SG F1 Smart Module Owner's Manual

Owner's Manual for SG models including: SGW3531, SGW3501, SGW3431, SGW3401, SGW3231, SGW3201, SGW3131, SGW3101, F1 Smart Module, F1, Smart Module, Module

DTSA7.01 SGW3501 Multi-connectivity Module Datasheet V1.2

SOW

SGW

Users Manual

SG Wireless Limited 10 2AS9410 2AS9410 10

File Info : application/pdf, 26 Pages, 1.57MB

GetApplicationAttachment.html?id=7632807

Datasheet
F1 Smart Module
August 2024 V1.3

SG Confidential

Page 1 of 26

DTSA7.01-V1.2

F1 Smart Module Datasheet

Introduction
The F1 Smart Module (order part number SGW3501) is a compact OEM module equipped with BLE, Wi-Fi, LoRa(WAN), and LTE CAT-M1/NB1/NB2 to support various connectivity needs. Running on a MicroPythonprogrammable microcontroller with a no-barrier entry into the SG Wireless Ctrl. Cloud Platform, the module enables truly limitless IoT application development with multi-network creation flexibility and rapid scaling capacity.
The F1 Smart Module has four variants with various connectivity options, under each variant, there are two subvariants with advanced security element option.
· Multi-connectivity: - Wi-Fi 802.11b/g/n (2.4GHz) - Bluetooth BLE 5.0 - Cellular LTE-CAT M1/NB1/NB2 - Semtech LoRa(WAN) 868MHz/915MHz
· Powerful Espressif ESP32 S3 CPU · MicroPython programmable with 27 IOs on module pads · SMT-friendly semi-hole pins at module edges · Operating temperature: 0°C to 85°C · Advanced Security IC NXP SE050 (for "s" suffix models) · Compact size-to-functionality ratio: 42.6mm x 17.6mm x 3.6mm

Order Part Number Description

SGW3531

F1s Smart Module: BLE, Wi-Fi, LoRa, LTE & Secure element

SGW3501

F1 Smart Module: BLE, Wi-Fi, LoRa, LTE

SGW3431

F1/Cs Cellular Module: BLE, Wi-Fi, LTE & Secure element

SGW3401

F1/C LoRa Module: BLE, Wi-Fi, LTE

SGW3231

F1/Ls LoRa Module: BLE, Wi-Fi, LoRa & Secure element

SGW3201

F1/L LoRa Module: BLE, Wi-Fi, LoRa

SGW3131

F1/Ws Wi-Fi BLE Module: BLE, Wi-Fi & Secure element

SGW3101

F1/W Wi-Fi BLE Module: BLE, Wi-Fi

SG Confidential

Page 2 of 26

DTSA7.01-V1.2
Contents
1. General Features a. Feature Specifications b. Block Diagram
2. Electrical Specifications a. Absolute Rating and Operating Conditions b. Wi-Fi c. Bluetooth d. LTE e. LoRa
3. Module Interface a. Power Management b. Memory Allocation
4. Mechanical Data a. Mechanical Specification b. Module Pin-out c. Recommended PCB Landing Pattern d. Recommended Basic Circuit e. Recommended Soldering Profile
5. MicroPython Application Development on F1 a. Device Programming via UART b. Module-supported libraries c. MicroPython Capability REPL (Read-Eval-Print Loop)
6. Product Packaging
7. Certification a. CE statement b. FCC statement
8. Orderable part number/Model no. comparison table
9. Revision History
10. Contact

F1 Smart Module Datasheet
4 4 5 6 6 7 8 9 10 11 11 11 12 12 13 16 17 18 19 19 19 20 21 22 22 23 24 25 25

SG Confidential

Page 3 of 26

DTSA7.01-V1.2

F1 Smart Module Datasheet

1. General Features
a. Feature Specifications
CPU · Xtensa® dual-core 32-bit LX7 microprocessor, up to 240Mhz · On-chip 384KB ROM and 512KB SRAM, on-board 8MB PSRAM and 16MB Flash · Deep Sleep Mode: 10µA Wi-Fi/BLE · Espressif ESP32-S3 on-chip RF frontend · Wi-Fi: IEEE 802.11b/g/n (2.4GHz band); Data Rate: 1M up to 54Mbps (MCS7); Max Tx Power: 20dBm · BLE: Bluetooth LE 5.0, Bluetooth mesh; Data Rate: 125kbps to 2Mbps; Max Tx Power: 20dBm LTE · Sequans Monarch2 GM02S for CAT-M1, CAT-NB1 and CAT-NB2 support · LTE CAT-M1/NB1/NB2 transmit power up to +23dBm · PTCRB and GCF 1.3 3GPP release 13 compliant; Operator Approval: Verizon, AT&T, T-Mobile, Vodafone, Orange LoRa · Semtech SX1262 RF transceiver, 868/915MHz LPWAN Module · TX Power: Up to +22dBm; Sensitivity: -127dBm · LoRaWAN stack Class A and Class C Device

SG Confidential

Page 4 of 26

DTSA7.01-V1.2
b. Block Diagram

F1 Smart Module Datasheet

Figure 1: F1 Smart Module Block Diagram SG Confidential

Page 5 of 26

DTSA7.01-V1.2

F1 Smart Module Datasheet

2. Electrical Specifications

a. Absolute Rating and Operating Conditions

Table 1: Absolute Rating and Operating Conditions Specifications

Symbol

Parameter

Min

Typ

Absolute Rating

+VBATT

Supply voltage to Sequans GM02S LTE module

5.0

+3V3

Supply voltage to Espressif ESP32-S3 and module main circuit

3.0

3.3

+1V8_OUT*

SPI supply voltage (output) of SPI flash and PSRAM for

1.8

decoupling capacitor connection

T(OPR)

Operating temperature

-40

Operating Conditions

+VBATT

Supply voltage to Sequans GM02S LTE module

2.5

5.0

+3V3

Supply voltage to Espressif ESP32-S3 and module main circuit

3.2

3.3

+1V8_OUT*

SPI supply voltage (output) of SPI flash and PSRAM for decoupling capacitor connection

1.7

1.8

CPU IO (3.3V power domain, VDD=3.3V)

VIH

Input high voltage for GPIOs

VIL

Input low voltage for GPIOs

VOH

Input high voltage for GPIOs

VOL

Input low voltage for GPIOs

0.75 x VDD -0.3
0.8 x VDD

Radio IO (1.8V power domain)

VIH

Input high voltage for GPIOs

VIL

Input low voltage for GPIOs

VOH

Input high voltage for GPIOs

VOL

Input low voltage for GPIOs

1.26 0
1.44 0

Max

Unit

5.8

3.6

2.3

°C

5.5

3.4

1.9

VDD + 0.3

0.25 x VDD

0.1 x VDD

1.8

0.54

1.8

0.36

* The +1V8_OUT pin is to connect an external capacitor to the module internal SPI flash and PSRAM for a more robust VDD_SPI supply. This pin should not be connected to any external circuits that may draw more than 20mA. Voltage of this pin will vary in module light sleep mode and approach zero in module deep sleep mode.

SG Confidential

Page 6 of 26

DTSA7.01-V1.2

F1 Smart Module Datasheet

b. Wi-Fi
Standard: 802.11b/g/n (2.4GHz ONLY) 1T1R

Table 2: Wi-Fi Specifications

Parameter
General
Freq. (EU)
Ch. (EU)
Freq. (US)
Ch. (US)
Power max. (EU/US)
Tx
Tx Power @B 1Mbps
EVM (Peak) @B 1Mbps
Freq. Err. @B 1Mbps
Tx Power @G 54Mbps
EVM (RMS) @G 54Mbps
Freq. Err. @G 54Mbps
Tx Power @N20 MCS7
EVM (RMS) @N20 MCS7
Freq. Err. @N20 MCS7
Tx Power @B 1Mbps
Rx
Rx Sens. @B 1Mbps
Rx Sens. @G 54Mbps
Rx Sens. @N20 MCS7

Description
Operating frequency (EU) Channel (EU) Operating frequency (US) Channel (US) Maximum power (EU/US)
Tx power at B mode with data rate 1Mbps
EVM(Peak) at B mode with data rate 1Mbps
Frequency error at B mode with data rate 1Mbps
Tx power at G mode with data rate 54Mbps
EVM(RMS) at G mode with data rate 54Mbps
Frequency error at G mode with data rate 54Mbps
Tx power at N mode with data rate MCS7 and 20MHz bandwidth EVM rms at N mode with data rate MCS7 and 20MHz bandwidth Frequency error @ N mode with data rate MCS7 and 20MHz bandwidth Tx power at B mode with data rate 1Mbps
Tx power at B mode with data rate 1Mbps
Tx power at G mode with data rate 54Mbps
Tx power at N mode with data rate MCS7 and 20MHz bandwidth

Min 2.402
1 2.402
1
-40
-40
-40

Typ
18 0 16 0 15 0 18 -92.0 -76.5 -71.4

Max
2.482 13
2.472 11 20
20 8 40 20 -25 40 20 -27 40 20

Unit GHz GHz dBm dBm
% kHz dBm dB kHz dBm dB kHz dBm

-82.0 -66.0 -64.0

dBm dBm dBm

SG Confidential

Page 7 of 26

DTSA7.01-V1.2

F1 Smart Module Datasheet

c. Bluetooth
Standard: BLE 5.0 1T1R

Table 3: Bluetooth Specifications

Parameter
General
Freq.
Ch.
Power max.
Tx
Tx Power @Ch.37 1 Mbps
Freq. Err. @Ch.37 1Mbps
Tx Power @Ch.38 1Mbps
Freq. Err. @Ch.38 1Mbps
Tx Power @Ch.39 1Mbps
Freq. Err. @Ch.39 1Mbps
Rx
Rx Sens. @Ch.38 2Mbps
Rx Sens. @Ch.38 1Mbps
Rx Sens. @Ch.38 500kbps

Description
Operating frequency Channel Maximum power
Tx power at channel 37 (freq.=2402MHz) with data rate 1Mbps Frequency error at channel 37 (freq.=2402MHz) with data rate 1Mbps Tx power at channel 38 (freq.=2426MHz) with data rate 1Mbps Frequency error at channel 38 (freq.=2426MHz) with data rate 1Mbps Tx power at channel 39 (freq.=2480MHz) with data rate 1Mbps Frequency error at channel 39 (freq.=2480MHz) with data rate 1Mbps
Tx power at channel 38 (freq.=2426MHz) with data rate 2Mbps Tx power at channel 38 (freq.=2426MHz) with data rate 1Mbps Tx power at channel 38 (freq.=2426MHz) with data rate 500kbps

Min 2.4000
0
-50 -50 -50

Typ
17 0 17 0 17 0 -93.5 -97.5 -100.0

Max
2.4835 39 20
20 50 20 50 20 50

Unit GHz dBm dBm
% kHz dBm dBm kHz

-70.0

dBm dBm dBm

SG Confidential

Page 8 of 26

DTSA7.01-V1.2

F1 Smart Module Datasheet

d. LTE
Standard: CAT-M1, CAT-NB1, CAT-NB2

Table 4: LTE Frequency Bands (in MHz)

Band No. Duplex Type

FDD

Uplink Frequency Uplink Bandwidth Downlink

Downlink

For

(MHz)

Frequency (MHz) Bandwidth (MHz) LTE-M

1920 1980

2110 2170

1850 1910

1930 1990

1710 1785

1805 1880

1710 1755

2110 2155

824 849

869 894

880 915

925 960

699 716

729 746

777 787

746 756

788 798

758 768

704 716

734 746

815 830

860 875

830 845

875 890

832 862

791 821

1850 1915

1930 1995

814 849

859 894

703 748

758 803

1710 1780

2110 2200

698 716

728 746

For NB-IoT

Table 5: LTE Specifications

Parameter

Description

Min

General Power max.

Maximum power

Tx Tx power @Band 8 (900MHz GSM) Tx power @Band 2 (1900MHz PCS)

Tx power at Band 8 (900MHz GSM) Tx power at Band 2 (1900MHz PCS)

Rx Rx sens. @Band 8 (900MHz GSM) Rx sens. @Band 2 (1900MHz PCS)

Rx sensitivity at Band 8 (900MHz GSM) Rx sensitivity at Band 2 (1900MHz PCS)

Typ
22 22 -103 -103

Max
23
23 23
-100 -100

Unit
dBm
dBm dBm
dBm dBm

SG Confidential

Page 9 of 26

DTSA7.01-V1.2

F1 Smart Module Datasheet

e. LoRa
Mode: LoRa RAW mode and LoRa WAN mode LoRaWAN Node Type: Class Type A, Class Type C Frequency Band: EU868, US915

Table 6: LoRa Specifications

Parameter

Description

Min

General Freq. (EU) Freq. (US) Power max. (EU) Power max. (US)

Frequency band (EU)

863

Frequency band (US)

902

Maximum power (EU)

Maximum power (US)

Tx
Tx power (Tx tone) @866.4MHZ [EU868 band]
Tx power (Tx tone) @918.2MHZ [US915 band]

Tx power (Tx tone) at 866.4MHz Tx power (Tx tone) at 918.2MHz

Rx
Rx Sens. @freq=866.4MHz, BW=500kHz, SF=12
Rx Sens. @freq=866.4MHz, BW=500kHz, SF=12

Rx sensitivity at 866.4MHz, 500kHz bandwidth and SF=12
Rx sensitivity at 866.4MHz, 500kHz bandwidth and SF=12

Typ
14 21 -127 -127

Max
870 928 15 22
15 22

Unit
GHz GHz dBm dBm
dBm %

dBm dBm

SG Confidential

Page 10 of 26

DTSA7.01-V1.2
3. Module Interface
a. Power Management
Table 7: Power Consumption by Mode of Operation
Mode of Operation Idle (no radio but MicroPython is running) Light sleep (wake up or restart is required for MicroPython to run) Deep sleep (wake up or restart is required for MicroPython to run)
b. Memory Allocation
Module OS firmware, OTA and user space sizes: · Module OS firmware: 2,560Kb · OTA1 space: 2,560Kb · OTA2 space: 2,560Kb · User space: 8Mb

F1 Smart Module Datasheet

Min

Typ

Max

Unit

800

µA

SG Confidential

Page 11 of 26

DTSA7.01-V1.2

F1 Smart Module Datasheet

4. Mechanical Data
a. Mechanical Specification
All pins have a pin width of 0.7mm with the exception of pin VBATT (pin #A4) with pin width 1.0mm.

Figure 2: F1 Smart Module Pin Dimensions, Pin Pitches and Pin Locations (Top View)

SG Confidential

Page 12 of 26

DTSA7.01-V1.2
b. Module Pin-out

F1 Smart Module Datasheet

Figure 3: F1 Smart Module Pin-out (Top View)

Table 8: F1 Smart Module Pin-out

Pin Number Pin Name

GND

USIM_CLK

R10

USIM_IO

R12

GND

R13

GND

R21

GND

R22

RESET

R23

R24

R25

MCU Pin
CHIP_PU U0RXD U0TXD GPIO0

R26

GPIO4

R27

R28

MTDO GPIO5

*R29

GPIO6

LTE Module Pin Type

Description

Power

Ground signal

Power

Ground signal

Power

Ground signal

SIM0_CLK

Analog I/O USIM interface I/O to GM02S

SIM0_IO

Digital I/O USIM interface I/O to GM02S

Power

Ground signal

Power

Ground signal

Power

Ground signal

Analog I/O Reset pin to ESP32-S3 for module reset

Analog I/O UART0 RXD to ESP32-S3

Analog I/O UART0 TXD to ESP32-S3

Analog I/O or Analog I/O or Digital I/O to ESP32-S3 Digital I/O

Digital I/O Digital I/O to ESP32-S3

Analog I/O or Analog I/O or Digital I/O to ESP32-S3 Digital I/O

Reserved Leave floating, do not connect

SG Confidential

Page 13 of 26

DTSA7.01-V1.2

R30 R31 R32 R33 R34 R35 R36 R37 R38 M39 L39 K39 A38 A37 A36 A35 A34 A33 A32 A31 A30 A29 A28 A27 A26 A25 A24 A23
A22

GPIO3

GPIO46

GPIO45

P10

MTCK

P11

GPIO11

P12

GPIO21

GND PEXT1

GPIO1

PEXT2

GPIO12

GND BLE/WIFI_ANT

GND PEXT4

GPIO14

PEXT3

GPIO13

GND GND P13

GPIO20

P14

GPIO19

P15

GPIO38

P16

GPIO41

P17

GPIO2

P18

GPIO10

P19

GPIO15

P20

GPIO16

P21

GPIO17

P22

GPIO18

P23 +3.3V
GND

GPIO42
VDD3P3_CPU VDD3P3_RTC
VDD3P3 VDDA

SG Confidential

F1 Smart Module Datasheet

Analog I/O or Analog I/O or Digital I/O to ESP32-S3 Digital I/O

Digital I/O Digital I/O to ESP32-S3

Analog I/O or Analog I/O or Digital I/O to ESP32-S3 Digital I/O

Power

Ground signal

Analog I/O or Analog I/O or Digital I/O to ESP32-S3 Digital I/O

Power

Ground signal

RF I/O

RF interface to ESP32-S3 for BLE and/or Wi-Fi interface

Power

Ground signal

Analog I/O or Analog I/O or Digital I/O to ESP32-S3 Digital I/O

Power

Ground signal

Power

Ground signal

Analog I/O or Analog I/O or Digital I/O to ESP32-S3 Digital I/O /USB OTG D+

Analog I/O or Analog I/O or Digital I/O to ESP32-S3 Digital I/O /USB OTG D-

Digital I/O Digital I/O to ESP32-S3

Analog I/O or Analog I/O or Digital I/O to ESP32-S3 Digital I/O

Digital I/O Digital I/O to ESP32-S3

Power

Voltage supply to ESP32-S3 and module main circuit

Power

Ground signal

Page 14 of 26

DTSA7.01-V1.2

F1 Smart Module Datasheet

A21

+1.8V_OUT

VDD_SPI

Power

Voltage supply VDD_SPI to ESP32-S3 for SPI flash and PSRAM

A13

GND

Power

Ground signal

A12

GND

Power

Ground signal

A10

USIM_RST

SIM0_RSTN

Digital I/O USIM interface I/O to GM02S

USIM_VCC

SIM0_VCC

Power

USIM voltage supply to GM02S

GND

Power

Ground signal

GND

Power

Ground signal

+VBATT

VBAT

Power

Voltage supply to GM02S

GND

Power

Ground signal

LORA_ANT

RF I/O

RF interface to SX1262 for LoRa interface

GND

Power

Ground signal

GND

Power

Ground signal

LTE_ANT

RF I/O

RF interface to GM02S for LTE CAT-M1/CATNB1/CAT-NB2 interface

GND

Power

Ground signal

ATUN2

GPIO34/ ANT_TUNE0

Analog I/O ANT_TUNE I/O to GM02S

ATUN3

GPIO35/ ANT_TUNE1

Analog I/O ANT_TUNE I/O to GM02S

LTE_PS_CTRL

GPIO2/ PS_STATUS

Digital I/O Power saving status I/O from GM02S

LTE_STATUS

GPIO1/ STATUS_LED

Digital I/O LTE status I/O from GM02S

SG Confidential

Page 15 of 26

DTSA7.01-V1.2

F1 Smart Module Datasheet

c. Recommended PCB Landing Pattern
All pins have a pin width of 0.7mm with the exception of pin VBATT (pin #A4) with pin width 1.0mm.

Figure 4: F1 Smart Module Recommended PCB Landing Pattern (Top View)

SG Confidential

Page 16 of 26

DTSA7.01-V1.2
d. Recommended Basic Circuit

F1 Smart Module Datasheet

Figure 5: F1 Smart Module Recommended Basic Circuit SG Confidential

Page 17 of 26

DTSA7.01-V1.2
e. Recommended Soldering Profile

F1 Smart Module Datasheet

Figure 6: F1 Smart Module Recommended Reflow Soldering Profile

SG Confidential

Page 18 of 26

DTSA7.01-V1.2

F1 Smart Module Datasheet

5. MicroPython Application Development on F1
a. Device Programming via UART
· By default, the F1 Smart Module runs an interactive python REPL (Read-Eval-Print-Loop) on UART0 which is connected to P0 (RX) and P1 (TX) running at 115200 baud.
· The Module can be connected via a development board or any USB UART adapter. Code can be run via the REPL and the SG Wireless CtrlR. Visual Studio Code plug-in can also be used to upload code to the board.
b. Module-supported Libraries

Table 9: F1 Smart Module Supported Libraries

Library

Min

Python Standard Libraries*

array, aysncio, binascii, builtins, cmath, collections, errno, gc, gzip, hashlib, heapq, io, json, math, os, platform, random, re, select, socket, ssl, struct, sys, time, zlib, _thread

MicroPython-specific Libraries*

Bluetooth, btree, cryptolib, deflate, framebuf, machine, micropython, neopixel, network, uctypes, esp, esp32

F1 Smart Module-specific Libraries lte: Ready-to-use LTE CAT-M1/NB1/NB2 library lora: Ready-to-use LoRa RAW and full stack LoRa WAN device Class A, Class C library ctrl: Ready-to-use Ctrl Cloud Platform client library

* MicroPython documentation library with API function calls (https://docs.micropython.org/en/latest/library/). SG Wireless F1 Smart Module documentation library with API function calls.

SG Confidential

Page 19 of 26

DTSA7.01-V1.2

F1 Smart Module Datasheet

c. MicroPython Capability REPL (Read-Eval-Print Loop)
The MicroPython-ready F1 Smart Module carries the REPL shell that that can execute codes in realtime, as well as enable section-by-section of code execution through a copy-and-paste function, both
of which facilitate real-time debugging and instant application code prototyping.

Figure 7: F1 Smart Module Code Sample in REPL Shell SG Confidential

Page 20 of 26

DTSA7.01-V1.2

F1 Smart Module Datasheet

6. Product Packaging
Modules are packed in tape-and-reel packaging and shipped out in carton boxes.
a. Tape MSL (Moisture sensitivity level): 1

b. Reel 250pcs per reel

c. Box

SG Confidential

Page 21 of 26

DTSA7.01-V1.2

F1 Smart Module Datasheet

7. Certification
a. CE Statements
EU Declaration of Conformity (DOC) Hereby, SG Wireless Limited declares that the F1 Smart Module series is in compliance with Radio Equipment Directive (RED) 2014/53/EU.
The full text of the EU declaration of conformity is available at the following Internet address: https://docs.sgwireless.com
RF exposure statement RF exposure information: The Maximum Permissible Exposure (MPE) level has been calculated based on a distance of d=20cm between the device and the human body. To maintain compliance with RF exposure requirement, use product that maintain a 20cm distance between the device and human body.
CE marking and labeling By complying to CE standard, all modules are laser printed with "CE" marking and part number at surface of the module shield can; and manufacturer information is printed with label at shipping box/packages.
CE marking on module:

SG Confidential

Page 22 of 26

DTSA7.01-V1.2
Manufacturer information at shipping package/box:

F1 Smart Module Datasheet

b. FCC Statements
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference. (2) This device must accept any interference received, including interference that may cause undesired operation.
CAUTION: Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
- Reorient or relocate the receiving antenna. - Increase the separation between the equipment and receiver. - Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. - Consult the dealer or an experienced radio/TV technician for help.
FCC Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body.

SG Confidential

Page 23 of 26

DTSA7.01-V1.2

F1 Smart Module Datasheet

OEM INTEGRATION INSTRUCTIONS: This device is intended only for OEM integrators under the following conditions:
The module must be installed in the host equipment such that 20 cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna. The module shall be only used with the internal on-board antenna that has been originally tested and certified with this module. External antennas are not supported. As long as these 3 conditions above are met, further transmitter test will not be required.
However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). The end-product may need Verification testing, Declaration of Conformity testing, a Permissive Class II Change or new Certification. Please involve a FCC certification specialist in order to determine what will be exactly applicable for the end-product.
Validity of using the module certification: In the event that these conditions cannot be met (for example certain laptop configurations or colocation with another transmitter), then the FCC authorization for this module in combination with the host equipment is no longer considered valid and the FCC ID of the module cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. In such cases, please involve a FCC certification specialist in order to determine if a Permissive Class II Change or new Certification is required.
Upgrade Firmware: The software provided for firmware upgrade will not be capable to affect any RF parameters as certified for the FCC for this module, in order to prevent compliance issues.
End product labeling: This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: "Contains FCC ID: 2AS9406" (for F1), "Contains FCC ID: 2AS9407" (for F1/C), "Contains FCC ID: 2AS9408" (for F1/L), "Contains FCC ID: 2AS9409" (for F1/W), "Contains FCC ID: 2AS9410" (for F1s), "Contains FCC ID: 2AS9411" (for F1/Cs), "Contains FCC ID: 2AS9412" (for F1/Ls), "Contains FCC ID: 2AS9413" (for F1W/s).
Information that must be placed in the end user manual: The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user's manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.
"CAUTION : Exposure to Radio Frequency Radiation. Antenna shall be mounted in such a manner to minimize the potential for human contact during normal operation. The antenna should not be contacted during operation to avoid the possibility of exceeding the FCC radio frequency exposure limit.

SG Confidential

Page 24 of 26

DTSA7.01-V1.2

F1 Smart Module Datasheet

8. Orderable part number/Model no. comparison table

Orderable

Model no.

part number

BLE/Wi-Fi

LTE Cat-M1/ LoRa(WAN) Security

NB-IoT

element

SGW3531

F1s

SGW3501

SGW3431

F1/Cs

SGW3401

F1/C

SGW3231

F1/Ls

SGW3201

F1/L

SGW3131

F1/Ws

SGW3101

F1/W

SG Confidential

Page 25 of 26

9. Revision History

Version 1.0 1.1

Released Date Feb 7, 2024 Mar 6, 2024

1.2

Jul 7, 2024

1.3

Aug 13, 2024

Description
Initial document release
Branding revised with updates: Introduction: Operating temperature updated Section 4: Pin number updated (A38 and A37) Section 5b: Link to MicroPython documentation library updated Section 6a: MSL updated
Adding following section: Section 7: Certification Section 8: Part number/Model no. comparison table
Updating following section: Section 7b: FCC Statements

10.Contact
Email: cs@sgwireless.com Website: https://sgwireless.com/ LinkedIn: https://www.linkedin.com/company/sgwireless/
Manufacturer Address: Rm504, 5/F, Sun Fung Industrial Building, 8 Ma Kok Street, Tsuen Wan, New Territories, Hong Kong
Information in this document is provided solely to enable authorized users or licensees of SG Wireless products. Do not make printed or electronic copies of this document, or parts of it, without written authority from SG Wireless.
SG Wireless reserves the right to make changes to products and information herein without further notice. SG Wireless makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SG Wireless assume any liability arising out of the application of any product and specifically disclaims any and all liability, including without limitation consequential or incidental damages. SG Wireless does not convey any license under its patent rights nor the rights of others. SG Wireless products may not be used in life critical equipment, systems or applications where failure of such equipment, system or application would cause bodily injury or death. SG Wireless sells products pursuant to standard Terms and Conditions of Sale which may be found at https://www.sgwireless.com/page/terms.
SG Wireless may refer to other SG Wireless documents or third-party products in this document and users are requested to contact SG Wireless or those third parties for appropriate documentation.
SG WirelessTM and the SG and SG Wireless logos are trademarks and service marks of SG Wireless Limited. All other product or service names are the property of their respective owners.
© 2024 SG Wireless Limited. All rights reserved.

References

Microsoft Word 2021