RPS631-H610

14th/13th/12th Gen Intel® Core™ Desktop ATX Motherboard

[FCC Certified] [CE Marked] [RoHS Compliant] [UKCA Marked]

Key Features

DDR5 Memory Support: Features 2 DDR5 UDIMM slots, supporting up to 96GB of memory with Dual Channel DDR5 up to 5600 MHz.
4K High Resolution: Capable of supporting 4K resolution output.
Dual Displays: Supports simultaneous output via VGA and HDMI for dual display configurations.
Multiple Expansion Options: Equipped with 1 PCIe x16 (Gen 4), 2 PCIe x4 (Gen 3), 4 PCI slots, and 1 M.2 M key slot for extensive connectivity.
Rich I/O Connectivity: Offers a comprehensive rear I/O panel including 1 Intel 2.5GbE LAN, 1 Intel 1GbE LAN, 4 USB 3.2 Gen 1 ports, 6 USB 2.0 ports, 4 SATA 3.0 ports, and 6 COM ports.

Motherboard Overview

The DFI RPS631-H610 is an ATX form factor motherboard designed for desktop applications. It integrates an LGA 1700 socket compatible with 14th, 13th, and 12th Generation Intel® Core™ processors. The board features four DDR5 UDIMM memory slots, multiple expansion slots including PCIe 4.0 x16, PCIe 3.0 x4, and standard PCI slots, along with M.2 slots and SATA III connectors for storage. The rear I/O panel provides a wide array of connectivity options, including networking, USB, video outputs, and serial ports.

Block Diagram Overview

The motherboard's architecture is centered around the Intel H610 chipset, which connects to the CPU via the DMI 4.0 interface. This chipset facilitates communication with DDR5 memory, PCIe Gen 4 and Gen 3 expansion slots, SATA III storage interfaces, and various USB controllers (USB 3.2 Gen 1/Gen 2, USB 2.0). Integrated networking is provided by Intel I226-V (2.5GbE) and Intel I219-V (1GbE) controllers. The system also includes Realtek ALC888S audio, display outputs via DDI (supporting HDMI and VGA), multiple serial ports (RS232/422/485), DIO, S/PDIF, front audio headers, PS/2 ports, and security features like TPM 2.0, managed through interfaces such as eSPI and SMBus.

Mechanical Drawing and Dimensions

The RPS631-H610 motherboard conforms to the ATX standard, measuring 304.80mm in width and 243.84mm in height. The mechanical drawing illustrates the physical layout of key components, including the CPU socket, memory slots, expansion slots, M.2 connectors, and the I/O panel, along with specific dimensional references for component placement.

Specifications

System

Component	Details
Processor	14th/13th/12th Generation Intel® LGA 1700 Socket Processors (TDP support up to 125W)
Chipset	Intel® H610 Chipset

Memory

Component	Details
Type	Two 288-pin UDIMM up to 96GB (Non-ECC)
Speed	Dual Channel DDR5 up to 5600 MHz

BIOS

Component	Details
Type	AMI SPI 256Mbit

Graphics

Component	Details
Controller	Intel® UHD Graphics 700 series
API Support	OpenGL 4.5, DirectX 12, OpenCL 2.1
Hardware Decode/Encode	AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9

Display

Component	Details
Ports	1 x VGA, 1 x HDMI 2.0a
Resolutions	VGA: up to 1920x1200 @ 60Hz HDMI: up to 4096x2160 @ 24Hz

Expansion

Component	Details
Slots	1 x PCIe x16 (Gen 4) 2 x PCIe x4 (Gen 3, x2) 4 x PCI 1 x M.2 M key (PCIe x2 NVMe)

Audio

Component	Details
Codec	Realtek ALC888S
Outputs	1 x Line-out, 1 x Mic-in, 1 x Line-in (optional)

Ethernet

Component	Details
Controller	1 x Intel® 1226V (2.5GbE) 1 x Intel® I219V (1GbE)

Rear I/O

Component	Details
Serial	2 x RS-232/422/485 (DB-9)
USB	4 x USB 3.2 Gen 1 2 x USB 2.0
PS/2	1 x PS/2 (mini-DIN-6)
Display	1 x VGA 1 x HDMI
Audio	1 x Line-out 1 x Mic-in 1 x Line-in (optional)

Internal I/O

Component	Details
Serial	4 x RS-232
USB	2 x USB 2.0 Type A 1 x USB 2.0 (2.54mm pitch, vertical Type A, optional)
Audio	1 x Front Audio 1 x S/PDIF
SATA	4 x SATA 3.0 (up to 6Gb/s)
DIO	4-IN / 8-OUT DIO
Other	1 x eSPI, 1 x SMBus

Watchdog Timer

Component	Details
Function	System Reset, Programmable via Software from 1 to 255 Seconds

Security

Component	Details
TPM	TPM2.0

Power

Component	Details
Type	ATX
Connectors	8-pin ATX 12V power, 24-pin ATX power
Consumption (Typical)	e.g., i9-12900K: 3.3V @ 0.4A (1.32W); 5V @ 0.85A (4.25W); 12V @ 1.09A (13.08W)
Consumption (Max)	e.g., i9-12900K: 3.3V @ 0.63A (2.08W); 5V @ 3.02A (15.1W); 12V @ 26.39A (316.68W)

OS Support

OS	Details
Microsoft	Windows 10 IoT Enterprise 64-bit, Windows 11 Enterprise
Linux	Linux

Environment

Parameter	Details
Temperature	Operating: -5 to 65°C Storage: -30 to 60°C (with RTC Battery); -40 to 85°C (without RTC Battery)
Humidity	Operating/Storage: 5 to 95% RH

Mechanism

Parameter	Details
MTBF	TBD
Dimensions	ATX Form Factor, 305mm (12") x 244mm (9.6")
PCB Thickness	1.6mm
Height	Top Side: 33.3mm Bottom Side: 4mm

Certifications

Certification	Details
Certifications	CE, FCC Class B, UKCA, RoHS

Ordering Information

Model Name	P/N	Memory	1 GbE	2.5 GbE	RS-232/422/485	USB 3.2 Gen1	USB 2.0	TPM 2.0	Power	Temp.
RPS631-H610E	770-RPS6311-000G	2 UDIMM	1	1	2	4	6	1	24-pin ATX/8-pin ATX 12V	-5 to 65°C

Packing List

1 RPS631 motherboard
1 COM port cables (Length: 300mm, 2 x COM ports)
1 Serial ATA data cable (Length: 500mm)
1 I/O shield
1 M.2 screw/standoff

Optional Items

USB 2.0 port cable (Length: 350/398mm)
USB 3.2 Gen1 port cable (Length: 320mm)
USB 3.2 Gen2 port cable (Length: 300mm)
COM port cable (Length: 300mm, 2 x COM ports)
Serial ATA data cable (Length: 500mm, W/LOCK)
Serial ATA data cable (Length: 500mm, W/LOCK, 90D)
Thermal solution (For 35W, Height: 29.39mm)
Thermal solution (For 65W, Height: 46mm)
Thermal solution (For 95W/125W, Height: 110mm)
DP to HDMI Dongle
M.2-COM4 (M.2 serial port module)
M.2-2LAN (M.2 LAN port module)
M.2-2PSE (M.2 PSE module)

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