Samsung Electro-Mechanics Automotive MLCC Specification
Supplier: Samsung Electro-Mechanics
Product: Multi-Layer Ceramic Capacitor (MLCC)
Samsung P/N: CL05B102KB5VPNC
Description: CAP, 1nF, 50V, ±10%, X7R, 0402, AEC-Q200 Qualified
Product Overview
This document provides the specification reference sheet for the Samsung Electro-Mechanics Automotive Multi-Layer Ceramic Capacitor (MLCC) with the part number CL05B102KB5VPNC. This capacitor is designed for automotive applications and is AEC-Q200 qualified.
Key Specifications:
- Capacitance: 1nF (based on part number code '102' = 10 x 10^2 pF)
- Rated Voltage: 50V
- Capacitance Tolerance: ±10%
- Dielectric: X7R
- Size: 0402 (inch code)
- Qualification: AEC-Q200
Dimensions
The physical dimensions of the 0402 size MLCC are as follows:
| Dimension | Size (inch code) | L (mm) | W (mm) | T (mm) | BW (mm) |
|---|---|---|---|---|---|
| 0402 | 1.00 ±0.05 | 0.50 ±0.05 | 0.50 ±0.05 | 0.25 ±0.10 |
Note: L = Length, W = Width, T = Thickness, BW = Break Wall
Samsung Part Number Breakdown
The Samsung part number CL05B102KB5VPNC is structured as follows:
| Field | Description | Value |
|---|---|---|
| Series | MLCC Series | CL |
| Size | Case Size Code | 05 (Corresponds to 0402 inch code) |
| Dielectric | Dielectric Material | B (X7R) |
| Capacitance | Nominal Capacitance Code | 102 (10 x 10^2 pF = 1000 pF = 1 nF) |
| Capacitance Tolerance | Tolerance Code | K (±10%) |
| Rated Voltage | Voltage Code | B (50V) |
| Thickness | Thickness Code | 5 (0.50 mm) |
| Special Code | Special Feature/Application | V (Automotive) |
| Packaging | Packaging Type | PNC (Normal Cardboard Type, 7" Reel) |
Reliability Test and Judgement Condition
The following table summarizes the reliability tests performed on the MLCC and their corresponding conditions and performance criteria:
| Test Item | Test Condition | Performance |
|---|---|---|
| High Temperature Exposure | Unpowered, 1000 hours @ Max. Temperature | Appearance: No abnormal exterior. Capacitance Change: Within ±10%. Tan δ: 3.0% max. IR: > 10000 MΩ or 500 MΩ (whichever is smaller). |
| Temperature Cycling | 1000 Cycles (-55°C to +125°C, 30 min each, 1 min transition) | Appearance: No abnormal exterior. Capacitance Change: Within ±10%. Tan δ: 3.0% max. IR: > 10000 MΩ or 500 MΩ (whichever is smaller). |
| Destructive Physical Analysis (DPA) | Per EIA 469 | No Defects or abnormalities. |
| Humidity Bias | 1000 hours, 85°C / 85% RH, Rated Voltage + 1.3~1.5V (Add 100Ω resistor) | Appearance: No abnormal exterior. Capacitance Change: Within ±12.5%. Tan δ: 3.5% max. IR: > 500 MΩ or 25 MΩ (whichever is smaller). |
| High Temperature Operating Life (HTOL) | 1000 hours @ 125°C, 200% Rated Voltage (Charge/discharge current < 50mA) | Appearance: No abnormal exterior. Capacitance Change: Within ±12.5%. Tan δ: 3.5% max. IR: > 1000 MΩ or 50 MΩ (whichever is smaller). |
| Mechanical Shock | Three shocks in each direction (18 shocks total) @ 1500G, 0.5 ms, Half sine wave | Appearance: No abnormal exterior. Capacitance Change: Within ±10%. Tan δ: 2.5% max. IR: > 10000 MΩ or 500 MΩ (whichever is smaller). |
| Vibration | 5g's for 20 min, 12 cycles each of 3 orientations (10-2000 Hz) | Appearance: No abnormal exterior. Capacitance Change: Within ±10%. Tan δ: 2.5% max. IR: > 10000 MΩ or 500 MΩ (whichever is smaller). |
| Resistance to Solder Heat | Preheating: 150°C for 60-120 sec. Solder pot: 260°C ±5°C, 10 sec ±1 sec. | Appearance: No abnormal exterior. Capacitance Change: Within ±10%. Tan δ: 2.5% max. IR: > 10000 MΩ or 500 MΩ (whichever is smaller). |
| ESD (Electrostatic Discharge) | AEC-Q200-002 or ISO/DIS10605 | Appearance: No abnormal exterior. Capacitance Change: Within ±10%. Tan δ: 2.5% max. IR: > 10000 MΩ or 500 MΩ (whichever is smaller). |
| Solderability | 95% of terminations soldered evenly and continuously. | Appearance: No abnormal exterior. Capacitance Change: Within ±10%. Tan δ: 2.5% max. IR: > 10000 MΩ or 500 MΩ (whichever is smaller). |
| Electrical Characterization | Measured after heat treatment (150°C, 1hr) and 24hr stabilization. Capacitance, Tan δ @ 25°C. IR @ 25°C and 125°C. | Capacitance: Within specified tolerance. Tan δ: 2.5% max. IR(25°C): > 10000 MΩ or 500 MΩ. IR(125°C): > 1000 MΩ or 10 MΩ. |
| Board Flex | Bending to the limit, 3 mm for 60 sec. | Appearance: No abnormal exterior. Capacitance Change: Within ±10%. |
| Terminal Strength (SMD) | 2N for 60 sec. (Destruction value > 8N) | Appearance: No abnormal exterior. Capacitance Change: Within ±10%. |
| Beam Load | Applied load to terminals. | Appearance: No abnormal exterior. Capacitance Change: Within ±10%. |
| Temperature Characteristic | -55°C to 125°C. | Capacitance Change: Within ±15% (for X7R). |
| Dielectric Strength | 250% of rated voltage for 1-5 sec. | Appearance: No abnormal exterior. Capacitance Change: Within ±10%. |
Note on Measurements: Initial measurements are performed after heat treatment and stabilization. Final measurements are taken after the test conclusion and stabilization period (24±2 hours at room temperature). Specific conditions for heat treatment and measurement are detailed in the document.
Recommended Soldering Method
Recommended method is Reflow soldering with a peak temperature of 260°C +0/-5°C for a maximum of 30 seconds, adhering to IPC/JEDEC J-STD-020 D Standard.
Recommended TEST PCB Dimensions
The following tables provide recommended PCB land dimensions for various MLCC sizes to ensure proper adhesion and performance. Materials are typically glass epoxy substrate with copper foil and solder resist.
A. Land Dimensions for Adhesive Strength of Termination
| Size Code | Size (mm) | a (mm) | b (mm) | c (mm) |
|---|---|---|---|---|
| 02 | 0.4 x 0.2 | 0.17 | 0.20 | 0.26 |
| 03 | 0.6 x 0.3 | 0.30 | 0.30 | 0.30 |
| 05 | 1.0 x 0.5 | 0.55 | 0.40 | 0.50 |
| 10 | 1.6 x 0.8 | 1.00 | 1.00 | 1.20 |
| 21 | 2.0 x 1.25 | 1.40 | 1.20 | 1.65 |
| 31 | 3.2 x 1.6 | 1.40 | 2.20 | 2.00 |
| 32 | 3.2 x 2.5 | 1.40 | 2.20 | 2.90 |
| 43 | 4.5 x 3.2 | 1.75 | 3.50 | 3.70 |
| 55 | 5.7 x 5.0 | 1.75 | 4.50 | 5.60 |
B. Substrate for Bending Strength Test
| Size Code | Size (mm) |
|---|---|
| 02 | 0.4 x 0.2 |
| 03 | 0.6 x 0.3 |
| 05 | 1.0 x 0.5 |
| 10 | 1.6 x 0.8 |
| 21 | 2.0 x 1.25 |
| 31 | 3.2 x 1.6 |
| 32 | 3.2 x 2.5 |
| 43 | 4.5 x 3.2 |
| 55 | 5.7 x 5.0 |
C. Substrate for Reliability Test
| Size Code | a (mm) | b (mm) | c (mm) | d (mm) | e (mm) |
|---|---|---|---|---|---|
| 02 | 0.2 | 0.6 | 0.2 | 5.0 | 5.5 |
| 03 | 0.3 | 0.9 | 0.3 | 5.0 | 5.5 |
| 05 | 0.4 | 1.5 | 0.5 | 5.0 | 5.5 |
| 10 | 1.0 | 3.0 | 1.2 | 5.0 | 5.5 |
| 21 | 1.2 | 4.0 | 1.65 | 5.0 | 5.5 |
| 31 | 2.2 | 5.0 | 2.0 | 5.0 | 5.5 |
| 32 | 2.2 | 5.0 | 2.9 | 5.0 | 5.5 |
| 43 | 3.5 | 7.0 | 3.7 | 5.0 | 5.5 |
| 55 | 4.5 | 8.0 | 5.6 | 5.0 | 5.5 |
Material: Glass epoxy substrate. Thickness: T=1.6 mm (T=0.8 mm for 03/05 sizes).
⚠️ Caution: Abnormality can occur if lead-based solder (KSD 6704) with 3% silver is used.
Packaging Information
This specification applies to taping of MLCC. Specifications may be changed under agreement if customers require.
1. Taping and Reel Packaging
MLCCs are supplied in tape reels for automated assembly. Standard reel sizes include 7-inch, 10-inch, and 13-inch.
- Taping Type: Paper or Embossed tape.
- Reel Quantity: Varies by chip size, thickness, and reel diameter. Examples:
- 0402 (0.2mm thick): 20k pcs on 7" reel (2mm pitch).
- 1005 (0.5mm thick): 10k pcs on 7" reel (2mm pitch).
- 1206 (1.6mm thick): 2k pcs on 7" reel (4mm pitch).
- 1210 (2.0mm thick): 1k pcs on 7" reel (4mm pitch).
- Tape Size: Detailed dimensions (A, B, W, F, E, P1, P2, P0, D, t) are specified for Cardboard (Paper) Tape (4mm and 2mm pitch) and Embossed (Plastic) Tape, varying by MLCC size.
- Reel Size: Standard dimensions (A, B MIN, C, D, E, W, t) are provided for 7", 10", and 13" reels, with tape widths of 4mm, 8mm, and 12mm.
- Cover Tape Peel-off Force: Specified between 10 gf and 70 gf. Packaging design follows IEC 60286-3 standard.
2. BOX Package
- Packaging Label: Includes Chip size, Temperature Characteristics, Nominal Capacitance, Model Name, LOT Number, Reel Number, and Quantity.
- Box Packaging: Double packaging (inner and outer boxes) to prevent damage during transportation.
- 7" Box Packaging: Available for 7" x 5 REEL, 7" x 10 REEL, 7" x 20 REEL, and 7" x 60 REEL configurations.
- 13" Box Packaging: Available for 13" x 4 REEL and 13" x 20 REEL configurations.
Chip Weight
Approximate chip weights (mg/pc) are provided for various MLCC sizes and thicknesses, categorized by dielectric type (e.g., X7R, C0G).
| Size(L/W) Inch(mm) | Size(T) (mm) | Thickness Code | Temp. | Weight (mg/pc) |
|---|---|---|---|---|
| 0402 (1005) | 0.50 | 5 | X7* | 1.606 |
| 0402 (1005) | 0.60 | 6 | X7* | 3.288 |
| 0402 (1005) | 0.50 | 5 | C0G | 1.181 |
| 0603 (1608) | 0.80 | 8 | X7* | 6.492 |
| 0603 (1608) | 0.80 | 8 | C0G | 4.600 |
| 0805 (2012) | 0.60 | 6 | X7* | 8.670 |
| 0805 (2012) | 0.85 | C | X7* | 13.338 |
| 0805 (2012) | 1.25 | F | X7* | 19.526 |
| 0805 (2012) | 1.25 | Q | X7* | 23.200 |
| 0805 (2012) | 0.60 | 6 | C0G | 8.253 |
| 0805 (2012) | 0.85 | C | C0G | 9.827 |
| 0805 (2012) | 1.25 | F | C0G | 16.737 |
| 1206 (3216) | 1.15 | P | X7* | 35.860 |
| 1206 (3216) | 1.60 | H | X7* | 55.045 |
| 1206 (3216) | 1.60 | K | X7* | 55.045 |
| 1210 (3225) | 2.00 | I | X7* | 111.670 |
| 1210 (3225) | 2.50 | J | X7* | 142.335 |
| 1210 (3225) | 2.50 | V | X7* | 195.049 |
Note: The weight of the product is a typical value per size. For more details, please contact Samsung Electro-Mechanics.
Product Characteristic Data
2-1. Capacitance
Capacitance is measured based on specified voltage and frequency conditions. For Class I MLCCs, measurement is at 1 MHz ±10% or 1 kHz ±10% with 0.5-5 Vrms. For Class II MLCCs, it's at 1 kHz ±10% or 120 Hz ±20% with 1.0 ±0.2 Vrms or 0.5 ±0.1 Vrms, respectively. Measurements require heat treatment (150°C, 1hr) followed by 24±2hr stabilization at room temperature.
It is recommended to use measurement equipment with an Auto Level Control (ALC) option. Capacitance value of Class II MLCCs changes with applied AC and DC voltage, which must be considered in circuit design.
2-2. Tan δ (DF)
Dissipation Factor (DF) represents the energy loss in an MLCC. It is the ratio of loss energy to stored energy. Quality Factor (Q factor) is the inverse of DF. Class I MLCCs are often specified by Q due to low DF, while Class II are specified by DF. Class I MLCCs are recommended for applications requiring good linearity and low loss (e.g., coupling, filter, time constant circuits).
2-3. Insulation Resistance (IR)
Ceramic dielectrics have high insulating properties, resulting in low leakage current. Insulation Resistance is the ratio of leakage current to DC voltage. IR is measured 1 minute after applying the rated voltage, allowing charging current to stabilize.
2-4. Capacitance Aging
High dielectric (Class II) MLCCs experience a decrease in capacitance value over time. This aging characteristic is typically linear with the log of time. Capacitance recovers after heat treatment (150°C, 1hr), and aging restarts from that point.
2-5. Temperature Characteristics of Capacitance (TCC)
Capacitance changes with temperature due to variations in the ceramic dielectric constant. TCC values and ranges are specified in the reliability test conditions. When selecting MLCCs, consider system operating temperature, ambient temperature, and the MLCC's TCC. Bias TCC must be considered when DC voltage is applied.
2-6. Self-heating Temperature
When AC or pulse voltage is applied, AC or pulse current flows through the MLCC, generating self-heating due to ESR. This can degrade insulating properties and potentially cause short circuits. The surface temperature of the MLCC must remain within the maximum operating temperature, and the temperature rise from self-heating should not exceed 20°C.
2-7. DC & AC Voltage Characteristics
The capacitance value of high dielectric constant (Class II) MLCCs varies with applied DC and AC voltage. Circuit designs must account for these changes, especially in systems with narrow capacitance tolerance requirements. DC Bias characteristics and AC voltage characteristics are critical considerations.
2-8. Impedance Characteristic
Impedance (Z) is the opposition to current flow in an AC circuit (Z = R + jX). At low frequencies, MLCCs act as capacitors with decreasing capacitive reactance (XC). At high frequencies, they act as inductors with increasing inductive reactance (XL) due to ESL. The Equivalent Series Resistance (ESR) contributes to impedance at all frequencies. The Self Resonant Frequency (SRF) is where XC and XL cancel out, leaving only ESR. Impedance is measured using network or impedance analyzers.
Electrical & Mechanical Cautions
3-1. Derating
For 'derated MLCC' models, operating voltage and temperature should be reduced below their rated values to achieve an equivalent lifetime comparable to standard MLCCs tested at 150% of rated voltage. The derating graph shows the maximum operating voltage relative to the surface temperature (including self-heating).
3-2. Applied Voltage
The actual applied voltage must not exceed the rated voltage. This applies to DC voltage, AC voltage (peak-to-peak), DC+AC voltage (maximum value), surge voltage, and static electricity. Electrical Overstress (EOS), including surge and ESD, can cause dielectric breakdown and short failures. Careful design is needed to prevent excessive voltage spikes and surges.
3-3. Vibration
In vibration environments, manage MLCCs to avoid resonance and impact. For severe vibration conditions, consult Samsung Electro-Mechanics for special MLCCs like Soft-term.
3-4. Shock
Mechanical shock from dropping or impact during handling can cause cracks or dielectric damage. Avoid using dropped MLCCs. Prevent impacts to terminals when handling PCBs.
3-5. Piezo-electric Phenomenon
High dielectric (Class II) MLCCs may generate audible noise due to vibration at specific frequencies when used in AC or pulse circuits. Mechanical vibrations or shocks can also cause noise.
Process of Mounting and Soldering
4-1. Mounting
- Mounting Position: Orient the major axis of MLCC parallel to the direction of applied stress.
- Cautions Near Cutout: Select mounting locations away from PCB cut lines to reduce stress from PCB cutting.
- Cautions Near Screw Holes: Mount MLCCs as far as possible from screw holes to minimize board deflection caused by screw torque.
4-2. Cautions Before Mounting
- Store and use MLCCs in reels; do not re-use isolated components.
- Verify capacitance under actual applied voltage.
- Check mechanical stress during actual process and equipment use.
- Confirm rated capacitance, voltage, and other electrical characteristics before assembly.
- Check solderability of MLCCs that have passed shelf life.
- Avoid using Sn-Zn based solder, as it may deteriorate reliability.
4-3. Cautions During Mounting with Machines
- Mounting Head Pressure: Adjust nozzle pressure to a maximum of 300 gf to prevent cracks.
- Bending Stress: Support PCBs when mounting components on the second side to prevent substrate bending and MLCC cracks.
- Suction Nozzle: Ensure suction nozzles are clean and mounting claws are not worn to prevent excessive force and cracks. Regular maintenance is required.
4-4. Reflow Soldering
MLCCs can be exposed to mechanical stress and contamination during soldering. Monitor the process closely.
- Reflow Profile: Peak temperature should not exceed 260°C for more than 30 seconds. Pre-heating is essential. Keep temperature difference between PCB and component minimal. Limit reflow soldering to less than three times, especially for ultra-small, thin-film, or high-capacitance MLCCs.
- Reflow Temperature: Maintaining the specified peak temperature is crucial to avoid issues like poor solder wettability, voids, whisker formation, and reduced adhesive strength.
- Cooling: Natural cooling with air is recommended.
- Optimum Solder Flux: Use appropriate solder paste amounts. Too much can cause stress and cracks; too little leads to weak adhesion. Design PCB land patterns carefully.
4-5. Flow Soldering
- Flow Profile: Peak temperature should not exceed 260°C for more than 5 seconds. Preheating is required.
- Cautions: Avoid sudden heat application. Long flow times or high temperatures can deteriorate adhesive strength or capacitance values.
4-6. Soldering Iron
Manual soldering poses a risk of thermal cracks. Use caution with soldering iron tip contact and temperature control.
- How to Use: Preheat MLCC and PCB. Minimize contact time with the soldering iron tip. Use a 20W max iron with a 3mm max tip diameter for a maximum of 4 seconds.
- Cautions: Avoid excessive solder. Ensure proper solder fillet shape. Use soldering wire ≤0.5mm. Iron tip should not contact the ceramic body directly.
4-7. Cleaning
Cleaning is generally unnecessary with rosin flux. If acidic flux is used, select cleaning fluids carefully as chlorine can affect MLCC performance. Avoid ultrasonic vibration that is too strong, as it can crack MLCCs or solder joints.
4-8. Cautions for Using Electrical Measuring Probes
Confirm probe positions and support jigs. Avoid PCB bending from probe pressure, which can crack MLCCs or damage solder joints. Use support pins on the back of the PCB to prevent flexing.
4-9. Printed Circuit Board Cropping
Avoid applying stress (bending, twisting) to MLCCs when cutting PCBs. Cracked MLCCs can lead to insulation resistance degradation and short circuits. Select PCB separation methods that minimize board deformation.
4-10. Assembly Handling
- PCB Handling: Hold PCBs with both hands to prevent bending. Do not use dropped boards.
- Mounting Other Components: Ensure suction nozzles are set correctly to avoid board deflection stress on MLCCs.
- Components with Leads: Support the board to avoid bending during insertion of components like transformers or ICs.
- Socket/Connector Attach/Detach: Prevent board bending that could damage MLCCs.
- Fastening Screw: Use torque drivers to prevent over-tightening screws, which can bend the board and damage MLCCs.
4-11. Adhesive Selection
Adhesives used before soldering must have sufficient strength, withstand soldering temperatures, not spread, have a long pot life, harden quickly, not corrode materials, and be insulating and non-toxic. Check application conditions carefully, as inappropriate use can degrade MLCC performance or cause cracks due to differential contraction.
4-12. Flux
Apply flux thinly and evenly. Use flux with a halogen content of 0.1% max. Avoid strong acidic flux. Check solder quality and remaining flux after mounting.
4-13. Coating
Cracks can occur due to resin amount or thermal contraction stress during coating. The difference in thermal expansion coefficients between the coating resin and MLCC can cause destruction or insulation degradation. Recommended coating materials have thermal expansion coefficients close to MLCCs, low curing contraction, and are insulating and non-corrosive.
Design Considerations
5-1. Circuit Design
Install safety equipment like fuses to prevent accidents if MLCCs short-circuit, as this product is not safety-guaranteed.
5-2. PCB Design
SMD components are fragile and sensitive to mechanical and thermal stress. Differences in thermal expansion coefficients between PCB materials and MLCCs can cause cracks.
5-3. Design System Evaluation
Evaluate the actual design with MLCCs to ensure no functional issues. Consider that Class II MLCC capacitance varies with operating conditions (voltage, temperature). Evaluate surge resistance, as system inductance can cause excessive surges.
5-4. Land Dimension
Recommended land dimensions for reflow and flow footprints are provided for various chip sizes to ensure proper soldering and adhesion. These dimensions are determined by evaluating the actual set and board.
Reflow Footprint Land Dimensions
| Chip Size [mm] | Chip Tol. [mm] | a [mm] | b [mm] | c [mm] | (a+2b) min | (a+2b) max |
|---|---|---|---|---|---|---|
| 0402 | ±0.02 | 0.14~0.20 | 0.14~0.22 | 0.20~0.26 | 0.42 | 0.64 |
| 0603 | ±0.03 | 0.16~0.20 | 0.24~0.32 | 0.30~0.35 | 0.64 | 0.84 |
| 1005 | ±0.05 | 0.18~0.26 | 0.24~0.32 | 0.32~0.37 | 0.66 | 0.84 |
| 1608 | ±0.07 | 0.20~0.28 | 0.25~0.35 | 0.35~0.39 | 0.70 | 0.90 |
| 2012 | ±0.09 | 0.22~0.30 | 0.25~0.35 | 0.35~0.39 | 0.72 | 0.90 |
| 3216 | ±0.05 | 0.35~0.40 | 0.37~0.47 | 0.50~0.55 | 1.09 | 1.34 |
| 3225 | ±0.07 | 0.37~0.42 | 0.37~0.47 | 0.52~0.58 | 1.11 | 1.36 |
| 4532 | ±0.10 | 0.40~0.45 | 0.37~0.47 | 0.55~0.60 | 1.14 | 1.39 |
| 5750 | ±0.15 | 0.40~0.45 | 0.40~0.50 | 0.60~0.65 | 1.20 | 1.45 |
Flow Footprint Land Dimensions
| Chip Size [mm] | Chip Tol. [mm] | a [mm] | b [mm] | c [mm] | (a+2b) min | (a+2b) max |
|---|---|---|---|---|---|---|
| 1608 | - | 0.60~1.00 | 0.60~0.80 | 0.60~0.80 | 1.80 | 2.60 |
| 2012 | - | 1.00~1.20 | 0.80~1.20 | 0.80~1.20 | 2.60 | 3.60 |
| 3216 | - | 2.00~2.40 | 1.00~1.20 | 1.00~1.40 | 4.00 | 4.80 |
Others
6-1. Storage Environment
- Temperature/Humidity: Recommended storage is 0-40°C and 0-70% RH. High temperatures or humidity can rapidly deteriorate product quality. Low humidity is better for solderability. Avoid temperature differences causing dew condensation.
- Shelf Life: Allowable storage period is within 6 months from the outgoing date of delivery. Check solderability before use for products stored over 6 months.
6-2. Caution for Corrosive Environment
Store MLCCs in an environment free of corrosive gases, as they can deteriorate solderability and cause quality issues due to plating corrosion and moisture penetration.
6-3. Equipment in Operation
- Do not touch MLCCs directly with bare hands.
- Avoid contact with conductive objects or conductive liquids.
- Do not use equipment exposed to water, oil, direct sunlight, ozone, UV radiation, corrosive gas, excessive vibration/shock, or high humidity.
- If smoke, fire, or unusual smell is detected, immediately switch off or unplug the equipment.
6-4. Waste Treatment
Scrapped MLCCs should be incinerated or buried by a licensed industrial waste company.
6-5. Operating Temperature
Do not use MLCCs above the maximum operating temperature. Consider equipment temperature distribution and ambient temperature fluctuations. The surface temperature, including self-heating, must not exceed the maximum operating temperature.
6-6. Transportation
Protect MLCCs from excessive temperature, humidity, and mechanical force during transportation. Avoid excessive vibrations, shocks, or forces that could crack the ceramic body or cause short circuits. Protect inner packaging from external forces.
6-7. Notice
This document is a standard product specification for reference only. Samsung Electro-Mechanics may change, modify, or discontinue product specifications without notice. Product specifications must be approved before placing an order. Contact sales personnel or application engineers for any questions.
Caution of Application
Disclaimer & Limitation of Use and Application
The products listed in this specification sheet are NOT designed and manufactured for high reliability applications such as aerospace, medical, military, power plant control, atomic energy, undersea, disaster prevention, crime prevention, traffic signal, data-processing, electric heating, safety equipment, or any other applications with similar complexity or reliability requirements. Misuse of products deviating from specifications may cause serious property damages or personal injury. Samsung Electro-Mechanics will NOT be liable for any damages resulting from such misuse. Contact sales personnel or application engineers for clarification.
