Key Features
- 11th Gen Intel® Core™ Processor
- COM Express® Mini Form Factor
- Single Channel LPDDR4X 4266MHz Memory Down up to 16GB
- Two independent displays: DDI + eDP
- DP++ supports 4K x 2K resolution
- 1x PCIe x4 (Gen 3) expansion
- 1x I2C, 1x SMBus expansion
- Rich I/O: 1x Intel 2.5GbE, 2x USB 3.2, 8x USB 2.0
- Wide Temperature Operation: -40°C to 85°C (select models)
Visual Description
The TGU9A2 is a compact COM Express Mini module designed for embedded applications. The front view typically shows the central processing unit area and various connectors. The rear view reveals additional connectors and interfaces. The module adheres to the COM Express® Type 10 standard.
Block Diagram Overview
The core of the module is the Intel® ULT SOC (Tiger Lake - UP3). It connects to system memory via a Single Channel LPDDR4X (X32) interface, supporting 8GB and 16GB configurations. Expansion capabilities are provided through multiple PCIe lanes, including PCIe 3.0 and PCIe 4.0, along with dedicated interfaces for I2C and SMBus. The module supports dual independent displays via DDI and eDP, with DP++ capable of 4K x 2K resolution. Key I/O includes one Intel 2.5GbE LAN port, two USB 3.2 Gen 2 ports, and eight USB 2.0 ports. Storage is supported via SATA 3.0 ports and NVMe SSD. System management features include SPI Flash BIOS, eSPI to LPC bridge, LPC, SPI, eSPI, I2C, SMBus interfaces, a Watchdog Timer (WDT), and optional TPM 2.0. An optional embedded controller (ITE8528) and CMOS backup EEPROM are also available.
Specifications
| Category | Details |
|---|---|
| SYSTEM | |
| Processor | Intel® Core™ i7-1185G7E/GRE, i5-1145G7E/GRE, i3-1115G4E/GRE, Celeron® 6305RE |
| Memory | Memory Down up to 16GB (Single Channel LPDDR4X 4266MHz) |
| BIOS | AMI SPI 256Mbit |
| GRAPHICS | |
| Controller Feature | Intel® Iris® Xe graphics, OpenGL 5.0, DirectX 12, OpenCL 2.1 |
| Display | 1x DDI (HDMI/DVI/DP++), 1x eDP. DP++ up to 4096x2160 @ 60Hz; HDMI up to 3840x2160 @ 30Hz; eDP up to 3840x2160 @ 60Hz. |
| Dual Displays | DDI + eDP |
| EXPANSION | |
| Interface | 1x PCIe x4 (Gen 3), 1x I2C, 1x SMBus, 2x SPI, 2x UART (TX/RX) |
| AUDIO | HD Audio |
| ETHERNET | 1x Intel® Ethernet I225IT (2.5Gbps) |
| I/O | 2x USB 3.2 Gen 2, 8x USB 2.0, 2x SATA 3.0 (up to 6Gb/s), 1x 8-bit DIO |
| NVMe SSD | 1x onboard SSD (128GB/256GB/512GB/1024GB available upon request) |
| WATCHDOG TIMER | System Reset, Programmable (1 to 255 Seconds) |
| SECURITY | TPM 2.0 support (by request) |
| POWER | 4.75V~20V (ATX mode), 4.75V~20V (AT mode) |
| OS SUPPORT | Windows 10 IoT Enterprise 64-bit, Linux |
| ENVIRONMENT | Operating Temperature: -5°C to 65°C (standard), -40°C to 85°C (wide temp models). Storage Temperature: -40°C to 85°C. Operating Humidity: 10 to 90% RH. Storage Humidity: 10 to 90% RH. MTBF: Up to 1,230,760 hrs @ 25°C. |
| MECHANICAL | Dimensions: 84mm (3.3") x 55mm (2.16") |
| STANDARDS AND CERTIFICATIONS | PICMG COM Express® R3.0, Type 10. Compliance: CE, FCC, RoHS, UKCA. |
Ordering Information
| Model Name | CPU | Memory | eDP | DIO | TPM | SSD | Operating Temp. | Part Number |
|---|---|---|---|---|---|---|---|---|
| TGU9A2-T16-1185GRE | i7 1185GRE | 16 GB | eDP | DIO | TPM 2.0 | 128 GB | -40-85°C | 770-TGU9A22-000G |
| TGU9A2-T86-1185GRE | i7 1185GRE | 8 GB | eDP | DIO | TPM 2.0 | 128 GB | -40-85°C | 770-TGU9A22-100G |
| TGU9A2-T16-1145GRE | i5 1145GRE | 16 GB | eDP | DIO | N/A | 128 GB | -40-85°C | 770-TGU9A22-200G |
| TGU9A2-B86-1115G4E | i3 1115G4E | 8 GB | eDP | DIO | N/A | 128 GB | -5-65°C | 770-TGU9A22-300G |
| TGU9A2-B86-6305E | Celeron 6305E | 8 GB | eDP | DIO | N/A | 128 GB | -5-65°C | 770-TGU9A22-400G |
Packing List
- CPU Cooler (i7 & i5 Series)
- CPU Cooler (i3 & Celeron Series)
Optional Items
- Heat Spreader
- COM100-B Carrier Board Kit
- COM335 Carrier Board Kit
