V-Mark nRF52840 Embedded Wireless Communication Module Instruction Manual
Description
Introduction
This module is embedded wireless communication module that supports ZigBee 3.0or Thread. The
module is compact, simple in application and can be integrated in system quick and easily. It can
help customers to shorten product development cycle and reduce development cost.
b. Appearance
Module Dimension (Show in Table 1-1)
| Dimension | |
| Lenngth x width x height | 17mm × 15mm × 2.1 mm |
Note: If the Shield is not used, the thickness is 1.8 mm.
c. Parameters
Module working parameters and chip-set characteriistics table.
| Technical Parameter | Parameter Value | ||
| Chip‐set model | nRF52840‐QIAA | ||
| Wireless standar | Support 802.15.4, ZigBeeand Thread | ||
| Operating voltag | 3.3V | ||
| Voltage characteristics | Minimum | Typical | Maximum |
| 1.70V | 3.3V | 3.6V | |
| Receive current | ~5mA, Refer to nRF52840 Product Specificationfor detail | ||
| Trans it current | 32.7mA(8dBm),Refer to nRF52840 Product Specificationfor detail | ||
| Stand y current | 0.4 µA at 3 V in System OFF mode, no RAM retention1.5 µA at 3 V in System ON mode, no RAM retention, wake on RTC | ||
| Flash | 1MB | ||
| RAM | 256KB | ||
| Operating frequency | 2400~ 2483.5 MHz | ||
| Trans it power output | +8dBm | ||
| Wireless data rate | IEEE 802.15.4‐2006 – 250 Kbps | ||
| Interface immunity | DSSS QPSK for IEEE 802.15.4 | ||
| Receiver sensitivity | ‐100dBm ‐‐‐‐ In IEEE 802.15.4 mode | ||
| Operating temperature | ‐40℃~+125℃ | ||
| Environment hu idity | 10%~ 90%No condensation | ||
| Support protocol | ZigBee, Thread | ||
| Approval | FCC (FCC ID: 2AQ7V‐KR840T01) | ||
Function
a. Antenna
The mojule has a meander line inverted F antenna as Figure 2-1 The maximum gain is 1.06 dBi. Please refer to the passive report for more detail parameters.
b. Pin assignment
c. Pin function
| ModulPin # | nRF52840Pin# | Pin Name | Description |
| 1 | G1 | P0.26/SDA | GPIO, configured as I2C SDA |
| 2 | H2 | P0.27/SCL | GPIO, configured as I2C SCL |
| 3 | D2 | P0.00/XL1 | GPIO, connection for 32.768kHz crystal |
| 4 | F2 | P0.01/XL2 | GPIO, connection for 32.768kHz crystal |
| 5 | A12 | P0.02/AIN0 | GPIO, Analog input |
| 6 | B13 | P0.03/AIN1 | GPIO, Analog input |
| 7 | L24 | P0.09/NFC1 | GPIO, NFC antenna connection |
| 8 | J24 | P0.10/NFC2 | GPIO, NFC antenna connection |
| 9 | B1 | VDD | DC supply 1.7V to 3.6V |
| 10 | B7 | GND | Ground |
| 11 | T2 | P0.11 | GPIO |
| 12 | AD22 | P1.00 | GPIO |
| 13 | AD8 | P0.13 | GPIO |
| 14 | AC13 | P0.18/RESET | GPIO, internal RC reset circuit, configurable asRESET pin |
| 15 | AA24 | SWDCLK | Serial Wire Debug clock input |
| 16 | AC24 | SWDIO | Serial Wire Debug I/O |
| Z0 | B19 | P1.11 | GPIO |
| Z1 | B17 | P1.12 | GPIO |
| Z2 | A16 | P1.13 | GPIO |
| Z3 | B15 | P1.14 | GPIO |
| Z4 | A14 | P1.15 | GPIO |
| Z5 | A20 | P1.10 | GPIO |
| Z6 | R24 | P1.06 | GPIO |
| A0 | GND | Ground | |
| A1 | B11 | P0.28/AIN4 | GPIO, Analog input |
| A2 | A10 | P0.29/AIN5 | GPIO, Analog input |
| A3 | J1 | P0.04/AIN2 | GPIO, Analog input |
| A4 | K2 | P0.05/AIN3 | GPIO, Analog input |
| A5 | M2 | P0.07 | GPIO |
| A6 | P2 | P1.08 | GPIO |
| B0 | GND | Ground | |
| B1 | AC21 | P0.25 | GPIO |
| B2 | B9 | P0.30/AIN6 | GPIO |
| B3 | A8 | P0.31/AIN7 | GPIO |
| B4 | L1 | P0.06 | GPIO, PA control |
| B5 | N1 | P0.08 | GPIO, PA control |
| B6 | V23 | P1.03 | GPIO |
| C0 | GND | Ground | |
| C1 | AD20 | P0.24 | GPIO |
| C2 | AD18 | P0.22 | GPIO |
| C3 | AD12 | P0.17 | GPIO, PA control |
| C4 | AD10 | P0.15 | GPIO |
| C5 | W24 | P1.02 | GPIO |
| C6 | U24 | P1.04 | GPIO |
| D0 | GND | Ground | |
| D1 | AC19 | P0.23 | GPIO |
| D2 | AC15 | P0.19 | GPIO, PA control |
| D3 | AC11 | P0.16 | GPIO |
| D4 | AC9 | P0.14 | GPIO |
| D5 | Y23 | P1.01 | GPIO |
| D6 | T23 | P1.05 | GPIO |
| E0 | P23 | P1.07 | GPIO |
| E1 | AD16 | P0.20 | GPIO |
| E2 | AC17 | P0.21 | GPIO |
| E3 | R1 | P1.09 | GPIO |
| E4 | AD6 | D+ | USB D+ |
| E5 | AD4 | D‐ | USB D‐ |
| E6 | U1 | P0.12 | GPIO |
| F0 | Ground pad | ||
| F1 | Ground pad | ||
| F2 | Ground pad | ||
| F3 | Ground pad | ||
| F4 | Y2 | VDDH | High Voltage Power Supply. |
| F5 | AB2 | DCCH | DC to DC converter output |
| F6 | AD2 | VBUS | 5V DC power for USB 3.3V regulator |
d. Debug function
Using Pin9, Pin10 and Pin14~15 for firmware programming, function descreption is shown in table 2-2.
| Pin # | Pin Name | Functio |
| 10 | GND | Ground |
| 14 | Hardware Reset | Triggered by low voltage signal |
| 15 | SWCLK | Debug clock |
| 16 | SWD | Debug Data |
| 9 | VDD | Power supply (3.3V) |
Design Reference
- Power supply filter circuit and data transmission line matching resistor should be placed as close as possible to the module.
- Place the module as far away as possible from interference source, for example, Wi-Fi antenna, GSM antenna, DDR CLK, LCD circuitry.
- Ensure that the ground, power, and signal planes are vacant immediately below the antenna section. Option 1 is the best layout for module on the host board. Option 2 is also recommended.
- Try to use an LDO which is suitable for radio frequency applications to provide 5V constant voltage power supply for the module
- Suggest using double-sided PCB design
- Unused 10 port can leave floating
- The width of LED driver trace should be designed according to actual current
- The default state of output 10 port is high level. It is recommended that the user to add a 1.2K0 pull low resistor.
- Reset pulse must be at least 200ms, as shown in Figure 3-1.
Structure and Assembly
a. structure
Mojule dimension is 17mm 15mm and thickness is 2.1mm (with the shield). The module demension and pas size are shown in Figure 5-1. The antenna size follows module size and the width is the same.
b. Schematic Diagram
Design Notes
a. Module storage instructions
- Packaged module storage period
- Storage period: 12 months
- Storage environment conditions: Temperature < 40°C, Humidity < 90% R.H.
- Inventory control: base on first in first out principle
- Time limit for SMT assembly for unpacked module
- Check humidity card: blue means humidity < 20%; Red means humidity > 30% (module has absorbed moisture)
- SMT workshop environment control: Temperature: 22°C (±4°C),Humidity: 60% R.H. (±20%)
- After baking, use for SMT production immediately or place an appropriate amount of
- desiccant, seal the package and store in a drying cabinet.
b. If it is not used up within 48hours after unpacked
- The module must be baked again to remove moisture on module
- Baking temperature conditions
- High temperature resistant packaging material: 120°C (±5°C), 24 hours
- Non-high temperature resistant packaging material: 40°C (±3°C), 192 hours
c. Module baking temperature, time, operation, and humidity requirements
- The requirement on “Incoming Packaging Instruction” shall prevail. If there is no incoming packaging instruction, please refer to this article.
d. Humidity check card on packaging and SMT time limit after unpacked
- After unpacked, the module must complete SMT assembly within 48hours
- Unpacked module must be stored in a drying cabinet where humidity must be lower than 20%R.H.
e. Soldering Temperature-Time Profile for Re-Flow Soldering
- Maximum number of cycles for re-flow is 2. No opposite side re-flow is allowed due to module weight.
A. FCC Warnings Statement
Changes or modifications not expressly approved by the party responsible for compliance couldvoid the user’s authority to operate the equipment. This equipment has been tested and found tocomply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. Theselimits are designed to provide reasonable protection against harmful interference in a residentialinstallation. This equipment generates uses and can radiate radio frequency energy and, if notinstalled and used in accordance with the instructions, may cause harmful interference to radiocommunications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception,which can be determined by turning the equipment off and on, the user is encouraged to try tocorrect the interference by one or more of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.
This device complies with part 15 of the FCC Rules. Operation is subject to the followingtwo conditions:
- This device may not cause harmful interference, and
- this device must accept any interference received, including interference that maycause undesired operation.
NOTE: This device and its antenna(s) must not be co-located or operation in conjunction with any other antenna or transmitter.
A.1 RF Exposure Statement
To maintain compliance with FCC’s RF Exposure guidelines, this equipment should beinstalled and operated with minimum distance of 20cm the radiator your body. This deviceand its antenna(s) must not be co-located or operation in conjunction with any other antenna or transmitter.
A.2 List of applicable FCC rules
List the FCC rules that are applicable to the modular transmitter. These are the rules that specificallyestablish the bands of operation, the power, spurious emissions, and operating fundamentalfrequencies. DO NOT list compliance to unintentional-radiator rules (Part 15 Subpart B) since that is not aconditionof a module grant that is extended to a host manufacturer. See also Section 2.10 below concerning theneed to notify host manufacturers that further testing is required.3 Explanation: This module meets the requirements of Part 15 Subpart C Section 15.247
A.3 Summarize the specific operational use conditions
Describe use conditions that are applicable to the modular transmitter, including for example anylimits on antennas, etc. For example, if point-to-point antennas are used that require reduction inpower or compensation for cable loss, then this information must be in the instructions. If the usecondition limitations extend to professional users, then instructions must state that this informationalso extends to the host manufacturer’ s instruction manual. In addition, certain information mayalso be needed, such as peak gain per frequency band and minimum gain, specifically for masterdevices in S GHz DFS bands. Explanation: The EUT uses PCB Antenna, antenna gain: 1.06dBi. There is no restriction onthe installation method.
A.4 Limited module procedures
If a modular transmitter is approved as a “limited module,” then the module manufacturer isresponsiblefor approving the host environment that the limited module is used with. The manufacturer of alimitedmodule must describe, both in the filing and in the installation instructions, the alternative means thatthelimited module manufacturer uses to verify that the host meets the necessary requirements to satisfythemodule limiting conditions.
A limited module manufacturer has the flexibility to define its alternative method to address theconditions that limit the initial approval, such as: shielding, minimum signaling amplitude, bufferedmodulation/data inputs, or power supply regulation. The alternative method could include that thelimitedmodule manufacturer reviews detailed test data or host designs prior to giving the host manufacturerapproval. This limited module procedure is also applicable for RF exposure evaluation when it is necessary todemonstrate compliance in a specific host. The module manufacturer must state how control of theproduct into which the modular transmitter will be installed will be maintained such that fullcomplianceof the product is always ensured. For additional hosts other than the specific host originally grantedwith alimited module, a Class II permissive change is required on the module grant to register the additionalhost as a specific host also approved with the module.
Explanation: The module is not a limited module.
A.5 Trace antenna designs
For a modular transmitter with trace antenna designs, see the guidance in Question 11 of KDBPublication 996369 D02 FAQ – Modules for Micro-Strip Antennas and traces. The integrationinformation shall include for the TCB review the integration instructions for the following aspects: layoutof trace design, parts list (BOM), antenna, connectors, and isolation requirements.4
a) Information that includes permitted variances (e.g., trace boundary limits, thickness, length,width, shape(s), dielectric constant, and impedance as applicable for each type of antenna);
b) Each design shall be considered a different type (e.g., antenna length in multiple(s) of frequency,the wavelength, and antenna shape (traces in phase) can affect antenna gain and must beconsidered);
c) The parameters shall be provided in a manner permitting host manufacturers to design the printedcircuit (PC) board layout;
d) Appropriate parts by manufacturer and specifications;
e) Test procedures for design verification; and
f) Production test procedures for ensuring compliance. The module grantee shall provide a notice that any deviation(s) from the defined parameters of theantenna trace, as described by the instructions, require that the host product manufacturer must notifythemodule grantee that they wish to change the antenna trace design. In this case, a Class II permissivechange application is required to be filed by the grantee, or the host manufacturer can take responsibilitythrough the change in FCC ID (new application) procedure followed by a Class II permissive changeapplication.
Explanation: No. The module with trace antenna designs
A.6 RF exposure considerations
It is essential for module grantees to clearly and explicitly state the RF exposure conditions that permit ahost product manufacturer to use the module. Two types of instructions are required for RF exposureinformation:
(1) to the host product manufacturer, to define the application conditions (mobile,portable – xx cm from a person’ s body); and
(2) additional text needed for the host product manufacturer toprovideto end users in their end-product manuals. If RF exposure statements and use conditions are notprovided,then the host product manufacturer is required to take responsibility of the module through a change inFCC ID (new application). Explanation: This module complies with FCC RF radiation exposure limits set forth for anuncontrolled environment. The device is mobile, portable, and the use distance is 20 cm.This moduleis designed to comply with the FCC statement, FCC ID is: 2AQ7V-KR840T01
A.7 Antennas
A list of antennas included in the application for certification must be provided in the instructions. For modular transmitters approved as limited modules, all applicable professional installer instructions must be included as part of the information to the host product manufacturer. The antenna list shall also identify the antenna types (mono-pole, PIFA, dipole, etc. (note that for example an “omni-directional antenna” is not considered to be a specific “antenna type”)). For situations where the host product manufacturer is responsible for an external connector, for Example with an RF pin and antenna trace design, the integration instructions shall inform the installer that unique antenna connector must be used on the Part 15 authorized transmitters used in the host product. The module manufacturers shall provide a list of acceptable unique connectors. Explanation: The EUT uses PCB Antenna, antenna gain: 1.06dBi.
A.8 Label and compliance information
Grantees are responsible for the continued compliance of their modules to the FCC rules. This includesadvising host product manufacturers that they need to provide a physical or e-label stating “ContainsFCCID” with their finished product. See Guidelines for Labeling and User Information for RF Devices – KDB Publication 784748. Explanation:The host system using this module, should have label in a visible area indicated hefollowing texts: “Contains FCC ID: 2AQ7V-KR840T01
A.9 Information on test modes and additional testing requirements
Additional guidance for testing host products is given in KDB Publication 996369 D04 ModuleIntegration Guide. Test modes should take into consideration different operational conditions for astandalonemodular transmitter in a host, as well as for multiple simultaneously transmitting modules or othertransmitters in a host product. The grantee should provide information on how to configure test modes for host product evaluationfordifferent operational conditions for a stand-alone modular transmitter in a host, versus with multiple,simultaneously transmitting modules or other transmitters in a host.Grantees can increase the utility of their modular transmitters by providing special means, modes, orinstructions that simulates or characterizes a connection by enabling a transmitter. This can greatlysimplify a host manufacturer’s determination that a module as installed in a host complies with FCCrequirements. Explanation: Data transfer module demo board can control the EUT work in RF test mode at specifiedtest channel
A.10 Additional testing, Part 15 Subpart B disclaimer
The grantee should include a statement that the modular transmitter is only FCC authorized for thespecific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host productmanufacturer is responsible for compliance to any other FCC rules that apply to the host not coveredby the modular transmitter grant of certification. If the grantee markets their product as being Part 15Subpart B compliant (when it also contains unintentional-radiator digital circuity), then the granteeshall provide a notice stating that the final host product still requires Part 15 Subpart B compliancetesting with the modular transmitter installed.
Explanation: The module without unintentional-radiator digital circuity, so the module does notrequire an evaluation by FCC Part 15 Subpart B. The host should be evaluated by the FCC Subpart B
V-Mark Enterprises Ltd.
Add.: 400-601 West Broadway, Vancouver BC, Canada V5Z 4C2
Phone: 604.588.6178,
Fax: 604.859.8818,
Email: infoPv-mark.com
Documents / Resources
 |
V-Mark nRF52840 Embedded Wireless Communication Module [pdf] Instruction Manual KR840T01, 2AQ7V-KR840T01, 2AQ7VKR840T01, nRF52840 Embedded Wireless Communication Module, Embedded Wireless Communication Module, Wireless Communication Module, Communication Module |
