RENESAS DA14592MOD SmartBond Bluetooth LE 5.2 Module Instruction Manual

Compliance: 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part
15 (US), ARIB STD-T66 (Japan)
Peripherals and Interfaces: Various standard and advanced
peripherals

Processing Power: Flexible with up to 32 General Purpose
I/Os
Processor: 32 kHz up to 64 MHz 32-bit Arm Cortex-M33TM with
cache and FPU

ADC: Eight-channel 10-bit SAR ADC, 2 Msamples/s; ADC with 15
bits at 1 ksps, 13 bits at 16 ksps
Memory: 256 kB embedded Flash, 96 kB Data SRAM with retention,
Caches with retention for Cortex M33 and M0+ respectively

Interfaces: QSPI PSRAM/Flash, 2 x UARTs up to 3 Mbps, SPI+TM,
I2C controller, PDM, PCM/I2S, dual SRC
Decoders: Quadrature Decoder, Application cryptographic engine
with AES-256 and SHA-256

Power/Clock Management: RTC with 10 ms resolution, Buck DCDC
converter, System clock up to 64 MHz
Radio Transceiver: High-performance mode with TX output

Product Usage Instructions:

1. Powering Up the DA14592MOD:

Ensure the voltage input is within the operating range of 1.7 V
to 3.6 V.

2. Connecting Peripherals:

Utilize the available GPIOs and interfaces to connect
peripherals as needed.

3. Programming and Development:

Utilize the processing power and memory to develop feature-rich
applications. Refer to the user manual for programming
guidelines.

4. Communication:

Utilize the UARTs, SPI, I2C, and other interfaces for
communication with external devices.

5. Power Management:

Utilize the power/clock management features for efficient power
consumption and operation.

Frequently Asked Questions (FAQ):

Q: What is the operating voltage range of the DA14592MOD?

A: The operating range is from 1.7 V to 3.6 V.

Q: What is the maximum system clock frequency supported?

A: The system clock can be up to 64 MHz using a doubler.

Q: How many UARTs are available on the DA14592MOD?

A: There are two UARTs available on the DA14592MOD with speeds
up to 3 Mbps.

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DA14592MOD

SmartBond Bluetooth® LE 5.2 Module

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General Description
Based on DA14592 Bluetooth® low energy 5.2 system on chip (SoC), the DA14592 Module brings out all the DA14592 hardware features and capabilities. The module integrates all passives, antenna and is supported by software that is easy to work with. The DA14592 Module targets broad market use and is certified across regions providing significant reductions in development cost and risks, and time-to-market.
The DA14592 is a multi-core wireless microcontroller, combining the latest Arm® Cortex® M33TM application processor with floating-point unit, advanced power management functionality, a cryptographic security engine, analog and digital peripherals, a software configurable protocol engine with a radio that is compliant to the Bluetooth® 5.2 Low Energy standard and 256 kB of embedded Flash accompanied by 96 kB of RAM.
The DA14592 is based on an Arm® Cortex®-M33 CPU with an 8-region MPU and a single-precision FPU offering up to 96 dMIPS at 64 MHz. The dedicated application processor executes code from RAM, embedded Flash or QSPI XiP Flash via an 8 kB 4-way associative cache controller. Bluetooth® 5.2 or other protocol connectivity is guaranteed by a software-configurable Bluetooth® Low Energy protocol engine (MAC) based on an Arm® Cortex®-M0+TM with an ultra-low-power radio transceiver, capable of +5.5 dBm output power and -97 dBm sensitivity offering a total link budget of 102.5 dB.
A variety of standard and advanced peripherals enable interaction with other system components. and the development of advanced user interfaces and feature-rich applications.

Key Features

Compatible with Bluetooth® 5.2, ETSI EN 300 2.3 mA TX at VBAT = 3 V and 0 dBm

328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66

3.5 µA at sleep with all RAM retained

(Japan)

Peripherals and interfaces

Flexible processing power

Up to 32 General Purpose I/Os

32 kHz up to 64 MHz 32-bit Arm Cortex-
M33TM with 8 kB, four-way associative

Eight-channel 10-bit SAR ADC,
2 Msamples/s

cache and FPU

ADC, 15 bits at 1 ksps, 13 bits at

A flexible and configurable Bluetooth® LE

16 ksps

MAC engine based on Arm Cortex-M0+TM QSPI PSRAM/Flash interface

with an 8 kB, four-way associative cache

2 x UARTs up to 3 Mbps, one UART

Memory

extended to support ISO7816

256 kB embedded Flash
96 kB Data SRAM with retention
8 kB Caches with retention for Cortex M33
and M0+ respectively

One SPI+TM and one I2C controller at
100 kHz, 400 kHz, or 3.4 MHz
PDM, PCM/I2S and dual SRC 3-axis capable Quadrature Decoder

288 kB ROM (including boot ROM, PKI
routines, and Bluetooth® LE stack)
Power/Clock management

RTC with 10 ms resolution
Four General purpose, 24-bit up/down
timers with PWM capabilities

Buck DCDC converter

Application cryptographic engine with

Operating range: from 1.7 V to 3.6 V

AES-256 and SHA-256

32 MHz or 64 MHz system clock using a Radio transceiver

doubler

High Performance mode: TX output

Fast wake-up from sleep in <15 µs Current Consumption
Hibernation <100 nA

power -22 to +5.5 dBm, RX sensitivity -97 dBm
Low Power mode: TX output power -23 to
4.5 dBm, RX sensitivity -96 dBm

1.2 mA RX at VBAT = 3 V

Datasheet
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DA14592MOD
SmartBond Bluetooth® LE 5.2 Module

Packaging 18 mm x 14.5 mm x 2.5 mm package
Module software Development Kit SDK10 support
Module software tools Flash/OTP programmer SUOTA support Battery Life Estimation Data Rate Monitoring Real-Time Power Profiling Production Line Testing

Standards conformance BT SIG QDID Europe (CE/RED) UK (UKCA) US (FCC) Canada (IC) Japan (MIC) South Korea (MSIP) Taiwan (NCC) South Africa (ICASA) Brazil (ANATEL) China (SRRC) Thailand (NBTC) India (WPC)

Applications
Fitness trackers Sport watches Smartwatches Voice-controlled remote controls Toys Consumer appliances Home automation Industrial automation

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Contents
General Description ……………………………………………………………………………………………………………. 1
Key Features ………………………………………………………………………………………………………………………. 1
Applications ……………………………………………………………………………………………………………………….. 2
Contents …………………………………………………………………………………………………………………………….. 3
Figures……………………………………………………………………………………………………………………………….. 4
Tables ………………………………………………………………………………………………………………………………… 4
1 Terms and Definitions……………………………………………………………………………………………………. 6
2 References ……………………………………………………………………………………………………………………. 6
3 Module Variants…………………………………………………………………………………………………………….. 7
4 Block Diagram ………………………………………………………………………………………………………………. 8 4.1 DA14592MOD ……………………………………………………………………………………………………….. 8 4.2 DA14592MOD with on-board XiP Flash ……………………………………………………………………. 9 4.3 DA14592MOD with on-board PSRAM …………………………………………………………………….. 10
5 Pinout …………………………………………………………………………………………………………………………. 11
6 Characteristics ……………………………………………………………………………………………………………. 17 6.1 Absolute maximum ratings…………………………………………………………………………………….. 17 6.2 Recommended operating conditions ………………………………………………………………………. 17 6.3 Electrical characteristics………………………………………………………………………………………… 17
7 Mechanical Specifications……………………………………………………………………………………………. 23 7.1 Mechanical dimensions and land pattern…………………………………………………………………. 23 7.2 Marking……………………………………………………………………………………………………………….. 23
8 BOM ……………………………………………………………………………………………………………………………. 24
9 Design Guidelines ……………………………………………………………………………………………………….. 25 9.1 Installation location……………………………………………………………………………………………….. 25 9.2 Antenna graphs ……………………………………………………………………………………………………. 28 9.3 Radiation pattern ………………………………………………………………………………………………….. 29
10 Soldering …………………………………………………………………………………………………………………….. 32
11 Packaging Information…………………………………………………………………………………………………. 34 11.1 Tape and reel ………………………………………………………………………………………………………. 34 11.2 Labeling………………………………………………………………………………………………………………. 34
12 Ordering Information …………………………………………………………………………………………………… 36
13 Regulatory Information ………………………………………………………………………………………………… 37 13.1 CE (Radio Equipment Directive 2014/53/EU (RED)) (Europe)…………………………………. 38 13.2 FCC (U.S.A.) …………………………………………………………………………………………………….. 38 13.2.1 List of applicable FCC rules……………………………………………………………………… 38 13.2.2 Summarize the specific operational use conditions …………………………………….. 38 13.2.3 Limited module procedures ……………………………………………………………………… 39 13.2.4 Trace antenna designs ……………………………………………………………………………. 39 13.2.5 RF exposure considerations …………………………………………………………………….. 39 13.2.6 Antennas……………………………………………………………………………………………….. 39 13.2.7 Label and compliance information. ……………………………………………………………. 39 13.2.8 Information on test modes and additional testing requirements: ……………………. 40

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13.2.9 Additional testing, Part 15 Subpart B disclaimer: ………………………………………… 40 13.3 IC (Canada)…………………………………………………………………………………………………………. 40 13.4 UKCA (UK) ………………………………………………………………………………………………………….. 41 13.5 NCC (Taiwan) ……………………………………………………………………………………………………… 42 13.6 MSIP (South Korea) ……………………………………………………………………………………………… 42 13.7 ICASA (South Africa) ……………………………………………………………………………………………. 42 13.8 ANATEL (Brazil) …………………………………………………………………………………………………… 43 13.9 SRRC (China) ……………………………………………………………………………………………………… 43 13.10 MIC (Japan) ………………………………………………………………………………………………………… 44 13.11 NBTC (Thailand) ………………………………………………………………………………………………….. 44 13.12 WPC (India)…………………………………………………………………………………………………………. 45
14 Bluetooth SIG Qualification………………………………………………………………………………………….. 46
Revision History ……………………………………………………………………………………………………………….. 47

Figures
Figure 1. DA14592MOD-0100000 block diagram ……………………………………………………………………… 8 Figure 2. DA14592MOD-01F3200 block diagram ……………………………………………………………………… 9 Figure 3. DA14592MOD-01S1600 block diagram……………………………………………………………………. 10 Figure 4. Pinout diagram top view ………………………………………………………………………………………. 11 Figure 5. Pinout diagram bottom view …………………………………………………………………………………. 11 Figure 6. Module shield marking …………………………………………………………………………………………… 23 Figure 7. Installation locations for optimum antenna performance …………………………………………….. 26 Figure 8. Antenna performance in proximity of copper (left), laminate (middle), and laminate under antenna (right) ……………………………………………………………………………………………………………………. 26 Figure 9. DA14592MOD module evaluation board ………………………………………………………………….. 27 Figure 10. VSWR installed in the upper-left corner (position #1) of evaluation board …………………… 28 Figure 11. VSWR with module installed in center (position #2) of the evaluation board ……………….. 28 Figure 12. VSWR with module installed in the upper-right corner (position #3) of the evaluation board …………………………………………………………………………………………………………………………………………. 28 Figure 13. Measurement plane definition ……………………………………………………………………………….. 29 Figure 14. Board orientation at different planes ………………………………………………………………………. 29 Figure 15. Radiation pattern for trace antenna ……………………………………………………………………….. 30 Figure 16. Recommended reflow profile for lead free solder …………………………………………………….. 32 Figure 17. Tape and reel ……………………………………………………………………………………………………… 34 Figure 18. Reel part information label ……………………………………………………………………………………. 35 Figure 19. EU-UK directives conformity labels ………………………………………………………………………… 35 Figure 20. ICASA conformity label ………………………………………………………………………………………… 35 Figure 21. CMIIT ID label …………………………………………………………………………………………………….. 35

Tables

Table 1: DA14592 module variants …………………………………………………………………………………………. 7 Table 2: Edge pins description ……………………………………………………………………………………………… 12 Table 3: Absolute maximum ratings ………………………………………………………………………………………. 17 Table 4: Recommended operating conditions …………………………………………………………………………. 17 Table 5: DC characteristics ………………………………………………………………………………………………….. 17 Table 6: GPIO – Recommended operating conditions ……………………………………………………………… 19 Table 7: GPIO – DC characteristics ……………………………………………………………………………………….. 19 Table 8: RCX – Timing characteristics ……………………………………………………………………………………. 20 Table 9: XTAL32K – Recommended operating conditions ………………………………………………………… 20

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Table 10: XTAL32M – Recommended operating conditions ……………………………………………………… 20 Table 11: RADIO 1M LP – AC characteristics …………………………………………………………………………. 20 Table 12: RADIO 1M HP – AC characteristics …………………………………………………………………………. 21 Table 13: RADIO 2M LP – AC characteristics …………………………………………………………………………. 21 Table 14: RADIO 2M HP – AC characteristics …………………………………………………………………………. 21 Table 15: Bill of materials …………………………………………………………………………………………………….. 24 Table 16: Antenna efficiency vs DA14592MOD module positions ……………………………………………… 25 Table 17: Antenna peak gain for 2.4 ghz frequency band ………………………………………………………… 31 Table 18: Reflow profile specification …………………………………………………………………………………….. 32 Table 19: MSL level vs floor lifetime………………………………………………………………………………………. 33 Table 20: Reel specifications………………………………………………………………………………………………… 34 Table 21: Ordering information (samples) ………………………………………………………………………………. 36 Table 22: Ordering information (production) …………………………………………………………………………… 36 Table 23: Standards conformance ………………………………………………………………………………………… 37

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DA14592MOD

SmartBond Bluetooth® LE 5.2 Module

1 Terms and Definitions

ADC DIO GND I-PD I-PU MSL NTC PCB PWR RDS VSWR

Analog-to-digital converter Digital input-output Ground. Input pulled down Input pulled up Moisture sensitivity level Negative temperature coefficient Printed circuit board Power Reduced driving strength Voltage standing wave ratio

2 References
[1] DA14592, Datasheet, Renesas Electronics. Note 1 References are for the latest published version, unless otherwise indicated.

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3 Module Variants
Table 1 presents the differentiation between the DA14592 Module variants.

Table 1: DA14592 module variants

Features GPIOs QSPI I/F On-board QSPI XiP Flash On-board QSPI PSRAM Package (mm)

DA14592MOD-0100000 20
18 x 14.5 x 2.5

DA14592MOD-01F3200 20
18 x 14.5 x 2.5

DA14592MOD-01S1600 20
18 x 14.5 x 2.5

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4 Block Diagram
The DA14592 Module is based on the Renesas Electronics DA14592 SoC. With an on-board 32 MHz XTAL and a printed antenna, the module enables a faster time to market at reduced development costs.

4.1 DA14592MOD
The DA14592MOD-0100000 Module, as seen in Figure 1, consists of:
32 MHz XTAL Decoupling capacitors A power inductor A CLC filter and matching components for the printed antenna.

VBAT
20

VDDIO
24

C5
U1

L1 C4 C3

VBAT Lx
VDCDC VDDIO

RSTn

P1_02

P0_14

P1_01

P1_00

CLC LP Filter

P0_15

P1_09

VDD C2

P1_07

P1_03

P1_06

DA14592

VDCDC_RF

C6 C7

P1_05

P1_04

FCQFN52

P1_08

P0_13

P0_12

P0_08

P0_09

P0_06

P0_07

P0_11

P0_10

P0_00 P0_01
P0_02
P0_03
P0_04 P0_05

GND P1_15 P1_12 P1_14 P1_10 P1_13 P1_11

1,2,4,11, 21,22,31, 38,41

36 37 42 43 44 45

35 34 40 32 33 39

Figure 1. DA14592MOD-0100000 block diagram

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4.2 DA14592MOD with on-board XiP Flash
The DA14592MOD-01F3200 Module, additionally to 0100000 variant, features also:
An on-board 32Mbit QSPI XiP Flash

VBAT
20

VDDIO
24

C5
U1

L1 C4 C3

VBAT Lx
VDCDC VDDIO

RSTn

P1_02

P0_14

P1_01

P1_00

CLC LP Filter

P0_15

P1_09

VDD C2

P1_07

P1_03

P1_06

DA14592

VDCDC_RF

C6 C7

P1_05

P1_04

FCQFN52

VDDIO

P1_08

P0_13

P0_12

P0_08

P0_09

P0_06

P0_07

P0_00 P0_01
P0_02
P0_03
P0_04 P0_05

C8
U2
P25Q32SL-UXH-IR 32Mbit NOR Flash

P0_11

P0_10

GND P1_15 P1_12 P1_14 P1_10 P1_13 P1_11

Y1
1,2,4,11, 21,22,31, 38,41

36 37 42 43 44 45

35 34 40 32 33 39

Figure 2. DA14592MOD-01F3200 block diagram

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SmartBond Bluetooth® LE 5.2 Module
4.3 DA14592MOD with on-board PSRAM
The DA14592MOD-01S1600 Module, additionally to 0100000 variant, features also:
An on-board 16Mbit PSRAM

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VBAT
20

VDDIO
24

C5
U1

L1 C4 C3

VBAT Lx
VDCDC VDDIO

RSTn

P1_02

P0_14

P1_01

P1_00

CLC LP Filter

P0_15

P1_09

VDD C2

P1_07

P1_03

15 16

P1_06 P1_05

DA14592

VDCDC_RF

C6 C7

P1_04

FCQFN52

VDDIO

P1_08

P0_13

P0_12

P0_08

P0_09

P0_06

P0_07

P0_00 P0_01
P0_02
P0_03
P0_04 P0_05

C8
U2
APS1604MSQR-ZR
16Mbit PSRAM

P0_11

P0_10

GND P1_15 P1_12 P1_14 P1_10 P1_14 P1_11

Y1
1,2,4,11, 21,22,31, 38,41

36 37 42 43 44 45

35 34 40 32 33 39

Figure 3. DA14592MOD-01S1600 block diagram

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SmartBond Bluetooth® LE 5.2 Module
5 Pinout

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ANTENNA AREA

MARKING AREA

11 12 13 14 15 16 17 18 19 20 21
Figure 4. Pinout diagram top view

ANTENNA AREA

32 33 28

34 35

36 37 38

26 39 40
25

6 41
7

9 43 44 45

Datasheet
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21 20 19 18 17 16 15 14 13 12 11
Figure 5. Pinout diagram bottom view Revision 1.3
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Table 2: Edge pins description

Pin # Pin Name

Type

GND

–

GND

–

Not Connected

GND

–

RSTn

P1_02

DIO

GPADC_2

SDADC_2

RC32M

P0_14

DIO

Hibernation Wake DI up 1

P1_01

DIO

PGA_INm

GPADC_1

SDADC_1

P1_00

DIO

PGA_INp

GPADC_0

SDADC_0

P0_15

DIO

UART Boot RX

GND

–

Reset State I-PD
I-PD I-PD
I-PD
I-PD

Description
Ground.
Ground.
Keep Floating.
Ground.
INPUT. Reset signal (active LOW). INPUT/OUTPUT with selectable pull-up/down resistor and open-drain functionality. Pull-down enabled during and after reset. General-purpose I/O port bit or alternate function nodes. Contains state retention mechanism during power down. INPUT. Analog input of the general-purpose ADC, channel 2.
INPUT. Analog input of the SDADC, channel 2.
OUTPUT. RC32M clock signal output (square wave).
INPUT/OUTPUT with selectable pull-up/down resistor and open-drain functionality. Pull-down enabled during and after reset. General-purpose I/O port bit or alternate function nodes. Contains state retention mechanism during power down.
INPUT. Wake up from hibernation mode source 1.
INPUT/OUTPUT with selectable pull-up/down resistor and open-drain functionality. Pull-down enabled during and after reset. General-purpose I/O port bit or alternate function nodes. Contains state retention mechanism during power down.
INPUT. Programmable gain amplifier negative input.
INPUT. Analog input of the general-purpose ADC, channel 1.
INPUT. Analog input of the SDADC, channel 1.
INPUT/OUTPUT with selectable pull-up/down resistor and open-drain functionality. Pull-down enabled during and after reset. General-purpose I/O port bit or alternate function nodes. Contains state retention mechanism during power down.
INPUT. Programmable gain amplifier positive input.
INPUT. Analog input of the general-purpose ADC, channel 0.
INPUT. Analog input of the SDADC, channel 0.
INPUT/OUTPUT with selectable pull-up/down resistor and open-drain functionality. Pull-down enabled during and after reset. General-purpose I/O port bit or alternate function nodes. Contains state retention mechanism during power down.
INPUT. UART Receive data input during boot.
Ground.

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Pin # Pin Name

P1_09

Type DIO

GPADC_6

SDADC_6

P1_07

DIO

P1_03

DIO

P1_06

DIO

GPADC_5

SDADC_5

SDADC_REFn

P1_05

DIO

GPADC_4

SDADC_4

SDADC_REFp

SDADC_INT_RE AO F

P1_04

DIO

Hibernation Wake DI Up 2

P1_08

DIO

Reset State I-PD
I-PD I-PD I-PD
I-PD
I-PD I-PD

Description
INPUT/OUTPUT with selectable pull-up/down resistor and open-drain functionality. Pull-down enabled during and after reset. General-purpose I/O port bit or alternate function nodes. Contains state retention mechanism during power down.
INPUT. Analog input of the general-purpose ADC, channel 6.
INPUT. Analog input of the SDADC, channel 6.
INPUT/OUTPUT with selectable pull-up/down resistor and open-drain functionality. Pull-down enabled during and after reset. General-purpose I/O port bit or alternate function nodes. Contains state retention mechanism during power down.
INPUT/OUTPUT with selectable pull-up/down resistor and open-drain functionality. Pull-down enabled during and after reset. General-purpose I/O port bit or alternate function nodes. Contains state retention mechanism during power down.
INPUT/OUTPUT with selectable pull-up/down resistor and open drain functionality. Pull-down enabled during and after reset. General-purpose I/O port bit or alternate function nodes. Contains state retention mechanism during power down.
INPUT. Analog input of the general-purpose ADC, channel 5.
INPUT. Analog input of the SDADC, channel 5.
INPUT. Analog input of the external SDADC negative
INPUT/OUTPUT with selectable pull-up/down resistor and open-drain functionality. Pull-down enabled during and after reset. General-purpose I/O port bit or alternate function nodes. Contains state retention mechanism during power down.
INPUT. Analog input of the general-purpose ADC, channel 4.
INPUT. Analog input of the SDADC, channel 4.
INPUT. Analog input of the external SDADC positive
OUTPUT. Analog output of the internal SDADC voltage reference.
INPUT/OUTPUT with selectable pull-up/down resistor and open-drain functionality. Pull-down enabled during and after reset. General-purpose I/O port bit or alternate function nodes. Contains state retention mechanism during power down.
INPUT. Wake up from hibernation mode source 2.
INPUT/OUTPUT with selectable pull-up/down resistor and open-drain functionality. Pull-down enabled during and after reset. General-purpose I/O port bit or alternate function nodes. Contains state retention mechanism during power down.

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Pin # Pin Name

P0_13

Type DIO

UART Boot TX

VBAT

GND

–

GND

–

P0_12

DIO

LP_CLK

Timer.PWM

VDDIO

AIO

P0_08

DIO

CMAC_SWDIO

DIO

DIVN

P0_09

DIO

CMAC_SWCLK

P0_06

DIO

M33_SWDIO

DIO

P0_07

DIO

M33_SWCLK

Reset State I-PD
I-PD
I-PU
I-PD I-PU I-PD

Description
INPUT/OUTPUT with selectable pull-up/down resistor and open-drain functionality. Pull-down enabled during and after reset. General-purpose I/O port bit or alternate function nodes. Contains state retention mechanism during power down.
OUTPUT. UART Transmit data output during boot.
INPUT. Battery connection.
Ground.
Ground.
INPUT/OUTPUT with selectable pull-up/down resistor and open drain functionality. Pull-down enabled during and after reset. General-purpose I/O port bit or alternate function nodes. Does not contain state retention mechanism during power down.
OUTPUT. LP clock signal output (square wave), active during sleep.
OUTPUT. Timer/PWM output (PWM) in Sleep mode.
OUTPUT. 1.8 V power rail.
INPUT/OUTPUT with selectable pull-up/down resistor and open-drain functionality. Pull-up enabled during and after reset. General-purpose I/O port bit or alternate function nodes. Contains state retention mechanism during power down.
INPUT/OUTPUT. Arm Cortex-M0+ Serial Wire Debug data I/O signal.
OUTPUT. DIVN clock signal output (square wave).
INPUT/OUTPUT with selectable pull-up/down resistor and open-drain functionality. Pull-down enabled during and after reset. General-purpose I/O port bit or alternate function nodes. Contains state retention mechanism during power down.
INPUT. Arm Cortex-M0+ Serial Wire Debug clock signal.
INPUT/OUTPUT with selectable pull-up/down resistor and open-drain functionality. Pull-down enabled during and after reset. General-purpose I/O port bit or alternate function nodes. Contains state retention mechanism during power down.
INPUT/OUTPUT. Arm Cortex-M33 Serial Wire Debug data I/O signal.
INPUT/OUTPUT with selectable pull-up/down resistor and open-drain functionality. Pull-down enabled during and after reset. General-purpose I/O port bit or alternate function nodes. Contains state retention mechanism during power down.
INPUT. Arm Cortex-M33 Serial Wire Debug clock signal.

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Pin # Pin Name

P0_11

XTAL32M

P0_10

Timer2.PWM

GPADC_3

SDADC_3

GND

P0_03

QSPI _D1

P0_04

QSPI _D2

P0_01

QSPI_CS

P0_00

QSPI_CLK

P1_15

P1_12

Datasheet
CFR0011-120-00

Type DIO
DO DIO
DO AI AI DIO
DIO DIO
DIO DIO
DO DIO
DO DIO
DIO

Reset State I-PD
I-PD
I-PD I-PD I-PU I-PD I-PD I-PD

Description
INPUT/OUTPUT with selectable pull-up/down resistor and open-drain functionality. Pull-down enabled during and after reset. General-purpose I/O port bit or alternate function nodes. Contains state retention mechanism during power down.
OUTPUT. XTAL32M clock signal output (square wave).
INPUT/OUTPUT with selectable pull-up/down resistor and open-drain functionality. Pull-down enabled during and after reset. General-purpose I/O port bit or alternate function nodes. Contains state retention mechanism during power down.
OUTPUT. Timer2/PWM output (PWM) in Sleep mode.
INPUT. Analog input of the general-purpose ADC, channel 3.
INPUT. Analog input of the SDADC, channel 3.
Ground.
INPUT/OUTPUT with selectable pull-up/down resistor and open-drain functionality. Pull-down enabled during and after reset. General-purpose I/O port bit or alternate function nodes. Contains state retention mechanism during power down.
INPUT/OUTPUT. QSPI RAM/Flash Data line 1.
INPUT/OUTPUT with selectable pull-up/down resistor and open-drain functionality. Pull-down enabled during and after reset. General-purpose I/O port bit or alternate function nodes. Contains state retention mechanism during power down.
INPUT/OUTPUT. QSPI RAM/Flash Data line 2.
NPUT/OUTPUT with selectable pull-up/down resistor and open drain functionality. Pull-up enabled during and after reset. General-purpose I/O port bit or alternate function nodes. Contains state retention mechanism during power down.
OUTPUT. QSPI RAM/Flash chip select.
INPUT/OUTPUT with selectable pull-up/down resistor and open-drain functionality. Pull-down enabled during and after reset. General-purpose I/O port bit or alternate function nodes. Contains state retention mechanism during power down.
OUTPUT. QSPI RAM/Flash clock.
INPUT/OUTPUT with selectable pull-up/down resistor and open-drain functionality. Pull-down enabled during and after reset. General-purpose I/O port bit or alternate function nodes. Contains state retention mechanism during power down.
INPUT/OUTPUT with selectable pull-up/down resistor and open-drain functionality. Pull-down enabled during and after reset. General-purpose I/O port bit or alternate function nodes. Contains state retention mechanism during power down.

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Pin # Pin Name

GND

P0_05

QSPI _D3

P0_02

QSPI _D0

GND

P1_14

XTAL32kp

P1_10

P1_13

XTAL32km

P1_11

GPADC_7 SDADC_7

Type DIO
DIO DIO
DIO DIO
AI DI DIO
DIO
AO DIO
AI AI

Reset State I-PD I-PD
I-PD
I-PD I-PD
I-PD

Description
Ground.
INPUT/OUTPUT with selectable pull-up/down resistor and open-drain functionality. Pull-down enabled during and after reset. General-purpose I/O port bit or alternate function nodes. Contains state retention mechanism during power down.
INPUT/OUTPUT. QSPI RAM/Flash Data line 3.
INPUT/OUTPUT with selectable pull-up/down resistor and open-drain functionality. Pull-down enabled during and after reset. General-purpose I/O port bit or alternate function nodes. Contains state retention mechanism during power down.
INPUT/OUTPUT. QSPI RAM/Flash Data line 0.
Ground.
INPUT/OUTPUT with selectable pull-up/down resistor and open-drain functionality. Pull-down enabled during and after reset. General-purpose I/O port bit or alternate function nodes. Contains state retention mechanism during power down.
INPUT. Analog input of the XTAL32k crystal oscillator.
INPUT. Digital input for an external clock (square wave).
INPUT/OUTPUT with selectable pull-up/down resistor and open-drain functionality. Pull-down enabled during and after reset. General-purpose I/O port bit or alternate function nodes. Contains state retention mechanism during power down.
INPUT/OUTPUT with selectable pull-up/down resistor and open-drain functionality. Pull-down enabled during and after reset. General-purpose I/O port bit or alternate function nodes. Contains state retention mechanism during power down.
OUTPUT. Analog output of the XTAL32k crystal oscillator.
INPUT/OUTPUT with selectable pull-up/down resistor and open-drain functionality. Pull-down enabled during and after reset. General-purpose I/O port bit or alternate function nodes. Contains state retention mechanism during power down.
INPUT. Analog input of the general-purpose ADC, channel 7.
INPUT. Analog input of the SDADC, channel 7.

Datasheet
CFR0011-120-00

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6 Characteristics
All MIN/MAX specification limits are guaranteed by design, production testing and/or statistical characterization. Typical values are based on characterization results at default measurement conditions and are informative only.
Default measurement conditions (unless otherwise specified): VBAT= 3.0 V, TA = 25°C. All radio measurements are done with standard RF measurement equipment.

6.1 Absolute maximum ratings
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, so the functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.

Table 3: Absolute maximum ratings

Parameter Description

Conditions

VPIN_LIM_DEF

Limiting voltage on any pin unless Default, unless otherwise

otherwise specified

specified

Min Max Unit

-0.1 3.6

VBAT_LIM

Limiting battery supply voltage

VPIN_LIM_3V0 Limiting voltage on a pin

VPIN_LIM_1V8 Limiting voltage on a pin

TSTG

Storage temperature

Pin VBAT 3.0 V I/O pins 1.8 V I/O pins

3.6

3.45

1.98

-50

150

°C

6.2 Recommended operating conditions

Table 4: Recommended operating conditions

Parameter Description

VBAT

Battery supply voltage

VDDIO

Pad supply voltage

VPIN_1V8

Voltage on a pin

VPIN_3V0

Voltage on a pin

VPIN_(1V2)

Voltage on a pin

Ambient temperature

Conditions Pin VBAT Pin VDDIO 1.8 V I/O pins 3.0 V I/O pins XTAL32Kp, XTAL32Km, XTAL32Mp, XTAL32Mm

Min Typ Max Unit

1.7

3.6

1.65

3.6

1.8

1.2

-40

°C

6.3 Electrical characteristics

Table 5: DC characteristics

Parameter Description

IBAT_IDLE

Battery supply current

Conditions

Min Typ Max Unit

CPU is idle (Wait for Interrupt

– WFI); sys_clk = 32 MHz;

481

pclk = 4 MHz; DCDC on;

Datasheet
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Parameter Description

IBAT_RUN_32M Average active battery

Hz_RAM

supply current

IBAT_RUN_64M Average active battery

Hz_RAM

supply current

IBAT_RUN_32M Average active battery

Hz_FLASH

supply current

IBAT_RUN_64M Average active battery

Hz_FLASH

supply current

IBAT_HIBERN Battery supply current IBAT_DP_SLP Battery supply current

IBAT_EX_SLP_3 Battery supply current
2KB_RET

IBAT_EX_SLP_6 Battery supply current
4KB_RET

IBAT_EX_SLP_9 Battery supply current
6KB_RET
IBAT_BLE_RX_3 Battery supply current
2M
IBAT_BLE_TX_3 Battery supply current
2M_0dbm
Datasheet
CFR0011-120-00

Conditions
FLASH off; peripherals off; VBAT = 3 V.

Min Typ Max Unit

CPU is executing code from

RAM; Cache bypassed;

RC32M on; pclk = 4 MHz;

1.52

DCDC on; Peripherals off;

VBAT = 3 V.

CPU is executing code from

RAM; Cache bypassed;

XTAL32M on; Doubler on;

4.78

pclk = 8 MHz; DCDC on;

Peripherals off; VBAT = 3 V.

CPU is executing code from

embedded FLASH; cache

bypassed; RC32M on; pclk =

1.16

4 MHz; DCDC on;

Peripherals off; VBAT = 3 V.

CPU is executing code from

embedded FLASH; cache

bypassed; XTAL32M on; Doubler on; pclk = 8 MHz;

4.52

DCDC on; Peripherals off;

VBAT = 3 V.

Hibernation mode; no RAM

retained; all clocks off;

DCDC off; VBAT = 3 V.

Deep Sleep mode; No RAM

retained; RCX on; RTC on DCDC on; VBAT = 3 V. Reset

on wake-up

Extended Sleep mode; Both

instruction caches retained.

32 kB (data) RAM retained;

2.6

RCX on; DCDC on; RTC on;

VDD = 0.75 V; VBAT = 3 V.

Extended Sleep mode; Both

instruction caches retained.

64 kB (data) RAM retained;

RCX on; DCDC on; RTC on;

VDD = 0.75 V; VBAT = 3 V.

Extended Sleep mode; Both

instruction caches retained.

96 kB (data) RAM retained;

3.5

RCX on; DCDC on; RTC on;

VDD = 0.75 V; VBAT = 3 V.

Bluetooth LE receive in LP

mode; fCLK = 32 MHz; CPU idle; DCDC on; eFLASH on;

2.67

VBAT = 3 V.

Bluetooth LE transmit mode

4.33

in LP mode; TX output power

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Parameter Description
IBAT_BLE_RX_6 Battery supply current
4M
IBAT_BLE_TX_6 Battery supply current
4M_0dbm
IBAT_BLE_TX_6 Battery supply current
4M_6dbm

Conditions

Min Typ Max Unit

0dBm; fCLK = 32 MHz; CPU idle; DCDC on; eFLASH on; VBAT = 3 V.

Bluetooth LE receive in HP

mode; fCLK = 64 MHz; CPU idle; DCDC on; eFLASH on;

4.99

VBAT = 3 V.

Bluetooth LE transmit in HP

mode; Tx output power 0

dBm; fCLK = 64 MHz; CPU

5.88

idle; DCDC on; eFLASH on;

VBAT = 3 V.

Bluetooth LE transmit in HP

mode; TX output power 6

dBm; fCLK = 64 MHz; CPU

9.56

idle; DCDC on; eFLASH on;

VBAT = 3 V.

Table 6: GPIO – Recommended operating conditions

Parameter Description

Conditions

VIH

HIGH level input voltage

VDD = 0.9 V, VDDIO = 1.8 V

VIL

LOW level input voltage

VDD = 0.9 V, VDDIO = 1.8 V

Min Typ Max Unit

0.63

0.27

Table 7: GPIO – DC characteristics

Parameter Description

IIH

HIGH level input current

IIL

LOW level input current

IIH_PD

HIGH level input current

IIL_PU

LOW level input current

VOH

HIGH level output voltage

VOL

LOW level output voltage

VOH_LOWDRV HIGH level output voltage

VOL_LOWDRV LOW level output voltage

Conditions

Min Typ Max Unit

VI=VDDIO = 3.0 V, T = 25

0.5

VI=VSSIO = 0 V, VDDIO = 3.0 V, T = 25

0.5

VI=VDDIO = 1.8 V

110

VI=VSS = 0 V, VDDIO = 1.8 V -110

-35

IO = 3.5 mA, VDDDIO = 1.8 V 1.44

IO = 3.5 mA, VDDIO = 1.8 V

0.36

IO = 0.35 mA, VDDIO = 1.8 V 1.44

IO = 0.35 mA, VDDIO = 1.8 V

0.36

Datasheet
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Table 8: RCX – Timing characteristics

Parameter Description

Conditions

fRC/T_1 Frequency accuracy per ºC 0<T<60

fRC/T_2 Frequency accuracy per ºC -40<T<115

fRC/V_VBA Supply voltage dependency
T

fRC/V_VDD Supply voltage dependency

fRC

RC oscillator frequency

For VBAT For VDD At default trim setting

Target

Min Typ Max Unit

150

ppm/d eg

100

250

ppm/d eg

ppm/V

kHz

Table 9: XTAL32K – Recommended operating conditions

Parameter Description

Conditions

fXTAL_32K

Crystal frequency tolerance (including aging)

Timing accuracy is dominated by crystal accuracy. A much smaller value is preferred.

Min Typ Max Unit

-250

250 ppm

Table 10: XTAL32M – Recommended operating conditions

Parameter Description

Conditions

fXTAL_32M fXTAL_32M

Crystal oscillator frequency Crystal frequency tolerance

After optional trimming; including aging and temperature drift

Min Typ Max Unit

MHz

-20

20 ppm

Table 11: RADIO 1M LP – AC characteristics

Parameter Description

Conditions

Min

PSENS_CLEAN Sensitivity level

Dirty Transmitter disabled; DCDC converter disabled; PER = 30.8%; VDCDC_RF = 1.1 V
Note 1

PSENS_EPKT Sensitivity level

PSENS

Sensitivity level

Extended packet size (255 octets)
Normal Operating Conditions; DCDC converter disabled; PER = 30.8% Note 1

Typ -96 -93.5 -95

Max

Unit dBm dBm dBm

Datasheet
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Parameter Description

Conditions

Min Typ Max Unit

Output power level

PA_POWER_SETTING = 15

4.5

dBm

Note 1 Measured according to Bluetooth® Low Energy Test Specification RF-PHY.TS/4.0.1, section 6.4.1.

Table 12: RADIO 1M HP – AC characteristics

Parameter Description

Conditions

Min Typ Max Unit

PSENS_CLEAN Sensitivity level PSENS_EPKT Sensitivity level

Dirty Transmitter disabled; DCDC converter disabled; PER = 30.8%; VDCDC_RF = 1.4 V Note 1
Extended packet size (255 octets)

-97 -94.5

dBm dBm

PSENS

Sensitivity level

Normal Operating

Conditions; DCDC converter

disabled; PER = 30.8%

-96

dBm

Note 1

Output power level

PA_POWER_SETTING = 15

5.5

dBm

Note 1 Measured according to Bluetooth® Low Energy Test Specification RF-PHY.TS/4.0.1, section 6.4.1.

Table 13: RADIO 2M LP – AC characteristics

Parameter Description

Conditions

Min Typ Max Unit

PSENS_CLEAN Sensitivity level

Dirty Transmitter disabled;

DCDC converter disabled;

PER = 30.8%; VDCDC_RF = 1.1

-93

Note 1

dBm

PSENS_EPKT Sensitivity level

Extended packet size (255 octets)

-91

dBm

PSENS

Sensitivity level

Normal Operating

Conditions; DC-DC converter

disabled; PER = 30.8 %

-93

Note 1

dBm

Output power level

PA_POWER_SETTING = 15

4.5

dBm

Note 1 Measured according to Bluetooth® Low Energy Test Specification RF-PHY.TS/4.0.1, section 6.4.1.

Table 14: RADIO 2M HP – AC characteristics

Parameter Description

Conditions

PSENS_CLEAN Sensitivity level

Dirty Transmitter disabled; DCDC converter disabled;

Min Typ Max Unit

-94

dBm

Datasheet
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Parameter Description

Conditions

Min Typ Max Unit

PER = 30.8%; VDCDC_RF = 1.4 V
Note 1

PSENS_EPKT Sensitivity level

Extended packet size (255 octets)

-91.5

dBm

PSENS

Sensitivity level

Normal Operating Conditions; DCDC converter disabled; PER = 30.8%
Note 1

-93.5

dBm

Output power level

PA_POWER_SETTING = 15

5.5

dBm

Note 1 Measured according to Bluetooth® Low Energy Test Specification RF-PHY.TS/4.0.1, section 6.4.1.

Datasheet
CFR0011-120-00

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DA14592MOD
SmartBond Bluetooth® LE 5.2 Module
7 Mechanical Specifications
7.1 Mechanical dimensions and land pattern
The module’s dimensions are accessible from the Renesas website 45-Module.
7.2 Marking
The module’s shield marking is shown in Figure 6.

Target

Figure 6. Module shield marking Marking Legend: DA14592MOD-xxxxxxx yyww xxxxxxx: module variant yy: production year ww: production week
All dimension in mm. Tolerance: 0.4 mm

Datasheet
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8 BOM

Table 15: Bill of materials

# Designat Type or

Value

Description

1 U1
2 C2 3 C3, C4,
C6 4 C5 5 C7, C8 6 Z1, Z3 7 Z2
8 R3, Z4 9 L1 10 Y1

IC
Capacitor Capacitor

DA14592010006F2
4.7 µF 10 µF

Capacitor Capacitor Capacitor Inductor

1.0 µF 100 nF 0.7 pF 2.8 nH

Capacitor Inductor Crystal

10 pF 2.2 µH 32.0000 MHz

Renesas DA14592 BLE 5.2 SoC with embedded Flash
CAP CERAMIC 4.7 µF ±20% 6.3 V X5R 0402 CAP CER. 10 µF ±20% 6.3 V X5R 0402
CAP CER G.P. 1 µF 10V ±20% X6S 0201 CAP CERAMIC 0.1 µF ±10% 6.3 V X5R, 0201 CAP CERAMIC 0.7 pF ±0.05 pF 50 V C0G/NP0 0201 INDUCTOR 2.8 nH Unshielded ±0.1 nH 450 mA 250 m Max 0201 CAP CER 10PF ±5% 50 V C0G/NP0 0201 INDUCTOR POWER 2.2 µH ± 20% 1.7 A 140 m 0806 CRYSTAL 32 MHz 2.0X1.6X0.65 MM XRCGB32M000F1S1AR0

11 U2

IC (Note 1)

P25Q32SL-UXH- FLASH 32MBIT QSPI 104 MHz 8USON 3x2x0.55 mm IR

IC (Note APS1604M-SQR- PSRAM 16MBIT QSPI 84 MHz 8USON 3x2x0.45 mm

Note 1 Available only in DA14592MOD-01F3200. Note 2 Available only in DA14592MOD-01S1600.

Manufacturer

MPN

Renesas Electronics
Murata
Murata

DA14592-010006F2
GRM155R60J475ME47D GRM155R60J106ME05D

Murata

GRM033C81A105ME05D

Murata

GRM033R60J104KE19D

Murata

GJM0335C1HR70WB01D

Murata Electronics LQP03TG2N8B02D

Murata
Taiyo Yuden
Murata
Puya Semiconductor
AP Memory Technology

GRM0335C1H100JA01D LSANB2016KKT2R2M XRCGB32M000F1SBAR0 P25Q32SL-UXH-IR
APS1604M-SQR-ZR

Datasheet
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9 Design Guidelines
The DA14592MOD comes with an integrated PCB trace antenna. The antenna area is 14.5 x 3.95 mm. The antenna’s Voltage Standing Wave Ratio (VSWR) and efficiency depend on the installation location.
The radiation performance of the PCB trace antenna depends on the host PCB layout. The maximum antenna gain is -0.4 dBi when installed on a 43×35 mm reference board, as shown in Figure 9. Antenna Radiation Efficiency is better than -3.6 dB for all mounting positions. The RF front end is optimized to achieve the maximum possible efficiency for various installation positions of the module on a host PCB. To obtain similar performance, follow the guidelines described in the following sections.

9.1 Installation location
For optimum performance, install the module at the edge of a host PCB with the antenna edge facing out. The module can be located on either of the outer corners or in the middle of the host PCB with equivalent performance.
The antenna should have 4.0 mm free space in all directions. Copper or laminate in the proximity of the PCB trace antenna will affect the efficiency of the antenna. Laminate or copper under the antenna should be avoided as it severely affects the performance of the antenna. The antenna keepout area is shown in Figure 8.
Metals close to the antenna will degrade the antenna’s performance. The amount of degradation depends on the host system’s characteristics.
Table 16 summarizes the antenna efficiency at different installation locations on a host PCB as shown in Figure 7.

Table 16: Antenna efficiency vs DA14592MOD module positions

Position # 1 (Left)

Position # 2 (Middle)

Position # 3 (Right)

Freq [MHz] 2405 2440 2480

Antenna efficiency

[%] [dB]

Antenna efficiency

[%] [dB]

Antenna efficiency

[%] [dB]

-3.5

-3.2

-3.3

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(Note 1)

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Optimum Performance
Position #1 (Left Corner)

Optimum Performance
Position #2 (Center)
Copper

Optimum Performance
Position #3 (Right Corner)

Note 1: Clearance between pad and PCB edge is considered 100um. Bottom 100um of antenna area will overlap with laminate (no copper). All measurements presented in this document depict the specific placement.

Figure 7. Installation locations for optimum antenna performance

4.1 mm

Laminate

4.0 mm

Laminate

Good Performance
Copper

Poor Performance
Copper

Figure 8. Antenna performance in proximity of copper (left), laminate (middle), and laminate under antenna (right)
The actual DA14592MOD module evaluation board layout that has been used to conduct measurements is shown in Figure 9.

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Figure 9. DA14592MOD module evaluation board

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9.2 Antenna graphs
The antenna Voltage Standing Wave Ratio measurements for the three installation positions are shown in Figure 10, Figure 11, and Figure 12.

TBD Figure 10. VSWR installed in the upper-left corner (position #1) of evaluation board

TBD Figure 11. VSWR with module installed in center (position #2) of the evaluation board

Figure 12. VSWR with module installed in the upper-right corner (position #3) of the evaluation board

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9.3 Radiation pattern
The antenna radiation pattern measurements are carried out in an anechoic chamber. Radiation patterns are presented for three measurement planes: XY, XZ, and YZ- planes with horizontal and vertical polarization of the receiving antenna.

Figure 13. Measurement plane definition
Measurements are carried out for the module installed in the upper-right corner on the reference board with no laminate below the antenna trace.

XY plane

XZ plane
Figure 14. Board orientation at different planes

YZ plane

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Horizontal polarization

Vertical polarization

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Figure 15. Radiation pattern for trace antenna
Table 17 summarizes the antenna peak gain for the module mounted on the right corner position of the evaluation board.

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Table 17: Antenna peak gain for 2.4 ghz frequency band

Frequency band
2.4 GHz

XY-Plane Peak gain [dBi] -1.1

YZ-Plane Peak gain [dBi] -0.4

Target
XZ-Plane Peak gain [dBi] -0.4

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10 Soldering
The successful reflow soldering of the DA14592 Module on a PCB depends on several parameters such as the thickness of the stencil, the pads solder paste aperture, the solder paste characteristics, the reflow soldering profile, the size of the PCB, and so on.
The volume of solder paste applied to the board is mainly determined by the aperture size and stencil thickness. An initial solder paste aperture for the pads is provided on the solder paste layer of the PCB footprint. This aperture is modified by the assembly process experts according to stencil thickness, solder paste, and available assembly equipment.
The solder profile depends on the solder paste type used. For example, the soldering profile of a lead-free solder paste, Sn3Ag0.5Cu with no clean Flux (ROL0) and Solder Powder Type 4, is presented in Figure 16.
No clean flux is recommended because washing must not be applied after assembly to avoid that moisture is trapped under the shield.

Figure 16. Recommended reflow profile for lead free solder

Table 18: Reflow profile specification
Statistic name Slope1 (Target = 2.0) Between 30.0 and 70.0 Slope2 (Target = 2.0) Between 70.0 and 150.0 Slope3 (Target = 2.8) Between 220.0 and 150.0 Preheat time 110190 C Time above reflow at 220 C Peak temperature Total time above at 235 C

Low limit 1 1 5 60 30
235 10

High limit 3 3
0.5 120 90 255 55

Units Degrees/Second Degrees/Second Degrees/Second Seconds Seconds Degrees Celsius Second

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Solderability reflow check of five cycles was performed, applying the procedures mentioned in JESDA113E standard.
The MSL is an indicator for the maximum allowable time period (floor lifetime) in which a moisturesensitive plastic device, once removed from the dry bag, can be exposed to an environment with a maximum temperature of 30 °C and a maximum relative humidity of 60% RH before the solder reflow process.
DA14592 SmartBondTM Module is qualified for TBD.
Table 19: MSL level vs floor lifetime

MSL level MSL 4 MSL 3 MSL 2A MSL 2 MSL 1

Floor lifetime 72 hours 168 hours 4 weeks 1 year
Unlimited at 30 °C/85% RH

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11 Packaging Information
11.1 Tape and reel

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Figure 17. Tape and reel

The reel specifications are presented in Table 20.

Table 20: Reel specifications
Parameter Diameter Reel tape width Tape material Qty/Reel Leader Trailer Round Sprocket Hole Diameter Round Sprocket Hole Pitch

Value 13 inches 22 inches Static Dissipative Black Conductive Polystyrene Alloy
400 mm + 10% 160 mm + 10% 1.50 ± 0.10 mm 4.00 ± 0.10 mm

11.2 Labeling
On each reel, a set of labels are placed. The information label shows information regarding the batch number, date code, reel date and number, quantity, and part number as in Figure 18.

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DA14592MOD-0100000

Figure 18. Reel part information label
The directives label shows information regarding directives conformity as in Figure 19, Figure 20, and Figure 21.

42 mm 42 mm

Manufacturer: Renesas Design Netherlands B.V. Het Zuiderkruis 53, 5215 MV s-Hertogenbosch THE NETHERLANDS Product name : DA14592MOD Model No. : DA14595MOD-0100000

Imported by: Renesas Electronics Operations Services Limited Dukes Meadow, Millboard Road, Bourne End, SL8 5FH, United Kingdom Manufacturer: Renesas Design Netherlands B.V. Het Zuiderkruis 53, 5215 MV s-Hertogenbosch THE NETHERLANDS Product name: DA14592MOD Model No. : DA14592MOD-0100000

67mm

Figure 19. EU-UK directives conformity labels

Figure 20. ICASA conformity label

Datasheet
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Figure 21. CMIIT ID label

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12 Ordering Information
The ordering number consists of the part number followed by a suffix indicating the packing method. For details and availability, consult your Renesas Electronics Corporation local sales representative.

Table 21: Ordering information (samples)

Part number

Size (mm)

DA14592MOD-0100000C

18 x 14.5 x 2.5

DA14592MOD-01F3200C

18 x 14.5 x 2.5

DA14592MOD-01S1600C

18 x 14.5 x 2.5

Shipment form Reel Reel Reel

Pack quantity

MOQ

TBD

Contact sales for availability

Table 22: Ordering information (production)

Part number

Size (mm)

DA14592MOD-01000002

18 x 14.5 x 2.5

DA14592MOD-01F32002

18 x 14.5 x 2.5

DA14592MOD-01S16002

18 x 14.5 x 2.5

Shipment form Reel Reel Reel

Pack quantity

MOQ

TBD

Contact sales for availability

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13 Regulatory Information
This section outlines the regulatory information for the DA14592 SmartBondTM Module. The module is certified for the global market. This facilitates the market entry of the end product. The end product would need to apply for the end product certification, however, the module certification listed below will facilitate that procedure.
When the user sends the end product to those markets, the end product may need to follow additional requirements according to the specific market regulation.
For example, some markets have additional testing and/or certification like Korea EMC, South Africa SABS EMC and some have the requirement to put on the end product label a modular approval ID or mark that consists of an approved Bluetooth® Low Energy modular ID on host label directly, like Japan, Taiwan, Brazil.
A list of the Conformance Standards that the DA14592 SmartBondTM Module meets is shown in Table 23.

Table 23: Standards conformance

Area Global

Item Safety for module

Service CB

Standard
IEC 62368-1:2018 EN IEC 62368-1:2020+A11:2020, BS EN IEC 623681:2020+A11:2020

Certificate ID
CERTIFICATION PENDING Note 1

Europe
UK
US/CA Japan Taiwan

Wireless Safety for module
EMC

RED CE RED

Wireless

UKCA-RED

Safety for module UKCA-LVD

EMC Wireless

UKCA-RED FCC ID IC ID

Wireless Wireless

MIC NCC

EN 300 328 v2.2.2 EN 62479:2010
EN IEC 62368-1: 2020+A11: 2020 EN 301 489-1 v2.2.3
Draft EN 301 489-17 v3.2.5 EN 300 328 v2.2.2 EN 62479:2010
BS EN IEC 62368-1: 2020+A11: 2020
EN 301 489-1 V2.2.3 Draft EN 301 489-17 V3.2.5 47 CFR PART 15 Subpart C: 2021
section 15.247 RSS-247 Issue 2: February 2017 RSS-Gen Issue 5: April 2018 +A1: March 2019+A2: February 2021
JRL
LP0002

CERTIFICATION PENDING
CERTIFICATION PENDING
CERTIFICATION PENDING
CERTIFICATION PENDING
CERTIFICATION PENDING
CCAH24Y10540T7

South Korea

Wireless

South Africa Brazil

Wireless Wireless

MSIP
ICASA Anatel

KS X 3123 ”
” KN 301 489
Based on RED
ATO No.14448/2017 Resolution No.680

CERTIFICATION PENDING
CERTIFICATION PENDING
CERTIFICATION PENDING

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Area

Item

Service

Standard

Certificate ID

China

Wireless

SRRC 2002353

CERTIFICATION PENDING

Thailand

Wireless

NBTC

NBTC TS 1035-2562

CERTIFICATION PENDING

India

Wireless

WPC

Based on RED

CERTIFICATION PENDING

Note 1 Include national differences of the US/Canada/Japan/China/Korea/Europe/Australia/South Africa/Taiwan/Brazil/Thailand.

13.1 CE (Radio Equipment Directive 2014/53/EU (RED)) (Europe)
Model no. DA14592MOD-0100000 Model no. DA14592MOD-01F3200 Model no. DA14592MOD-01S1600

The DA14592 SmartBondTM Module is a Radio Equipment Directive (RED) assessed radio that is CE marked. The module has been manufactured and tested with the intention of being a subassembly to a final product. The module has been tested to RED 2014/53/EU Essential Requirements for Health, Safety, and Radio. The applicable standards are:
Radio: EN 300 328 V2.2.2 (2019-07) Health: (SAR) EN 62479:2010 Safety: EN IEC 62368-1: 2020+A11: 2020 EMC: EN 301 489-1 v2.2.3, Draft EN 301 489-17 v3.2.5
End product will need to perform the radio EMC tests according to EN 301 489. The conducted tests can be inherited from the module test report. It is recommended to repeat the EN 300 328 radiated testing with the end product assembly.
Simplified Declaration of Conformity Hereby, Renesas Design Netherlands B.V. declares that radio type equipment DA14592MOD-0100000 is in compliance with Directive 2014/53/EU. The full text of the EU declaration of conformity is available at the following internet address: www.renesas.com
13.2 FCC (U.S.A.)
Model no. DA14592MOD-0100000
Model no. DA14592MOD-01F3200
Model no. DA14592MOD-01S1600

FCC ID: Y82-DA14592MOD
13.2.1 List of applicable FCC rules
The module complies with FCC Part 15.247.
13.2.2 Summarize the specific operational use conditions
The module has been certified for Portable applications. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

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13.2.4 Trace antenna designs
Not applicable.

13.2.5 RF exposure considerations
This equipment complies with FCC’s RF radiation exposure limits set forth for an uncontrolled environment. The module integrator has to integrate the device within 10mm minimum distance to the human body, otherwise the module integrator has to do SAR testing and certification. The antenna(s) used for this transmitter must not be collocated or operating in conjunction with any other antenna or transmitter.

13.2.6 Antennas

Type PCB Antenna

Gain -0.4dBi

Impedance 50

The antenna is permanently attached, cannot be replaced.

Application Fixed

13.2.7 Label and compliance information.
This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions:
1. This device may not cause harmful interference. 2. This device must accept any interference received, including interference that may cause
undesired operation.
Note
The manufacturer is not responsible for any radio or TV interference caused by unauthorized modifications or changes to this equipment. Such modifications or changes could void the user’s authority to operate the equipment.

Warning
Changes or modifications to this unit not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.
Note
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help.

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The system integrator must place an exterior label on the outside of the final product housing the DA14592MOD-0100000 Module. Below are the contents that must be included on this label.
OEM Labeling Requirements:
Notice
The OEM must make sure that FCC labeling requirements are met. This includes a clearly visible exterior label on the outside of the final product housing that displays the contents shown below.

Model: DA14592MOD-0100000 Contains FCC ID: Y82-DA14592MOD
13.2.8 Information on test modes and additional testing requirements:
When testing host product, the host manufacture should follow FCC KDB Publication 996369 D04 Module Integration Guide for testing the host products. The host manufacturer may operate their product during the measurements. In setting up the configurations, if the pairing and call box options for testing do not work, then the host product manufacturer should coordinate with the module manufacturer for access to test mode software.
13.2.9 Additional testing, Part 15 Subpart B disclaimer:
The modular transmitter is only FCC authorized for the specific rule parts (FCC Part 15.247) list on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed when contains digital circuity.
13.3 IC (Canada)
Model no. DA14592MOD-0100000 Model no. DA14592MOD-01F3200 Model no. DA14592MOD-01S1600

IC ID: 9576A-DA14592MOD
The DA14592 SmartBondTM Module is certified for the IC as a single-modular transmitter. The module meets IC modular approval and labeling requirements. The IC follows the same testing and rules as the FCC regarding certified modules in authorized equipment.
The module has been tested according to the following standards:
Radio: RSS-247 Issue 3: August 2023, RSS-Gen Issue 5: April 2018 +A1: March 2019+A2:
February 2021
Health: RSS-102 Issue 5:2015
This device contains license exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canada’s license-exempt RSS(s). Operation is subject to the following two conditions:
(1) this device may not cause interference
(2) this device must accept any interference, including interference that may cause undesired operation of the device.
L’emitteur/récepteur exempt de licence contenu dans le présent appareil est conforme aux CNR d’Inovvation, Sciences et Développement economic Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes:

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(1) L’appareil ne doit pas produire de brouillage
(2) L’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement.
RF Exposure Statement
This device complies with IC radiation exposure limits set forth for an uncontrolled environment and meets RSS-102 of the IC radio frequency (RF) Exposure rules. The module integrator has to integrate the device within 10 mm minimum distance to the human body, otherwise the module integrator has to do SAR testing and certification. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
Le présent appareil est conforme à l’exposition aux radiations IC définies pour un environnement non contrôlé et répond aux RSS-102 de la fréquence radio (RF) IC règles d’exposition. L’intégrateur de module doit intégrer l’appareil à une distance minimale de 10 mm du corps humain, sinon l’intégrateur de module doit effectuer des tests et une certification SAR. L’émetteur ne doit pas être colocalisé ni fonctionner conjointement avec à autre antenne ou autre émetteur.
OEM Responsibilities to comply with IC Regulations
OEM integrator is responsible for testing their end product for any additional compliance requirements needed for the module installation like IC ES003 (EMC). This can be combined with the FCC Part 15B test.
End product labeling
The DA14592 SMARTBONDTM Module is labeled with its own IC ID: 9576A-DA14592MOD . If the IC ID is not visible when the module is installed inside another device, the host product must be labelled to display the ISED certification number for the module, preceded by the word “contains” or similar wording expressing the same meaning, as follows: “Contains IC: 9576A-DA14592MOD”

13.4 UKCA (UK)

Model no. DA14592MOD-0100000 Model no. DA14592MOD-01F3200 Model no. DA14592MOD-01S1600

UKCA ID: CERTIFICATION PENDING
The module has been tested and found to comply with the standards harmonized with the regulations listed below according to UKCA-Radio Equipment Regulations 2017-CHAPTER 1 6(1)(a) Health, 6(1)(b) & 6(2).
The applicable standards are:
Radio: EN 300 328 V2.2.2 (2019-07) Health: (SAR) EN 62479:2010 Safety: EN IEC 62368-1: 2020+A11: 2020 EMC: EN 301 489-1 v2.2.3, Draft EN 301 489-17 v3.2.5
End product will need to perform the radio EMC tests according to EN 301 489. The conducted tests can be inherited from the module test report. It is recommended to repeat the EN 300 328 radiated testing with the end-product assembly.
Simplified Declaration of Conformity Hereby, Renesas Design Netherlands B.V. declares that radio type equipment DA14592MOD-0100000 is in compliance with Radio Equipment Regulations 2017. The full text of the UK declaration of conformity is available at the following internet address: www.renesas.com

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13.5 NCC (Taiwan)
Model no. DA14592MOD-0100000 NCC ID:CCAH24Y10540T7

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The DA14592 SmartBondTM Module has received compliance approval in accordance with the Telecommunications Act. The module has been tested according to the following standard:
Radio: Low Power Radio Frequency Devices Technical Regulations (LP0002)
End product may need to follow additional requirements according to the regulation EMC.
End product labeling The NCC ID can be applied directly to the end product’s label.
NCC Warning
(OEM Integrator)(End Product)” NCC:
13.6 MSIP (South Korea)
Model no. DA14592MOD-0100000 MSIP ID: CERTIFICATION PENDING DA14592 SmartBondTM Module has received certification of conformity in accordance with Radio Waves Act. The module has been tested according to the following standard:
Radio: Ministry of Science and ICT Notice No. 2019-105
For the end product wireless test, you can refer to Renesas’ own certification report so that the lab knows the module itself has passed although it still needs to be tested. Additionally, EMC for wireless (KN301489). End product labeling The MSIP ID can be applied directly to the end product’s label. The ID should be clearly visible on the final end product. The integrator of the module should refer to the labeling requirements for Korea available on the Korea Communications Commission (KCC) website.
13.7 ICASA (South Africa)
South Africa certification is based on RED(CE) approval. Model no. DA14592MOD-0100000 Equipment Type Approval Number: CERTIFICATION PENDING

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Approval is granted to print labels for the products as described below: 1. For use as Label on the product size: 80 mm (W) X 40 mm (H). To be printed on the
product. 2. For use as Label on the package size: 80 mm (W) X 40 mm (H). To be printed on the
package. End product may need to follow additional requirements according to the regulation EMC.
13.8 ANATEL (Brazil)
Model no. DA14592MOD-0100000 Model no. DA14592MOD-01F3200 Model no. DA14592MOD-01S1600
ANATEL ID: 05494-24-16689

Certification Pending

The module has been tested and found to be compliant according to the following standards:
ATO (Act) No 14448/2017
End product may need to follow additional requirements according to the regulation EMC.
“Este equipamento não tem direito à proteção contra interferência prejudicial e não pode causar interferência em sistemas devidamente autorizados. Para mais informações consulte o site da ANATEL www.anatel.gov.br”
Translation of the text:
“This equipment is not entitled to protection against harmful interference and must not cause interference in duly authorized systems. For more information, consult the ANATEL website www.anatel.gov.br”

13.9 SRRC (China)
Model no. DA14592MOD-0100000 CMIIT ID: CERTIFICATION PENDING Datasheet
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The module has been tested and found to be compliant according to the following standards:
2002353
End product may need to follow additional requirements according to the regulation EMC.

13.10 MIC (Japan)
Model no. DA14592MOD-0100000 Model no. DA14592MOD-01F3200 Model no. DA14592MOD-01S1600

MIC ID: R 202-JCE029

The DA14592 SmartBondTM Module has received type certification as required to conform to the technical standards regulated by the Ministry of Internal Affairs and Communications (MIC) of Japan pursuant to the Radio Act of Japan. The module has been tested according to the following standard:
Radio: JRL “Article 49-20 and the relevant articles of the Ordinance Regulating Radio” Equipment
End product may need to follow additional requirements according to the regulation EMC. End product labeling The MIC ID can be applied directly to the end product’s label. The end product may bear the GITEKI mark and certification number so that is clear that the end product contains a certified radio module. The following note may be shown next to, below, or above the GITEKI mark and certification number in order to indicate the presence of a certified radio module:
Translation of the text: “This equipment contains specified radio equipment that has been certified to the Technical Regulation Conformity Certification under the Radio Law.”
13.11 NBTC (Thailand)
Model no. DA14592MOD-0100000 NBTC SDoC ID: CERTIFICATION PENDING “This telecommunication equipment conforms to the technical standards or requirements of NBTC.” End product may need to follow additional requirements according to the regulation EMC. End product labeling End products will have their own ID and labeling requirements.

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(Translation of content: This radiocommunication equipment is exempted to possess license, user license, or radiocommunication station license as per NBTC notification regarding radiocommunication equipment and radiocommunication station has been exempted for license according to radio communication act B.E.2498)
13.12 WPC (India)
Model no. DA14592MOD-0100000
Registration No: CERTIFICATION PENDING
India certification is based on RED(CE) approval/reports. There are no marking/labeling requirements. End product may need to follow additional requirements according to the regulation EMC.

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14 Bluetooth SIG Qualification
The DA14592 SmartBondTM Module is listed on the Bluetooth® SIG Website as a qualified product. The customers can refer to the following QDIDs to qualify their product:
QDID 221791 for Host Subsystem QDID 221790 for Controller Subsystem

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Revision History

Revision 1.3 1.2 1.1

Date Apr 24, 2024 Apr 18, 2024 Apr 24, 2024

Description Datasheet Status: Target, Product status: Development Datasheet Status: Target, Product status: Development Datasheet status: Target. Product status: Development

Target

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Status Definitions

Revision 1.<n>

Datasheet Status Target

2.<n>

Preliminary

3.<n>

Final

4.<n>

Obsolete

Product Status Development Qualification Production
Archived

Definition
This datasheet contains the design specifications for product development. Specifications may be changed in any manner without notice.
This datasheet contains the specifications and preliminary characterization data for products in pre-production. Specifications may be changed at any time without notice in order to improve the design.
This datasheet contains the final specifications for products in volume production. The specifications may be changed at any time in order to improve the design, manufacturing and supply. Major specification changes are communicated via Customer Product Notifications. Datasheet changes are communicated via www.renesas.com.
This datasheet contains the specifications for discontinued products. The information is provided for reference only.

RoHS Compliance
Renesas Electronics’ suppliers certify that its products are in compliance with the requirements of Directive 2011/65/EU of the European Parliament on the restriction of the use of certain hazardous substances in electrical and electronic equipment. RoHS certificates from our suppliers are available on request.

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IMPORTANT NOTICE AND DISCLAIMER
RENESAS ELECTRONICS CORPORATION AND ITS SUBSIDIARIES (“RENESAS”) PROVIDES TECHNICAL SPECIFICATIONS AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS OR IMPLIED, INCLUDING, WITHOUT LIMITATION, ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT OF THIRD-PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for developers who are designing with Renesas products. You are solely responsible for (1) selecting the appropriate products for your application, (2) designing, validating, and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. Renesas grants you permission to use these resources only to develop an application that uses Renesas products. Other reproduction or use of these resources is strictly prohibited. No license is granted to any other Renesas intellectual property or to any third-party intellectual property. Renesas disclaims responsibility for, and you will fully indemnify Renesas and its representatives against, any claims, damages, costs, losses, or liabilities arising from your use of these resources. Renesas’ products are provided only subject to Renesas’ Terms and Conditions of Sale or other applicable terms agreed to in writing. No use of any Renesas resources expands or otherwise alters any applicable warranties or warranty disclaimers for these products.

(Disclaimer Rev.1.1 Jan 2024)

Corporate Headquarters

Contact Information

TOYOSU FORESIA, 3-2-24 Toyosu Koto-ku, Tokyo 135-0061, Japan www.renesas.com
Trademarks

For further information on a product, technology, the most up-to-date version of a document, or your nearest sales office, please visit www.renesas.com/contact-us/

Renesas and the Renesas logo are trademarks of Renesas Electronics Corporation. All trademarks and registered trademarks are the property of their respective owners.

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Documents / Resources

RENESAS DA14592MOD SmartBond Bluetooth LE 5.2 Module [pdf] Instruction Manual
Y82-DA14592MOD, Y82DA14592MOD, da14592mod, DA14592MOD SmartBond Bluetooth LE 5.2 Module, DA14592MOD, SmartBond Bluetooth LE 5.2 Module, Bluetooth LE 5.2 Module, Module

References

User Manual

RENESAS DA14592MOD SmartBond Bluetooth LE 5.2 Module Instruction Manual

DA14592MOD SmartBond Bluetooth LE 5.2 Module

Specifications:

Product Usage Instructions:

1. Powering Up the DA14592MOD:

2. Connecting Peripherals:

3. Programming and Development:

4. Communication:

5. Power Management:

Frequently Asked Questions (FAQ):

Q: What is the operating voltage range of the DA14592MOD?

Q: What is the maximum system clock frequency supported?

Q: How many UARTs are available on the DA14592MOD?

Documents / Resources

References

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