TQMxCU1-HPCM Embedded Module User Manual

This Preliminary User’s Manual is the guide for operating the
MB-COMHPCM-1. It contains important information regarding
copyright, licensing, and usage restrictions.

1.1 Copyright and License Expenses

The manual may not be copied, reproduced, translated, changed,
or distributed without written consent from TQ-Systems GmbH. The
drivers, utilities, and BIOS included are subject to the copyrights
of their respective manufacturers. BIOS-license expenses are
covered by TQ-Systems GmbH.

FAQ:

Q: Can I modify or distribute the manual?

A: No, the manual cannot be modified, copied, or distributed
without written consent from TQ-Systems GmbH.

Q: Who covers the BIOS-license expenses?

A: BIOS-license expenses are paid by TQ-Systems GmbH and are
included in the product price.

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MB-COMHPCM-1 Preliminary User’s Manual
MB-COMHPCM-1 UM 0001 17.06.2025

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TABLE OF CONTENTS

1. 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 1.10 1.11 2. 2.1 2.2 2.3 2.4 3. 3.1 3.2 3.2.1 3.2.2 3.3 3.4 3.4.1 3.5 3.5.1 3.5.2 3.5.3 3.5.4 3.5.5 3.5.6 3.5.7 3.5.8 3.5.9 3.5.10 3.5.11 3.5.12 3.5.13 3.5.14 3.5.15 3.5.16 3.6 3.6.1 3.6.2 3.7 4. 4.1 4.2 5. 5.1 5.2 6. 6.1 6.2 6.3 6.4 6.5 6.6 6.7 6.8 6.9

ABOUT THIS MANUAL …………………………………………………………………………………………………………………………………………………… 1 Copyright and Licence Expenses …………………………………………………………………………………………………………………………………. 1 Registered Trademarks …………………………………………………………………………………………………………………………………………………. 1 Disclaimer……………………………………………………………………………………………………………………………………………………………………….. 1 Intended Use ………………………………………………………………………………………………………………………………………………………………….. 1 Imprint…………………………………………………………………………………………………………………………………………………………………………….. 2 Service and Support……………………………………………………………………………………………………………………………………………………….2 Tips on Safety………………………………………………………………………………………………………………………………………………………………….2 Symbols and Typographic Conventions……………………………………………………………………………………………………………………… 2 Handling and ESD Tips…………………………………………………………………………………………………………………………………………………..3 Naming of Signals…………………………………………………………………………………………………………………………………………………………..3 Further Applicable Documents / Presumed Knowledge……………………………………………………………………………………………3 INTRODUCTION ……………………………………………………………………………………………………………………………………………………………… 4 Functional Overview………………………………………………………………………………………………………………………………………………………4 Specification Compliance……………………………………………………………………………………………………………………………………………… 5 Carrier Board Standard Configurations………………………………………………………………………………………………………………………..5 Accessories……………………………………………………………………………………………………………………………………………………………………… 5 FUNCTION ………………………………………………………………………………………………………………………………………………………………………. 6 Block Diagram…………………………………………………………………………………………………………………………………………………………………6 Electrical Specification ………………………………………………………………………………………………………………………………………………….. 7 Supply Voltage Characteristics …………………………………………………………………………………………………………………………………….. 7 Power Consumption Specification……………………………………………………………………………………………………………………………….7 Environmental Specification ………………………………………………………………………………………………………………………………………… 7 System Components……………………………………………………………………………………………………………………………………………………… 7 HD-Audio Controller ……………………………………………………………………………………………………………………………………………………… 7 Connectors and Interfaces ……………………………………………………………………………………………………………………………………………. 8 Power Supply Input connector………………………………………………………………………………………………………………………………….. 10 DisplayPort Interface ………………………………………………………………………………………………………………………………………………….. 10 USB Host Interfaces …………………………………………………………………………………………………………………………………………………….. 11 USB4 Type C Interface ………………………………………………………………………………………………………………………………………………… 11 Ethernet Interface ……………………………………………………………………………………………………………………………………………………….. 12 Serial (RS-232) Interface ……………………………………………………………………………………………………………………………………………… 12 Embedded Display and LVDS connector………………………………………………………………………………………………………………….. 13 M.2 sockets with M key (PCI Express SSD devices) ………………………………………………………………………………………………….. 16 M.2 sockets with E key (I/O devices) …………………………………………………………………………………………………………………………. 16 PCI Express connector ………………………………………………………………………………………………………………………………………………… 16 Audio connectors ……………………………………………………………………………………………………………………………………………………….. 17 Fan connector ……………………………………………………………………………………………………………………………………………………………… 17 Debug connector………………………………………………………………………………………………………………………………………………………… 18 Debug LEDs …………………………………………………………………………………………………………………………………………………………………. 20 SPI Flash Socket …………………………………………………………………………………………………………………………………………………………… 20 COM-HPC® Mini connector………………………………………………………………………………………………………………………………………… 21 Buttons…………………………………………………………………………………………………………………………………………………………………………. 22 Reset Button ………………………………………………………………………………………………………………………………………………………………… 22 Power Button ………………………………………………………………………………………………………………………………………………………………. 22 PCIe Lane assignment ………………………………………………………………………………………………………………………………………………… 22 MECHANICS …………………………………………………………………………………………………………………………………………………………………. 23 Dimensions ………………………………………………………………………………………………………………………………………………………………….. 23 Protection Against External Effects …………………………………………………………………………………………………………………………… 23 SOFTWARE …………………………………………………………………………………………………………………………………………………………………… 23 System Resources ……………………………………………………………………………………………………………………………………………………….. 23 Driver Download…………………………………………………………………………………………………………………………………………………………. 23 SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS…………………………………………………………………………………….. 24 EMC ………………………………………………………………………………………………………………………………………………………………………………. 24 ESD ……………………………………………………………………………………………………………………………………………………………………………….. 24 Operational Safety and Personal Security………………………………………………………………………………………………………………… 24 Cyber Security……………………………………………………………………………………………………………………………………………………………… 24 Reliability and Service Life………………………………………………………………………………………………………………………………………….. 24 Export Control and Sanctions Compliance………………………………………………………………………………………………………………. 24 Warranty ………………………………………………………………………………………………………………………………………………………………………. 24 RoHS……………………………………………………………………………………………………………………………………………………………………………… 25 WEEE® …………………………………………………………………………………………………………………………………………………………………………… 25

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6.10

REACH® ………………………………………………………………………………………………………………………………………………………………………… 25

6.11

Statement on California Proposition 65 …………………………………………………………………………………………………………………… 25

6.12

EuP………………………………………………………………………………………………………………………………………………………………………………… 25

6.13

Battery ………………………………………………………………………………………………………………………………………………………………………….. 25

6.14

Packaging…………………………………………………………………………………………………………………………………………………………………….. 25

6.15

Other Entries………………………………………………………………………………………………………………………………………………………………… 26

APPENDIX …………………………………………………………………………………………………………………………………………………………………….. 27

7.1

Acronyms and Definitions………………………………………………………………………………………………………………………………………….. 27

7.2

References……………………………………………………………………………………………………………………………………………………………………. 31

TABLE DIRECTORY

Table 1: Table 2: Table 3: Table 4: Table 5: Table 6: Table 7: Table 8: Table 9: Table 10: Table 11: Table 12: Table 13: Table 14: Table 15: Table 16: Table 17: Table 18: Table 19: Table 20:

Terms and Conventions…………………………………………………………………………………………………………………………………………………2 Power-In connector…………………………………………………………………………………………………………………………………………………….. 10 COM-HPC® Mini SuperSpeed DisplayPort port mapping ………………………………………………………………………………………. 10 USB 2.0 Host Extension connector ……………………………………………………………………………………………………………………………. 11 COM-HPC® Mini SuperSpeed USB 3.2 and USB 2.0 port mapping ………………………………………………………………………… 11 Ethernet LEDs………………………………………………………………………………………………………………………………………………………………. 12 Serial port RS-232 pinout via cable to 9-pin D-Sub …………………………………………………………………………………………………. 12 eDP connector …………………………………………………………………………………………………………………………………………………………….. 13 LVDS connector…………………………………………………………………………………………………………………………………………………………… 14 Backlight connector ……………………………………………………………………………………………………………………………………………………. 15 COM-HPC® Mini PCI Express port mapping……………………………………………………………………………………………………………… 16 COM-HPC® Mini PCI Express and USB port mapping ……………………………………………………………………………………………… 16 COM-HPC® Mini PCI Express port mapping……………………………………………………………………………………………………………… 16 Fan connector ……………………………………………………………………………………………………………………………………………………………… 17 GPIO Signal Debug connector X28 …………………………………………………………………………………………………………………………… 18 I2C and COM Signal Debug connector X26………………………………………………………………………………………………………………. 19 Debug LEDs …………………………………………………………………………………………………………………………………………………………………. 20 PCIe lane assignment …………………………………………………………………………………………………………………………………………………. 22 Acronyms …………………………………………………………………………………………………………………………………………………………………….. 27 Further Applicable Documents and Links………………………………………………………………………………………………………………… 31

ILLUSTRATION DIRECTORY

Illustration 1: Illustration 2: Illustration 3: Illustration 4: Illustration 5: Illustration 6: Illustration 7: Illustration 8: Illustration 9: Illustration 10: Illustration 11: Illustration 12: Illustration 13: Illustration 14: Illustration 15:

MB-COMHPCM-1 Block Diagram …………………………………………………………………………………………………………………………………. 6 MB-COMHPCM-1 Top view …………………………………………………………………………………………………………………………………………… 8 MB-COMHPCM-1 Bottom view……………………………………………………………………………………………………………………………………..9 RJ45 connectors ………………………………………………………………………………………………………………………………………………………….. 12 10-pin RS-232 connectors ………………………………………………………………………………………………………………………………………….. 12 eDP connector …………………………………………………………………………………………………………………………………………………………….. 13 Config jumper: eDP or LVDS………………………………………………………………………………………………………………………………………. 14 LVDS connector…………………………………………………………………………………………………………………………………………………………… 14 Backlight connector ……………………………………………………………………………………………………………………………………………………. 15 Audio connectors ……………………………………………………………………………………………………………………………………………………….. 17 Fan connector ……………………………………………………………………………………………………………………………………………………………… 17 Debug connectors………………………………………………………………………………………………………………………………………………………. 18 SPI socket and BSEL0 Jumper…………………………………………………………………………………………………………………………………….. 20 COM-HPC® Mini board-to-board distance ……………………………………………………………………………………………………………….. 21 COM-HPC® Mini connectors ………………………………………………………………………………………………………………………………………. 21

REVISION HISTORY

Rev.

Date

0001 17.06.2025

Name KG

Pos. First edition

Modification

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1. ABOUT THIS MANUAL

1.1

Copyright protected © 2025 by TQ-Systems GmbH.
This Preliminary User’s Manual may not be copied, reproduced, translated, changed or distributed, completely or partially in electronic, machine readable, or in any other form without the written consent of TQ-Systems GmbH.
The drivers and utilities for the components used as well as the BIOS are subject to the copyrights of the respective manufacturers. The licence conditions of the respective manufacturer are to be adhered to.
BIOS-licence expenses are paid by TQ-Systems GmbH and are included in the price.
Licence expenses for the operating system and applications are not taken into consideration and must be calculated / declared separately.

1.2

Registered Trademarks

TQ-Systems GmbH aims to adhere to copyrights of all graphics and texts used in all publications, and strives to use original or license-free graphics and texts.
All brand names and trademarks mentioned in this Preliminary User’s Manual, including those protected by a third party, unless specified otherwise in writing, are subjected to the specifications of the current copyright laws and the proprietary laws of the present registered proprietor without any limitation. One should conclude that brand and trademarks are rightly protected by a third party.

1.3

Disclaimer

TQ-Systems GmbH does not guarantee that the information in this Preliminary User’s Manual is up-to-date, correct, complete or of good quality. Nor does TQ-Systems GmbH assume guarantee for further usage of the information. Liability claims against TQSystems GmbH, referring to material or non-material related damages caused, due to usage or non-usage of the information given in this Preliminary User’s Manual, or due to usage of erroneous or incomplete information, are exempted, as long as there is no proven intentional or negligent fault of TQ-Systems GmbH.
TQ-Systems GmbH explicitly reserves the rights to change or add to the contents of this Preliminary User’s Manual or parts of it without special notification.

1.4

Intended Use

TQ DEVICES, PRODUCTS AND ASSOCIATED SOFTWARE ARE NOT DESIGNED, MANUFACTURED OR INTENDED FOR USE OR RESALE FOR THE OPERATION IN NUCLEAR FACILITIES, AIRCRAFT OR OTHER TRANSPORTATION NAVIGATION OR COMMUNICATION SYSTEMS, AIR TRAFFIC CONTROL SYSTEMS, LIFE SUPPORT MACHINES, WEAPONS SYSTEMS, OR ANY OTHER EQUIPMENT OR APPLICATION REQUIRING FAIL-SAFE PERFORMANCE OR IN WHICH THE FAILURE OF TQ PRODUCTS COULD LEAD TO DEATH, PERSONAL INJURY, OR SEVERE PHYSICAL OR ENVIRONMENTAL DAMAGE. (COLLECTIVELY, “HIGH RISK APPLICATIONS”)

You understand and agree that your use of TQ products or devices as a component in your applications are solely at your own risk. To minimize the risks associated with your products, devices and applications, you should take appropriate operational and design related protective measures.

You are solely responsible for complying with all legal, regulatory, safety and security requirements relating to your products. You are responsible for ensuring that your systems (and any TQ hardware or software components incorporated into your systems or products) comply with all applicable requirements. Unless otherwise explicitly stated in our product related documentation, TQ devices are not designed with fault tolerance capabilities or features and therefore cannot be considered as being designed, manufactured or otherwise set up to be compliant for any implementation or resale as a device in high risk applications. All application and safety information in this document (including application descriptions, suggested safety precautions, recommended TQ products or any other materials) is for reference only. Only trained personnel in a suitable work area are permitted to handle and operate TQ products and devices. Please follow the general IT security guidelines applicable to the country or location in which you intend to use the equipment.

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1.5

Imprint

TQ-Systems GmbH Gut Delling, Mühlstraße 2 D-82229 Seefeld

Tel: Fax: E-Mail: Web:

+49 8153 93080 +49 8153 93084223 Info@TQ-Group TQ-Group

1.6

Service and Support

Please visit our website www.tq-group.com for latest product documentation, drivers, utilities and technical support. You can register on our website www.tq-group.com to have access to restricted information and automatic update services. For direct technical support, you can contact our FAE team by email: support@tq-group.com. Our FAE team can also support you with additional information like 3D-STEP files and confidential information, which is not provided on our public website. For service/RMA, please contact our service team by email (service@tq-group.com) or your sales team at TQ.

1.7

Tips on Safety

Improper or incorrect handling of the product can substantially reduce its life span.

1.8

Symbols and Typographic Conventions

Table 1: Symbol

Terms and Conventions

Meaning

This symbol represents the handling of electrostatic-sensitive modules and / or components. These components are often damaged / destroyed by the transmission of a voltage higher than about 50 V. A human body usually only experiences electrostatic discharges above approximately 3,000 V.

This symbol indicates the possible use of voltages higher than 24 V. Please note the relevant statutory regulations in this regard. Non-compliance with these regulations can lead to serious damage to your health and cause damage / destruction of the component.

This symbol indicates a possible source of danger. Acting against the procedure described can lead to possible damage to your health and / or cause damage / destruction of the material used.

This symbol represents important details or aspects for working with TQ-products.

Command

A font with fixed width denotes commands, contents, file names, or menu items.

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1.9

Handling and ESD Tips

General handling of your TQ-products

The TQ-product may only be used and serviced by certified personnel who have taken note of the information, the safety regulations in this document and all related rules and regulations.
A general rule is, not to touch the TQ-product during operation. This is especially important when switching on, changing jumper settings or connecting other devices without ensuring beforehand that the power supply of the system has been switched off.
Violation of this guideline may result in damage / destruction of the MB-COMHPCM-1 module and be dangerous to your health.
Improper handling of your TQ-product would render the guarantee invalid.

Proper ESD handling

The electronic components of your TQ-product are sensitive to electrostatic discharge (ESD).
Always wear antistatic clothing, use ESD-safe tools, packing materials etc., and operate your TQproduct in an ESD-safe environment. Especially when you switch modules on, change jumper settings, or connect other devices.

1.10 Naming of Signals
A hash mark (#) at the end of the signal name indicates a low-active signal. Example: RESET# If a signal can switch between two functions and if this is noted in the name of the signal, the low-active function is marked with a hash mark and shown at the end. Example: C / D# If a signal has multiple functions, the individual functions are separated by slashes when they are important for the wiring. The identification of the individual functions follows the above conventions. Example: WE2# / OE#

1.11 Further Applicable Documents / Presumed Knowledge
· Specifications and manual of the modules used: These documents describe the service, functionality and special characteristics of the module used.
· Specifications of the components used: The manufacturer’s specifications of the components used, for example CompactFlash cards, are to be taken note of. They contain, if applicable, additional information that must be taken note of for safe and reliable operation. These documents are stored at TQ-Systems GmbH.
· Chip errata: It is the user’s responsibility to make sure all errata published by the manufacturer of each component are taken note of. The manufacturer’s advice should be followed.
· Software behaviour: No warranty can be given, nor responsibility taken for any unexpected software behaviour due to deficient components.
· General expertise: Expertise in electrical engineering / computer engineering is required for the installation and the use of the device.
Implementation information for the carrier board design is provided in the COM-HPC® Design Guide (2) maintained by the PICMG®. This Carrier Design Guide includes a very good guideline to design a COM-HPC® Mini carrier board. It includes detailed information with schematics and detailed layout guidelines. Please refer to the official PICMG® documentation for additional information (1), (2).
The COM-HPC® Mini redefines a number of I/O voltages from 3.3 V to 1.8 V, reflecting current processor trends. Low-speed, single-ended signals, that are directly attached to the COM-HPC® Mini module are redefined to operate at 1.8 V.

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2. INTRODUCTION
The COM-HPC® Mini mainboard MB-COMHPCM-1 is a carrier board for COM-HPC® Mini modules. It can be used for panel PCs, embedded computers or as an evaluation platform for COM-HPC® Mini modules. In combination with a standard COM-HPC® Mini module it forms a very compact hardware kit that can be used for a freely scalable embedded PC platform. Because of this with uniform interfaces and dimensions the PC system can be easily adapted to meet the requirements of the application. The manifold extension options and storage media, which can be added, offer a high level of flexibility and allow functionalities and performance to be extended easily, quickly and inexpensively. Typical usage is in embedded server applications, PC systems for automation, visualisation and monitoring and all applications that place high demands on quality, durability and long-term availability.

2.1

Functional Overview

The following key functions are implemented on the MB-COMHPCM-1: Supported Modules:
· TQ COM-HPC® Mini modules

External Interfaces: · 2 × 10 BASE-T / 100 BASE-TX / 1000 BASE-T / 2500 BASE-T Ethernet interface · 2 × USB 3.2 Gen 2 Type A connector, USB 3.0 compatible · 2 × USB 3.2 Gen 1 Type A connector, USB 3.0 compatible · 1 × USB4 Type C connector or DisplayPort (DP++) connector · 1 × DisplayPort (DP++) connector · 3 × Audio (headphone out, microphone in, line in) · Power Button / Reset

Internal Interfaces: · 1 × LVDS and eDP connector · 1 × Backlight power connector · 1 × USB 2.0 on-board header · 3 × M.2 socket with E key for USB 2.0 and PCI Express x1 ( for WLAN / Bluetooth cards) · 2 × M.2 socket with M key for PCI Express Gen4 x4 (for SSDs) · 1 × PCI Express standard x16 port to support standard PCI Express Gen4 x4 cards · 2 × Serial port with RS-232 transceivers · 2 × GPIO / I2C / MISC debug connectors · 1 × FAN

Power supply: · Voltage: 12 V DC ±5 %

Environment: · Extended temperature: 20 °C to +85 °C

Form factor / dimensions: · 170 mm × 170 mm (Mini ITX)

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2.2

Specification Compliance

The MB-COMHPCM-1 supports compliant to PICMG® standard COM-HPC® Mini (COM-HPC® Module Base Specification Rev. 1.2).

2.3

Carrier Board Standard Configurations

· MB-COMHPCM-1

Other configurations are available on request.

2.4

Accessories

· DK-USB-TYPE A-MOL5 Adapter cable from internal USB connector to A-Type receptacle, 150 mm long
· DK-RS232-9-PIN-DSUB-PICOBLADE Adapter cable from internal connector to 9-pin D-Sub male connector, 150 mm long
· Battery CR2032 lithium coin cell
· Meanwell 180W 12V Power Supply GST220A12-R7B

Please contact support@tq-group.com for details about DisplayPort cables and DisplayPort to DVI/HDMI adapters.

3. FUNCTION

3.1

Block Diagram

The following illustration shows the block diagram of the MB-COMHPCM-1:

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Illustration 1: MB-COMHPCM-1 Block Diagram

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3.2

Electrical Specification

3.2.1 Supply Voltage Characteristics

The MB-COMHPCM-1 requires a supply voltage of 12 V DC ±5 %. The input voltages shall rise from 10 % of nominal to 90 % of nominal within 0.1 msec to 20 msec. (0.1 msec Rise Time 20 msec).
There must be a smooth and continuous increase of each DC output voltage from 10 % to 90 % of its final set point within the regulation range.

3.2.2 Power Consumption Specification
The power consumption of the system significantly depends on the connected devices; e.g. type of COM-HPC® Mini module, mass storage devices, USB devices, display backlight, etc. The power consumption of the MB-COMHPCM-1 itself is approximately 2 W.

Note: Power requirement
The MB-COMHPCM-1 input current is not fused. The user has to ensure that the input current does not exceed the maximum current of 25 A (300 W). When designing on own power supply, the maximum power consumption of all connected components has to be taken into account.

3.3
· · ·

Environmental Specification
Operating temperature, extended: Storage temperature: Relative humidity (operating / storage):

20 °C to +85 °C 40 °C to +85 °C
10 % to 90 % (not condensing)

3.4

System Components

3.4.1 HD-Audio Controller

The MB-COMHPCM-1 features a Realtek ALC262 High Definition Audio Codec with headphone out, line-in, and microphone in.

3.5

Connectors and Interfaces

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X10:

X15:

Power In 12 V DC LVDS or eDP

X16: RTC battery

X17: M.2 socket (E key)

X11 (blue): Line-in X12 (green): Headphone out X13 (pink): Mic in

X20: RS-232 (UART0)
X23: RS-232 (UART1)

Debug LEDs
X19: PCI Express slot
X1: COM-HPC® Mini connector
X26: Debug socket
X27: SPI flash socket
X28: Debug socket
X29: BSEL0
X31: 12 V Fan

X2 | X3: USB4 Type C or DisplayPort

X4: DisplayPort

X5: 2 × USB 3.2 Gen 2

X6: 2 × USB 3.2 Gen 1

X7 | X8: 2 × 2.5 Gigabit Ethernet

S2: Power Button

S3: Reset Button

Illustration 2: MB-COMHPCM-1 Top view

X32: LVDS

X33:
Embedded DisplayPort

X34: Display Backlight

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X36 | X35: M.2 socket (M key) PCIe SSD
Illustration 3: MB-COMHPCM-1 Bottom view

X37: M.2 socket (E key)
X39: M.2 socket (E key)
X40: USB2.0

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3.5.1 Power Supply Input connector The MB-COMHPCM-1 requires a single 12 V DC power supply. The supply voltage must not vary more than ±5 %.

X10: Power Input connector – Connector type: – Mating connector:

Phoenix PC4/2-G-7,62 Phoenix PC4/2-ST-7,62 (up to 20 A) Phoenix PC5/2-ST-7,62 (up to 25 A)

Table 2: Pin 1 2

Power-In connector Signal
12 V GND

Remark Max. 25 A, current limit has to be supported by power supply

Note: Power requirement
The MB-COMHPCM-1 input current is not fused. The user has to ensure that the input current does not exceed the maximum current of 25 A (300 W). Additionally the cable diameter has to be selected in correlation to the maximum current.

3.5.2 DisplayPort Interface
The MB-COMHPCM-1 features up to two DisplayPort interfaces. – X3: DisplayPort 0 with 4k (HBR2) on standard DisplayPort connector – X4: DisplayPort 1 with 4k (HBR2) on standard DisplayPort connector

The DisplayPort 1 interface and the USB4 Type C port are factory-configured. The user has to select one of the interfaces.

Table 3: COM-HPC® Mini SuperSpeed DisplayPort port mapping

COM-HPC® Mini SuperSpeed port

MB-COMHPCM-1 connector

SuperSpeed port 1 0 SuperSpeed port 3 2

DisplayPort connector X4 DisplayPort connector X3

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3.5.3 USB Host Interfaces The MB-COMHPCM-1 features several USB Host interfaces.

X5: USB 3.2 Gen 2 (up to 10 Gb/s) double Type A connector with USB 3.0 compatibility Power: up to 1.5 A @ 5 V

X6: USB 3.2 Gen 1 (up to 5 Gb/s) double Type A connector with USB 3.0 compatibility Power: up to 1.5 A @ 5 V

X40: USB 2.0 host extension connector for usage of a USB 2.0 host port with an adapter cable

– Connector type:

Molex 53398-0571

– Mating connector: Molex 51021-0500 crimp housing

Table 4: USB 2.0 Host Extension connector

Signal

+5 V

D+

GND

Remark

Table 5: COM-HPC® Mini SuperSpeed USB 3.2 and USB 2.0 port mapping

COM-HPC® Mini SuperSpeed port

COM-HPC® Mini USB 2.0 port

MB-COMHPCM-1 connector

SuperSpeed port 7 SuperSpeed port 6 SuperSpeed port 5 SuperSpeed port 4

USB 2.0 port 5 USB 2.0 port 3 USB 2.0 port 4 USB 2.0 port 1

USB Type A connector X5, top USB Type A connector X5, bot USB Type A connector X6, top USB Type A connector X6, bot

3.5.4 USB4 Type C Interface The USB Type-C sub-system supports USB2.0, USB 3.2, USB4, and DPoC (DisplayPort over Type-C) protocols.
X2: USB4 Type C connector with USB4 compatibility Power: up to 3 A @ 5 V
The DisplayPort 1 interface and the USB4 Type C port are factory-configured. The user has to select one of the interfaces.

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3.5.5 Ethernet Interface
The MB-COMHPCM-1 features two NBASE-T Ethernet ports with automatic speed configuration 10 BASE-T / 100 BASE-TX / 1000 BASE-T / 2500 BASE-T. The Ethernet ports of the COM-HPC® Mini module are routed to connectors X7 and X8.

Table 6: Ethernet LEDs

LED
Left, green (Link)
Right, yellow (ACT)

Status
Off: No link On: Link established with 2500 BASE-T Off: No activity On: Activity

Illustration 4: RJ45 connectors

3.5.6 Serial (RS-232) Interface The MB-COMHPCM-1 features two RS-232 serial ports at the on-board connector.

X20, X23: RS-232 connector – Connector type: – Mating connector:

Molex 53398-1071 Molex 51021-1000 crimp housing

Table 7: Serial port RS-232 pinout via cable to 9-pin D-Sub

MB-COMHPCM-1 connector

9-pin D-Sub connector (with D-Sub adapter)

1 NC 2 NC 3 RXD 4 RTS 5 TXD 6 CTS 7 NC 8 NN 9 GND 10 NC

RXD TXD GND RTS CTS

Illustration 5: 10-pin RS-232 connectors

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3.5.7 Embedded Display and LVDS connector
The COM-HPC® Mini module only supports an embedded DisplayPort (eDP); the LVDS interface is no longer supported. However, an eDP-to-LVDS bridge is provided on the MB-COMHPCM-1 for the LVDS interface. The user can select the eDP or LVDS display interface via a jumper. A power supply connector for the backlight is provided on the MB-COMHPCM-1. Please contact support@tq-group.com for further information about eDP or LVDS display support.

X33: eDP connector – Connector type: – Mating connector:

JAE HD1S040HA1 JAE HD1P040MA1

Table 8: eDP connector

Signal

1 NC 2 GND 3 TX3 4 TX3+ 5 GND 6 TX2 7 TX2+ 8 GND 9 TX1 10 TX1+ 11 GND 12 TX0 13 TX0+ 14 GND 15 AUX+ 16 AUX 17 GND 18 3V3 19 3V3 20 3V3 21 3V3 22 NC 23 GND 24 GND 25 GND 26 GND 27 HPD 28 GND 29 GND 30 GND 31 GND 32 BLKT_EN 33 BLKT_CTRL 34 VDD_EN 35 NC 36 V_BLKT 37 V_BLKT 38 V_BLKT 39 V_BLKT 40 NC

Remark Lane 3 differential pair Lane 2 differential pair Lane 1 differential pair Lane 0 differential pair AUX – channel
3.3 V supply voltage

Hot Plug Detect

Backlight enable 3.3 V Backlight (brightness) control 3.3 V Panel power enable 3.3 V
12 V Backlight supply voltage

Illustration 6: eDP connector

Preliminary User’s Manual l MB-COMHPCM-1 UM 0001 l © 2025, TQ-Systems GmbH
Close jumper X15 to select the eDP interface on the MB-COMHPCM-1.

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Illustration 7: Config jumper: eDP or LVDS

X32: LVDS connector – Connector type: – Mating connector:

Hirose DF19G-30P-1H Hirose DF19-30S-1C

Table 9: LVDS connector

Signal

1 A0 2 A0+ 3 A1 4 A1+ 5 A2 6 A2+ 7 GND 8 ACLK 9 ACLK+ 10 A3 11 A3+ 12 B0 13 B0+ 14 GND 15 B1 16 B1+ 17 GND 18 B2 19 B2+ 20 BCLK 21 BCLK+ 22 B3 23 B3+ 24 GND 25 5V_PANEL 26 5V_PANEL 27 5V_PANEL 28 3V3_PANEL 29 3V3_PANEL 30 3V3_PANEL

Odd bus Odd bus Odd bus Odd bus Odd bus Odd bus Odd bus Odd bus Odd bus Odd bus Even bus Even bus Even bus Even bus Even bus Even bus Even bus Even bus Even bus Even bus

Remark

5 V Panel supply voltage

3.3 V Panel supply voltage

Illustration 8: LVDS connector

Page 15

X34: Display Backlight connector

– Connector type:

Molex 53398-1271

– Mating connector: Molex 51021-1200

Table 10: Backlight connector

Signal

2 VCC_BKLT_OUT

5 GND

7 NC

8 LCD0_BKLT_EN

9 LCD0_BKLT_CTRL

10 3V3_PROG 1

11 EDID_CLK 2

12 EDID_DAT 2

Remark
Backlight voltage output

Display 0 Backlight Enable 3.3 V Display 0 Backlight (brightness) 3.3 V 3.3 V input (programming) EDID I2C clock 3.3 V EDID I2C data 3.3 V

1: The EEPROM can be powered by the 3V3_PROG pin. 2: These pins can be used to program the on-board EDID EEPROM.

Illustration 9: Backlight connector

3.5.8 M.2 sockets with M key (PCI Express SSD devices)
The MB-COMHPCM-1 provides two sockets for PCI Express based M.2 SSD with 22 mm width and 80 mm length. Single and double-sided M.2 2280 modules with M key (PCI Express only) can be used. The data transfer rate of this interface mainly depends on the COM-HPC® Mini module and the connected device. The MB-COMHPCM-1 supports PCI Express Gen 5 data transfer rate.

Table 11: COM-HPC® Mini PCI Express port mapping

COM-HPC® Mini PCI Express port Group 0 low port 7 4 Group 0 high port 15 12

M.2, X35 M.2, X36

MB-COMHPCM-1 connector

Page 16

3.5.9 M.2 sockets with E key (I/O devices)
The MB-COMHPCM-1 provides three sockets for M.2 modules with 22 mm width and 30 mm length. One USB 2.0 and PCI Express x1 signals are routed to these sockets. Single and double-sided M.2 2230 modules with E or A&E key can be used. The transfer rate of this interface mainly depends on the COM-HPC® Mini module and the connected device.

Table 12: COM-HPC® Mini PCI Express and USB port mapping

COM-HPC® Mini PCI Express port

COM-HPC® Mini USB 2.0 port

Group 0 low port 0 Group 0 low port 1 Group 0 low port 2 3

USB 2.0 port 6 USB 2.0 port 7

MB-COMHPCM-1 connector M.2, X39 M.2, X37 M.2, X17

3.5.10 PCI Express connector
The MB-COMHPCM-1 provides a standard PCI Express x16 slot with a PCI Express x4 configuration. The data transfer rate of this interface mainly depends on the COM-HPC® Mini module and the connected device. The MB-COMHPCM-1 supports PCI Express Gen 5 data transfer rate.

Table 13: COM-HPC® Mini PCI Express port mapping

COM-HPC® Mini PCI Express port

MB-COMHPCM-1 connector

Group 0 high port 11 8

PCI Express connector X19

Preliminary User’s Manual l MB-COMHPCM-1 UM 0001 l © 2025, TQ-Systems GmbH
3.5.11 Audio connectors The MB-COMHPCM-1 provides an audio codec to support the following audio features:
· Microphone in (pink) · Headphone out (green) · Line in (blue)
X11, X12, X13: Audio connectors

Page 17

Illustration 10: Audio connectors

3.5.12 Fan connector The MB-COMHPCM-1 provides a connector for 12 V fans.

X31: 12 V fan connector – Connector type: – Mating connector:

Tyco 640456-3 3-pin fan connector (2.54 mm pitch)

Table 14: Fan connector

Signal

1 GND 2 Fan Voltage 3 SENSE

Remark
Output voltage (0 to 12 V PWM) Sense input for fan speed

Illustration 11: Fan connector

Page 18

3.5.13 Debug connector The MB-COMHPCM-1 provides several COM-HPC® Mini signals at two headers. These headers are for debugging and software development purposes. The user can access the SMBus, I2C bus and several other signals.
The COM-HPC® Mini redefines a number of I/O voltages from 3.3 V to 1.8 V, reflecting current processor trends. Low-speed, single-ended signals, that are directly attached to the COM-HPC® Mini module are redefined to operate at 1.8 V.

– Connector type:

Male Pin header with 2 rows and 2.54 mm pitch

Table 15: GPIO Signal Debug connector X28

Signal

1 V_1V8_STBY 2 GND 3 GPIO_00 4 GPIO_06 5 GPIO_01 6 GPIO_07 7 GPIO_02 8 GPIO_08 9 GPIO_03 10 GPIO_09 11 GPIO_04 12 GPIO_10 13 GPIO_05 14 GPIO_11 15 NC 16 NC 17 SMB_CLK_3V3 18 SUS_S3# 19 SMB_DAT_3V3 20 SUS_S4_S5#

Remark
1.8 V supply GPIO bidir signal to module 1.8 V GPIO bidir signal to module 1.8 V GPIO bidir signal to module 1.8 V GPIO bidir signal to module 1.8 V GPIO bidir signal to module 1.8 V GPIO bidir signal to module 1.8 V GPIO bidir signal to module 1.8 V GPIO bidir signal to module 1.8 V GPIO bidir signal to module 1.8 V GPIO bidir signal to module 1.8 V GPIO bidir signal to module 1.8 V GPIO bidir signal to module 1.8 V SM bus clock signal from module 3.3 V Suspend to Ram signal from module 1.8 V SM bus data bidir signal to module 3.3 V Soft-off signal from module 1.8 V

Illustration 12: Debug connectors

Table 16: I2C and COM Signal Debug connector X26

Signal

V_3V3_STBY

GND

COM_TEST#

GND

RST_BTN#

GND

PWR_BTN#

CARRIER_HOT#

WD_STROBE#

THRMTRIP#

WD_OUT#

ACPRESENT#

BATLOW#

LID#

Wake1#

SLEEP#

RAPID_SHUTDOWN

I2C0_ALERT#

SMB_ALERT#

Remark 3.3 V supply COM Test signal to module 1.8 V Reset Button to module 1.8 V Power Button to module 1.8 V Carrier hot signal to module 1.8 V Watchdog Strobe signal to module 1.8 V Thermtrip signal from module 1.8 V Watchdog Out signal from module 1.8 V NC AC present signal to module 1.8 V Battery low signal to module 1.8 V Lid button signal to module 1.8 V Wake up signal to module 1.8 V Sleep button signal to module 1.8 V Trigger for Rapid Shutdown to module 1.8 V I2C0 Alert signal to module 1.8 V SM bus alert signal to module 1.8 V

Page 19

Page 20

3.5.14 Debug LEDs The MB-COMHPCM-1 provides several LEDs for debug purposes.

Table 17: Debug LEDs

Function

PCB text

SUS S3 Power Good # Reset active CATERROR signal PROCHOT signal

S3 act. PWR OK RESET CATERR PROCHOT

Remark Green if module is in power-saving S3 mode (Suspend to RAM) Green if PWR_OK signal is not valid Green if module PLTRST# signal is asserted Red if module catastrophic error signal is asserted Red if module processor hot signal is asserted

3.5.15 SPI Flash Socket
The MB-COMHPCM-1 provides a socket for 1.8 V SPI flashes. This is useful for BIOS updates. 1.8 V SPI flashes with SO8W package can be used. When the jumper “BSEL0” is set, the BIOS in the socket is active.

Illustration 13: SPI socket and BSEL0 Jumper

Page 21

3.5.16 COM-HPC® Mini connector
COM-HPC® Mini modules feature one high performance 400-pin connector, originally introduced by Samtec. Multiple vendors offer this connector now as well. Connector (X1) has four rows A, B, C, and D. Connectors with 5 mm or 10 mm stack height are available. The connector on the carrier board determines the stack height. The board-to-board stack height of MB-COMHPCM-1 and TQMxCU1-HPCM is 10 mm.

Illustration 14: COM-HPC® Mini board-to-board distance

Illustration 15: COM-HPC® Mini connectors

Page 22

3.6

Buttons

3.6.1 Reset Button

The MB-COMHPCM-1 provides a Reset button (S3). Pressing the button triggers the COM-HPC® Mini module RSTBTN# signal.

3.6.2 Power Button
The MB-COMHPCM-1 provides a Power button (S2). Pressing the button triggers the COM-HPC® Mini module PWRBTN# signal. This initiates a power state transition (e.g. from S0 to S5).

3.7

PCIe Lane assignment

The PCIe lanes of the COM-HPC® Mini module are assigned as shown in the following table. Attention: not all CPUs provide all lanes.

Table 18: PCIe lane assignment

PCIe Lane

Device

M.2 E key

2 M.2 E key
3

5 M.2 M key
6

9 PCIe x16
10

13 M.2 M key
14

Connector X39 X37 X17
X35
X19
X36

Lane-config. x1 x1 x1 x1
x4
x4
x4

4. MECHANICS

4.1

Dimensions

The MB-COMHPCM-1 has dimensions of 170 mm × 170 mm, according to the Mini-ITX form factor.

Please contact support@tq-group.com for more details about 2D/3D Step models.

Page 23

4.2

Protection Against External Effects

The MB-COMHPCM-1 is not protected against dust, external impact and contact (IP00). Adequate protection has to be guaranteed by the surrounding system.

5. SOFTWARE

5.1

System Resources

Please contact support@tq-group.com for further information of the on-board components.

5.2

Driver Download

The MB-COMHPCM-1 is well supported by the Standard Operating Systems, which already include most of the drivers required. It is recommended to use the latest drivers for best performance and the full feature set of the COM-HPC® Mini module.

Please contact support@tq-group.com for further drivers.

Page 24

6. SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS

6.1

EMC

The MB-COMHPCM-1 was developed according to the requirements of electromagnetic compatibility (EMC). Depending on the target system, anti-interference measures may still be necessary to guarantee that the limits for the overall system including housing are met.

6.2

ESD

In order to avoid interspersion on the signal path from the input to the protection circuit in the system, the protection against electrostatic discharge should be arranged directly at the inputs of a system. Most external interfaces are protected using ESD protection diodes. Measurements for ESD protection have to be done with the electronic parts mounted in a housing. Since TQSystems GmbH does not offer a housing for the MB-COMHPCM-1, no special preventive measures are taken.

6.3

Operational Safety and Personal Security

Due to the occurring voltages (12 V DC), tests with respect to the operational and personal safety have not been carried out.

6.4

Cyber Security

A Threat Analysis and Risk Assessment (TARA) must always be performed by the customer for their individual end application, as the MB-COMHPCM-1 is only a sub-component of an overall system.

6.5

Reliability and Service Life

No detailed MTBF calculation has been done for the MBa8MP-RAS314. The MBa8MP-RAS314 is designed to be insensitive to vibration and impact.

6.6

Export Control and Sanctions Compliance

The customer is responsible for ensuring that the product purchased from TQ is not subject to any national or international export/import restrictions. If any part of the purchased product or the product itself is subject to said restrictions, the customer must procure the required export/import licenses at its own expense. In the case of breaches of export or import limitations, the customer indemnifies TQ against all liability and accountability in the external relationship,irrespective of the legal grounds. If there is a transgression or violation, the customer will also be held accountable for any losses, damages or fines sustained by TQ. TQ is not liable for any delivery delays due to national or international export restrictions or for the inability to make a delivery as a result of those restrictions. Any compensation or damages will not be provided by TQ in such instances.

The classification according to the European Foreign Trade Regulations (export list number of Reg. No. 2021/821 for dual-usegoods) as well as the classification according to the U.S. Export Administration Regulations in case of US products (ECCN according to the U.S. Commerce Control List) are stated on TQ´s invoices or can be requested at any time. Also listed is the Commodity code (HS) in accordance with the current commodity classification for foreign trade statistics as well as the country of origin of the goods requested/ordered.

6.7

Warranty

TQ-Systems GmbH warrants that the product, when used in accordance with the contract, fulfills the respective contractually

agreed specifications and functionalities and corresponds to the recognized state of the art.

The warranty is limited to material, manufacturing and processing defects. The manufacturer’s liability is void in the following

cases:

Original parts have been replaced by non-original parts.

Improper installation, commissioning or repairs.

Improper installation, commissioning or repair due to lack of special equipment.

Incorrect operation

Improper handling

Use of force

Normal wear and tear

Page 25

6.8

RoHS

The MB-COMHPCM-1 is manufactured RoHS compliant. · All components and assemblies are RoHS compliant · The soldering processes are RoHS compliant

6.9

WEEE®

The final distributor is responsible for compliance with the WEEE® regulation. Within the scope of the technical possibilities, the MB-COMHPCM-1 was designed to be recyclable and easy to repair.

6.10

REACH®

The EU-chemical regulation 1907/2006 (REACH® regulation) stands for registration, evaluation, certification and restriction of substances SVHC (Substances of very high concern, e.g., carcinogen, mutagen and/or persistent, bio accumulative and toxic). Within the scope of this juridical liability, TQ-Systems GmbH meets the information duty within the supply chain with regard to the SVHC substances, insofar as suppliers inform TQ-Systems GmbH accordingly.

6.11 Statement on California Proposition 65
California Proposition 65, formerly known as the Safe Drinking Water and Toxic Enforcement Act of 1986, was enacted as a ballot initiative in November 1986. The proposition helps protect the state’s drinking water sources from contamination by approximately 1,000 chemicals known to cause cancer, birth defects, or other reproductive harm (“Proposition 65 Substances”) and requires businesses to inform Californians about exposure to Proposition 65 Substances.
The TQ device or product is not designed or manufactured or distributed as consumer product or for any contact with endconsumers. Consumer products are defined as products intended for a consumer’s personal use, consumption, or enjoyment. Therefore, our products or devices are not subject to this regulation and no warning label is required on the assembly.
Individual components of the assembly may contain substances that may require a warning under California Proposition 65. However, it should be noted that the Intended Use of our products will not result in the release of these substances or direct human contact with these substances. Therefore you must take care through your product design that consumers cannot touch the product at all and specify that issue in your own product related documentation.
TQ reserves the right to update and modify this notice as it deems necessary or appropriate.

6.12

EuP

The Eco Design Directive, also Energy using Products (EuP), is applicable to products for the end user with an annual quantity >200,000. The MB-COMHPCM-1 must therefore always be seen in conjunction with the complete device.
The available standby and sleep modes of the components on the MB-COMHPCM-1 enable compliance with EuP requirements for the MB-COMHPCM-1.

6.13

Battery

No batteries are assembled on the MB-COMHPCM-1 by default. The MB-COMHPCM-1 provides a battery socket, which can be equipped with a CR2032, 3.0 V lithium coin cell. The MB-COMHPCM-1 provides current limiting circuitry and protection against reverse current.

6.14

Packaging

The MB-COMHPCM-1 is delivered in reusable packaging.

Page 26

6.15

Other Entries

By environmentally friendly processes, production equipment and products, we contribute to the protection of our environment. The energy consumption of this subassembly is minimised by suitable measures.
Since there is currently no technical equivalent alternative for printed circuit boards with bromine-containing flame protection (FR-4 material), such printed circuit boards are still used.
Capacitors and transformers containing PCB (polychlorinated biphenyls) are not used.
These points are an essential part of the following laws:
· The law to encourage the circular flow economy and assurance of the environmentally acceptable removal of waste as at 27.9.94 (source of information: BGBl I 1994, 2705)
· Regulation with respect to the utilization and proof of removal as at 1.9.96 (source of information: BGBl I 1996, 1382, (1997, 2860))
· Regulation with respect to the avoidance and utilization of packaging waste as at 21.8.98 (source of information: BGBl I 1998, 2379)
· Regulation with respect to the European Waste Directory as at 1.12.01 (source of information: BGBl I 2001, 3379)

This information is to be seen as notes. Tests or certifications were not carried out in this respect.

7. APPENDIX

7.1

Acronyms and Definitions

The following acronyms and abbreviations are used in this document.

Table 19:
Acronym AHCI BIOS CAN CMOS CODEC COM CPU CSM cTDP DC DDC DDI DDR DMA DP DVI EAPI ECC EDID eDP EEPROM EFI EMC ESD FAE FIFO flexiCFG FPGA FR-4 GPIO HDA HDMI HEVC HSP HT I I PD I PU I/O I2C IEC IoT IP00

Acronyms
Meaning Advanced Host Controller Interface Basic Input/Output System Controller Area Network Complementary Metal Oxide Semiconductor Code/Decode Computer-On-Module Central Processing Unit Compatibility Support Module Configurable Thermal Design Power Direct Current Display Data Channel Digital Display Interface Double Data Rate Direct Memory Access DisplayPort Digital Visual Interface Embedded Application Programming Interface Error-Correcting Code Extended Display Identification Data embedded DisplayPort Electrically Erasable Programmable Read-Only Memory Extensible Firmware Interface Electromagnetic Compatibility Electrostatic Discharge Field Application Engineer First In First Out Flexible Configuration Field Programmable Gate-Array Flame Retardant 4 General-purpose Input/Output High Definition Audio High Definition Multimedia Interface High Efficiency Video Coding Heat Spreader Hyper-Threading Input Input with internal Pull-Down resistor Input with internal Pull-Up resistor Input/Output Inter-Integrated Circuit International Electrotechnical Commission Internet of Things Ingress Protection 00

Page 27

Acronym IRQ JEIDA JPEG JTAG® LED LPDDR5 ME MMC MPEG MST MT/s MTBF

Preliminary User’s Manual l MB-COMHPCM-1 UM 0001 l © 2025, TQ-Systems GmbH
Meaning Interrupt Request Japanese Electronics Industry Development Association Joint Photographic Experts Group Joint Test Action Group Light Emitting Diode Low Power Double Data Rate 5 Management Engine Multimedia Card Moving Picture Experts Group Multi-Stream Transport Mega Transfers per second Mean operating Time Between Failures

Page 28

Page 29

Table 19:
Acronym N/A NC O OD OpROM OS PC PCB PCH PCI PCIe PD PEG PICMG® POST PU PWM RAID RAM RMA RoHS RSVD RTC SATA SCU SD SD/MMC SDIO SIMD SMART SMBus SO-DIMM SPD SPI SPKR SSD STEP TDM TDP TPM UART UEFI USB

Acronyms (continued)

Not Available

Meaning

Not Connected Output

Open Drain Option ROM Operating System Personal Computer Printed Circuit Board Platform Controller Hub Peripheral Component Interconnect

Peripheral Component Interconnect Express Pull-Down PCI Express for Graphics

PCI Industrial Computer Manufacturers Group

Power-On Self-Test Pull-Up Pulse-Width Modulation Redundant Array of Independent/Inexpensive Disks/Drives Random Access Memory

Return Merchandise Authorization Restriction of (the use of certain) Hazardous Substances Reserved Real-Time Clock Serial ATA System Control Unit Secure Digital

Secure Digital Multimedia Card Secure Digital Input/Output

Single Instruction, Multiple Data Self-Monitoring, Analysis and Reporting Technology System Management Bus Small Outline Dual In-Line Memory Module Serial Presence Detect Serial Peripheral Interface Speaker Solid-State Drive

Standard for Exchange of Products Time-Division Multiplexing Thermal Design Power Trusted Platform Module Universal Asynchronous Receiver/Transmitter Unified Extensible Firmware Interface Universal Serial Bus

Acronym VC-1 VESA VGA VP8 WDT WEEE® WES

Video Coding (format) 1 Video Electronics Standards Association Video Graphics Array Video Progressive (compression format) 8 Watchdog Timer Waste Electrical and Electronic Equipment Windows® Embedded Standard

Meaning

Page 30

Page 31

7.2

References

Table 20: No.

Further Applicable Documents and Links Name

(1) PICMG® COM-HPC® Module Base Specification

(2) PICMG® COM-HPC® Carrier Design Guide

Rev. / Date Rev. 1.2 Rev. 2.2

Company
PICMG PICMG PDF

TQ-Systems GmbH Mühlstraße 2 l Gut Delling l 82229 Seefeld info@tq-group.com l www.tq-group.com

Documents / Resources

TQ TQMxCU1-HPCM Embedded Module [pdf] User Manual
MB-COMHPCM-1, TQMxCU1-HPCM Embedded Module, TQMxCU1-HPCM, Embedded Module, Module

References

User Manual

TQMxCU1-HPCM Embedded Module User Manual

TQMxCU1-HPCM Embedded Module

Specifications:

Product Usage Instructions:

1. About This Manual

1.1 Copyright and License Expenses

FAQ:

Q: Can I modify or distribute the manual?

Q: Who covers the BIOS-license expenses?

Documents / Resources

References

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