E10-915MS30 User Manual

SI4463 915MHz 1W SMD Wireless Module

Brand: EBYTE

Manufacturer: Chengdu Ebyte Electronic Technology Co.,Ltd.

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The information contained herein is provided "as is" and EBYTE assumes no liability for the use of the information. No warranty, either express or implied, is given, including but not limited, with respect to the accuracy, correctness, reliability and fitness for a particular purpose of the information. This document may be revised by EBYTE at any time. For most recent documents, visit www.ebyte.com.

1 Overview

1.1 Brief introduction

The E10-915MS30 is a 1W SMD wireless module operating at 915MHz, developed based on the SI4463 chip from Silicon Labs. Due to the use of the imported Si4463 as the core of the module, with PA and LNA, its sensitivity and stability are largely improved when the transmit power is 1W. The module is aimed at smart home, wireless meter reading, scientific research and medical, and medium and long distance wireless communication equipment. Since RF performance and component selection are in accordance with industrial standards, and the product has obtained FCC, CE, RoHs and other international authoritative certification reports, users do not need to worry about its performance. With its stable and reliable characteristics, it is favored by the majority of users. Compared with older products, it has made great progress in receiving current, receiving sensitivity, transmitting power, receiving rate range, and anti-interference ability. A high-precision 26MHz crystal is used.

Since the module is a pure RF transceiver module, you need to use an MCU driver or a dedicated SPI debug tool.

Diagram: A rectangular electronic module with dimensions 40.0±0.1 mm by 25.0±0.1 mm, labeled E10-915MS30 with a part number No.170306000022. It shows an IPEX connector and 20 pins.

1.2 Features

1.3 Application

2 Specification and parameter

2.1 Limit parameter

Main parameter Performance Min. Performance Max. Remark
Power supply (V) 0 5.5 Voltage over 5.5V will cause permanent damage to module
Blocking power (dBm) - 10 Chances of burn is slim when modules are used in short distance
Operating temperature (°C) -40 85 /

2.2 Operating parameter

Main parameter Performance Min. Performance Typ. Performance Max. Remark
Operating voltage (V) 4.8 5.0 5.5 ≥5.0 V ensures output power
Communication level (V) - 3.3 - For 5V TTL, it may be at risk of burning down
Operating temperature (°C) -40 - 85 Industrial design
Operating frequency (MHz) 900 915 925.5 Support ISM band
Power consumption TX current (mA) - - 753 Instant power consumption
RX current (mA) - 20 -
Sleep current (μA) - 5.0 - Software is shut down
Max Tx power (dBm) 29 - 31 Air data rate is 1kbps
Receiving sensitivity (dBm) -121 -122 -124
Air data rate (bps) 0.123k - 1M Controlled via user's programming
Main parameter Description Remark
Distance for reference 6000m Test condition: clear and open area, antenna gain: 5dBi, antenna height: 2.5m, air data rate: 1kbps
FIFO 64Byte Max length transmitted each time
Crystal frequency 26MHz
Modulation GFSK(recommended) (G)FSK, 4(G)FSK, (G)MSK, OOK
Package SMD
Connector 2.54mm
Communication interface SPI 0-10Mbps
Size 25*40 mm
Antenna IPEX/stamp hole 50 ohm impedance

3 Size and pin definition

Diagram: Top view of a rectangular module showing pin numbering from 1 to 20. Side views show dimensions and pin arrangements. A detailed pinout diagram shows pin numbers, pin items (GND, SDN, GPIO3, etc.), pin direction (Input/Output), and pin application descriptions.

Pin No. Pin item Pin direction Pin application
1 GND Ground, connecting to power supply reference ground
2 SDN Input Module operation enabling control pin, low level in operation (refer to SI4463 Datasheet for details)
3 GPIO3 Output Connecting to the internal RF switch transmission, can be disconnected, controlled by SI4463 intelligently
4 GPIO2 Output Connecting to the internal RF switch receiving, can be disconnected, controlled by SI4463 intelligently
5 CSN Input Module chip selection pin, used to start a SPI communication
6 MOSI Input Module SPI data input pin
7 MISO Output Module SPI data output pin
8 GND Ground, connecting to power supply reference ground
9 SCK Output Module SPI clock pin
10 IRQ Output Module interrupt pin
11 GPIO1 Output Module data output pin (refer to SI4463 datasheet)
12 GPIO0 Output Module data output pin (refer to SI4463 datasheet)
13 VCC Power supply must be 5.0 ~ 5.5V DC (voltage higher than 6V is forbidden)
14 GND Ground, connecting to power supply reference ground
15 GND Ground, connecting to power supply reference ground
16 GND Ground, connecting to power supply reference ground
17 GND Ground, connecting to power supply reference ground
18 GND Ground, connecting to power supply reference ground
19 GND Ground, antenna port reference ground
20 ANT Output Antenna

4. Basic operation

4.1 Hardware design

4.2 Software editing

5. Basic application

5.1 Basic circuit diagram

Diagram: A circuit diagram showing the connection between a microcontroller (STM8L) and the E10-915MS30 module. It illustrates connections for SPI communication (CSN, MOSI, MISO, SCK), GPIO pins, power (VCC, GND), and the ANT (antenna) pin.

6 FAQ

6.1 Communication range is too short

6.2 Module is easy to damage

6.3 BER(Bit Error Rate) is high

7 Production guidance

7.1 Reflow soldering temperature

Profile Feature Curve characteristics Sn-Pb Assembly (Sn63/Pb37) Pb-Free Assembly (Sn96.5/Ag3/Cu0.5)
Preheat Temperature min (Tsmin) Min preheating temp. 100°C 150°C
Preheat temperature max (Tsmax) Mx preheating temp. 150°C 200°C
Preheat Time (Tsmin to Tsmax)(ts) Preheating time 60-120 sec 60-120 sec
Average ramp-up rate(Tsmax to Tp) Average ramp-up rate 3°C/second max 3°C/second max
Liquidous Temperature (TL) Liquid phase temp. 183°C 217°C
Time (tL) Maintained Above (TL) Time below liquid phase line 60-90 sec 30-90 sec
Peak temperature (Tp) Peak temp. 220-235°C 230-250°C
Average ramp-down rate (Tp to Tsmax) Aveage ramp-down rate 6°C/second max 6°C/second max
Time 25°C to peak temperature Time to peak temperature for 25°C max 6 minutes max 8 minutes

7.2 Reflow soldering curve

Diagram: A reflow soldering temperature curve graph showing temperature on the Y-axis and time on the X-axis. It illustrates stages like Preheat (Tsmin, Tsmax), Ramp-up, Liquidous (TL), Time at TL, Peak (Tp), and Ramp-down, with critical zones marked.

8 E10 Series

Model No. IC Frequency(Hz) Tx power (dBm) Test distance km Package Antenna
E10-868MS30 SI4463 868M 30 6 SMD Stamp hole/IPEX
E10-915MS20 SI4463 915M 20 2.5 SMD Stamp hole/IPEX
E10-868MS20 SI4463 868M 20 2.5 SMD Stamp hole/IPEX
E10-433MS1W SI4463 433M 30 6 SMD Stamp hole
E10-433MD3 SI4438 433M 20 2 SMD IPEX
E10-433MD-SMA SI4463 433M 20 2 DIP SMA-K
E10-433MS SI4463 433M 20 2 SMD Stamp hole

9 Antenna guidance

9.1 Antenna recommendation

The antenna is an important role in the communication process. A good antenna can largely improve the communication system. Therefore, we recommend some antennas for wireless modules with excellent performance and reasonable price.

Model No. Type Frequency Hz Interface Gain dBi Height Cable Function feature
TX915-XP-100 Sucker antenna 915M SMA-J 3.5 25cm 100cm Sucker antenna, High gain
TX915-JK-20 Rubber antenna 915M SMA-J 3 210mm - Flexible &omnidirectional
TX915-JK-11 Rubber antenna 915M SMA-J 2.5 110mm - Flexible &omnidirectional
TX915-JZ-5 Rubber antenna 915M SMA-J 2 50mm - Short straight &omnidirectional

9.2 Antenna selection

Diagram: Two images showing antenna connection options on a PCB: one labeled 'Stamp hole (default)' and another labeled 'IPEX'.

Revision history

Version Date Description Issued by
1.00 2017/10/16 Initial version huaa
1.10 2018/5/23 Content updated huaa
1.20 2018/9/19 Model No. split Huaa

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Documents and RF Setting download link: www.ebyte.com

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Fax: 028-64146160 ext. 821

Web: www.ebyte.com

Address: Innovation Center D347, 4# XI-XIN Road, Chengdu, Sichuan, China

[EBYTE logo] Chengdu Ebyte Electronic Technology Co.,Ltd.

Models: SI4463, 915MHz 1W SMD Wireless Module

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E10-915MS30 Usermanual EN v1.20

References

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