Introduction to Underfill
This guide provides detailed instructions for using the Underfill feature within Altair PollEx 2021. Underfill is a crucial process in electronics manufacturing, involving the application of a thermo-hardening resin (epoxy) between the PCB's top side and the chip's bottom side. This application enhances mechanical and thermal properties, protecting package chips from physical or thermal shock and ensuring device reliability, particularly in portable and high-speed communication devices.
The Altair PollEx Underfill Editor allows engineers to define the movement path of the nozzle and the amount of resin applied. By utilizing PCB design data, users can generate precise coordinate data for the nozzle's movement path, streamlining the underfill dispensing process.
Key Features and Functionality
- Underfill Editor: A dedicated tool for creating and managing underfill paths.
- File Operations: Save and load underfill data in various formats (.ini, .capb), save screens as images, and print.
- Settings: Configure CAP Data, Color, and Label Input parameters for the underfill process.
- View and Edit Tools: Tools to manipulate and refine the underfill design.
Getting Support
For technical assistance and further information, Altair provides comprehensive support through its customer portal, Altair One (https://altairone.com/). Users are encouraged to create an account for access to product downloads, a Knowledge Base, and direct support requests. Additional resources, including training classes, are available via https://learn.altair.com/.
For specific inquiries regarding the PollEx document, contact the PollEx team at PollEx_support_kr@altair.com.
