Analog Devices Product/Process Change Notice - PCN 25_0185 Rev. -
Analog Devices, Inc. One Analog Way, Wilmington, MA 01887, USA
This notice is to inform you of a change that will be made to certain ADI products (see Appendix A) that you may have purchased in the last 2 years. An acceptance or concern response should be submitted to ADI promptly. Any requests for samples of changed material or additional information must be made within 30 days of the notification. In accordance with JEDEC Standard 046, customers should acknowledge receipt of the PCN within 30 days of the PCN delivery. ADI contact information is listed below. Note: Revised fields are indicated by a red field name. See Appendix B for revision history.
Lack of acknowledgment of the PCN within 30 days constitutes acceptance of the change. After the acknowledgment, a lack of additional requests within 90 days constitutes acceptance of the change.
Key Change Details
| PCN Title | LTM8078 - Die Thickness and Thermal Parameters Change |
|---|---|
| Publication Date | 11-Aug-2025 |
| Effectivity Date | 13-Nov-2025 (the earliest date that a customer could expect to receive changed material) |
| Revision Description | Initial Release |
Description Of Change
Die thickness updated from 450um to 200um and thermal parameters will be changed as shown in an attached document.
Reason For Change
Die thickness change for improved manufacturability.
Impact of the change (positive or negative) on fit, form, function & reliability
The change is transparent in customer applications since there is no change in form, fit, function, quality or reliability of the product.
Product Identification
Production shipment of the product incorporating the new material will begin no sooner than the effective date.
Summary of Supporting Information
Qualification has been performed per Industry Standard Test Methods. See attached Qualification Results Summary.
Supporting Documents
- Type: Qualification Results Summary
File: ADI_PCN_25_0185_Rev_-_Reliability Report - LTM8078.pdf - Type: Other
File: ADI_PCN_25_0185_Rev_-_Thermal Analysis Summary - LTM8078.pdf
Note: If applicable, the device material declaration will be updated due to material change.
ADI Contact Information
For questions on this PCN, please send an email to the regional contacts below or contact your local ADI sales representatives.
| Americas: | PCN_Americas@analog.com |
|---|---|
| Europe: | PCN_Europe@analog.com |
| Japan: | PCN_Japan@analog.com |
| Korea: | PCN_Korea@analog.com |
| Rest of Asia: | PCN_ROA@analog.com |
Appendix A - Affected ADI Models
Added Parts On This Revision - Product Family / Model Number (5)
- LTM8078/LTM8078EY#3QAPBF
- LTM8078/LTM8078EY#PBF
- LTM8078/LTM8078IY
- LTM8078/LTM8078IY#3ZZPBF
- LTM8078/LTM8078IY#PBF
Appendix B - Revision History
| Rev | Publish Date | Effectivity Date | Rev Description |
|---|---|---|---|
| Rev.- | 11-Aug-2025 | 13-Nov-2025 | Initial Release |
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