MICROCHIP SP1F, SP3F Power Module
Fa'amatalaga
- Product: SP1F and SP3F Power Modules
- Fa'ata'ita'iga: AN3500
- Application: PCB Mounting and Power Module Mounting
Folasaga
O lenei tusi talosaga o loʻo tuʻuina atu ai fautuaga autu e faʻafesoʻotaʻi lelei le laupapa faʻasalalau lolomi (PCB) i le SP1F poʻo le SP3F power module ma faʻapipiʻi le eletise i luga o le vevela. Mulimuli i faʻatonuga faʻapipiʻi e faʻatapulaʻa uma le mamafa o le vevela ma le masini.
PCB Fa'atonuga fa'apipi'i
- The PCB mounted on the power module can be screwed to the standoffs to reduce all mechanical stress and minimize relative movements on the pins that are soldered to the power module. Step 1: Screw the PCB to the standoffs of the power module.
- O se fa'ailoga fa'apipi'i fa'apipi'i fa'apitoa e 2.5 mm le lautele o lo'o fautuaina e fa'apipi'i le PCB. O le sikulima plastite, o loʻo faʻaalia i le ata o loʻo i lalo, o se ituaiga o faʻailoga ua mamanuina faapitoa mo le faʻaogaina i palasitika ma isi mea e maualalo le mamafa. Le umi sikulima e faalagolago i le mafiafia PCB. Faatasi ai ma le 1.6 mm (0.063”) PCB mafiafia, fa'aaoga se sikulima plastite 6 mm (0.24”) umi. Ole pito maualuga ole fa'apipi'i ole 0.6 Nm (5 lbf·in). Siaki le sa'o o le pou palasitika pe a uma ona fa'amau fa'amau.
- Laasaga 2: Solder all electrical pins of the power module to the PCB as shown in the following figure. A no-clean solder flux is required to attach the PCB, as the aqueous module cleaning is not allowed.
Fa'aaliga:
- Aua le toe fesuiai nei laasaga e lua, aua afai o pine uma e soldered muamua i le PCB, screwing le PCB i le standoffs fatuina se deformation o le PCB, e taitai atu ai i nisi faʻalavelave faʻainisinia e mafai ona faʻaleagaina ala pe motusia vaega i luga o le PCB.
- O pu i le PCB e pei ona faʻaalia i le ata muamua e manaʻomia e faʻapipiʻi pe aveese faʻamau faʻapipiʻi e faʻapipiʻi i lalo le module eletise i le vevela. O nei pu e tatau ona lava lapopoa mo le ulu sikulima ma fufulu e mafai ona pasia saoloto, e mafai ai mo le faapalepale masani i le nofoaga o pu PCB. Ole lautele ole pu PCB mo pine eletise e fautuaina ile 1.8 ± 0.1 mm. Ole lautele ole pu PCB mo le faʻaofiina poʻo le aveeseina o faʻamau faʻapipiʻi e fautuaina ile 10 ± 0.1 mm.
- For efficient production, a wave soldering process can be used to solder the terminals to the PCB. Each application, heat sink and PCB can be different; wave soldering must be evaluated on a case-by-case basis. In any case, a well-balanced layer of solder should surround each pin.
- The gap between the bottom of the PCB and the power module is 0.5 mm to 1 mm only as shown in PCB Mounted on Power Module figure. Using through-hole components on the PCB is not recommended.
- SP1F or SP3F pinout can change according to the configuration. See the product datasheet for more information on the pin-out location.
Fa'atonuga mo le fa'apipi'iina o le Power Module
- O le fa'apipi'iina lelei o le ipu fa'avae i luga o le fa'avevela e mana'omia e fa'amautinoa lelei le felauaiga o le vevela. O le vevela ma le faʻaogaina o le eletise eletise e tatau ona mafolafola (faʻatonuina mafolafola e tatau ona laʻititi ifo i le 50 μm mo le 100 mm faʻaauau, fautuaina Rz 10) ma mama (leai se palapala, pala, poʻo le faʻaleagaina) e aloese ai mai le faʻalavelave faʻainisinia pe a faʻapipiʻi le eletise, ma aloese mai le faʻateleina o le vevela.
- Laasaga 1: Fa'aoga ga'o vevela: Ina ia ausia le tulaga pito i lalo e fa'afefe ai le vevela, e tatau ona fa'aoga se vaega manifinifi o le ga'o vevela i le va o le eletise ma le vevela. E fautuaina le fa'aogaina o le masini lolomi e fa'amautinoa ai le tu'u tutusa o le mafiafia la'ititi o le 60 μm (2.4 mils) i luga o le vevela e pei ona fa'aalia i le ata o lo'o mulimuli mai. E mafai fo'i ona faia le feso'ota'iga fa'avevela i le va o le module ma le su'ega vevela fa'atasi ai ma isi mea fa'aoga fa'afefe fa'aulu e pei o le fa'aogaina o le vaega (fa'alolo-lomi po'o le fa'apipi'i).
- Laasaga 2: Fa'apipi'i o le masini eletise i luga o le fa'avevela: Fa'atū le masini eletise i luga a'e o pu fa'avevela ma fa'apipi'i sina mamafa i ai. Fa'aofi le sikulima M4 ma loka ma fa'amafola fa'ameamea i pu fa'apipi'i ta'itasi (e mafai ona fa'aoga le sikulima #8 nai lo le M4). E tatau ona le itiiti ifo i le 12 mm (0.5” le umi o le sikuila). Muamua, fa'amau fa'amau fa'amau fa'amau fa'amau e lua. Fa'amau fa'ailoga fa'ailoga se'ia o'o i le tau fa'ai'u (silasila i le fa'amatalaga o oloa mo le maualuga e fa'atagaina). o le taimi lava e faʻapipiʻi ai i luga o le vevela faʻatasi ma le faʻapipiʻi talafeagai O le pito i lalo o le module e tatau ona susu atoa i le gaʻo vevela e pei ona faʻaalia i le Gaʻo i luga o le Module Ina ua maeʻa le faʻapipiʻiina.
Fono Tele View
- Afai e faʻaaogaina se PCB tele, e manaʻomia ni vaʻa faaopoopo i le va o le PCB ma le vevela. E fautuaina ina ia tausia se mamao e le itiiti ifo i le 5 cm i le va o le eletise ma vaʻa e pei ona faʻaalia i le ata o loʻo i lalo. E tatau ona tutusa le maualuga o va'a ma fa'amaufa'ailoga (12 ± 0.1 mm).
- Mo fa'atonuga fa'apitoa, o nisi SP1F po'o le SP3F fa'aogaina eletise o lo'o gaosia ma le AlSiC (Aluminium Silicon Carbide) fa'avae (M suffix i le numera vaega). AlSiC baseplate e 0.5 mm mafiafia nai lo le apamemea faavae, o lea o le spacers e tatau ona 12.5 ± 0.1 mm i le mafiafia.
- Ole maualuga ole faavaa palasitika SP1F ma SP3F e tutusa le maualuga ma le SOT-227. I luga o le PCB lava e tasi, afai e faʻaaogaina se SOT-227 ma se tasi poʻo le tele o SP1F / SP3F faʻapipiʻi eletise faʻatasi ma apamemea baseplate, ma afai o le mamao i le va o le lua eletise e le sili atu i le 5 cm, e le tatau ona faʻapipiʻi le spacer e pei ona faʻaalia i le ata o loʻo i lalo.
- Afai o le SP1F/SP3F power modules ma le AlSiC baseplate o lo'o fa'aogaina i le SOT-227 po'o isi SP1F/SP3F modules ma le pa'u kopa, e tatau ona fa'aititia le maualuga o le heatsink i le 0.5 mm i lalo ole SP1F/SP3F modules ma le AlSiC baseplate e fa'amautu uma ai le fa'amaufa'ailoga i le maualuga tutusa.
- E tatau ona faʻaeteete i vaega mamafa e pei o eletise eletise poʻo polypropylene capacitors, transformers, poʻo inductors. Afai o nei vaega o loʻo i totonu o le eria lava e tasi, e fautuaina e faʻapipiʻi avanoa e tusa lava pe o le mamao i le va o modules e lua e le sili atu i le 5 cm, o le mamafa o nei vaega i luga o le laupapa e le faʻaaogaina e le eletise eletise ae o le spacers. I soʻo se tulaga, o talosaga taʻitasi, vevela vevela, ma PCB e eseese; o le tu'uina o spacers e tatau ona iloiloina i luga o se fa'avae ma lea mataupu.
Power Module Dismounting Instructions
To safely remove the power module from the heatsink, perform following steps:
- On the PCB, remove all screws from the spacers.
- On the heatsink, remove all screws from the power module mounting holes.
Fa'aeteete
Depending on the thermal interface material, the module baseplates may adhere strongly to the heatsink. Do not pull on the PCB to remove the assembly, as this may damage the PCB or the modules. To prevent damage, detach each module from the heatsink before removal. - To safely detach the modules:
- Insert a thin blade, such as the tip of a flat screwdriver, between the module baseplate and the heatsink.
- Gently twist the blade to separate the baseplate from the heatsink.
- Repeat this process for each module mounted to the PCB.
Fa'ai'uga
This application note gives the main recommendations regarding the mounting of SP1F or SP3F modules. Applying these instructions helps decrease the mechanical stress on PCB and power module, while ensuring long term operation of the system. Mounting instructions to the heatsink must also be followed to achieve the lowest thermal resistance from the power chips down to the cooler. All these steps are essential to guarantee the best system reliability.
Toe Iloilo Tala'aga
O le tala fa'asolopito o lo'o fa'amatalaina suiga na fa'atinoina i le pepa. O suiga o lo'o lisiina e ala i toe iloiloga, amata i le lomiga aupito lata mai.
| Toe Iloiloga | Aso | Fa'amatalaga |
| B | 10/2025 | Faaopoopo Power Module Dismounting Instructions. |
| A | 05/2020 | O le fa'asalalauga muamua lea o lenei pepa. |
Microchip Fa'amatalaga
Fa'ailoga Fa'ailoga
- O le igoa "Microchip" ma le logo, le "M" logo, ma isi igoa, logos, ma faʻailoga o loʻo resitalaina ma faʻailoga faʻailoga a le Microchip Technology Incorporated poʻo ana paaga ma / poʻo lala i le Iunaite Setete ma / poʻo isi atunuu ("Microchip Fa'ailoga”). Fa'amatalaga e uiga i Microchip Trademarks e mafai ona maua ile https://www.microchip.com/en-us/about/legal-information/microchip-trademarks.
- ISBN: 979-8-3371-2109-3
Faasilasilaga Faaletulafono
- O lenei lomiga ma faʻamatalaga o loʻo i totonu e mafai ona faʻaaogaina naʻo oloa Microchip, e aofia ai le mamanu, suʻega, ma tuʻufaʻatasia oloa Microchip ma lau talosaga. O le fa'aogaina o nei fa'amatalaga i so'o se isi lava faiga e solia ai nei aiaiga. O fa'amatalaga e uiga i le fa'aogaina o masini e tu'uina atu mo na'o lou fa'amalieina ma e ono suia i fa'afouga. O lau matafaioi le faʻamautinoa o lau talosaga e fetaui ma au faʻamatalaga. Fa'afeso'ota'i lou ofisa fa'atau Microchip fa'apitonu'u mo se lagolago fa'aopoopo pe, maua se lagolago fa'aopoopo ile www.microchip.com/en-us/support/design-help/client-support-services.
- O LENEI FAʻAMATALAGA E TUUINA E MICROCHIP "AS IS". E LEAI FAIA e le MICROCHIP ni sui po'o se fa'amaoniga o so'o se ituaiga pe fa'aalia pe fa'aali, tusia pe tugutu, tulāfono po'o se isi mea, e feso'ota'i ma fa'amatalaga e aofia ai ae le tapula'a i so'o se fa'amaoniaga fa'amaonia, fa'amaonia, ma le fa'amaoniaina. FAAMOEMOEGA, POO WARRANTY E FAI I ONA TULAGA, TULAGA, POO LE FAIGALUEGA.
E LEAI SE MEA E TATAU AI MICROCHIP MO SO'O SE FA'AMATALAGA, FA'AMATALAGA, FA'ASA'OGA, FA'AMATALAGA, PO'O LE FA'A'ALI'AGA MA'U'U, FA'AFIA, TAU, PO'O LE TU'U'UINA O SO'O SE I'UGA SO'O SE FA'AIGA I LE FA'AMATALAGA POO LONA FA'A'OGA, PE'O LE MEA NA FA'AUPUNA'I, E tusa lava pe fa'aletonu. FA'ATONU POO LE FA'AFIA E FA'AVAEINA. I LE AGATOGA FA'AALIGA E LE TULAFONO, O LE UMA AOFA'IGA A MICROCHIP I TOTOGI UMA I SO'O SE AUALA E FA'AIGA I LE FA'AMATALAGA POO LONA FA'A'OGA E LE'A LOLOA I LE TOTOGI O TOTOGI, AFAI E IAI, NA E TOTOGI SA'O I LE MICROCHIP MO LE FA'AMATALAGA. - O le fa'aogaina o masini Microchip i le tausiga o le ola ma/po'o le saogalemu o lo'o i le tulaga lamatia o le tagata fa'atau, ma e malie le tagata fa'atau e puipuia, fa'aleaga ma taofia Microchip le afaina mai so'o se mea leaga, tagi, suti, po'o tupe alu e mafua mai i lea fa'aoga. E leai ni laisene e tu'uina atu, fa'aalia po'o se isi mea, i lalo o so'o se Microchip aia tatau tau le atamai se'i vagana ua ta'ua.
Fa'ailoga Puipuiga o Fa'ailoga Fa'atonu a Microchip
Manatua faʻamatalaga o loʻo i lalo o le faʻaogaina o le puipuiga o tulafono i luga o oloa Microchip:
- O oloa Microchip e fetaui ma faʻamatalaga o loʻo i totonu o la latou Pepa Faʻamatalaga Microchip.
- E talitonu Microchip o lona aiga o oloa e saogalemu pe a faʻaaogaina i le auala faʻamoemoeina, i totonu o faʻamatalaga faʻaogaina, ma i lalo o tulaga masani.
- Microchip fa'atauaina ma puipuia fa'amalosi ana aia tatau tau meatotino. O taumafaiga e soli le tulafono o le puipuiga o oloa Microchip e matua fa'asaina ma e ono solia ai le Digital Millennium Copyright Act.
- E le mafai e le Microchip poʻo se isi mea gaosi semiconductor ona faʻamaonia le saogalemu o lana tulafono. O le puipuiga o tulafono laiti e le o lona uiga tatou te faʻamautinoa o le oloa e "le mafai ona motusia". O le puipuiga o tulafono laiti o lo'o fa'asolosolo pea. Microchip ua tuuto atu i le faʻaauauina pea o le faʻaleleia atili o uiga puipuia o tulafono a tatou oloa.
FAQ
Can I use a wave soldering process for soldering terminals to the PCB?
Yes, a wave soldering process can be used for efficient production. However, evaluate its suitability based on your specific application, heat sink, and PCB requirements.
Is it necessary to install a spacer between power modules?
If the distance between two power modules does not exceed 5 cm and they are mounted on the same PCB with a SOT-227, it is not necessary to install a spacer.
Pepa / Punaoa
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MICROCHIP SP1F, SP3F Power Module [pdf] Tusi Taiala SP1F, SP3F, AN3500, SP1F SP3F Power Module, SP1F SP3F, Power Module, Module |