TQ MBa8MP-RAS314 Embedded Single Board Computer User Manual

User Manual for TQ models including: MBa8MP-RAS314 Embedded Single Board Computer, MBa8MP-RAS314, Embedded Single Board Computer, Single Board Computer, Board Computer

Preliminary User's Manual

MBa8MP-RAS314

Kreuzer TQ-Systems GmbH

Manuals | ARM Architecture | TQ

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Preliminary User's Manual

MBa8MP-RAS314.UM.0003

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MBa8MP-RAS314.UM.0003

MBa8MP-RAS314 Preliminary User's Manual
MBa8MP-RAS314 UM 0003 02.08.2024

Preliminary User's Manual l MBa8MP-RAS314 UM 0003 l © 2024, TQ-Systems GmbH
TABLE OF CONTENTS

Page i

1. 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2. 2.1 2.2 3. 3.1 3.1.1 3.1.2 3.1.3 3.1.4 3.1.5 3.1.6 3.2 3.2.1 3.2.2 3.3 3.3.1 3.3.2 3.3.3 3.3.4 3.3.5 3.3.6 3.3.7 3.3.8 3.3.9 3.3.10 3.3.11 3.3.12 3.3.13 3.3.14 3.3.15 3.3.16 3.3.17 3.3.18 3.4 3.4.1 3.4.2 3.4.3 3.4.4 4. 5. 5.1 5.2 5.3 5.4 6. 6.1 6.2 6.3

ABOUT THIS MANUAL................................................................................................................................................................................6 Copyright and license expenses ............................................................................................................................................6 Registered trademarks ...............................................................................................................................................................6 Disclaimer ........................................................................................................................................................................................ 6 Imprint .............................................................................................................................................................................................. 6 Tips on safety .................................................................................................................................................................................7 Symbols and typographic conventions ..............................................................................................................................7 Handling and ESD tips................................................................................................................................................................7 Naming of signals.........................................................................................................................................................................8 Further applicable documents / presumed knowledge...............................................................................................8 BRIEF DESCRIPTION .................................................................................................................................................................................... 9 MBa8MP-RAS314 block diagram............................................................................................................................................9 MBa8MP-RAS314 interfaces, overview ............................................................................................................................. 10 ELECTRONICS............................................................................................................................................................................................. 11 MBa8MP-RAS314 functional groups.................................................................................................................................. 11 TQMa8MPxL overview ............................................................................................................................................................................ 11 TQMa8MPxL pinout................................................................................................................................................................................. 11 I2C devices, address mapping............................................................................................................................................................... 12 RTC backup ................................................................................................................................................................................................ 13 Temperature sensor ................................................................................................................................................................................ 13 Reset............................................................................................................................................................................................................. 13 Power supply .............................................................................................................................................................................. 14 Protective circuitry................................................................................................................................................................................... 15 Shared power budgets ........................................................................................................................................................................... 15 Communication interfaces .................................................................................................................................................... 16 Ethernet 1000 Base-T (RGMII) ............................................................................................................................................................... 16 SD card interface ...................................................................................................................................................................................... 17 USB 3.0 Hub................................................................................................................................................................................................ 18 USB 3.0 Device / Serial Downloader ................................................................................................................................................... 18 WiFi ............................................................................................................................................................................................................... 19 Debug UART .............................................................................................................................................................................................. 19 Camera Interface ...................................................................................................................................................................................... 19 Display Interface ....................................................................................................................................................................................... 20 LVDS ............................................................................................................................................................................................................. 20 HDMI ............................................................................................................................................................................................................ 22 Audio............................................................................................................................................................................................................ 23 ECSPI............................................................................................................................................................................................................. 23 SPDIF ............................................................................................................................................................................................................ 23 GPT................................................................................................................................................................................................................ 23 PWM ............................................................................................................................................................................................................. 23 UART............................................................................................................................................................................................................. 23 USDHC ......................................................................................................................................................................................................... 24 GPIO header............................................................................................................................................................................................... 24 User interfaces and diagnostic............................................................................................................................................. 25 Boot Mode configuration ...................................................................................................................................................................... 25 Reset buttons............................................................................................................................................................................................. 25 Status LEDs ................................................................................................................................................................................................. 25 JTAG® ........................................................................................................................................................................................................... 26 SOFTWARE.................................................................................................................................................................................................. 27 MECHANICS................................................................................................................................................................................................ 27 MBa8MP-RAS314 dimensions .............................................................................................................................................. 27 Embedding in the overall system ....................................................................................................................................... 27 Thermal management............................................................................................................................................................. 27 Component placement & labeling..................................................................................................................................... 28 SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS ......................................................................................................... 30 EMC................................................................................................................................................................................................. 30 ESD .................................................................................................................................................................................................. 30 Operational safety and personal security........................................................................................................................ 30

Page ii

CLIMATIC AND OPERATIONAL CONDITIONS ................................................................................................................................... 31

7.1

Protection against external effects .................................................................................................................................... 31

7.2

Reliability and service life....................................................................................................................................................... 31

ENVIRONMENT PROTECTION................................................................................................................................................................ 32

8.1

RoHS ............................................................................................................................................................................................... 32

8.2

WEEE® ............................................................................................................................................................................................ 32

8.3

REACH®.......................................................................................................................................................................................... 32

8.4

EuP .................................................................................................................................................................................................. 32

8.5

Packaging..................................................................................................................................................................................... 32

8.6

Batteries ........................................................................................................................................................................................ 32

8.7

Other entries ............................................................................................................................................................................... 32

APPENDIX ................................................................................................................................................................................................... 33

9.1

Acronyms and definitions...................................................................................................................................................... 33

9.2

References.................................................................................................................................................................................... 35

Preliminary User's Manual l MBa8MP-RAS314 UM 0003 l © 2024, TQ-Systems GmbH
TABLE DIRECTORY

Page iii

Table 1: Table 2: Table 3: Table 4: Table 5: Table 6: Table 7: Table 8: Table 9: Table 10: Table 11: Table 12: Table 13: Table 14: Table 15: Table 16: Table 17: Table 18: Table 19: Table 20: Table 21: Table 22: Table 23:

Terms and conventions.............................................................................................................................................................................7 Data interfaces .......................................................................................................................................................................................... 10 Diagnostic and user interfaces............................................................................................................................................................. 10 I2C devices, address mapping on TQMa8MPxL and MBa8MP-RAS314.................................................................................... 12 Temperature sensor SE97BTP, D1 ....................................................................................................................................................... 13 Reset signals............................................................................................................................................................................................... 14 Pinout RJ45 Ethernet connector X15, X16 ........................................................................................................................................ 16 Pinout microSD card, X2 ........................................................................................................................................................................ 17 Pinout Camera Interface, X5 ................................................................................................................................................................. 20 Pinout Display Interface, X6 .................................................................................................................................................................. 20 Pinout LVDS data, X7............................................................................................................................................................................... 21 Pinout LVDS control, X8 ......................................................................................................................................................................... 21 Pinout HDMI connector, X9................................................................................................................................................................... 22 Pinout audio connector X3 ................................................................................................................................................................... 23 SPDIF signal usage ................................................................................................................................................................................... 23 Pinout GPIO header, X1 .......................................................................................................................................................................... 24 Boot Source options TQMa8MPxL ...................................................................................................................................................... 25 Status LEDs ................................................................................................................................................................................................. 25 Pinout JTAG® pin header, X17.............................................................................................................................................................. 26 Labels on MBa8MP-RAS314 .................................................................................................................................................................. 29 Climatic and operational conditions MBa8MP-RAS314 ............................................................................................................... 31 Acronyms.................................................................................................................................................................................................... 33 Further applicable documents............................................................................................................................................................. 35

Preliminary User's Manual l MBa8MP-RAS314 UM 0003 l © 2024, TQ-Systems GmbH
FIGURE DIRECTORY

Page iv

Figure 1: Figure 2: Figure 3: Figure 4: Figure 5: Figure 6: Figure 7: Figure 8: Figure 9: Figure 10: Figure 11: Figure 12: Figure 13: Figure 14: Figure 15: Figure 16: Figure 17: Figure 18: Figure 19:

Block diagram MBa8MP-RAS314 ............................................................................................................................................................ 9 Block diagram TQMa8MPxL .................................................................................................................................................................. 11 Block diagram I2C bus ............................................................................................................................................................................. 12 Block diagram MBa8MP-RAS314 Reset structure........................................................................................................................... 13 Block diagram power supply MBa8MP-RAS314 ............................................................................................................................. 14 MBa8MP-RAS314 protective circuit.................................................................................................................................................... 15 Block diagram Ethernet 1000 Base-T ................................................................................................................................................. 16 Block diagram SD card interface, MBa8MP-RAS314 ...................................................................................................................... 17 Block diagram USB 3.0 Hub................................................................................................................................................................... 18 Block diagram WiFi .................................................................................................................................................................................. 19 Block diagram UARTs .............................................................................................................................................................................. 19 Block diagram MIPI CSI ........................................................................................................................................................................... 19 Block diagram LVDS ................................................................................................................................................................................ 21 Block diagram HDMI................................................................................................................................................................................ 22 Block diagram audio interface ............................................................................................................................................................. 23 Block diagram JTAG................................................................................................................................................................................. 26 Dimensions MBa8MP-RAS314 .............................................................................................................................................................. 27 MBa8MP-RAS314 component placement top ................................................................................................................................ 28 MBa8MP-RAS314 component placement bottom ........................................................................................................................ 29

Preliminary User's Manual l MBa8MP-RAS314 UM 0003 l © 2024, TQ-Systems GmbH
REVISION HISTORY

Rev. 0001 0002
0003

Date 11.10.2023 04.03.2024
02.08.2024

Name Kreuzer Kreuzer
Kreuzer

Pos.
Figure 17 3.2 6.4, 6.5, 6.6, 6.7, 8.5

Modification First edition added Range corrected added

Page v

Page 6

ABOUT THIS MANUAL

1.1

Copyright protected © 2024 by TQ-Systems GmbH.
This Preliminary User's Manual may not be copied, reproduced, translated, changed or distributed, completely or partially in electronic, machine readable, or in any other form without the written consent of TQ-Systems GmbH.
The drivers and utilities for the components used as well as the BIOS are subject to the copyrights of the respective manufacturers. The licence conditions of the respective manufacturer are to be adhered to.
Bootloader-licence expenses are paid by TQ-Systems GmbH and are included in the price.
Licence expenses for the operating system and applications are not taken into consideration and must be calculated / declared separately.

1.2

Registered trademarks

TQ-Systems GmbH aims to adhere to copyrights of all graphics and texts used in all publications, and strives to use original or license-free graphics and texts.
All brand names and trademarks mentioned in this Preliminary User's Manual, including those protected by a third party, unless specified otherwise in writing, are subjected to the specifications of the current copyright laws and the proprietary laws of the present registered proprietor without any limitation. One should conclude that brand and trademarks are rightly protected by a third party.

1.3

Disclaimer

TQ-Systems GmbH does not guarantee that the information in this Preliminary User's Manual is up-to-date, correct, complete or of good quality. Nor does TQ-Systems GmbH assume guarantee for further usage of the information. Liability claims against TQSystems GmbH, referring to material or non-material related damages caused, due to usage or non-usage of the information given in this Preliminary User's Manual, or due to usage of erroneous or incomplete information, are exempted, as long as there is no proven intentional or negligent fault of TQ-Systems GmbH.
TQ-Systems GmbH explicitly reserves the rights to change or add to the contents of this Preliminary User's Manual or parts of it without special notification.

Important Notice:
Before using the MBa8MP-RAS314 or parts of the MBa8MP-RAS314 schematics, you must evaluate it and determine if it is suitable for your intended application. You assume all risks and liability associated with such use. TQ-Systems GmbH makes no other warranties including, but not limited to, any implied warranty of merchantability or fitness for a particular purpose. Except where prohibited by law, TQ-Systems GmbH will not be liable for any indirect, special, incidental or consequential loss or damage arising from the usage of the MBa8MP-RAS314 or schematics used, regardless of the legal theory asserted.

1.4

Imprint

TQ-Systems GmbH Gut Delling, Mühlstraße 2 D-82229 Seefeld

Tel: Fax: E-Mail: Web:

+49 8153 93080 +49 8153 93084223 Info@TQ-Group.com TQ-Group

1.5

Tips on safety

Improper or incorrect handling of the product can substantially reduce its life span.

Page 7

1.6

Symbols and typographic conventions

Table 1: Terms and conventions

Symbol

Meaning

This symbol represents the handling of electrostatic-sensitive modules and / or components. These components are often damaged / destroyed by the transmission of a voltage higher than about 50 V. A human body usually only experiences electrostatic discharges above approximately 3,000 V.

This symbol indicates the possible use of voltages higher than 24 V. Please note the relevant statutory regulations in this regard. Non-compliance with these regulations can lead to serious damage to your health and cause damage / destruction of the component.

This symbol indicates a possible source of danger. Acting against the procedure described can lead to possible damage to your health and / or cause damage / destruction of the material used.

This symbol represents important details or aspects for working with TQ-products.

Command

A font with fixed-width is used to denote commands, file names, or menu items.

1.7

Handling and ESD tips

General handling of your TQ-products

The TQ-product may only be used and serviced by certified personnel who have taken note of the information, the safety regulations in this document and all related rules and regulations.
A general rule is not to touch the TQ-product during operation. This is especially important when switching on, changing jumper settings or connecting other devices without ensuring beforehand that the power supply of the system has been switched off.
Violation of this guideline may result in damage / destruction of the MBa8MP-RAS314 and be dangerous to your health.
Improper handling of your TQ-product would render the guarantee invalid.

Proper ESD handling

The electronic components of your TQ-product are sensitive to electrostatic discharge (ESD).
Always wear antistatic clothing, use ESD-safe tools, packing materials etc., and operate your TQproduct in an ESD-safe environment. Especially when you switch modules on, change jumper settings, or connect other devices.

Page 8

1.8

Naming of signals

A hash mark (#) at the end of the signal name indicates a low-active signal. Example: RESET#

If a signal can switch between two functions and if this is noted in the name of the signal, the low-active function is marked with a hash mark and shown at the end.
Example: C / D#

If a signal has multiple functions, the individual functions are separated by slashes when they are important for the wiring. The identification of the individual functions follows the above conventions. Example: WE2# / OE#

1.9

Further applicable documents / presumed knowledge

· Specifications and manual of the modules used: These documents describe the service, functionality and special characteristics of the module used (incl. BIOS).
· Specifications of the components used: The manufacturer's specifications of the components used, for example CompactFlash cards, are to be taken note of. They contain, if applicable, additional information that must be taken note of for safe and reliable operation. These documents are stored at TQ-Systems GmbH.
· Chip errata: It is the user's responsibility to make sure all errata published by the manufacturer of each component are taken note of. The manufacturer's advice should be followed.
· Software behaviour: No warranty can be given, nor responsibility taken for any unexpected software behaviour due to deficient components.
· General expertise: Expertise in electrical engineering / computer engineering is required for the installation and the use of the device.

The following documents are required for full comprehension of this Preliminary User's Manual:

· MBa8MP-RAS314 schematics

· TQMa8MPxL Preliminary User's Manual

· i.MX 8M Plus Data Sheet

· i.MX 8M Plus Reference Manual

· U-Boot documentation:

www.denx.de/wiki/U-Boot/Documentation

· Yocto documentation:

www.yoctoproject.org/docs/

· TQ-Support Wiki:

https://support.tq-group.com/en/arm/tqma8mp-ras314

Page 9

BRIEF DESCRIPTION

This Preliminary User's Manual describes the hardware of the MBa8MP-RAS314 as of revision 01xx. The MBa8MP-RAS314 is designed as a carrier board for the TQMa8MPxL. The TQMa8MPxL is directly soldered on the MBa8MPRAS314. Core of the MBa8MP-RAS314 is the TQMa8MPxL with an NXP i.MX 8M Plus CPU based on a Dual or Quad Cortex®-A53. The TQMa8MPxL connects all peripheral components. In addition to the standard communication interfaces such as USB, Ethernet, SD card, etc., most other available TQMa8MPxL signals are routed on 100 mil pin headers on the MBa8MP-RAS314. CPU features and interface can be evaluated, software development for a TQMa8MPxL-based project can start immediately. Currently four i.MX 8M Plus derivatives are supported:

1) i.MX 8M Plus Dual (Dual Cortex®-A53) 2) i.MX 8M Plus Quad 4 Lite (Quad Cortex®-A53) 3) i.MX 8M Plus Quad 6 Video (Quad Cortex®-A53) 4) i.MX 8M Plus Quad 8 ML/AI (Quad Cortex®-A53)

2.1

MBa8MP-RAS314 block diagram

µSD-Card

SDHC

Micro-USB

Bus bridge

TQMa8MPxL (LGA module) uSDHC #2 USB3.0 #1

RAM NOR Flash
E-MMC

UART #3/4

USB3.0 #2

USB

USB DEV

4x USB3.0

USB Hub optional

Touch (LVDS)

GPIO header

1 x 3,5 mm jack
Camera interface

I2C
Audio Codec
MIPI-CSI

I2C #3/5 ECSPI #3 uSDHC #1 UART #1
GPIO

PCIe UART #2

PCIe Data

HDMI

HDMI signal conditioning

LVDS

I2C #4

MIPI DSI

DSI

SAI #5 MIPI CSI1

ENET TSN RGMII ENET QOS RGMII

Gigabit ETH PHY
Gigabit ETH PHY

WiFi
HDMI
LVDS
Display interface Ethernet 10/100/1k Ethernet 10/100/1k

Power IN 12 V DC/DC

Module

5 V

Power Rails

Boot

Figure 1: Block diagram MBa8MP-RAS314

Boot Config

Page 10

2.2

MBa8MP-RAS314 interfaces, overview

The following interfaces/functions and user interfaces are available on the MBa8MP-RAS314:

Table 2: Data interfaces

Interface Audio Camera interface Display Interface
Eth. 1000 Base-T
GPIO HDMI JTAG LVDS CMD LVDS Data SD card USB 3.0 USB Debug USB 3.0 DEV WiFi

Connector

Type

1 × 3.5 mm jack

1-1734248-5, TE Connectivity

X15, X16 RJ45

X1 X9 X17 X8 X7 X2 X12, X13 X4 X14 X10, X11

SL-22-124-40-G, 2,54 mm HDMI 10-pin, 50 mil pin header 14-pin, DF19G 20-pin, DF19G Micro-SD Stacked Type A Micro USB AB Micro USB Type B U.FL-R-SMT-1(10)

Remark MIC (mono), headphone (stereo) Gigabit PHY DP83867 and socket with integrated transformers Connected to IO bank (GPIO) JTAG ZIF connector ZIF connector USDHC2, optional boot source UART3, UART4 USB 3.0 Device or Serial Downloader

The MBa8MP-RAS314 provides the following diagnostic and user interfaces:

Table 3: Diagnostic and user interfaces

Interface

Reference

Status LEDs

Power / Reset

Boot-Mode

Component 1 × Red LED 5 × Green LED 1 × Green LED 1 × Orange LED 1 x Green LED 1 x Green LED 4 x Green LED 4 x Green LED
3 × Pushbutton
1 × 4-fold DIP switch

Remark Reset Voltages on MBa8MP-RAS314 General purpose LED General purpose LED SD-Card Debug-USB USB V_VBUS30_H1...H4 Ethernet link / activity Reset PMIC reset CPU-ON/OFF Boot Device selection

Page 11

ELECTRONICS

3.1

MBa8MP-RAS314 functional groups

The following chapters describe the interfaces of the MBa8MP-RAS314 in connection with a TQMa8MPxL.

3.1.1

TQMa8MPxL overview

The MBa8MP-RAS314 provides all power supplies and configurations required for the operation of the TQMa8MPxL. The TQMa8MPxL is the central system on the MBa8MP-RAS314. It provides LPDDR4 SDRAM, eMMC, NOR flash, RTC, an EEPROM, power supply and power management functionality. All TQMa8MPxL internal voltages are derived from the 5 V supply voltage. All functionally relevant pins of the i.MX 8M Plus are routed to the TQMa8MPxL connectors or LGA pads. This enables to use the TQMa8MPxL with all the freedom that comes with a customer-specific design-in solution. Further information can be found in the TQMa8MPxL User's Manual. On the MBa8MP-RAS314 the standard interfaces like USB, Ethernet, etc., provided by the TQMa8MPxL are routed to industry standard connectors. Most other relevant signals and buses provided by the TQMa8MPxL are routed to 100 mil pin headers on the MBa8MP-RAS314. The boot behaviour of the TQMa8MPxL can be controlled. The boot mode configuration is set with a DIP switch on the MBa8MPRAS314.

PMIC NXP PCA9450C
Supervisor MAX803SQ438T1G

i.MX 8M Plus

LPDDR4-RAM
e-MMC 5.1 (optional)
1x QSPI-NORFlash (optional)
RTC (optional) TPM (optional) EEPROM (option.)
Temperaturesensor / EEPROM

PCIe RGMII USB3.0 UART
I2C GPIO SPI HDMI CSI DSI

5 V
5 V

Figure 2: Block diagram TQMa8MPxL

366 LGA-Pads

3.1.2

TQMa8MPxL pinout

The most relevant TQMa8MPxL signals that are not already used are routed out to a header on the MBa8MP-RAS314.

Note: Available interfaces
Depending on the TQMa8MPxL derivative, not all interfaces are available. More information about available interfaces can be found in the TQMa8MPxL User's Manual and pinout tables.

Page 12

3.1.3

I2C devices, address mapping

The TQMa8MPxL provides five I2C buses. Of these, only I2C3 and I2C5 are provided on a pin header. All other buses are used by different components on the module or the mainboard.

The following block diagram shows the I2C bus structure.

TQMa8MPxL I2C1

PCA9450

3V3

PCF85063

24LC64T

SE97BTP

SE050

I2C2

I2C4

1V8

I2C3

3V3

I2C5

3V3

optional
USB-Hub
AudioCodec

Camera interface Display interface
GPIO header

Figure 3: Block diagram I2C bus

The following table shows the addresses used on the TQMa8MPxL and the MBa8MP-RAS314.

Table 4: I2C devices, address mapping on TQMa8MPxL and MBa8MP-RAS314

Location TQMa8MPxL

Device PCA9450 PCF85063 24LC64T
SE97BTP

Function

Bus

System Controller RTC EEPROM Temperature sensor I2C1

EEPROM

SE050

Trust Secure Element

TLV320AIC3204 Audio Codec

I2C4

TUSB8041

USB 3.0 hub

X5 MBa8MP-RAS314
X6

Camera interface

I2C2

Display interface

I2C3

GPIO header

I2C5

7-bit address 0x25 / 010 0101b 0x51 / 101 0001b 0x57 / 101 0111b 0x1B / 001 1011b
0x33 / 011 0011b
0x53 / 101 0011b 0x48 / 100 1000b 0x18 / 001 1000b 0x44 / 100 0100b (Device dependent) (Device dependent) (Device dependent) (Device dependent)

Remark
Should not be altered Optional Optional R/W access in Protected Mode R/W access in Normal Mode Optional N1 D10

Page 13

3.1.4

RTC backup

In case of power failure or power down, a Goldcap capacitor on the MBa8MP-RAS314 supplies the RTC on the TQMa8MPxL. The TQMa8MPxL features an i.MX 8M Plus-internal RTC or a discrete RTC PCF85063A. The RTC is supplied in either way.

3.1.5

Temperature sensor

The SE97BTP sensor is used to monitor the temperature of the TQMa8MPxL. The sensor is connected to I2C1; see Table 4.

Table 5: Temperature sensor SE97BTP, D1

Manufacturer

Device

Resolution

NXP

SE97BTP

11 bits

Accuracy Max. ±1 °C Max. ±2 °C Max. ±3 °C

Temperature range +75 °C to +95 °C +40 °C to +125 °C 40 °C to +125 °C

3.1.6

Reset

The RESET_OUT# signal of the TQMa8MPxL is available on the MBa8MP-RAS314. A red LED (V1) on the MBa8MP-RAS314 indicates a reset condition; see Table 26.
On the MBa8MP-RAS314 a partial reset of the TQMa8MPxL is possible, e.g. with signal RESET_IN#.

TQMa8MPxL
IMX_ONOFF

Button

PMIC_RST#

Button

RESET_IN#

Button
JTAG Header

RESET_OUT#

LED

Figure 4: Block diagram MBa8MP-RAS314 Reset structure

Attention: RESET_OUT# / PMIC_RST#
Attention: The signal RESET_OUT# is designed as a reset triggering signal. To feed a reset signal into the system, it is mandatory to use the signal PMIC_RST#.

Page 14

Table 6: Signal
RESET_OUT#

Reset signals

Dir.

Source

O TQMa8MPxL

IMX_ONOFF

I MBa8MP-RAS314

PMIC_RST# RESET_IN#

I MBa8MP-RAS314 I MBa8MP-RAS314

PMIC_WDOG_IN#

I MBa8MP-RAS314

PMIC_WDOG_OUT# O TQMa8MPxL

Default

Remark

High · Requires pull-up on carrier board (max. 6.5 V)

High

· ON/OFF function; see i.MX 8M Plus data sheet (1) · No pull-up on carrier board required; low-active · Connect 5 s to GND to activate

High · No pull-up on carrier board required; low-active · Programmable PMIC response (warm reset, cold reset)

High · Activates POR_B of the i.MX 8M Plus; low-active · Connect to GND to activate

High

· No pull-up on carrier board required; low-active · Disabled by default on PMIC side · Programmable PMIC response (warm reset, cold reset)

· Multiplexed to GPIO1_IO02 pin of i.MX 8M Plus

· Connected to PMIC_WDOG_IN# via 0 bridge

3.2

Power supply

At X18, the MBa8MP-RAS314 has to be supplied with 12 V +/-10 % (10.8 V to 13.2 V). All other voltages required on the MBa8MPRAS314 are derived from this supply voltage. The MBa8MP-RAS314 has a theoretical maximum power consumption of approx. 42 W at its 12 V supply connection. This corresponds to a maximum typical current of 3.5 A at 12 V. The power supply unit used must be selected accordingly. In most applications, however, the power consumption will be significantly lower and the MBa8MP-RAS314 including TQMa8MPxL consumes approx. 5 W to 6 W when the i.MX 8M Plus operates at 100 % load. Most of the theoretically possible power consumption results from the standard-compliant supply of the USB and LVDS interfaces, as well as from the power available at the pin headers. It must be ensured that the permissible limit values of the input circuitry are not exceeded.

V_in (max. 3.5 A)

V_12V

V_3V3_SD (max. 0.4 A)

TPS54335

V_5V_MOD (max. 3 A)

TQMa8MPxL (PCA9450)

V_1V8_MOD (max. 0.5 A)

V_3V3_MOD (max. 0.5 A)

PFET

Key: Buck

TPS54335

V_3V3_MB (max. 3 A)

LDO/Switch

Power Rail

Figure 5: Block diagram power supply MBa8MP-RAS314

V_5V_SW
AP7361C AP7361C AP7361C

V_1V8
V_2V5_ETH V_1V0_ETH V_1V1_USB

Page 15

3.2.1

Protective circuitry

The protective circuit (see Figure 8) features the following characteristics:
· Overcurrent protection by fuse 7 A, Slow Blow · Overvoltage protection · PI filter · Reverse polarity protection · Capacitors for voltage smoothing

V_12V (max. 3.5 A)

4 A fuse, Slow Blow

TVS Diode

Figure 6: MBa8MP-RAS314 protective circuit

Filter

Reverse Polarity Protection

3.2.2

Shared power budgets

Ensure maximum listed power budget for IO interfaces is not exceeded. Observe maximum current rating on the individual connectors.

Voltage Rail V_3V3_MB V_5V_SW

Power Budget (mA) 1500 1000

Available on connector X5 (Camera), X6 (Display), X7 & X8 (LVDS), X1 (GPIO Header) X7 & X8 (LVDS), X9 (HDMI), X1 (GPIO Header)

Attention: Maximum current of 3.3 V and 5 V rails
The currents load of the 3.3 V and 5 V rails add up to the current consumption of the MBa8MP-RAS314. The additional power required must be provided by the power supply of the MBa8MP-RAS314. The maximum load of the fuse must be observed.

Page 16

3.3

Communication interfaces

3.3.1

Ethernet 1000 Base-T (RGMII)

The i.MX 8M Plus CPU has two independent RGMII interfaces. On the MBa8MP-RAS314 both interfaces are used to provide two Gigabit Ethernet ports by means of two DP83867 Ethernet PHYs.
The PHY has boot straps to start with adjustable default values. Some boot straps can be customized with placement options. More information is available in the latest MBa8MP-RAS314 schematic.

ENET0

RGMII0

TQMa8MPxL

ENET1

RGMII1

Figure 7: Block diagram Ethernet 1000 Base-T

PHY #0 DP83867
PHY #1 DP83867

RJ45 RJ45

Table 7: Pinout RJ45 Ethernet connector X15, X16

X15

Pin name

1 GND

2 TD0+

3 TD0

6 TD1+

4 TD1

5 TD2+

7 TD2

8 TD3+

9 TD4

10 CHS.GND

11 GREEN_ANODE

12 GREEN_CATHODE

13 GREEN_ANODE

14 GREEN_CATHODE

Signal GND ENET0_A+ ENET0_A ENET0_B+ ENET0_B ENET0_C+ ENET0_C ENET0_D+ ENET0_D GND V_3V3_MB ENET0_LED_0 V_3V3_MB ENET0_LED_2

X16

Pin name

1 GND

2 TD0+

3 TD0

6 TD1+

4 TD1

5 TD2+

7 TD2

8 TD3+

9 TD4

10 CHS.GND

11 GREEN_ANODE

12 GREEN_CATHODE

13 GREEN_ANODE

14 GREEN_CATHODE

Signal GND ENET1_A+ ENET1_A ENET1_B+ ENET1_B ENET1_C+ ENET1_C ENET1_D+ ENET1_D GND V_3V3_MB ENET1_LED_0 V_3V3_MB ENET1_LED_2

Remark
120 in series Switched by transistor 120 in series Switched by transistor

Page 17

3.3.2

SD card interface

The MBa8MP-RAS314 offers a microSD card slot that can also be used as boot source. All signals are directly connected to the USDHC2 interface of the i.MX 8M Plus.
The TQMa8MPxL voltage V_3V3_SD supplies the microSD card slot. This voltage is controlled by SD_RESET#, therefore the microSD card is automatically reset in case of a Reset. An external switch is not required. Signal USDHC2_CD# has a pull-up on the MBa8MP-RAS314. All data lines are ESD protected.
Standard, High and Extended capacity card types are supported. Default Speed, High Speed, and SD UHS-1 Speed Mode SDR104 with theoretically max.104 MB/s are supported. UHS-1 Speed Modes SDR12, SDR25, SDR50 and DDR50 are theoretically supported but not verified.
The TQMa8MPxL sets USDHC2 is to 1.8 V or 3.3 V automatically, depending on the transfer mode. The corresponding driver handles the changeover; it does not have to be done explicitly.
USDHC2_WP is not used and is terminated accordingly.

TQMa8MPxL
USDHC2 V_3V3_SD

3.3 V / 400 mA

SD Card Slot

Figure 8: Block diagram SD card interface, MBa8MP-RAS314

Table 8:
Pin 1 2 3 4 5 6 7 8 SW1 SW2 M1...4

Pinout microSD card, X2
Pin name DAT2 DAT3 CMD VDD CLK GND DAT0 DAT1 CD# CD# Shield

Signal USDHC2_DATA2 USDHC2_DATA3 USDHC2_CMD V_3V3_SD USDHC2_CLK GND USDHC2_DATA0 USDHC2_DATA1 GND USDHC2_CD# GND

Remark 10 k PU 10 k PU 10 k PU Supply from TQMa8MPxL 10 k PU 10 k PU 10 k PU

Page 18

3.3.3

USB 3.0 Hub

A USB 3.0 hub TUSB8041 is connected to the USB2 interface on the MBa8MP-RAS314, which provides four USB 3.0 / 2.0 host interfaces.

USB Host 1 & 2 of the TUSB8041 are connected to a Dual USB 3.0 Type A socket (X12) on the MBa8MP-RAS314. USB Host 3 & 4 are routed to the connector X13.
USB Host 4 can be routed to the LVDS-CMD connector X8 on the MBa8MP-RAS314 by changing the resistor placement R152/153 (STD) and R156/157 (OPT).

The USB hub is programmed via bootstrapping or as a placement option via I2C. Further information can be found in the TUSB8041 data sheet and the MBa8MP-RAS314 schematics.

TQMa8MPxL
USB

USB 3.0

V_5V_SW

USB_VBUS

TUSB8041

USB

Host 1

Host 2

Host 3 Host 4

USB 3.0 USB 3.0

USB 3.0

USB3.0

STD

USB Stacked Type A
USB Stacked Type A

I2C2

OPT

I2C

GPIO1_IO11

RESET#

OPT

LVDS CMD

Figure 9: Block diagram USB 3.0 Hub
The USB connectors are supplied with 5 V via power switches. The current is monitored and can be switched off in case of an overload and/or overheating.
The USB 3.0 port of the TQMa8MPxL provides a theoretical data rate of 5 Gbit/s. This is divided among the connected ports on the MBa8MP-RAS314. Depending on the software and hardware used, the effective read and write rates of the ports may vary.

3.3.4

USB 3.0 Device / Serial Downloader

The USB1 interface of the TQMa8MPxL is configured as USB 3.0 Device and routed to USB Micro-B connector X14 on the MBa8MPRAS314. This interface can be used for the Serial Download Mode of the TQMa8MPxL. It can be used as a normal USB 3.0 or USB 2.0 device interface.
The USB1 interface of the TQMa8MPxL provides a theoretical data rate of 5 Gbit/s. Depending on the software and hardware used, the effective read and write rates of the ports may vary.

Page 19

3.3.5

WiFi

A WiFi module (LBEE5XV1YM from Murata) is available on the MBa8MP-RAS314. It supports IEEE 802.11 a/b/g/n/ac and offers a dual-band RF interface (2.4 / 5 GHz).

The LBEE5XV1YM is connected to the MBa8MP-RAS314 via PCIe (for WiFi) and UART (for a wireless function). The theoretically achievable maximum data rate of the LBEE5XV1YM is 866 Mbit/s.

The antennas have to be connected separately to the U.FL-R-SMT-1(10) sockets (X10, X11) and are not part of the MBa8MPRAS314.

TQMa8MPxL
PCIE

WiFi module

PCIE

RF_A

UART2

UART

GPIO

Control

RF_B

U.FL U.FL

Figure 10:

Block diagram WiFi

3.3.6

Debug UART

For debug functionalities UART3 and UART4 are provided as virtual COM ports via USB.

TQMa8MPxL UART4 UART3

Level translator

Bridge UART UART
USB

USB-Debug (Micro-USB)

Figure 11: Block diagram UARTs

The CP2105-bridge is bus-powered so that the COM port on the PC side is maintained even if the mainboard power supply is interrupted.

3.3.7

Camera Interface

A camera interface provided by the TQMa8MPxL is routed to connector X5 (Type 1-1734248-5) on the MBa8MP-RAS314. The GPIO signals of the interface are connected to the GPIO2 signals (GPIO2_6/_7) of the TQMa8MPxL. The I2C bus operate at 1.8 V and is connected to I2C2 on the MBa8MP-RAS314. Common mode chokes have to be located at the source on camera module. "Camera Module v2" and "HQ Camera" from raspberrypi.org have common mode chokes onboard.

TQMa8MPxL
MIPI_CSI1 I2C2

CAM_GPIO1

CAM_GPIO2

OPT

Camera

Figure 12: Block diagram MIPI CSI

Table 9:

Pinout Camera Interface, X5

Signal

1 GND 2 MIPI_CSI1_DATA0_N 3 MIPI_CSI1_DATA0_P 4 GND 5 MIPI_CSI1_DATA1_N 6 MIPI_CSI1_DATA1_P 7 GND 8 MIPI_CSI1_CLK_N 9 MIPI_CSI1_CLK_P 10 GND 11 CAM_GPIO1 12 CAM_GPIO2 13 I2C2_SCL 14 I2C2_SDA 15 V_3V3_MB

Remark
Enable LED (optional) max. 1.0 A

Page 20

3.3.8

Display Interface

A display interface provided by the TQMa8MPxL is routed to connector X6 (Type 1-1734248-5) on the MBa8MP-RAS314.

Table 10: Pinout Display Interface, X6

Signal

1 GND 2 MIPI_DSI1_DATA1_N_L 3 MIPI_DSI1_DATA1_P_L 4 GND 5 MIPI_DSI1_CLK_N_L 6 MIPI_DSI1_CLK_P_L 7 GND 8 MIPI_DSI1_DATA0_N_L 9 MIPI_DSI1_DATA0_P_L

10 GND

11 I2C2_SCL

12 I2C2_SDA

13 GND

14 15

V_3V3_MB

Remark

max. 1.0 A

3.3.9

LVDS

The i.MX 8M Plus offers an LVDS controller with a dual LVDS interface. Each of the interfaces uses four differential lanes. On the MBa8MP-RAS314 there is one interface for connecting Single LVDS. In addition, two GPIO (BLT_EN, RESET#), a PWR_EN and a PWM signal are provided. GPIO1_IO03, GPIO1_IO01, GPIO1_IO07 and GPIO1_IO09 are used for these four 3.3 V signals. Both LVDS interfaces - Data and CMD use DF19 connectors.

The USB signals of the CMD connector are optional connected to port 4 of the USB 3.0 hub (see 3.3.3).

TQRMESaE8TM, BPLxTL_EN,
PWRL_VEDNS,0 CONTRAST/PWM

5 V / 3.3 V

LVDS Data

USB

5 V / 12 V
LVDS Control USB 3.0 Hub optional

Figure 13: Block diagram LVDS

Table 11:

Pinout LVDS data, X7
Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20

Signal LVDS0_D0_N LVDS0_D0_P LVDS0_D1_N LVDS0_D1_P LVDS0_D2_N LVDS0_D2_P
GND LVDS0_CLK_N LVDS0_CLK_P LVDS0_D3_N LVDS0_D3_P
GND
V_5V_LVDS0
V_3V3_LVDS0

Table 12: Pinout LVDS control, X8
Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14

Signal
V_12V
GND V_5V_SW
GND V_VBUS30_H4_LVDS
GND USB_LVDS_DN USB_LVDS_DP
GND LVDS0_RESET# LVDS0_BLT_EN LVDS0_PWR_EN LVDS_PWM

Remark

max. 1.0 A
max. 1.0 A
Remark max. 1.0 A
max. 0.5 A
optional optional 10 k PD 10 k PD 10 k PD

Page 21

Page 22

3.3.10 HDMI
The HDMI_TX interface of the TQMa8MPxL is provided on the MBa8MP-RAS314 on an HDMI connector. Between TQMa8MPxL and HDMI socket is a "HDMI signal conditioning chip", which converts the levels and provides ESD protection. The HDMI_ARC_N and HDMI_ARC_P signals have capacitors between the module and the connector according to the EARC specification.

TQMa8MPxL
HDMI
Figure 14: Block diagram HDMI

HDMI signal conditioning

HDMI socket

Table 13:
Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 M1...M4

Pinout HDMI connector, X9
Signal HDMI_DATA2_P GND HDMI_DATA2_N HDMI_DATA1_P GND HDMI_DATA1_N HDMI_DATA0_P GND HDMI_DATA0_N HDMI_CLK_P GND HDMI_CLK_N HDMI_CEC HDMI_ARC_P HDMI_DDC_SCL HDMI_DDC_SDA GND HDMI_5V_OUT HDMI_ARC_N Shield/GND

Remark 1.87 k PU to HDMI_5V_OUT 1.87 k PU to HDMI_5V_OUT max. 0.5 A

Preliminary User's Manual l MBa8MP-RAS314 UM 0003 l © 2024, TQ-Systems GmbH
3.3.11 Audio A Texas Instruments TLV320 audio codec is assembled. It is configured via SAI5 and controlled by the I2C4 bus. The audio codec provides microphone (mono) and headphone at a 3.5 mm jack on the MBa8MP-RAS314. The supply voltage and signal level operate at 1.8 V. The jack socket is ESD protected. Headphone can become Line out by replacement of resistors R75/76 to R72/74.

TQMA8MPxL
SAI5 I2C4

Audio Codec TLV320

Figure 15: Block diagram audio interface

Headphone MIC

3.5 mm Jack

Page 23

Table 14: Pinout audio connector X3

Pin 1 4A, 4B 3 2

Signal MIC_IN HEADPHONE_L HEADPHONE_R AGND_AUDIO

Remark Optional connection to LOL Optional connection to LOR

3.3.12 ECSPI
The ECSPI3 interface signals from the TQMa8MPxL are connected to the GPIO header X1. There they can be also used as GPIO control signals.

3.3.13 SPDIF
The SPDIF interface is not used as such on the MBa8MP-RAS314, but can be provided on the GPIO header if required. By default these module signals are configured as I2C5 and GPIO.

Table 15: SPDIF signal usage
TQMa8MPxL signal SPDIF_EXT_CLK SPDIF_IN SPDIF_OUT

MBa8MP-RAS314 usage GPIO21 GPIO2 / I2C5_SDA GPIO3 / I2C5_SCL

Remark 2.2 k PU to V_3V3_MB 2.2 k PU to V_3V3_MB

3.3.14 GPT The MBa8MP-RAS314 provides up to three general purpose timer signals. They are connected to the GPIO header.
3.3.15 PWM The MBa8MP-RAS314 provides two PWM signals. They are connected to the GPIO header.
3.3.16 UART The MBa8MP-RAS314 provides one UART interface connected to the GPIO header. The interface includes besides RXD and TXD also CTS and RTS signals.

Page 24

3.3.17 USDHC
The USDHC1 interface of the TQMa8MPxL is provided at the GPIO header of the MBa8MP-RAS314. It can be used as a 4-bit wide SDIO interface.

3.3.18 GPIO header
Nearly all GPIOs provided by the TQMa8MPxL are used as control signals on the MBa8MP-RAS314 and are therefore not available. GPIOs can however be configured from signals available at the pin header. The GPIO signal level is 3.3 V.

A complete list of all possible GPIO pins can be found in the i.MX 8M Plus data sheet (1).

Table 16: Pinout GPIO header, X1

Alternative
GPIO21 GPIO31 GPIO4
GPIO17 GPIO27 GPIO22
GPIO10 GPIO9 GPIO11
GPIO0 GPIO5 GPIO6 GPIO13
GPIO26

Signal V_3V3_MB
I2C5_SDA I2C5_SCL GPT1_CLK GND UART1_RTS USDHC1_DATA3 USDHC1_CLK V_3V3_MB ECSPI3_MOSI ECSPI3_MISO ECSPI3_SCLK GND I2C3_SDA (ID) GPT2_CLK GPT3_CLK
PWM4 GPIO19
USDHC1_DATA2 GND

Pin Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40

Signal
V_5V_SW
GND UART1_TXD UART1_RXD
GPIO18 GND
USDHC1_CMD USDHC1_DATA0
GND USDHC1_DATA1
(SS1) ECSPI3_SS0 I2C3_SCL (ID)
GND PWM3
GND UART1_CTS
GPIO20 GPIO21

Alternative
GPIO14 GPIO15
GPIO23 GPIO24 GPIO25 GPIO8 GPIO7 GPIO1 GPIO12 GPIO16

1 2.2 k PU to V_3V3_MB

Page 25

3.4

User interfaces and diagnostic

3.4.1

Boot Mode configuration

The Boot Mode is set with the 4-fold DIP switch S4 at the four i.MX 8M Plus pins Boot_Mode[3:0]. Information on the boot configuration of the i.MX 8M Plus can be found in the i.MX 8M Plus documentation; see Table 31.

Table 17:

Boot Source options TQMa8MPxL Boot Mode[3:0] 0 0 0 0 0 0 0 1 0 0 1 0 0 0 1 1 0 1 0 x 0 1 1 0 0 1 1 1 1 0 0 0

Boot Source Boot from eFuses USB Serial Downloader Boot from eMMC (USDHC3) Boot from SD card (USDHC2) Boot from NAND (not supported) Boot from QSPI (3-Byte Read) Boot from Hyperflash 3.3 V (not supported) Boot from eCSPI (not supported)

3.4.2

Reset buttons

More information can be found in chapter 3.1.6

3.4.3

Status LEDs

The MBa8MP-RAS314 offers diagnosis and status LEDs (plus the ones in the RJ45 connectors) to signal the system status.

Table 18: Interface
USB
USB debug User LED
Power
Reset SD-Card Ethernet

Status LEDs

Ref.

Colour

Indication

Green Status V_VBUS30_H1 (lit when USB 3.0 port 1 is active)

Green Status V_VBUS30_H2 (lit when USB 3.0 port 2 is active)

Green Status V_VBUS30_H3 (lit when USB 3.0 port 3 is active)

Green Status V_VBUS30_H4 (lit when USB 3.0 port 4 is active)

Green Status 3.45 V Debug (lit when 3.45 V of Silicon Labs chip is active)

Green USER_LED1 (lit when ENET_RX_ER is active)

Orange USER_LED2 (lit when ENET_TX_ER is active)

V11

Green Status V_5V_MOD (lit when active)

V12

Green Status V_3V3_MB (lit when active)

V13

Green Status 12 V MBa8MP-RAS314 (lit when 12 V for MBa8MP-RAS314 is active)

V14

Green Status V_5V_SW (lit when active)

V15

Green Status V_1V8 (lit when active)

Red

Reset LED (lit when RESET_OUT# is low)

Green Status V_3V3_SD (lit when active)

X15

Green/Green ETH0 - Link/Activity

X16

Green/Green ETH1 - Link/Activity

Page 26

3.4.4

JTAG®

The JTAG® port of the i.MX 8M Plus is routed to a standard ARM® 10-pin JTAG® connector (X17) on the MBa8MP-RAS314. JTAG_SRST# is connected to RESET_IN# via a buffer. The same reset can be executed as with reset button S1. The JTAG® interface is not ESD protected.

TQMa8MPxL
JTAG_TCK JTAG_TDI JTAG_TDO JTAG_TMS
Figure 16: Block diagram JTAG

10-pin Header

The following table shows the JTAG® connector pinout.

Table 19: Pinout JTAG® pin header, X17

Signal

Vref / VCC

JTAG_TMS

GND

JTAG_TCK

GND

JTAG_TDO

Key

JTAG_TDI

GND_DETECT

JTAG_SRST#

3.3 V (NC) 10 k PD RESET_IN#, 10 k PU

Remark

Page 27

SOFTWARE

No software is required for the MBa8MP-RAS314. Suitable software is only required on the TQMa8MPxL and is not a part of this Preliminary User's Manual. More information can be found in the TQ-Support Wiki for the TQMa8MPxL.

MECHANICS

5.1

MBa8MP-RAS314 dimensions

The MBa8MP-RAS314 has overall dimensions (length × width) of 100 mm × 100 mm. The height without heatspreader and heatsink is approximately 20.5 mm. The MBa8MP-RAS314 including TQMa8MPxL weighs approximately 95 grams.

Figure 17:

Dimensions MBa8MP-RAS314

5.2

Embedding in the overall system

The MBa8MP-RAS314 serves as a design base for customer products, as well as a platform to support during development.

5.3

Thermal management

The combination of MBa8MP-RAS314 and TQMa8MPxL has a power consumption of approximately TBD watts. Further power consumption occurs mainly at externally connected devices.

Attention: TQMa8MPxL heat dissipation
The i.MX 8M Plus belongs to a performance category in which a cooling system is essential. It is the user's sole responsibility to define a suitable heat sink (weight and mounting position) depending on the specific mode of operation (e.g., dependence on clock frequency, stack height, airflow, and software). Particularly the tolerance chain (PCB thickness, board warpage, BGA balls, BGA package, thermal pad, heatsink) as well as the maximum pressure on the TQMa8MPxL must be taken into consideration when connecting the heat sink. The TQMa8MPxL is not the highest component. Inadequate cooling connections can lead to overheating of the TQMa8MPxL or the MBa8MP-RAS314 and thus malfunction, deterioration or destruction.

5.4

Component placement & labeling

Page 28

Figure 18: MBa8MP-RAS314 component placement top

Page 29

AK1 AK2

Figure 19: MBa8MP-RAS314 component placement bottom

The labels on the MBa8MP-RAS314 show the following information:

Table 20: Label
AK1 AK2

Labels on MBa8MP-RAS314 Content
MBa8MP-RAS314 version and revision, tests performed Serial number

SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS

6.1

EMC

Since the MBa8MP-RAS314 is a development platform, no EMC tests have been performed.

Page 30

6.2

ESD

Most interfaces provide ESD protection. Details are to be taken from the MBa8MP-RAS314 schematics.

6.3

Operational safety and personal security

Tests for operational safety and personal protection were not carried out due to the voltages 30 V DC.

6.4

Cyber Security

A Threat Analysis and Risk Assessment (TARA) must always be performed by the customer for their individual end application, as the MBa8MP-RAS314 is only a sub-component of an overall system.

6.5

Intended Use

TQ DEVICES, PRODUCTS AND ASSOCIATED SOFTWARE ARE NOT DESIGNED, MANUFACTURED OR INTENDED FOR USE OR RESALE FOR THE OPERATION IN NUCLEAR FACILITIES, AIRCRAFT OR OTHER TRANSPORTATION NAVIGATION OR COMMUNICATION SYSTEMS, AIR TRAFFIC CONTROL SYSTEMS, LIFE SUPPORT MACHINES, WEAPONS SYSTEMS, OR ANY OTHER EQUIPMENT OR APPLICATION REQUIRING FAIL-SAFE PERFORMANCE OR IN WHICH THE FAILURE OF TQ PRODUCTS COULD LEAD TO DEATH, PERSONAL INJURY, OR SEVERE PHYSICAL OR ENVIRONMENTAL DAMAGE. (COLLECTIVELY, "HIGH RISK APPLICATIONS")

You understand and agree that your use of TQ products or devices as a component in your applications are solely at your own risk. To minimize the risks associated with your products, devices and applications, you should take appropriate operational and design related protective measures.

You are solely responsible for complying with all legal, regulatory, safety and security requirements relating to your products. You are responsible for ensuring that your systems (and any TQ hardware or software components incorporated into your systems or products) comply with all applicable requirements. Unless otherwise explicitly stated in our product related documentation, TQ devices are not designed with fault tolerance capabilities or features and therefore cannot be considered as being designed, manufactured or otherwise set up to be compliant for any implementation or resale as a device in high risk applications. All application and safety information in this document (including application descriptions, suggested safety precautions, recommended TQ products or any other materials) is for reference only. Only trained personnel in a suitable work area are permitted to handle and operate TQ products and devices. Please follow the general IT security guidelines applicable to the country or location in which you intend to use the equipment.

6.6

Export Control and Sanctions Compliance

The customer is responsible for ensuring that the product purchased from TQ is not subject to any national or international export/import restrictions. If any part of the purchased product or the product itself is subject to said restrictions, the customer must procure the required export/import licenses at its own expense. In the case of breaches of export or import limitations, the customer indemnifies TQ against all liability and accountability in the external relationship, irrespective of the legal grounds. If there is a transgression or violation, the customer will also be held accountable for any losses, damages or fines sustained by TQ. TQ is not liable for any delivery delays due to national or international export restrictions or for the inability to make a delivery as a result of those restrictions. Any compensation or damages will not be provided by TQ in such instances.

The classification according to the European Foreign Trade Regulations (export list number of Reg. No. 2021/821 for dual-usegoods) as well as the classification according to the U.S. Export Administration Regulations in case of US products (ECCN according to the U.S. Commerce Control List) are stated on TQ´s invoices or can be requested at any time. Also listed is the Commodity code (HS) in accordance with the current commodity classification for foreign trade statistics as well as the country of origin of the goods requested/ordered.

Page 31

6.7

Warranty

TQ-Systems GmbH warrants that the product, when used in accordance with the contract, fulfills the respective contractually agreed specifications and functionalities and corresponds to the recognized state of the art. The warranty is limited to material, manufacturing and processing defects. The manufacturer's liability is void in the following cases:
· Original parts have been replaced by non-original parts. · Improper installation, commissioning or repairs. · Improper installation, commissioning or repair due to lack of special equipment. · Incorrect operation · Improper handling · Use of force · Normal wear and tear

CLIMATIC AND OPERATIONAL CONDITIONS

In general reliable operation is given when the following conditions are met:

Table 21: Climatic and operational conditions MBa8MP-RAS314

Parameter Ambient temperature Storage temperature Relative humidity (operation / storing)

Range TBD TBD TBD

Remark Not condensing

Attention: TQMa8MPxL heat dissipation
The i.MX 8M Plus belongs to a performance category in which a cooling system is essential.
It is the user's sole responsibility to define a suitable heat sink (weight and mounting position) depending on the specific mode of operation (e.g., dependence on clock frequency, stack height, airflow, and software).
Particularly the tolerance chain (PCB thickness, board warpage, BGA balls, BGA package, thermal pad, heatsink) as well as the maximum pressure on the TQMa8MPxL must be taken into consideration when connecting the heat sink. The TQMa8MPxL is not the highest component. Inadequate cooling connections can lead to overheating of the TQMa8MPxL or the MBa8MP-RAS314 and thus malfunction, deterioration or destruction.

7.1

Protection against external effects

Protection class IP00 was defined for the MBa8MP-RAS314. There is no protection against foreign objects, touch or humidity.

7.2

Reliability and service life

No detailed MTBF calculation has been done for the MBa8MP-RAS314. The MBa8MP-RAS314 is designed to be insensitive to vibration and impact.

Page 32

ENVIRONMENT PROTECTION

8.1

RoHS

The MBa8MP-RAS314 is manufactured RoHS compliant. All components, assemblies and soldering processes are RoHS compliant.

8.2

WEEE®

The final distributor is responsible for compliance with the WEEE® regulation. Within the scope of the technical possibilities, the MBa8MP-RAS314 was designed to be recyclable and easy to repair.

8.3

REACH®

The EU-chemical regulation 1907/2006 (REACH® regulation) stands for registration, evaluation, certification and restriction of substances SVHC (Substances of very high concern, e.g., carcinogen, mutagen and/or persistent, bio accumulative and toxic). Within the scope of this juridical liability, TQ-Systems GmbH meets the information duty within the supply chain with regard to the SVHC substances, insofar as suppliers inform TQ-Systems GmbH accordingly.

8.4

EuP

The Ecodesign Directive, also Energy using Products (EuP), is applicable to products for the end user with an annual quantity >200,000. The MBa8MP-RAS314 must therefore always be seen in conjunction with the complete device. The available standby and sleep modes of the components on the MBa8MP-RAS314 enable compliance with EuP requirements for the MBa8MP-RAS314.

8.5

Statement on California Proposition 65

California Proposition 65, formerly known as the Safe Drinking Water and Toxic Enforcement Act of 1986, was enacted as a ballot initiative in November 1986. The proposition helps protect the state's drinking water sources from contamination by approximately 1,000 chemicals known to cause cancer, birth defects, or other reproductive harm ("Proposition 65 Substances") and requires businesses to inform Californians about exposure to Proposition 65 Substances. The TQ device or product is not designed or manufactured or distributed as consumer product or for any contact with endconsumers. Consumer products are defined as products intended for a consumer's personal use, consumption, or enjoyment. Therefore, our products or devices are not subject to this regulation and no warning label is required on the assembly. Individual components of the assembly may contain substances that may require a warning under California Proposition 65. However, it should be noted that the Intended Use of our products will not result in the release of these substances or direct human contact with these substances. Therefore you must take care through your product design that consumers cannot touch the product at all and specify that issue in your own product related documentation. TQ reserves the right to update and modify this notice as it deems necessary or appropriate.

8.6

Packaging

The MBa8MP-RAS314 is delivered in reusable packaging.

8.7

Batteries

The MBa8MP-RAS314 does not require a battery and therefore does not use batteries containing mercury (Hg), cadmium (Cd) or lead (Pb).

8.8

Other entries

By environmentally friendly processes, production equipment and products, we contribute to the protection of our environment. To be able to reuse the MBa8MP-RAS314, it is produced in such a way (a modular construction) that it can be easily repaired and disassembled. The energy consumption of the MBa8MP-RAS314 is minimised by suitable measures. Because currently there is still no technical equivalent alternative for printed circuit boards with bromine-containing flame protection (FR-4 material), such printed circuit boards are still used. No use of PCB containing capacitors and transformers (polychlorinated biphenyls). These points are an essential part of the following laws:
· The law to encourage the circular flow economy and assurance of the environmentally acceptable removal of waste as at 27.9.94 (Source of information: BGBl I 1994, 2705)
· Regulation with respect to the utilization and proof removal as at 1.9.96 (Source of information: BGBl I 1996, 1382, (1997, 2860))
· Regulation with respect to the avoidance and utilization of packaging waste as at 21.8.98 (Source of information: BGBl I 1998, 2379)
· Regulation with respect to the European Waste Directory as at 1.12.01 (Source of information: BGBl I 2001, 3379)

This information is to be seen as notes. Tests or certifications were not carried out in this respect.

APPENDIX

9.1

Acronyms and definitions

The following acronyms and abbreviations are used in this document:

Table 22: Acronyms

Acronym
ADC AI ARM® BGA BIOS CAN CAN FD CCM CPU CSI DIP DNC DP DSI eCSPI eDP EEPROM EMC eMMC ESD EU EuP FPS FR-4 GP GPIO GPT HD HDMI HSS I I/O I2C IEEE® IP00 JTAG® LCD LED LGA LPDDR4 LVDS

Meaning Analog/Digital Converter Artificial Intelligence Advanced RISC Machine Ball Grid Array Basic Input/Output System Controller Area Network Controller Area Network Flexible Data-Rate Clock Control Module Central Processing Unit Camera Serial Interface Dual In-line Package Do Not Connect DisplayPort Display Serial Interface enhanced Capability Serial Peripheral Interface embedded DisplayPort Electrically Erasable Programmable Read-Only Memory Electromagnetic Compatibility embedded Multimedia Card (Flash) Electrostatic Discharge European Union Energy using Products Frames Per Second Flame Retardant 4 General Purpose General Purpose Input/Output General Purpose Timer High Density (graphics) High-Definition Multimedia Interface High-Side Switch Input Input/Output Inter-Integrated Circuit Institute of Electrical and Electronics Engineers Ingress Protection 00 Joint Test Action Group Liquid Crystal Display Light Emitting Diode Land Grid Array Low-Power DDR4 Low Voltage Differential Signal

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9.1

Acronyms and definitions (continued)

Table 23: Acronyms (continued)

Acronym
MAC MIC MIPI ML MTBF NAND NC NMI NOR NP O OTG P PCB PCIe PCMCIA PD PHY PMIC PU PWM QSPI REACH® RGMII RJ45 RoHS RPM RTC SAI SD SDHC SDRAM SIM SPDIF SVHC TSE UART UHS UM UN USB uSDHC WEEE® ZIF

Meaning Media Access Controller Microphone Mobile Industry Processor Interface Machine Learning Mean operating Time Between Failures Not-And (flash memory) Not Connected Non-Maskable Interrupt Not-Or Not Placed Output On-The-Go Power Printed Circuit Board Peripheral Component Interconnect express People Can't Memorize Computer Industry Acronyms Pull-Down Physical (layer of the OSI model) Power Management Integrated Circuit Pull-Up Pulse-Width Modulation Quad Serial Peripheral Interface Registration, Evaluation, Authorisation (and restriction of) Chemicals Reduced Gigabit Media-Independent Interface Registered Jack 45 Restriction of (the use of certain) Hazardous Substances Revolutions Per Minute Real-Time Clock Serial Audio Interface Secure Digital Secure Digital High Capacity Synchronous Dynamic Random Access Memory Subscriber Identification Module Sony-Philips Digital Interface Format Substances of Very High Concern Trust Secure Element Universal Asynchronous Receiver/Transmitter Ultra-High Speed User's Manual United Nations Universal Serial Bus Ultra-Secured Digital Host Controller Waste Electrical and Electronic Equipment Zero Insertion Force

Page 34

Page 35

9.2

References

Table 23: Further applicable documents

No.

Name

(1)

i.MX 8M Plus Applications Processor Data Sheet

(2)

i.MX 8M Plus Applications Processor Reference Manual

(3)