SKYPER 32PRO R Semikron Board
Product Information
The 32PRO R is an IGBT Driver with an Adapter Board SKYPER. Please note that all values in this technical explanation are typical values and may vary in different applications.
- Application and Handling Instructions
For design support and further application assistance, visit www.semikron.com. You can also refer to the SEMIKRON Application Manual Power Modules available on the website. - General Description
The product undergoes various quality tests including Automated Optical Inspection, In-Circuit Test, Electrical Parameters Test, Isolation Test, Thermal Cycling, Partial Discharge Test, Temperature Humidity Vibration Test, and Shock Test. - Dimensions
Dimensions: 16.73mm x 2.77mm x 40.37mm x 97.27mm x 100mm. - Component Placement Layout
Refer to Figure 3 for the Adaptor Board layout. - PIN Array
Refer to Figure 4 for Connector X20 (Assmann AWHW 20G SMD) details. Product information for suitable female connectors is available at www.harting.com (part number 09 18 520 6 813). - Signal IF_CMN_nHALT
Refer to Figure 5 for Connection IF_CMN_nHALT details. - Setting Dead Time
| Designation | Pattern Name | Setting |
|---|---|---|
| R43 (connected to GND) | 0603 | PRIM_CFG_TDT2_IN Factory setting: 0 |
| R44 (connected to GND) | 0603 | PRIM_CFG_SELECT_IN Factory setting: not equipped |
Frequently Asked Questions (FAQ)
Q: Where can I find additional technical support for the 32PRO R?
A: For further technical assistance, visit the SEMIKRON website at www.semikron.com or refer to the Application Manual Power Modules available on the website.
Please note:
All values in this technical explanation are typical values. Typical values are the average values expected in large quantities and are provided for information purposes only. These values can and do vary in different applications. All operating parameters should be validated by the user’s technical experts for each application.
Application and Handling Instructions
- Please provide static discharge protection during handling. As long as the hybrid driver is not completely assembled, the input terminals have to be short-circuited. Persons working with devices have to wear a grounded bracelet. Any synthetic floor coverings must not be statically chargeable. Even during transportation the input terminals have to be short-circuited using, for example, conductive rubber. Worktables have to be grounded. The same safety requirements apply to MOSFET- and IGBT modules.
- Any parasitic inductances within the DC-link have to be minimized. Over-voltages may be absorbed by C- or RCD-snubber networks between main terminals for PLUS and MINUS of the power module.
- When first operating a newly developed circuit, SEMIKRON recommends applying low collector voltage and load current in the beginning and increasing these values gradually, observing the turn-off behavior of the free-wheeling diode and the turn-off voltage spikes generated across the IGBT. An oscillographic control will be necessary. Additionally, the case temperature of the module has to be monitored. When the circuit works correctly under rated operation conditions, short-circuit testing may be done, starting again with low collector voltage.
- It is important to feed any errors back to the control circuit and to switch off the device immediately in failure events. Repeated turn-on of the IGBT into a short circuit with a high frequency may destroy the device.
- The inputs of the hybrid driver are sensitive to over-voltage. Voltages higher than VS +0,3V or below -0,3V may destroy these inputs. Therefore, control signal over-voltages exceeding the above values have to be avoided.
- The connecting leads between the hybrid driver and the power module should be as short as possible (max. 20cm), and the driver leads should be twisted.
Further application support
The latest information is available at http://www.semikron.com. For design support please read the SEMIKRON Application Manual Power Modules available at http://www.semikron.com.
General Description
The Board 3s SKYPER® 32PRO R is an adaptor board for the IGBT module SEMiX® 3s (spring contact version). The board can be customized allowing adaptation and optimization to the used SEMiX® Module. The switching characteristic of the IGBT can be influenced through user settings, e.g. changing turn-on and turn-off speed by variation of RGon and RGoff. Furthermore, it is possible to adjust the monitoring level and blanking time for the DSCP (see Technical Explanations SKYPER® 32PRO R).
Please note:
This technical explanation is based on the Technical Explanations for SKYPER® 32PRO R. Please read the Technical Explanations for SKYPER® 32 PRO R before using the Adaptor Board.
Quality
| Table 1: Quality | |||
| End test | test category | test description | standard |
| AOI | Automated Optical Inspection | Control of accurate placement of components/solder joints | SEMIKRON |
| ICT | In-Circuit Test | Test of the populated PCB, checking the correct fabrication | SEMIKRON |
| Type test | test category | test conditions | standard |
| EP | Electrical Parameters | Jamb = -40°C / +85°C | SEMIKRON |
| SP | STEP Test, Interrupted PS | 20x 10µs to 2s | EN61000-4-29 |
| Iso | Isolation Test | High voltage test 4kV, 60s | EN 61800-5-1 |
| TC | Thermal Cycling | 200 cycles, Tstgmax – Tstgmin | IEC60068-2-14 |
| PD | Partial discharge test | >1,1 kV; suitable for 900V DC Link | VDE 0110-20 |
| TH | Temperature Humidity | 85°C, 85% RH, 96h | IEC 60068-2-67 |
| VB | Vibration | Sinus 20/2000Hz Random 10/2000Hz, 5g, 26 per x,y,z | IEC 60068-2-6 |
| SH | Shock | Half-sinus pulse, 30g, 6000 shocks, 6ms, ±x, ± y, ± z | IEC 60068-2-29 |
Dimensions
Component Placement Layout
Figure 3: Adaptor Board
PIN Array
Figure 4: Connector X20 (Assmann AWHW 20G SMD)
Product information of suitable female connectors and distributor contact information is available at e.g. http://www.harting.com (part number 09 18 520 6 813).
|
Table 2: PIN Array |
|||
|
PIN |
Signal | Function |
Specification |
| X20:01 | IF_PWR_15P | Drive power supply | Stabilised +15V ±4% |
| X20:02 | IF_PWR_GND | GND for power supply | |
| X20:03 | IF_PWR_15P | Drive power supply | Stabilised +15V ±4% |
| X20:04 | IF_PWR_GND | GND for power supply | |
| X20:05 | IF_PWR_15P | Drive power supply | Stabilised +15V ±4% |
| X20:06 | IF_PWR_GND | GND for power supply | |
| X20:07 | reserved | ||
| X20:08 | IF_PWR_GND | GND for power supply | |
| X20:09 | IF_CMN_nHALT | Driver core status signal (bidirectional signal with dominant recessive behavior) | Digital 15V logic;
LOW (dominant) = driver disabled; HIGH (recessive) = ready to operate |
| X20:10 | reserved | ||
| X20:11 | reserved | ||
| X20:12 | IF_CMN_GND | GND for signal IF_CMN_nHALT | |
| X20:13 | reserved | ||
| X20:14 | reserved | ||
| X20:15 | IF_HB_TOP | Switching signal input (TOP switch) | Digital 15 V logic; 10 kOhm impedance;
LOW = TOP switch off; HIGH = TOP switch on |
| X20:16 | IF_HB_BOT | Switching signal input (BOTTOM switch) | Digital 15 V logic; 10 kOhm impedance;
LOW = BOT switch off; HIGH = BOT switch on |
| X20:17 | reserved | ||
| X20:18 | IF_HB_GND | GND for signals IF_HB_TOP & F_HB_BOT | |
| X20:19 | reserved | ||
| X20:20 | reserved | ||
Signal IF_CMN_nHALT
The Halt Logic Signals PRIM_HALT_IN and PRIM_HALT_OUT of the driver core are coupled to one bidirectional signal (IF_CMN_nHALT) with dominant recessive behavior. IF_CMN_nHALT shows the driver core status. When IF_CMN_nHALT is HIGH (recessive), the driver core is ready to operate. When IF_CMN_nHALT is LOW (dominant), the driver core is disabled / not ready to operate because of e. g. detected failure or driver core system start.
A controller can hold with the IF_CMN_nHALT signal the driver core in a safe state (e.g. during a start-up of a system or gathered failure signal of other hardware) or generate a coeval release of the paralleled driver. Furthermore, paralleled drivers can send and receive IF_CMN_nHALT signals among each other by using a single-wire bus.
Figure 5: Connection IF_CMN_nHALT
Setting Dead Time
|
Table 3: DT adjustment |
||
| Designation | Pattern Name |
Setting |
| R43
(connected to GND) |
0603 | PRIM_CFG_TDT2_IN
Factory setting: 0Ω |
| R44
(connected to GND) |
0603 | PRIM_CFG_SELECT_IN
Factory setting: not equipped |
| R45
(connected to GND) |
0603 | PRIM_CFG_TDT3_IN
Factory setting: 0Ω |
| R46
(connected to GND) |
0603 | PRIM_CFG_TDT1_IN
Factory setting: not equipped |
Factory setting: 3,3µs
Setting Dynamic Short Circuit Protection
|
Table 4: RCE & CCE |
|||
| Designation | Pattern Name |
Setting |
|
| R162 | 1206 | RCE
Factory setting: not equipped |
TOP |
| C150 | 1206 | CCE
Factory setting: not equipped |
TOP |
| R262 | 1206 | RCE
Factory setting: not equipped |
BOT |
| C250 | 1206 | CCE
Factory setting: not equipped |
BOT |
Collector Series Resistance
|
Table 5: RVCE |
|||
| Designation | Pattern Name |
Setting |
|
| R150 | MiniMELF | RVCE *
Factory setting: not equipped |
TOP |
| R250 | MiniMELF | RVCE *
Factory setting: not equipped |
BOT |
- 1200V IGBT operation: 0Ω
- 1700V IGBT operation: 1kΩ / 0,4W
Adaptation Gate Resistors
|
Table 6: RGon & RGoff |
|||
| Designation | Pattern Name |
Setting |
|
| R151, R152, R153 (parallel connected) | MiniMELF | RGon
Factory setting: not equipped |
TOP |
| R154, R155, R156 (parallel connected) | MiniMELF | RGoff
Factory setting: not equipped |
TOP |
| R251, R252, R253 (parallel connected) | MiniMELF | RGon
Factory setting: not equipped |
BOT |
| R254, R255, R256 (parallel connected) | MiniMELF | RGoff
Factory setting: not equipped |
BOT |
Adaptation Decoupling Gate Resistors
For details to the decoupling gate resistors and recommended values, see Modules Explanations and Data Sheets SEMiX®.
|
Table 7: RG1, RG2, RG3 |
|||
| Designation | Pattern Name |
Setting |
|
| R101 | MELF | RG1
Factory setting: not equipped |
TOP |
| R102 | MELF | RG2
Factory setting: not equipped |
TOP |
| R103 | MELF | RG3
Factory setting: not equipped |
TOP |
| R201 | MELF | RG1
Factory setting: not equipped |
BOT |
| R202 | MELF | RG2
Factory setting: not equipped |
BOT |
| R203 | MELF | RG3
Factory setting: not equipped |
BOT |
Setting Soft Turn-Off
|
Table 8: RGoff_SC |
|||
| Designation | Pattern Name |
Setting |
|
| R160, R161
(parallel connected) |
MiniMELF | RGoff_SC
Factory setting: not equipped |
TOP |
| R260, R261
(parallel connected) |
MiniMELF | RGoff_SC
Factory setting: not equipped |
BOT |
Temperature Signal
The temperature sensor inside the SEMiX® module is directly connected to contacting points T1 and T2. For details on the temperature sensor, see Modules Explanations SEMiX®.
Safety Warnings:
The contacting points T1 and T2 are not electrically isolated. Due to the high voltage that may be present at the contacting points T1 and T2, some care must be taken to avoid accidents. There is no cover or potential isolation that protects the high-voltage sections/wires from accidental human contact.
Please note:
If the contacting points T1 and T2 are used for the adaptor of the temperature sensor, the Over Temperature Protection Circuit must be disabled by taking out the resistors R175, R178, and R179.
Over Temperature Protection Circuit (OTP)
The external error input SEC_TOP_ERR_IN on the secondary side (high potential) of the driver core is used for an over-temperature protection circuit to place the gate driver into halt mode.
Dimensioning OTP
- Define an over-temperature trip level according to the application.
- Calculate the nominal ohmic resistance value of the temperature sensor at the defined trip level (see “Modules – Explanations – SEMiX®” on the SEMiX® product overview page at http://www.semikron.com).
- The trip level on the adapter board is set with R172 by using the calculated resistance value.
- Factory setting R172: not equipped
- If no resistor is used, a failure signal is generated.
Mounting
Mounting Notes
The electrical connections between the adaptor board and SEMiX® are realized via spring contacts integrated into SEMiX® power modules and via landing pads on the bottom side of the adaptor board.
Figure 6: Adaptor Board & Driver Core Mounting
- Soldering of components (e.g. RGon, RGoff, etc.) on adapter board.
- Adaptor Board has to be fixed to the SEMiX® module (see “Mounting Instruction and Application Notes for SEMiX® IGBT modules” on the SEMiX® product overview page at http://www.semikron.com).
- Insert the driver core into the box connector on the adaptor board.
- The connection between the driver core and the adaptor board should be mechanically reinforced by using support posts. The posts have to be spaced between the driver core and the adaptor board.
- The product information of suitable support posts and distributor contact information is available at e.g. http://www.richco-inc.com (e.g. part number DLMSPM-8-01, LCBST-8-01).
Schematics
Parts List
Figure 10: Parts List Adaptor Board
|
Count |
Ref. Designator | Value | Pattern Name |
Description |
|
7 |
C170, C171, C173, C174, C175, C176, CN170 |
100nF |
0805 (SMD) |
Capacitor X7R |
| 6 | C20, C21, C22, C23, C24, C25 | 1nF | 0805 (SMD) | Capacitor X7R |
| 1 | C26 | 2,2µF | 1210 (SMD) | Capacitor X7R |
| 1 | C27 | 220uF/35V | SMD | Longlife-Elko |
| 1 | C31 | 68pF | 0603 (SMD) | Capacitor NP0 |
| 2 | C35, C151 | 1uF | 1206 (SMD) | Capacitor X7R |
| 1 | C36 | 100pF | 0603 (SMD) | Capacitor NP0 |
| 1 | CD20 | 100nF | 1206 (SMD) | Capacitor X7R |
| 1 | D20 | 74C14 | SOIC 14 (SMD) | Logic-IC 74C… |
| 2 | L150, L151 | 100uH | 1210 (SMD) | Inductor |
| 1 | N170 | LM2904 | SOIC 8 (SMD) | Operational Amplifier |
|
6 |
R111, R112, R113, R201, R211, R212, R 213 |
0,51Ohm |
Melf (SMD) |
2% |
| 2 | R157, R171 | 15,0KOhm | 0603 (SMD) | 1% |
| 1 | R158 | 10,0Ohm | 0603 (SMD) | 1% |
| 2 | R163, R263 | 10,0KOhm | MiniMelf (SMD) | 1% |
| 3 | R170, R174, R176 | 30,1KOhm | 0603 (SMD) | 1% |
| 1 | R175 | 5,62KOhm | MiniMelf (SMD) | 1% |
| 1 | R177 | 3,01KOhm | 1206 (SMD) | 1% |
| 3 | R27, R178, R179 | 0,00Ohm | MiniMelf (SMD) | |
| 3 | R28, R50, R52 | 10,0KOhm | MicroMelf (SMD) | 1% |
| 6 | R30, R31, R32, R33, R34, R37 | 5,11KOhm | MicroMelf (SMD) | 1% |
| 1 | R36 | 3,32KOhm | 0603 (SMD) | 1% |
| 2 | R43, R45 | 0,00Ohm | 0603 (SMD) | |
| 3 | R47, R54, R56 | 10,0KOhm | 0603 (SMD) | 1% |
| 1 | R51 | 121KOhm | 0603 (SMD) | 1% |
| 1 | R53 | 100Ohm | MicroMelf (SMD) | 1% |
| 1 | R57 | 1,50KOhm | MicroMelf (SMD) | 1% |
| 1 | R58 | 1,00KOhm | 0603 (SMD) | 1% |
| 2 | R60, R61 | 2,00KOhm | 0603 (SMD) | 1% |
| 1 | R62 | 3,92KOhm | 0603 (SMD) | 1% |
|
6 |
V111, V112, V113, V211, V212, V213 |
10BQ100 |
SMB (SMD) |
Diode Schottky |
| 2 | V150, V250 | BY203/20S | SMD | High Voltage Diode |
| 2 | V170, V171 | BAV70W | SOT323 (SMD) | Double Diode |
| 1 | V20 | SMCJ15 | DO214AB (SMD) | Suppressor Diode |
| 5 | V23, V25, V26, V27, V29 | BC847B | SOT23 (SMD) | NPN-Transistor |
| 1 | V28 | BZX284-C7V5 | SOD110 (SMD) | Zener-Diode |
| 1 | X20 | 20p. | SMD | Connector |
| 4 | X6, X7, X10, X11 | RM2,54 10p. | SMD | Box Connector |
- TP: Test Point
- Box Connector: SUYIN 254100FA010G200ZU
References
- www.SEMIKRON.com
- A. Wintrich, U. Nicolai, W. Tursky, T. Reimann, “Application Manual Power Semiconductors”, ISLE Verlag 2011, ISBN 978-3-938843-666
HISTORY
SEMIKRON reserves the right to make changes without further notice herein
DISCLAIMER
SEMIKRON reserves the right to make changes without further notice herein to improve reliability, function, or design. Information furnished in this document is believed to be accurate and reliable. However, no representation or warranty is given and no liability is assumed concerning the accuracy or use of such information, including without limitation, warranties of non-infringement of intellectual property rights of any third party. SEMIKRON does not assume any liability arising out of the application or use of any product or circuit described herein. Furthermore, this technical information may not be considered as an assurance of component characteristics. No warranty or guarantee expressed or implied is made regarding delivery, performance, or suitability. This document supersedes and replaces all information previously supplied and may be superseded by updates without further notice.
SEMIKRON products are not authorized for use in life support appliances and systems without express written approval by SEMIKRON.
SEMIKRON INTERNATIONAL GmbH
- P.O. Box 820251 • 90253 Nuremberg • Germany
- Tel: +49 911-65 59-234
- Fax: +49 911-65 59-262
- sales.skd@semikron.com
- www.semikron.com.
Documents / Resources
 |
SEMIKRON SKYPER 32PRO R Semikron Board [pdf] User Guide SKYPER 32PRO R Semikron Board, SKYPER 32PRO R, Semikron Board, Board |