VISHAY IRF830B D Series Power MOSFET 

VISHAY IRF830B D Series Power MOSFET

FEATURES

  • Optimal design
    • Low area specific on-resistance
    • Low input capacitance (Ciss)
    • Reduced capacitive switching losses
    • High body diode ruggedness
    • Avalanche energy rated (UIS)
  • Optimal efficiency and operation
    • Low cost
    • Simple gate drive circuitry
    • Low figure-of-merit (FOM): Ron x Qg
    • Fast switching
  • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912

APPLICATIONS

  • Consumer electronics
    • Displays (LCD or plasma TV)
  • Server and telecom power supplies
    • SMPS
  • Industrial
    • Welding
    • Induction heating
    • Motor drives
  • Battery chargers
PRODUCT SUMMARY
VDS (V) at TJ max. 550
RDS(on) max. (Ù) at 25 °C VGS = 10 V 1.5
Qg max. (nC) 20
Qgs (nC) 3
Qgd (nC) 5
Configuration Single
ORDERING INFORMATION
Package TO-220AB
Lead (Pb)-free IRF830BPbF
Lead (Pb)-free and halogen-free IRF830BPbF-BE3
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER SYMBOL LIMIT UNIT
Drain-source voltage VDS 500 V
Gate-source Voltage VGS ± 30
Gate-source voltage AC (f > 1 Hz) 30
Continuous drain current (TJ = 150 °C) VGS at 10 V TC = 25 °C ID 5.3 A
TC = 100 °C 3.4
Pulsed drain current a IDM 10
Linear derating factor 0.83 W/°C
Single pulse avalanche energy b EAS 28.8 mJ
Maximum power dissipation PD 104 W
Operating junction and storage temperature range TJ, Tstg -55 to +150 °C
Drain-source voltage slope TJ = 125 °C dV/dt 24 V/ns
Reverse diode dV/dt d 0.28
Soldering recommendations (peak temperature) c For 10 s 300 °C

Notes

  • a. Repetitive rating; pulse width limited by maximum junction temperature
  • b. VDD = 50 V, starting TJ = 25 °C, L = 2.3 mH, Rg = 25 Ω, IAS = 5 A
  • c. 1.6 mm from case
  • d. ISD ≤ ID, starting TJ = 25 °C

THERMAL RESISTANCE RATINGS

THERMAL RESISTANCE RATINGS
PARAMETER SYMBOL TYP. MAX. UNIT
Maximum junction-to-ambient RthJA 62 °C/W
Maximum junction-to-case (drain) RthJC 1.2

SPECIFICATIONS

SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
Static
Drain-source breakdown voltage VDS VGS = 0 V, ID = 250 μA 500 V
VDS temperature coefficient ÄVDS/TJ Reference to 25 °C, ID = 250 μA 0.58 V/°C
Gate-source threshold voltage (N) VGS(th) VDS = VGS, ID = 250 μA 3 5 V
Gate-source leakage IGSS VGS = ± 30 V ± 100 nA
Zero gate boltage drain current IDSS VDS = 500 V, VGS = 0 V 1 μA
VDS = 400 V, VGS = 0 V, TJ = 125 °C 10
Drain-source on-state resistance RDS(on) VGS = 10 V ID = 2.5 A 1.2 1.5 Ù
Forward transconductance a gfs VDS = 20 V, ID = 2.5 A 1.8 S
Dynamic
Input capacitance Ciss VGS = 0 V, VDS = 100 V,

f = 1 MHz

325 pF
Output capacitance Coss 34
Reverse transfer capacitance Crss 6
Effective output capacitance, energy related b Co(er) VDS = 0 V to 400 V, VGS = 0 V 31
Effective output capacitance, time related c Co(tr) 41
Total gate charge Qg VGS = 10 V ID = 2.5 A, VDS = 400 V 10 20 nC
Gate-source charge Qgs 3
Gate-drain charge Qgd 5
Turn-on delay time td(on) VDD = 400 V, ID = 2.5 A Rg = 9.1 Ù, VGS = 10 V 12 24 ns
Rise time tr 11 22
Turn-off delay time td(off) 14 28
Fall time tf 11 22
Gate input resistance Rg f = 1 MHz, open drain 0.8 1.7 3.4 Ù
Drain-Source Body Diode Characteristics
Continuous source-drain diode current IS MOSFET symbol showing the integral reverse P – N junction diode
Wir
5 A
Pulsed diode forward current ISM 20
Diode forward voltage VSD TJ = 25 °C, IS = 4 A, VGS = 0 V 1.2 V
Reverse recovery time trr TJ = 25 °C, IF = IS = 2.5 A, dI/dt = 100 A/μs, VR = 20 V 320 ns
Reverse recovery charge Qrr 1.2 μC
Reverse recovery current IRRM 8 A

TYPICAL CHARACTERISTICS

(25 °C, unless otherwise noted)

Typical Characteristics
Typical Characteristics
Typical Characteristics
Typical Characteristics
Typical Characteristics
Typical Characteristics
Typical Characteristics
Typical Characteristics
Typical Characteristics
Typical Characteristics
Typical Characteristics
Typical Characteristics
Typical Characteristics
Typical Characteristics
Typical CharacteristicsTypical Characteristics
Typical Characteristics

Peak Diode Recovery dV/dt Test Circuit 

Typical Characteristics
Typical Characteristics

Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?91520.

Package Information

Package Information

DIM. MILLIMETERS INCHES
MIN. MAX. MIN. MAX.
A 4.24 4.65 0.167 0.183
b 0.69 1.02 0.027 0.040
b(1) 1.14 1.78 0.045 0.070
c 0.36 0.61 0.014 0.024
D 14.33 15.85 0.564 0.624
E 9.96 10.52 0.392 0.414
e 2.41 2.67 0.095 0.105
e(1) 4.88 5.28 0.192 0.208
F 1.14 1.40 0.045 0.055
H(1) 6.10 6.71 0.240 0.264
J(1) 2.41 2.92 0.095 0.115
L 13.36 14.40 0.526 0.567
L(1) 3.33 4.04 0.131 0.159
Ø P 3.53 3.94 0.139 0.155
Q 2.54 3.00 0.100 0.118
ECN: E21-0621-Rev. D, 04-Nov-2021 DWG: 6031

Note

  • M* = 0.052 inches to 0.064 inches (dimension including protrusion), heatsink hole for HVM

Legal Disclaimer Notice

Disclaimer

ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.

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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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Documents / Resources

VISHAY IRF830B D Series Power MOSFET [pdf] Owner's Manual
IRF830B D Series Power MOSFET, IRF830B, D Series Power MOSFET, Power MOSFET, MOSFET

References

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