJURY, OR SEVERE PHYSICAL OR ENVIRONMENTAL DAMAGE. (COLLECTIVELY, “HIGH RISK APPLICATIONS”)
You understand and agree that your use of TQ products or devices as a component in your applications are solely at your own risk. To minimize the risks associated with your products, devices and applications, you should take appropriate operational and design related protective measures.
You are solely responsible for complying with all legal, regulatory, safety and security requirements relating to your products. You are responsible for ensuring that your systems (and any TQ hardware or software components incorporated into your systems or products) comply with all applicable requirements. Unless otherwise explicitly stated in our product related documentation, TQ devices are not designed with fault tolerance capabilities or features and therefore cannot be considered as being designed, manufactured or otherwise set up to be compliant for any implementation or resale as a device in high risk applications. All application and safety information in this document (including application descriptions, suggested safety precautions, recommended TQ products or any other materials) is for reference only. Only trained personnel in a suitable work area are permitted to handle and operate TQ products and devices. Please follow the general IT security guidelines applicable to the country or location in which you intend to use the equipment.
6.6
Export Control and Sanctions Compliance
The customer is responsible for ensuring that the product purchased from TQ is not subject to any national or international export/import restrictions. If any part of the purchased product or the product itself is subject to said restrictions, the customer must procure the required export/import licenses at its own expense. In the case of breaches of export or import limitations, the customer indemnifies TQ against all liability and accountability in the external relationship, irrespective of the legal grounds. If there is a transgression or violation, the customer will also be held accountable for any losses, damages or fines sustained by TQ. TQ is not liable for any delivery delays due to national or international export restrictions or for the inability to make a delivery as a result of those restrictions. Any compensation or damages will not be provided by TQ in such instances.
The classification according to the European Foreign Trade Regulations (export list number of Reg. No. 2021/821 for dual-usegoods) as well as the classification according to the U.S. Export Administration Regulations in case of US products (ECCN according to the U.S. Commerce Control List) are stated on TQ´s invoices or can be requested at any time. Also listed is the Commodity code (HS) in accordance with the current commodity classification for foreign trade statistics as well as the country of origin of the goods requested/ordered.
Preliminary User’s Manual l MBa8MP-RAS314 UM 0003 l © 2024, TQ-Systems GmbH
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6.7
Warranty
TQ-Systems GmbH warrants that the product, when used in accordance with the contract, fulfills the respective contractually agreed specifications and functionalities and corresponds to the recognized state of the art. The warranty is limited to material, manufacturing and processing defects. The manufacturer’s liability is void in the following cases:
· Original parts have been replaced by non-original parts. · Improper installation, commissioning or repairs. · Improper installation, commissioning or repair due to lack of special equipment. · Incorrect operation · Improper handling · Use of force · Normal wear and tear
7.
CLIMATIC AND OPERATIONAL CONDITIONS
In general reliable operation is given when the following conditions are met:
Table 21: Climatic and operational conditions MBa8MP-RAS314
Parameter Ambient temperature Storage temperature Relative humidity (operation / storing)
Range TBD TBD TBD
Remark Not condensing
Attention: TQMa8MPxL heat dissipation
The i.MX 8M Plus belongs to a performance category in which a cooling system is essential.
It is the user’s sole responsibility to define a suitable heat sink (weight and mounting position) depending on the specific mode of operation (e.g., dependence on clock frequency, stack height, airflow, and software).
Particularly the tolerance chain (PCB thickness, board warpage, BGA balls, BGA package, thermal pad, heatsink) as well as the maximum pressure on the TQMa8MPxL must be taken into consideration when connecting the heat sink. The TQMa8MPxL is not the highest component. Inadequate cooling connections can lead to overheating of the TQMa8MPxL or the MBa8MP-RAS314 and thus malfunction, deterioration or destruction.
7.1
Protection against external effects
Protection class IP00 was defined for the MBa8MP-RAS314. There is no protection against foreign objects, touch or humidity.
7.2
Reliability and service life
No detailed MTBF calculation has been done for the MBa8MP-RAS314. The MBa8MP-RAS314 is designed to be insensitive to vibration and impact.
Preliminary User’s Manual l MBa8MP-RAS314 UM 0003 l © 2024, TQ-Systems GmbH
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8.
ENVIRONMENT PROTECTION
8.1
RoHS
The MBa8MP-RAS314 is manufactured RoHS compliant. All components, assemblies and soldering processes are RoHS compliant.
8.2
WEEE®
The final distributor is responsible for compliance with the WEEE® regulation. Within the scope of the technical possibilities, the MBa8MP-RAS314 was designed to be recyclable and easy to repair.
8.3
REACH®
The EU-chemical regulation 1907/2006 (REACH® regulation) stands for registration, evaluation, certification and restriction of substances SVHC (Substances of very high concern, e.g., carcinogen, mutagen and/or persistent, bio accumulative and toxic). Within the scope of this juridical liability, TQ-Systems GmbH meets the information duty within the supply chain with regard to the SVHC substances, insofar as suppliers inform TQ-Systems GmbH accordingly.
8.4
EuP
The Ecodesign Directive, also Energy using Products (EuP), is applicable to products for the end user with an annual quantity >200,000. The MBa8MP-RAS314 must therefore always be seen in conjunction with the complete device. The available standby and sleep modes of the components on the MBa8MP-RAS314 enable compliance with EuP requirements for the MBa8MP-RAS314.
8.5
Statement on California Proposition 65
California Proposition 65, formerly known as the Safe Drinking Water and Toxic Enforcement Act of 1986, was enacted as a ballot initiative in November 1986. The proposition helps protect the state’s drinking water sources from contamination by approximately 1,000 chemicals known to cause cancer, birth defects, or other reproductive harm (“Proposition 65 Substances”) and requires businesses to inform Californians about exposure to Proposition 65 Substances. The TQ device or product is not designed or manufactured or distributed as consumer product or for any contact with endconsumers. Consumer products are defined as products intended for a consumer’s personal use, consumption, or enjoyment. Therefore, our products or devices are not subject to this regulation and no warning label is required on the assembly. Individual components of the assembly may contain substances that may require a warning under California Proposition 65. However, it should be noted that the Intended Use of our products will not result in the release of these substances or direct human contact with these substances. Therefore you must take care through your product design that consumers cannot touch the product at all and specify that issue in your own product related documentation. TQ reserves the right to update and modify this notice as it deems necessary or appropriate.
8.6
Packaging
The MBa8MP-RAS314 is delivered in reusable packaging.
8.7
Batteries
The MBa8MP-RAS314 does not require a battery and therefore does not use batteries containing mercury (Hg), cadmium (Cd) or lead (Pb).
8.8
Other entries
By environmentally friendly processes, production equipment and products, we contribute to the protection of our environment. To be able to reuse the MBa8MP-RAS314, it is produced in such a way (a modular construction) that it can be easily repaired and disassembled. The energy consumption of the MBa8MP-RAS314 is minimised by suitable measures. Because currently there is still no technical equivalent alternative for printed circuit boards with bromine-containing flame protection (FR-4 material), such printed circuit boards are still used. No use of PCB containing capacitors and transformers (polychlorinated biphenyls). These points are an essential part of the following laws:
· The law to encourage the circular flow economy and assurance of the environmentally acceptable removal of waste as at 27.9.94 (Source of information: BGBl I 1994, 2705)
· Regulation with respect to the utilization and proof removal as at 1.9.96 (Source of information: BGBl I 1996, 1382, (1997, 2860))
· Regulation with respect to the avoidance and utilization of packaging waste as at 21.8.98 (Source of information: BGBl I 1998, 2379)
· Regulation with respect to the European Waste Directory as at 1.12.01 (Source of information: BGBl I 2001, 3379)
This information is to be seen as notes. Tests or certifications were not carried out in this respect.
Preliminary User’s Manual l MBa8MP-RAS314 UM 0003 l © 2024, TQ-Systems GmbH
9.
APPENDIX
9.1
Acronyms and definitions
The following acronyms and abbreviations are used in this document:
Table 22: Acronyms
Acronym
ADC AI ARM® BGA BIOS CAN CAN FD CCM CPU CSI DIP DNC DP DSI eCSPI eDP EEPROM EMC eMMC ESD EU EuP FPS FR-4 GP GPIO GPT HD HDMI HSS I I/O I2C IEEE® IP00 JTAG® LCD LED LGA LPDDR4 LVDS
Meaning Analog/Digital Converter Artificial Intelligence Advanced RISC Machine Ball Grid Array Basic Input/Output System Controller Area Network Controller Area Network Flexible Data-Rate Clock Control Module Central Processing Unit Camera Serial Interface Dual In-line Package Do Not Connect DisplayPort Display Serial Interface enhanced Capability Serial Peripheral Interface embedded DisplayPort Electrically Erasable Programmable Read-Only Memory Electromagnetic Compatibility embedded Multimedia Card (Flash) Electrostatic Discharge European Union Energy using Products Frames Per Second Flame Retardant 4 General Purpose General Purpose Input/Output General Purpose Timer High Density (graphics) High-Definition Multimedia Interface High-Side Switch Input Input/Output Inter-Integrated Circuit Institute of Electrical and Electronics Engineers Ingress Protection 00 Joint Test Action Group Liquid Crystal Display Light Emitting Diode Land Grid Array Low-Power DDR4 Low Voltage Differential Signal
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Preliminary User’s Manual l MBa8MP-RAS314 UM 0003 l © 2024, TQ-Systems GmbH
9.1
Acronyms and definitions (continued)
Table 23: Acronyms (continued)
Acronym
MAC MIC MIPI ML MTBF NAND NC NMI NOR NP O OTG P PCB PCIe PCMCIA PD PHY PMIC PU PWM QSPI REACH® RGMII RJ45 RoHS RPM RTC SAI SD SDHC SDRAM SIM SPDIF SVHC TSE UART UHS UM UN USB uSDHC WEEE® ZIF
Meaning Media Access Controller Microphone Mobile Industry Processor Interface Machine Learning Mean operating Time Between Failures Not-And (flash memory) Not Connected Non-Maskable Interrupt Not-Or Not Placed Output On-The-Go Power Printed Circuit Board Peripheral Component Interconnect express People Can’t Memorize Computer Industry Acronyms Pull-Down Physical (layer of the OSI model) Power Management Integrated Circuit Pull-Up Pulse-Width Modulation Quad Serial Peripheral Interface Registration, Evaluation, Authorisation (and restriction of) Chemicals Reduced Gigabit Media-Independent Interface Registered Jack 45 Restriction of (the use of certain) Hazardous Substances Revolutions Per Minute Real-Time Clock Serial Audio Interface Secure Digital Secure Digital High Capacity Synchronous Dynamic Random Access Memory Subscriber Identification Module Sony-Philips Digital Interface Format Substances of Very High Concern Trust Secure Element Universal Asynchronous Receiver/Transmitter Ultra-High Speed User’s Manual United Nations Universal Serial Bus Ultra-Secured Digital Host Controller Waste Electrical and Electronic Equipment Zero Insertion Force
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Preliminary User’s Manual l MBa8MP-RAS314 UM 0003 l © 2024, TQ-Systems GmbH
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9.2
References
Table 23: Further applicable documents
No.
Name
(1)
i.MX 8M Plus Applications Processor Data Sheet
(2)
i.MX 8M Plus Applications Processor Reference Manual
(3)
Mask Set Errata i.MX 8M Plus
(4)
TQMa8MPxL User’s Manual
(5)
TQMa8MPxL Support Wiki
Rev. / Date Rev. 1 / 08/2021 Rev. 1/ 03/2021 current current current
Company NXP NXP NXP TQ-Systems TQ-Systems
TQ-Systems GmbH Mühlstraße 2 l Gut Delling l 82229 Seefeld Info@TQ-Group | TQ-Group
Documents / Resources
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TQ MBa8MP-RAS314 Embedded Single Board Computer [pdf] User Manual MBa8MP-RAS314 Embedded Single Board Computer, MBa8MP-RAS314, Embedded Single Board Computer, Single Board Computer, Board Computer |