SG F1 Smart Module
Specifications
- Product: F1 Smart Module
- Order Part Number: SGW3501
- Equipped with: BLE, Wi-Fi, LoRa(WAN), and LTE CAT-M1/NB1/NB2
- Microcontroller: MicroPython programmable
- Connectivity Options: Various
Product Information
Introduction
The F1 Smart Module is a compact OEM module that supports BLE, Wi-Fi, LoRa(WAN), and LTE CAT-M1/NB1/NB2 connectivity options. It runs on a MicroPython programmable microcontroller and provides easy access to the SG Wireless Ctrl. Cloud Platform for IoT application development.
Order Part Number Description
| Order Part Number | Description |
|---|---|
| SGW3531 | F1’s Smart Module: BLE, Wi-Fi, LoRa, LTE & Secure element |
| SGW3501 | F1 Smart Module: BLE, Wi-Fi, LoRa, LTE |
Module Interface
- Power Management
Instructions on how to manage power for the module. - Memory Allocation
Guidelines for memory allocation for optimal performance.
Introduction
The F1 Smart Module (order part number SGW3501) is a compact OEM module equipped with BLE, Wi-Fi, LoRa(WAN), and LTE CAT-M1/NB1/NB2 to support various connectivity needs. Running on a MicroPython-programmable microcontroller with a no-barrier entry into the SG Wireless Ctrl. Cloud Platform, the module enables truly limitless IoT application development with multi-network creation flexibility and rapid scaling capacity. The F1 Smart Module has four variants with various connectivity options; under each variant, there are two sub-variants with advanced security element options.
- Multi-connectivity:
- Wi-Fi 802.11b/g/n (2.4GHz)
- Bluetooth BLE 5.0
- Cellular LTE-CAT M1/NB1/NB2
- Semtech LoRa(WAN) 868MHz/915MHz
- Powerful Espressif ESP32 S3 CPU
- MicroPython programmable with 27 IOs on module pads
- SMT-friendly semi-hole pins at module edges
- Operating temperature: 0°C to 85°C
- Advanced Security IC NXP SE050 (for “s” suffix models)
- Compact size-to-functionality ratio: 42.6mm x 17.6mm x 3.6mm
| Order Part Number | Description |
| SGW3531 | F1s Smart Module: BLE, Wi-Fi, LoRa, LTE & Secure element |
| SGW3501 | F1 Smart Module: BLE, Wi-Fi, LoRa, LTE |
| SGW3431 | F1/Cs Cellular Module: BLE, Wi-Fi, LTE & Secure element |
| SGW3401 | F1/C LoRa Module: BLE, Wi-Fi, LTE |
| SGW3231 | F1/Ls LoRa Module: BLE, Wi-Fi, LoRa & Secure element |
| SGW3201 | F1/L LoRa Module: BLE, Wi-Fi, LoRa |
| SGW3131 | F1/Ws Wi-Fi BLE Module: BLE, Wi-Fi & Secure element |
| SGW3101 | F1/W Wi-Fi BLE Module: BLE, Wi-Fi |
General Features
a. Feature Specifications
| CPU |
| · Xtensa® dual-core 32-bit LX7 microprocessor, up to 240Mhz
· On-chip 384KB ROM and 512KB SRAM, on-board 8MB PSRAM and 16MB Flash · Deep Sleep Mode: 10µA |
| Wi-Fi/BLE |
| · Espressif ESP32-S3 on-chip RF frontend
· Wi-Fi: IEEE 802.11b/g/n (2.4GHz band); Data Rate: 1M up to 54Mbps (MCS7); Max Tx Power: 20dBm · BLE: Bluetooth LE 5.0, Bluetooth mesh; Data Rate: 125kbps to 2Mbps; Max Tx Power: 20dBm |
| LTE |
| · Sequans Monarch2 GM02S for CAT-M1, CAT-NB1 and CAT-NB2 support
· LTE CAT-M1/NB1/NB2 transmit power up to +23dBm · PTCRB and GCF 1.3 3GPP release 13 compliant; Operator Approval: Verizon, AT&T, T-Mobile, Vodafone, Orange |
| LoRa |
| · Semtech SX1262 RF transceiver, 868/915MHz LPWAN Module
· TX Power: Up to +22dBm; Sensitivity: -127dBm · LoRaWAN stack – Class A and Class C Device |
b. Block Diagram
Electrical Specifications
a. Absolute Rating and Operating Conditions
Table 1: Absolute Rating and Operating Conditions Specifications
| Symbol | Parameter | Min | Typ | Max | Unit |
| Absolute Rating | |||||
| +VBATT | Supply voltage to Sequans GM02S LTE module | 5.0 | 5.8 | V | |
| +3V3 | Supply voltage to Espressif ESP32-S3 and module main circuit | 3.0 | 3.3 | 3.6 | V |
| +1V8_OUT* | SPI supply voltage (output) of SPI flash and PSRAM for decoupling capacitor connection | 1.8 | 2.3 | V | |
| T(OPR) | Operating temperature | -40 | 85 | °C | |
| Operating Conditions | |||||
| +VBATT | Supply voltage to Sequans GM02S LTE module | 2.5 | 5.0 | 5.5 | V |
| +3V3 | Supply voltage to Espressif ESP32-S3 and module main circuit | 3.2 | 3.3 | 3.4 | V |
| +1V8_OUT* | SPI supply voltage (output) of SPI flash and PSRAM for decoupling capacitor connection | 1.7 | 1.8 | 1.9 | V |
| CPU IO (3.3V power domain, VDD=3.3V) | |||||
| VIH | Input high voltage for GPIOs | 0.75 x VDD | VDD + 0.3 | V | |
| VIL | Input low voltage for GPIOs | -0.3 | 0.25 x VDD | V | |
| VOH | Input high voltage for GPIOs | 0.8 x VDD | V | ||
| VOL | Input low voltage for GPIOs | 0.1 x VDD | V | ||
| Radio IO (1.8V power domain) | |||||
| VIH | Input high voltage for GPIOs | 1.26 | 1.8 | V | |
| VIL | Input low voltage for GPIOs | 0 | 0.54 | V | |
| VOH | Input high voltage for GPIOs | 1.44 | 1.8 | V | |
| VOL | Input low voltage for GPIOs | 0 | 0.36 | V | |
The +1V8_OUT pin is to connect an external capacitor to the module internal SPI flash and PSRAM for a more robust VDD_SPI supply. This pin should not be connected to any external circuits that may draw more than 20mA. The voltage of this pin will vary in module light sleep mode and approach zero in module deep sleep mode.
b. Wi-Fi
Standard: 802.11b/g/n (2.4GHz ONLY) – 1T1R
Table 2: Wi-Fi Specifications
| Parameter | Description | Min | Typ | Max | Unit |
| General | |||||
| Freq. (EU) | Operating frequency (EU) | 2.402 | 2.482 | GHz | |
| Ch. (EU) | Channel (EU) | 1 | 13 | ||
| Freq. (US) | Operating frequency (US) | 2.402 | 2.472 | GHz | |
| Ch. (US) | Channel (US) | 1 | 11 | ||
| Power max. (EU/US) | Maximum power (EU/US) | 20 | dBm | ||
| Tx | |||||
| Tx Power @B – 1Mbps | Tx power at B mode with data rate 1Mbps | 18 | 20 | dBm | |
| EVM (Peak) @B – 1Mbps | EVM(Peak) at B mode with data rate 1Mbps | 8 | % | ||
| Freq. Err. @B – 1Mbps | Frequency error at B mode with data rate 1Mbps | -40 | 0 | 40 | kHz |
| Tx Power
@G – 54Mbps |
Tx power at G mode with data rate 54Mbps | 16 | 20 | dBm | |
| EVM (RMS)
@G – 54Mbps |
EVM(RMS) at G mode with data rate 54Mbps | -25 | dB | ||
| Freq. Err.
@G – 54Mbps |
Frequency error at G mode with data rate 54Mbps | -40 | 0 | 40 | kHz |
| Tx Power @N20 – MCS7 | Tx power at N mode with data rate MCS7 and 20MHz bandwidth | 15 | 20 | dBm | |
| EVM (RMS) @N20 – MCS7 | EVM rms at N mode with data rate MCS7 and 20MHz bandwidth | -27 | dB | ||
| Freq. Err. @N20 – MCS7 | Frequency error @ N mode with data rate MCS7 and 20MHz bandwidth | -40 | 0 | 40 | kHz |
| Tx Power @B – 1Mbps | Tx power at B mode with data rate 1Mbps | 18 | 20 | dBm | |
| Rx | |||||
| Rx Sens. @B – 1Mbps | Tx power at B mode with data rate 1Mbps | -92.0 | -82.0 | dBm | |
| Rx Sens.
@G – 54Mbps |
Tx power at G mode with data rate 54Mbps | -76.5 | -66.0 | dBm | |
| Rx Sens. @N20 – MCS7 | Tx power at N mode with data rate MCS7 and 20MHz bandwidth | -71.4 | -64.0 | dBm | |
c. Bluetooth
Standard: BLE 5.0 – 1T1
Table 3: Bluetooth Specifications
| Parameter | Description | Min | Typ | Max | Unit |
| General | |||||
| Freq. | Operating frequency | 2.4000 | 2.4835 | GHz | |
| Ch. | Channel | 0 | 39 | ||
| Power max. | Maximum power | 20 | dBm | ||
| Tx | |||||
| Tx Power @Ch.37 – 1 Mbps | Tx power at channel 37 (freq.=2402MHz) with data rate 1Mbps | 17 | 20 | dBm | |
| Freq. Err. @Ch.37 – 1Mbps | Frequency error at channel 37 (freq.=2402MHz) with data rate 1Mbps | -50 | 0 | 50 | % |
| Tx Power @Ch.38 – 1Mbps | Tx power at channel 38 (freq.=2426MHz) with data rate 1Mbps | 17 | 20 | kHz | |
| Freq. Err. @Ch.38 – 1Mbps | Frequency error at channel 38 (freq.=2426MHz) with data rate 1Mbps | -50 | 0 | 50 | dBm |
| Tx Power @Ch.39 – 1Mbps | Tx power at channel 39 (freq.=2480MHz) with data rate 1Mbps | 17 | 20 | dBm | |
| Freq. Err. @Ch.39 – 1Mbps | Frequency error at channel 39 (freq.=2480MHz) with data rate 1Mbps | -50 | 0 | 50 | kHz |
| Rx | |||||
| Rx Sens. @Ch.38 – 2Mbps | Tx power at channel 38 (freq.=2426MHz) with data rate 2Mbps | -93.5 | dBm | ||
| Rx Sens. @Ch.38 – 1Mbps | Tx power at channel 38 (freq.=2426MHz) with data rate 1Mbps | -97.5 | -70.0 | dBm | |
| Rx Sens.
@Ch.38 – 500kbps |
Tx power at channel 38 (freq.=2426MHz) with data rate 500kbps | -100.0 | dBm | ||
d. LTE
Standard: CAT-M1, CAT-NB1, CAT-NB2
Table 4: LTE Frequency Bands (in MHz)
| Band No. | Duplex Type | Uplink Frequency (MHz) | Uplink Bandwidth (MHz) | Downlink Frequency (MHz) | Downlink Bandwidth (MHz) | For LTE-M | For
NB-IoT |
| 1 | FDD | 1920 – 1980 | 60 | 2110 – 2170 | 60 | ü | ü |
| 2 | FDD | 1850 – 1910 | 60 | 1930 – 1990 | 60 | ü | ü |
| 3 | FDD | 1710 – 1785 | 75 | 1805 – 1880 | 75 | ü | ü |
| 4 | FDD | 1710 – 1755 | 45 | 2110 – 2155 | 45 | ü | ü |
| 5 | FDD | 824 – 849 | 25 | 869 – 894 | 25 | ü | ü |
| 8 | FDD | 880 – 915 | 35 | 925 – 960 | 35 | ü | ü |
| 12 | FDD | 699 – 716 | 17 | 729 – 746 | 17 | ü | ü |
| 13 | FDD | 777 – 787 | 10 | 746 – 756 | 10 | ü | ü |
| 14 | FDD | 788 – 798 | 10 | 758 – 768 | 10 | ü | ü |
| 17 | FDD | 704 – 716 | 12 | 734 – 746 | 12 | û | ü |
| 18 | FDD | 815 – 830 | 15 | 860 – 875 | 15 | ü | ü |
| 19 | FDD | 830 – 845 | 15 | 875 – 890 | 15 | ü | ü |
| 20 | FDD | 832 – 862 | 30 | 791 – 821 | 30 | ü | ü |
| 25 | FDD | 1850 – 1915 | 65 | 1930 – 1995 | 65 | ü | ü |
| 26 | FDD | 814 – 849 | 35 | 859 – 894 | 35 | ü | ü |
| 28 | FDD | 703 – 748 | 45 | 758 – 803 | 45 | ü | ü |
| 66 | FDD | 1710 – 1780 | 70 | 2110 – 2200 | 90 | ü | ü |
| 85 | FDD | 698 – 716 | 18 | 728 – 746 | 18 | ü | ü |
Table 5: LTE Specifications
| Parameter | Description | Min | Typ | Max | Unit |
| General | |||||
| Power max. | Maximum power | 23 | dBm | ||
| Tx | |||||
| Tx power @Band 8 (900MHz GSM) | Tx power at Band 8 (900MHz GSM) | 22 | 23 | dBm | |
| Tx power @Band 2 (1900MHz PCS) | Tx power at Band 2 (1900MHz PCS) | 22 | 23 | dBm | |
| Rx | |||||
| Rx sens. @Band 8 (900MHz GSM) | Rx sensitivity at Band 8 (900MHz GSM) | -103 | -100 | dBm | |
| Rx sens. @Band 2 (1900MHz PCS) | Rx sensitivity at Band 2 (1900MHz PCS) | -103 | -100 | dBm | |
e. LoRa
- Mode: LoRa RAW mode and LoRa WAN mode
- LoRaWAN Node Type: Class Type A, Class Type C
- Frequency Band: EU868, US915
Table 6: LoRa Specifications
| Parameter | Description | Min | Typ | Max | Unit |
| General | |||||
| Freq. (EU) | Frequency band (EU) | 863 | 870 | GHz | |
| Freq. (US) | Frequency band (US) | 902 | 928 | GHz | |
| Power max. (EU) | Maximum power (EU) | 15 | dBm | ||
| Power max. (US) | Maximum power (US) | 22 | dBm | ||
| Tx | |||||
| Tx power (Tx tone) @ @866.4MHZ [EU868 band] | Tx power (Tx tone) at 866.4MHz | 14 | 15 | dBm | |
| Tx power (Tx tone) @918.2MHZ [US915 band] | Tx power (Tx tone) at 918.2MHz | 21 | 22 | % | |
| Rx | |||||
| Rx Sens.
@freq=866.4MHz, BW=500kHz, SF=12 |
Rx sensitivity at 866.4MHz, 500kHz bandwidth and SF=12 | -127 | dBm | ||
| Rx Sens.
@freq=866.4MHz, BW=500kHz, SF=12 |
Rx sensitivity at 866.4MHz, 500kHz bandwidth and SF=12 | -127 | dBm | ||
Module Interface
a. Power Management
Table 7: Power Consumption by Mode of Operation
| Mode of Operation | Min | Typ | Max | Unit |
| Idle (no radio, but MicroPython is running) | 30 | mA | ||
| Light sleep (wake up or restart is required for MicroPython to run) | 800 | µA | ||
| Deep sleep (wake up or restart is required for MicroPython to run) | 10 | µA |
b. Memory Allocation
Module OS firmware, OTA, and user space sizes:
- Module OS firmware: 2,560Kb
- OTA1 space: 2,560Kb
- OTA2 space: 2,560Kb
- User space: 8Mb
Mechanical Data
a. Mechanical Specification
All pins have a pin width of 0.7mm except pin VBATT (pin #A4) with a pin width of 1.0mm
b. Module Pin-out
Table 8: F1 Smart Module Pin-out
| Pin Number | Pin Name | MCU Pin | LTE Module Pin | Type | Description |
| R4 | GND | Power | Ground signal | ||
| R6 | GND | Power | Ground signal | ||
| R7 | GND | Power | Ground signal | ||
| R9 | USIM_CLK | SIM0_CLK | Analog I/O | USIM interface I/O to GM02S | |
| R10 | USIM_IO | SIM0_IO | Digital I/O | USIM interface I/O to GM02S | |
| R12 | GND | Power | Ground signal | ||
| R13 | GND | Power | Ground signal | ||
| R21 | GND | Power | Ground signal | ||
| R22 | RESET | CHIP_PU | Analog I/O | Reset the pin to ESP32-S3 for module reset | |
| R23 | P0 | U0RXD | Analog I/O | UART0 RXD to ESP32-S3 | |
| R24 | P1 | U0TXD | Analog I/O | UART0 TXD to ESP32-S3 | |
| R25 | P2 | GPIO0 | Analog I/O or Digital I/O | Analog I/O or Digital I/O to ESP32-S3 | |
| R26 | P3 | GPIO4 | Analog I/O or Digital I/O | Analog I/O or Digital I/O to ESP32-S3 | |
| R27 | P4 | MTDO | Digital I/O | Digital I/O to ESP32-S3 | |
| R28 | P5 | GPIO5 | Analog I/O or Digital I/O | Analog I/O or Digital I/O to ESP32-S3 | |
| *R29 | P6 | GPIO6 | Reserved – Leave floating, do not connect. |
| R30 | P7 | GPIO3 | Analog I/O or Digital I/O | Analog I/O or Digital I/O to ESP32-S3 | |
| R31 | P8 | GPIO46 | Digital I/O | Digital I/O to ESP32-S3 | |
| R32 | P9 | GPIO45 | Digital I/O | Digital I/O to ESP32-S3 | |
| R33 | P10 | MTCK | Digital I/O | Digital I/O to ESP32-S3 | |
| R34 | P11 | GPIO11 | Analog I/O or Digital I/O | Analog I/O or Digital I/O to ESP32-S3 | |
| R35 | P12 | GPIO21 | Analog I/O or Digital I/O | Analog I/O or Digital I/O to ESP32-S3 | |
| R36 | GND | Power | Ground signal | ||
| R37 | PEXT1 | GPIO1 | Analog I/O or Digital I/O | Analog I/O or Digital I/O to ESP32-S3 | |
| R38 | PEXT2 | GPIO12 | Analog I/O or Digital I/O | Analog I/O or Digital I/O to ESP32-S3 | |
| M39 | GND | Power | Ground signal | ||
| L39 | BLE/WIFI_ANT | RF I/O | RF interface to ESP32-S3 for BLE and/or Wi-Fi interface | ||
| K39 | GND | Power | Ground signal | ||
| A38 | PEXT4 | GPIO14 | Analog I/O or Digital I/O | Analog I/O or Digital I/O to ESP32-S3 | |
| A37 | PEXT3 | GPIO13 | Analog I/O or Digital I/O | Analog I/O or Digital I/O to ESP32-S3 | |
| A36 | GND | Power | Ground signal | ||
| A35 | GND | Power | Ground signal | ||
| A34 | P13 | GPIO20 | Analog I/O or Digital I/O | Analog I/O or Digital I/O to ESP32-S3
/USB OTG D+ |
|
| A33 | P14 | GPIO19 | Analog I/O or Digital I/O | Analog I/O or Digital I/O to ESP32-S3
/USB OTG D- |
|
| A32 | P15 | GPIO38 | Digital I/O | Digital I/O to ESP32-S3 | |
| A31 | P16 | GPIO41 | Digital I/O | Digital I/O to ESP32-S3 | |
| A30 | P17 | GPIO2 | Analog I/O or Digital I/O | Analog I/O or Digital I/O to ESP32-S3 | |
| A29 | P18 | GPIO10 | Analog I/O or Digital I/O | Analog I/O or Digital I/O to ESP32-S3 | |
| A28 | P19 | GPIO15 | Analog I/O or Digital I/O | Analog I/O or Digital I/O to ESP32-S3 | |
| A27 | P20 | GPIO16 | Analog I/O or Digital I/O | Analog I/O or Digital I/O to ESP32-S3 | |
| A26 | P21 | GPIO17 | Analog I/O or Digital I/O | Analog I/O or Digital I/O to ESP32-S3 | |
| A25 | P22 | GPIO18 | Analog I/O or Digital I/O | Analog I/O or Digital I/O to ESP32-S3 | |
| A24 | P23 | GPIO42 | Digital I/O | Digital I/O to ESP32-S3 | |
| A23 | +3.3V | VDD3P3_CPU VDD3P3_RTC VDD3P3 VDDA | Power | Voltage supply to ESP32-S3 and module main circuit | |
| A22 | GND | Power | Ground signal |
| A21 | +1.8V_OUT | VDD_SPI | Power | Voltage supply VDD_SPI to ESP32-S3 for SPI flash and PSRAM | |
| A13 | GND | Power | Ground signal | ||
| A12 | GND | Power | Ground signal | ||
| A10 | USIM_RST | SIM0_RSTN | Digital I/O | USIM interface I/O to GM02S | |
| A9 | USIM_VCC | SIM0_VCC | Power | USIM voltage supply to GM02S | |
| A7 | GND | Power | Ground signal | ||
| A6 | GND | Power | Ground signal | ||
| A4 | +VBATT | VBAT | Power | Voltage supply to GM02S | |
| E1 | GND | Power | Ground signal | ||
| F1 | LORA_ANT | RF I/O | RF interface to SX1262 for LoRa interface | ||
| G1 | GND | Power | Ground signal | ||
| J1 | GND | Power | Ground signal | ||
| K1 | LTE_ANT | LTE_ANT | RF I/O | RF interface to GM02S for LTE CAT-M1/CAT- NB1/CAT-NB2 interface | |
| L1 | GND | Power | Ground signal | ||
| M1 | ATUN2 | GPIO34/ ANT_TUNE0 | Analog I/O | ANT_TUNE I/O to GM02S | |
| N1 | ATUN3 | GPIO35/ ANT_TUNE1 | Analog I/O | ANT_TUNE I/O to GM02S | |
| O1 | LTE_PS_CTRL | GPIO2/ PS_STATUS | Digital I/O | Power saving status I/O from GM02S | |
| P1 | LTE_STATUS | GPIO1/ STATUS_LED | Digital I/O | LTE status I/O from GM02S |
c. Recommended PCB Landing Pattern
All pins have a pin width of 0.7mm, except pin VBATT (pin #A4) with a pin width of 1.0mm.
d. Recommended Basic Circuit
e. Recommended Soldering Profile
MicroPython Application Development on F1
a. Device Programming via UART
- By default, the F1 Smart Module runs an interactive python REPL (Read-Eval-Print-Loop) on UART0, which is connected to P0 (RX) and P1 (TX) running at 115200 baud.
- The Module can be connected via a development board or any USB UART adapter. Code can be run via the REPL and the SG Wireless CtrlR. The Visual Studio Code plug-in can also be used to upload code to the board.
b. Module-supported Libraries
Table 9: F1 Smart Module Supported Libraries
| Library | Min |
| Python Standard Libraries* | array, aysncio, binascii, builtins, cmath, collections, errno, gc, gzip, hashlib, heapq, io, json, math, os, platform, random, re, select, socket, ssl, struct, sys, time, zlib, _thread |
| MicroPython-specific Libraries* | Bluetooth, btree, cryptolib, deflate, framebuf, machine, micropython, neopixel, network, uctypes, esp, esp32 |
| F1 Smart Module-Specific Libraries† | lte: Ready-to-use LTE CAT-M1/NB1/NB2 library
lora: Ready-to-use LoRa RAW and full stack LoRa WAN device Class A, Class C library ctrl: Ready-to-use Ctrl Cloud Platform client library |
- MicroPython documentation library with API function calls (https://docs.micropython.org/en/latest/library/).
- SG Wireless F1 Smart Module documentation library with API function calls.
c. MicroPython Capability – REPL (Read-Eval-Print Loop)
The MicroPython-ready F1 Smart Module carries the REPL shell that can execute codes in real time, as well as enable section-by-section of code execution through a copy-and-paste function, both of which facilitate real-time debugging and instant application code prototyping.
Product Packaging
Modules are packed in tape-and-reel packaging and shipped out in carton boxes.
Certification
a. CE Statements
- EU Declaration of Conformity (DOC)
Hereby, SG Wireless Limited declares that the F1 Smart Module series complies with Radio Equipment Directive (RED) 2014/53/EU.
The full text of the EU declaration of conformity is available at the following Internet address:
https://docs.sgwireless.com - RF exposure statement
RF exposure information: The Maximum Permissible Exposure (MPE) level has been calculated based on a distance of d=20cm between the device and the human body. To maintain compliance with RF exposure requirements, use a product that maintains a 20cm distance between the device and human body. - CE marking and labeling
By complying with CE standards, all modules are laser printed with “CE” markings and part numbers on the surface of the module shield, and manufacturer information is printed on labels on the shipping boxes/packages.
CE marking on module:
Manufacturer information on the shipping package/box:
b. FCC Statements
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
- This device may not cause harmful interference.
- This device must accept any interference received, including interference that may cause undesired operation.
CAUTION:
Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.
NOTE:
This equipment has been tested and found to comply with the limits for a Class B digital device, under Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used by the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.
FCC Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20cm between the radiator & your body.
OEM INTEGRATION INSTRUCTIONS:
- This device is intended only for OEM integrators under the following conditions:
- The module must be installed in the host equipment such that 20 cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna. The module shall be only used with the internal on-board antenna that has been originally tested and certified with this module.
- External antennas are not supported.
- As long as these 3 conditions above are met, further transmitter tests will not be required.
- However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.).
- The end-product may need Verification testing, Declaration of Conformity testing, a Permissive Class II Change, or new Certification.
- Please involve a FCC certification specialist to determine what will be exactly applicable for the end-product.
Validity of using the module certification:
If these conditions cannot be met (for example, certain laptop configurations or co-location with another transmitter), then the FCC authorization for this module in combination with the host equipment is no longer considered valid, and the FCC ID of the module cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. In such cases, please involve a FCC certification specialist to determine if a Permissive Class II Change or new Certification is required.
Upgrade Firmware:
The software provided for firmware upgrade will not be capable of affecting any RF parameters as certified for the FCC for this module to prevent compliance issues. End product labeling: This transmitter module is authorized only for use in devices where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The end product must be labeled in a visible area with the following: “Contains FCC ID: 2AS9406” (for F1), “Contains FCC ID: 2AS9407” (for F1/C), “Contains FCC ID: 2AS9408” (for F1/L), “Contains FCC ID: 2AS9409” (for F1/W), “Contains FCC ID: 2AS9410” (for F1s), “Contains FCC ID: 2AS9411” (for F1/Cs), “Contains FCC ID: 2AS9412” (for F1/Ls), “Contains FCC ID: 2AS9413” (for F1W/s).
Information that must be placed in the end user manual:
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user manual of the end product that integrates this module. The end-user manual shall include all required regulatory information/warnings as shown in this manual.
“CAUTION :
Exposure to Radio Frequency Radiation. The antenna shall be mounted in such a manner to minimize the potential for human contact during normal operation. The antenna should not be contacted during operation to avoid the possibility of exceeding the FCC radio frequency exposure limit.
Orderable part number/Model no. comparison table
| Orderable part number | Model no. | BLE/Wi-Fi | LTE Cat-M1/ NB-IoT | LoRa(WAN) | Security element |
| SGW3531 | F1s | ü | ü | ü | ü |
| SGW3501 | F1 | ü | ü | ü | û |
| SGW3431 | F1/Cs | ü | ü | û | ü |
| SGW3401 | F1/C | ü | ü | û | û |
| SGW3231 | F1/Ls | ü | û | ü | ü |
| SGW3201 | F1/L | ü | û | ü | û |
| SGW3131 | F1/Ws | ü | û | û | ü |
| SGW3101 | F1/W | ü | û | û | û |
Revision History
| Version | Released Date | Description |
| 1.0 | Feb 7, 2024 | Initial document release |
| 1.1 | Mar 6, 2024 | Branding revised with updates:
Introduction: Operaforure updated Section 4: PIN updated (A38 and A37) Section 5b: Link to MicroPython documentation library updated Section 6a: MSL updated |
| 1.2 | Jul 7, 2024 | Adding the following section:
Section 7: Certification Section 8: Part number/Model no. comparison table |
| 1.3 | Aug 13, 2024 | Updating following section: Section 7b: FCC Statements |
Contact
- Email: cs@sgwireless.com
- Website: https://sgwireless.com/
- LinkedIn: https://www.linkedin.com/company/sgwireless/
- Manufacturer Address:
- Rm504, 5/F, Sun Fung Industrial Building, 8 Ma Kok Street, Tsuen Wan, New Territories, Hong Kong
- Information in this document is provided solely to enable authorized users or licensees of SG Wireless products.
- Do not make printed or electronic copies of this document or parts of it without written authority from SG Wireless.
- SG Wireless reserves the right to make changes to products and information herein without further notice.
- SG Wireless makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does SG Wireless assume any liability arising out of the application of any product and specifically disclaims any liability, including without limitation consequential or incidental damages. SG Wireless does not convey any license under its patent rights nor the rights of others.
- SG Wireless products may not be used in life-critical equipment, systems, or applications where failure of such equipment, system, or application would cause bodily injury or death.
- SG Wireless sells products under standard Terms and Conditions, which may be found at https://www.sgwireless.com/page/terms.
- SG Wireless may refer to other SG Wireless documents or third-party products in this document, and users are requested to contact SG Wireless or those third parties for appropriate documentation.
- SG Wireless™ and the SG and SG Wireless logos are trademarks and service marks of SG Wireless Limited.
- All other product or service names are the property of their respective owners.
© 2024 SG Wireless Limited. All rights reserved.
FAQs
- Q: How do I update the firmware of the F1 Smart Module?
A: To update the firmware, please follow the steps outlined in the user manual provided with the module. - Q: Can I use multiple F1 Smart Modules together in a network?
A: Yes, you can use multiple modules together to create a network. Refer to the user manual for detailed instructions on network setup.
Documents / Resources
 |
SG F1 Smart Module [pdf] Owner's Manual SGW3531, SGW3501, SGW3431, SGW3401, SGW3231, SGW3201, SGW3131, SGW3101, F1 Smart Module, F1, Smart Module, Module |
