Samsung CL31B105KBHNNNE Multi-layer Ceramic Capacitor Specification
Product Overview
This document provides the specifications for the Samsung CL31B105KBHNNNE Multi-layer Ceramic Capacitor (MLCC). It details the electrical characteristics, dimensions, reliability test conditions, packaging, and handling precautions for this component.
General Specifications
| Supplier | Product | Samsung P/N | Description |
|---|---|---|---|
| Samsung electro-mechanics | Multi-layer Ceramic Capacitor | CL31B105KBHNNNE | CAP, 1μF, 50V, ±10%, X7R, 1206 |
A. Samsung Part Number Breakdown
- CL: Series
- 31: Size (1206)
- B: Dielectric (X7R)
- 105: Capacitance (1μF)
- K: Tolerance (±10%)
- B: Rated Voltage (50V)
- H: Temperature Characteristics (X7R)
- N: Termination (Ni/Sn)
- N: Packaging (Embossed)
- E: Special (RoHS+Halogen Compliant)
B. Structure & Dimension
The capacitor has a rectangular chip form. The dimensions are provided in millimeters (mm).
| Samsung P/N | L | W | T | BW |
|---|---|---|---|---|
| CL31B105KBHNNNE | 3.20±0.20 | 1.60±0.20 | 1.60±0.20 | 0.50±0.30 |
C. Samsung Reliability Test and Judgement Condition
This section details various reliability tests performed on the MLCC, including capacitance, Tan δ, insulation resistance, appearance, withstanding voltage, temperature characteristics, adhesive strength, bending strength, solderability, resistance to soldering heat, vibration test, moisture resistance, high temperature resistance, and temperature cycling. Each test includes the judgement criteria and test conditions.
D. Recommended Soldering Method
Reflow Soldering:
- Reflow Peak Temperature: 260 +0/-5°C, 30sec. Max.
- Meet IPC/JEDEC J-STD-020 D Standard.
Note: These are standard product specifications for reference only. Samsung may change or modify specifications without notice. Customers should approve specifications before placing an order.
E. Recommended TEST PCB
This section provides recommended PCB land dimensions for various MLCC chip sizes to ensure proper adhesive strength of termination and substrate for bending strength test.
| Size code | Size (mm) | a | b | c |
|---|---|---|---|---|
| R1 | 0.25 × 0.125 | 0.11 | 0.1 | 0.13 |
| R5 | 0.50 × 0.25 | 0.2 | 0.64 | 0.25 |
| 02 | 0.4 x 0.2 | 0.2 | 0.17 | 0.26 |
| 03 | 0.6 x 0.3 | 0.3 | 0.3 | 0.3 |
| 05 | 1.0 x 0.5 | 0.4 | 0.55 | 0.5 |
| 10 | 1.6 x 0.8 | 1.0 | 1.0 | 1.2 |
| 10(ANSC) | 1.6 x 0.8 | 0.6~0.8 | 0.6~0.8 | 0.6~0.8 |
| 21 | 2.0 x 1.25 | 1.2 | 1.4 | 1.65 |
| 31 | 3.2 x 1.6 | 2.2 | 1.4 | 2.0 |
| 32 | 3.2 x 2.5 | 2.2 | 1.4 | 2.9 |
| 42 | 4.5 ×2.0 | 3.3 | 6.0 | 1.5 |
| 43 | 4.5 x 3.2 | 3.5 | 1.75 | 3.7 |
| 55 | 5.7 x 5.0 | 4.5 | 1.75 | 5.6 |
| Size code | Size (mm) | a | b | c |
|---|---|---|---|---|
| R1 | 0.25 x 0.125 | 0.1 | 0.35 | 0.14 |
| R5 | 0.50 × 0.25 | 0.2 | 0.64 | 0.25 |
| 02 | 0.4 x 0.2 | 0.2 | 0.6 | 0.2 |
| 03 | 0.6 x 0.3 | 0.3 | 0.9 | 0.3 |
| 05 | 1.0 × 0.5 | 0.4 | 1.5 | 0.5 |
| 10 | 1.6 x 0.8 | 1.0 | 3.0 | 1.2 |
| 10(ANSC) | 1.6 x 0.8 | 0.6~0.8 | 1.8~2.4 | 0.6~0.8 |
| 21 | 2.0 x 1.25 | 1.2 | 4.0 | 1.65 |
| 31 | 3.2 x 1.6 | 2.2 | 5.0 | 2.0 |
| 32 | 3.2 x 2.5 | 2.2 | 5.0 | 2.9 |
| 42 | 4.5 ×2.0 | 3.5 | 5.0 | 1.6~2.0 |
| 43 | 4.5 x 3.2 | 3.5 | 7.0 | 3.7 |
| 55 | 5.7 x 5.0 | 4.5 | 8.0 | 5.6 |
1. Packaging
This specification applies to the taping of MLCC. Packaging design follows IEC 60286-3 standard.
- 1-1. Figure: Diagram illustrating the carrier tape, reel, and cover tape for packaging.
- 1-2. Quantity: Table showing the quantity of MLCCs per reel (7, 10, and 13 inches) for various chip sizes and taping types (Paper/Embossed).
- 1-3. Tape Size: Detailed tables and diagrams specifying the dimensions for cardboard/paper tape and embossed plastic tape for different MLCC sizes and pitches.
- 1-4. Cover Tape Peel-Off Force: Specifies the peel-off force for the cover tape (10 g.f ≤ peel-off force ≤ 70 g.f) and the measurement method.
- 1-5. Box Packaging: Describes the packaging labels and the dimensions for inner and outer boxes for 7" and 13" reels.
1-6. Chip Weight
Table listing the typical chip weight (mg/pc) for various MLCC sizes, chip thicknesses, and temperature characteristics.
2. Product Characteristic Data
- 2-1. Capacitance: Explains capacitance as the ratio of electric charge change to voltage change and provides voltage and frequency conditions for measurement based on capacitance range (Class I and Class II).
- 2-2. Tan δ (DF): Defines Dissipation Factor (DF) and Quality Factor (Q factor) and recommends Class I MLCC for applications requiring linearity and low loss.
- 2-3. Insulation Resistance: Describes insulation resistance as the ratio of leakage current to DC voltage and specifies measurement timing.
- 2-4. Capacitance Aging: Discusses the decrease in capacitance over time for Class II MLCC and the recovery after heat treatment. Includes a graph illustrating capacitance aging.
- 2-5. Temperature Characteristics of Capacitance (TCC): Emphasizes considering temperature effects on capacitance and provides example graphs for X5R and Bias TCC.
- 2-6. Self-heating Temperature: Explains self-heating due to ESR when AC or pulse voltage is applied and provides conditions to prevent degradation. Includes a graph of ripple current vs. temperature rise.
- 2-7. DC & AC Voltage Characteristics: Highlights the change in capacitance with applied DC and AC voltage for Class II MLCC and provides example graphs for DC Bias and AC voltage characteristics.
- 2-8. Impedance Characteristic: Defines electrical impedance (Z) for MLCCs, explaining behavior at low and high frequencies, Self Resonant Frequency (SRF), and measurement methods. Includes a graph of impedance vs. frequency.
3. Electrical & Mechanical Caution
- 3-1. Applied Voltage: Stresses that applied voltage should not exceed the rated voltage and details the effects of Electrical Overstress (EOS), including surge and ESD. Includes diagrams illustrating types of applied voltage and example graphs for surge and ESD effects.
- 3-2. Vibration: Advises checking vibration and shock status and avoiding resonance and terminal impact.
- 3-3. Shock: Warns against using dropped MLCCs and hitting MLCCs with PCB corners during handling.
- 3-4. Piezo-electric Phenomenon: Explains that MLCCs can generate noise due to vibration at specific frequencies.
4. Process of Mounting and Soldering
- 4-1. Mounting: Provides recommendations for mounting position, cautions for mounting near cutouts and screw holes, with diagrams illustrating recommended and not recommended practices.
- 4-2. Caution before Mounting: Lists precautions such as checking capacitance characteristics, mechanical stress, rated values, solderability, and avoiding Sn-Zn based solder.
- 4-3. Cautions during Mounting with Mounting (pick-and-place) Machines: Details cautions regarding mounting head pressure, bending stress on substrates, and suction nozzle maintenance. Includes a diagram for bending stress.
- 4-4. Reflow Soldering: Describes reflow soldering methods, reflow profiles, cooling recommendations, optimum solder flux, and potential issues with too much or too little solder. Includes a reflow profile graph and diagrams illustrating solder application.
- 4-5. Flow Soldering: Outlines the flow soldering profile and cautions regarding sudden heat application and flow time/temperature. Includes a flow soldering profile graph.
- 4-6. Soldering Iron: Provides guidance on using a soldering iron, including preheating, contact time, and conditions for iron facilities. Includes tables for soldering parameters and cautions for spot heater usage. Also includes cautions for re-work.
- 4-7. Cleaning: Discusses cleaning necessity, cautions for cleaning with ultrasonic vibration, and selection of cleaning fluids.
- 4-8. Cautions for using electrical measuring probes: Advises on proper probe positioning and avoiding PCB bending during electrical testing. Includes diagrams for recommended and not recommended probe placement.
- 4-9. Printed Circuit Board Cropping: Warns against applying stress to the PCB during cutting and explains how cracked MLCCs can lead to short circuits. Includes diagrams illustrating bending and twisting stresses.
- 4-10. Assembly Handling: Provides cautions for PCB handling, mounting other components, board mounting components with leads, socket/connector attach/detach, and fastening screws. Includes diagrams for recommended and not recommended practices for lead insertion and board support.
- 4-11. Adhesive selection: Lists requirements for adhesives used in MLCC positioning and cautions regarding adhesive application, selection, and curing temperature.
- 4-12. Flux: Discusses the impact of flux amount and type on solderability and MLCC performance.
- 4-13. Coating: Explains cracks caused by coating and recommends coating materials, considering thermal expansion coefficients and resin properties.
5. Design
- 5-1. Circuit design: Emphasizes installing safety equipment like fuses due to the risk of short circuits from bent or dropped boards.
- 5-2. PCB Design: Highlights the fragility of SMD components to stress and the impact of thermal expansion differences between PCB and MLCC materials on crack formation.
- 5-3. Design system evaluation: Recommends evaluating actual designs with MLCCs, considering capacitance variation with operating conditions, surge resistance, and MLCC size/termination shape.
- 5-4 Land Dimension: Provides recommended land dimensions for various MLCC chip sizes for reflow footprint, including tables with detailed measurements.
6. Others
- 6-1. Storage environment: Recommends storage conditions (0~40°C, 0~70% RH) to maintain product quality and solderability, and specifies a shelf life of 6 months. Also notes MSL Level 1.
- 6-2. Caution for corrosive environment: Advises storing MLCCs in an environment free of corrosive gases to prevent solderability issues.
- 6-3. Equipment in operation: Provides safety precautions for handling MLCCs, including avoiding direct contact with bare hands, conductive objects, and specific environmental conditions.
- 6-4. Waste treatment: Recommends incineration or burial by a licensed industrial waste company for scrapped MLCCs.
- 6-5. Operating temperature: States that operating temperature limits are model-specific and MLCC surface temperature should not exceed the maximum operating temperature, including self-heating effects.
- 6-6. Transportation: Outlines precautions for transportation, including protection from temperature, humidity, mechanical force, vibrations, and shocks.
- 6-7. Notice: States that the document is a standard product specification for reference only and may be subject to change without notice. Advises contacting sales personnel for questions.
Caution of Application
Disclaimer: All product specifications are subject to change. Customers are responsible for verifying applicability. Information is presented without guarantee. Use outside specifications voids warranty. Applications requiring high reliability or safety should employ suitable designs or safeguards.
Limitation: Contact Samsung with usage environment information for applications requiring high reliability, such as aerospace, automotive, medical, and safety equipment.
